QUECTEL FGM842D Wi-Fi and Bluetooth Module User Manual

User Manual for QUECTEL models including: FGM842D Wi-Fi and Bluetooth Module, FGM842D, Wi-Fi and Bluetooth Module, Bluetooth Module, Module

Roshan Weng(翁雄智)

UM

Quectel Wireless Solutions Company Limited 2023FGM842D Wi-Fi & Bluetooth Module XMR2023FGM842D XMR2023FGM842D 2023fgm842d

File Info : application/pdf, 51 Pages, 1.73MB

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FGM842D Hardware Design
Wi-Fi&Bluetooth Module Version: 1.0.0 Date: 2023-10-26 Status: Preliminary

Wi-Fi&Bluetooth Module
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an "as available" basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
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Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties ("third-party materials"). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel's or third-party's servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers' failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

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About the Document

Revision History

Version Date

Author

Description

2023-10-26 Wain ZHAO/Neil CHENG Creation of the document

1.0.0

2023-10-26 Wain ZHAO/Neil CHENG Preliminary

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Contents
Safety Information ...................................................................................................................................... 3
About the Document .................................................................................................................................. 4
Contents ...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index ................................................................................................................................................ 8
1 Introduction ............................................................................................................................................. 9 1.1. Special Mark .................................................................................................................................. 9
2 Product Overview ................................................................................................................................. 11 2.1. Key Features................................................................................................................................ 12
3 Application Interfaces .......................................................................................................................... 13 3.1. Pin Assignment ............................................................................................................................ 13 3.2. Pin Description ............................................................................................................................. 14 3.3. GPIO Multiplexing ........................................................................................................................ 16 3.4. Application Interfaces................................................................................................................... 17 3.4.1. UARTs ............................................................................................................................... 17 3.4.2. SPI ..................................................................................................................................... 18 3.4.3. I2C Interface ...................................................................................................................... 20 3.4.4. PWM Interfaces ................................................................................................................. 20 3.4.5. ADC Interfaces .................................................................................................................. 21
4 Operating Characteristics.................................................................................................................... 22 4.1. Power Supply ............................................................................................................................... 22 4.1.1. Reference Design for Power Supply ................................................................................. 22 4.2. Turn On ........................................................................................................................................ 23 4.3. Reset ............................................................................................................................................ 24
5 RF Performances .................................................................................................................................. 26 5.1. Wi-Fi Performances ..................................................................................................................... 26 5.2. Bluetooth Performances .............................................................................................................. 27 5.3. Antenna/Antenna Interfaces ........................................................................................................ 28 5.3.1.1. Antenna Design Requirements ............................................................................... 28 5.3.2. FGM842D RF Coaxial Connector ..................................................................................... 28 5.3.2.1. Receptacle Specifications ....................................................................................... 28 5.3.2.2. Antenna Connector Installation ............................................................................... 29 5.3.2.3. Recommended RF Connector Installation .............................................................. 30 5.3.2.4. Recommended Manufacturers of RF Connector and Cable .................................. 32
6 Electrical Characteristics & Reliability............................................................................................... 33 6.1. Absolute Maximum Ratings ......................................................................................................... 33

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6.2. Power Supply Ratings.................................................................................................................. 33 6.3. Power Consumption..................................................................................................................... 34
6.3.1. Wi-Fi Power Consumption................................................................................................. 34 6.3.2. Bluetooth Power Consumption.......................................................................................... 34 6.4. Digital I/O Characteristics ............................................................................................................ 35 6.5. ESD Protection ............................................................................................................................ 35
7 Mechanical Information ....................................................................................................................... 36 7.1. Mechanical Dimensions ............................................................................................................... 36 7.2. Top and Bottom Views................................................................................................................. 38
8 Storage, Manufacturing & Packaging................................................................................................. 39 8.1. Storage Conditions ...................................................................................................................... 39 8.2. Manufacturing and Soldering ....................................................................................................... 40 8.3. Packaging Specification............................................................................................................... 42 8.3.1. Carrier Tape....................................................................................................................... 42 8.3.2. Plastic Reel ........................................................................................................................ 43 8.3.3. Mounting Direction............................................................................................................. 43 8.3.4. Packaging Process ............................................................................................................ 44
9 Appendix References ........................................................................................................................... 45

