M5STACK STAMPS3: Overview and Technical Specifications

The M5STACK STAMPS3 is a compact and powerful development board designed around the Espressif ESP32-S3 System-on-Chip (SoC). This board offers robust connectivity options, including integrated 2.4GHz Wi-Fi and Bluetooth 5 (LE) in Long Range mode, making it suitable for a wide range of IoT and embedded applications.

Key features of the STAMPS3 include:

Espressif ESP32-S3 dual-core LX7 processor running up to 240 MHz.
On-chip memory: 384 KB ROM, 512 KB SRAM, and 16 KB SRAM in RTC.
Support for multiple external flash and RAM configurations via SPI, Dual SPI, Quad SPI, Octal SPI, QPI, and OPI interfaces.
Comprehensive power management capabilities, supporting various low-power modes like Modemsleep and Lightsleep.
USB-C interface for programming and power, along with a 28-pin stamp hole pad for flexible integration.
Onboard WS2812LED and a 2.4g antenna for wireless communication.

The STAMPS3 is engineered for ease of development, providing essential components and interfaces required for prototyping and deploying connected devices. It details electrical characteristics, pin descriptions, and functional aspects of the ESP32-S3 chip and the board itself.

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