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Table Index
Table 1 : Special Mark................................................................................................................................ 10 Table 2 : Basic Information ........................................................................................................................ 11 Table 3 : Key Features ............................................................................................................................... 12 Table 4 : Parameter Description ................................................................................................................ 14 Table 5 : Pin Description ............................................................................................................................ 14 Table 6 : GPIO Multiplexing ....................................................................................................................... 16 Table 7 : Pin Definition of UARTs .............................................................................................................. 17 Table 8 : Pin Definition of SPI .................................................................................................................... 19 Table 9 : Pin Definition of I2C Interface ..................................................................................................... 20 Table 10 : Pin Definition of PWM Interfaces .............................................................................................. 20 Table 11 : Pin Definition of ADC Interfaces ............................................................................................... 21 Table 12 : ADC Features ........................................................................................................................... 21 Table 13 : Pin Definition of Power Supply and GND Pins ......................................................................... 22 Table 14 : Pin Definition of CHIP_EN ........................................................................................................ 23 Table 15 : Wi-Fi Performances .................................................................................................................. 26 Table 16 : Bluetooth Performances ........................................................................................................... 27 Table 18 : Antenna Design Requirements ................................................................................................. 28 Table 19 : Major Specifications of the RF Connector ................................................................................ 29 Table 21 : Absolute Maximum Ratings (Unit: V) ........................................................................................ 33 Table 22 : Module Power Supply Ratings (Unit: V) ................................................................................... 33 Table 23 : Power Consumption in Non-signaling Mode (Unit: mA) ........................................................... 34 Table 24 : Power Consumption in Non-signaling Mode (Unit: mA) ........................................................... 34 Table 25 : VBAT I/O Requirements (Unit: V) ............................................................................................. 35 Table 26 : ESD Characteristics (Unit: kV).................................................................................................. 35 Table 27 : Recommended Thermal Profile Parameters ............................................................................ 41 Table 28 : FGM842D Carrier Tape Dimension Table (Unit: mm) .............................................................. 42 Table 29 : FGM842D-P Carrier Tape Dimension Table (Unit: mm) .......................................................... 42 Table 30 : Plastic Reel Dimension Table (Unit: mm) ................................................................................. 43 Table 31 : Reference Documents .............................................................................................................. 45 Table 32 : Terms and Abbreviations .......................................................................................................... 45

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Figure Index
Figure 2 :FGM842D Pin Assignment (Top View)....................................................................................... 13 Figure 4 : UART1 Connection .................................................................................................................... 18 Figure 5 : UART2 Reference Design ......................................................................................................... 18 Figure 6 : SPI Connection (Master Mode) ................................................................................................. 19 Figure 7 : SPI Connection (Slave Mode) ................................................................................................... 19 Figure 8 : Reference Circuit of Power Supply............................................................................................ 23 Figure 9 : Turn-on Timing........................................................................................................................... 23 Figure 10 : Reference Circuit of CHIP_EN by Using a Driving Circuit ...................................................... 24 Figure 11 : Reference Circuit of RESET with a Button .............................................................................. 24 Figure 12 : Reset Timing ............................................................................................................................ 25 Figure 18 : Dimensions of the Receptacle (Unit: mm) ............................................................................... 29 Figure 19 : Space Factor of the Mated Connectors (Unit: mm)................................................................. 30 Figure 20 : Plug in a Coaxial Cable Plug ................................................................................................... 31 Figure 21 : Pull out a Coaxial Cable Plug .................................................................................................. 31 Figure 22 : Install the Coaxial Cable Plug with Jig..................................................................................... 32 Figure 24 :FGM842D Top and Side Dimensions....................................................................................... 36 Figure 25 :FGM842D Bottom Dimensions (Bottom View) ......................................................................... 37 Figure 29 : FGM842D Top and Bottom Views ........................................................................................... 38 Figure 31 : Recommended Reflow Soldering Thermal Profile .................................................................. 40 Figure 32 : Carrier Tape Dimension Drawing (Unit: mm) .......................................................................... 42 Figure 33 : Plastic Reel Dimension Drawing ............................................................................................. 43 Figure 34 : Mounting Direction ................................................................................................................... 43 Figure 35 : Packaging Process .................................................................................................................. 44

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1 Introduction
QuecOpen® is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:
Realize embedded applications' quick development and shorten product R&D cycle Simplify circuit and hardware structure design to reduce engineering costs Miniaturize products Reduce product power consumption Apply OTA technology Enhance product competitiveness and price-performance ratio
This document defines FGM842D in QuecOpen® solution and describes its air interfaces and hardware interfaces, which are connected with your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, as well as other related information of the module.
Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FGM842D is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm

1.1. Special Mark
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Table 1: Special Mark

Mark [...]

Definition
Brackets ([...]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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2 Product Overview
FGM842D are high performance MCU Wi-Fi 4 and Bluetooth modules supporting IEEE 802.11b/g/n and BLE 5.2 protocols. It provides multiple interfaces including UART, GPIO, SPI, I2C, PWM and ADC for various applications.
It is an SMD module with compact packaging. It includes:
160 MHz MCU processor Built-in 288 KB RAM and 2 MB Flash Support for secondary development

Table 2: Basic Information

FGM842D Packaging type Pin counts Dimensions Weight

LGA 61 FGM842D: (12.5 ±0.2) mm × (13.2 ±0.2) mm × (1.8 ±0.2) mm FGM842D: Approx. 1.05 g

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2.1. Key Features

Wi-Fi&Bluetooth Module

Table 3: Key Features

Basic Information Protocols and Standard Power Supply Temperature Ranges TE-B Kit

Wi-Fi Protocols: IEEE 802.11b/g/n Bluetooth protocol: BLE 5.2 All hardware components are fully compliant with EU RoHS directive
VBAT Power Supply: 3.03.6 V Typ.: 3.3 V Design Solution 1:
- Operating temperature: -40 to +85 °C - Storage temperature: -45 to +95 °
FGM842D-TE-B 1

Antenna/Antenna Interface

Antenna/Antenna

Interfaces

Application Interface 2

FGM842D RF coaxial connector 50 characteristic impedance

Application Interfaces UART, GPIO, SPI, I2C PWM, ADC

1 For more details about the TE-B, see document [1]. 2 For more details about the interfaces, see Chapter 3.3 and Chapter 3.4
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3 Application Interfaces

3.1. Pin Assignment

53 GND
1 GND
2 GND
3 VBAT
4 RESERVED
5 GPIO20
6 GPIO28
7 RESERVED
8 CHIP_EN
9 RESERVED
10 RESERVED
11 GND
52 GND

54 GN D
57 GND
59 GND

48 GND
47 ANT_WIFI/BT
46 GND
45 GND
44 GND
43 GND
42 GND
41 GND
40 GND
39 GND
38 GND
37 GND
36 GND

55 GND
49 GND
60 GND

56 GND
58 GND
61 GND

50 GND
35 GPIO9
34 GPIO7
33 GPIO6
32 GPIO8
31 UART1_TXD
30 UART1_RXD
29 RESERVED
28 RESERVED
27 RESERVED
26 GPIO23
25 RESERVED
51 GND

24 RESERVED
23 GPIO22
22 GPIO21
21 GPIO16
20 UART2_RXD
19 UART2_TXD
18 GPIO17
17 GPIO14
16 GPIO15
15 RESERVED
14 GND
13 GPIO24
12 GPIO26

GND

Power

GPIO

UART

Control RESERVED

Figure 1:FGM842D Pin Assignment (Top View)

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NOTE 1. Keep all RESERVED and unused pins unconnected. 2. All GND pins should be connected to ground. 3. The module provides 2 UARTs and 15 GPIO interfaces by default. In the case of multiplexing, it
can support interfaces including SPI, I2C, PWM and ADC. For more details, see Chapter 3.3 and 3.4.

3.2. Pin Description

Table 4: Parameter Description

Parameter AIO DI DO DIO PI

Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input

DC characteristics include power domain and rated current.

Table 5: Pin Description

Power Supply

Pin Name VBAT GND

Pin No. I/O Description

DC Characteristics

Vmax = 3.6 V

Power supply for

Vmin = 3.0 V

the module

Vnom = 3.3 V

FGM842D: 1, 2, 11, 14, 3646, 4861 FGM842D-P: 1, 2, 11, 14, 3661

Control Signal

Comment
It must be provided with sufficient current of at least 0.6 A.

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Pin Name

Pin No. I/O

CHIP_EN

UARTs

Pin Name

Pin No. I/O

UART1_TXD 31

Description

DC Characteristics

Enable the module VBAT

Comment
Hardware enable. Internally pulled up to 3.3 V. Active high.

Description UART1 transmit

DC Comment
Characteristics

UART1_RXD 30 UART2_TXD 19 UART2_RXD 20 GPIO Interfaces

DI UART1 receive DO UART2 transmit DI UART2 receive

Pin Name GPIO20 GPIO28 GPIO26 GPIO24 GPIO15 GPIO14 GPIO17 GPIO16 GPIO21 GPIO22 GPIO23 GPIO8

Pin No. I/O Description

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

VBAT DC
Comment Characteristics

VBAT

Wakeup.

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GPIO6 GPIO7 GPIO9

General-purpose

DIO

input/output

General-purpose

DIO

input/output

General-purpose

DIO

input/output

FGM842D RF Antenna Interface

Pin Name

Pin No. I/O Description

ANT_WIFI/BT 47 RESERVED Pins

Wi-Fi/Bluetooth AIO
antenna interface

DC Characteristics

Comment
50 characteristic impedance.

Pin Name

Pin No.

Comment

RESERVED 4, 7, 9, 10, 15, 24, 25, 2729

Keep them open.

3.3. GPIO Multiplexing
The module provides 15 GPIO interfaces by default, and can support up to 19 GPIO interfaces in the case of multiplexing. Pins are defined as follows:

Table 6: GPIO Multiplexing

Pin Name GPIO14

Pin No.

Alternate Function 0 (GPIO No.)

GPIO14

Alternate Function 1
SPI_CLK

GPIO17

SPI_MISO

GPIO16

SPI_MOSI

GPIO15

SPI_CS

UART2_TXD 19

GPIO0

UART2_RXD 20

GPIO1

ADC5

GPIO23

Alternate Alternate Alternate Function 2 Function 3 Function 4

I2C_SDA -

I2C_SCL

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GPIO6

GPIO7

GPIO8

GPIO9

GPIO21

UART1_RXD 30

UART1_TXD 31

GPIO22

GPIO28

GPIO20

GPIO24

GPIO26

GPIO6 GPIO7 GPIO8 GPIO9 GPIO21 GPIO10 GPIO11 GPIO22 GPIO28 GPIO20 GPIO24 GPIO26

CLK13M PWM1 PWM2 PWM3 ADC6 ADC4 ADC3 LPO_CLK PWM5

PWM0

JTAG_TCK -

JTAG_TMS -

JTAG_TDI CLK26M

JTAG_TDO -

PWM4

I2C_SCL

ADC2

I2C_SDA ADC1

NOTE
1. All GPIO can be used as sleep interrupt to wake up the module which will immediately enter the operating state after being awakened.
2. The maximum number of each application interface multiplexed with GPIOs is not available simultaneously. For more details, see Chapter 3.4.

3.4. Application Interfaces
3.4.1. UARTs
The module provides 2 UARTs by default which can all support full-duplex asynchronous serial communication at a baud rate up to 6 Mbps.

Table 7: Pin Definition of UARTs

Pin Name

Pin No.

I/O

UART1_TXD

Description UART1 transmit

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UART1_RXD

UART2_TXD

UART2_RXD

UART1 receive

UART2 transmit

UART2 receive

The UART1 can be used for downloading, debugging and AT command communication with the default baud rate of 115200 bps. The UART1 connection between the module and the MCU is illustrated below.

UART1_TXD UART1_RXD

UART_RXD UART_TXD

GND

Module

MCU

Figure 2: UART1 Connection

The UART2 can be used for the output of partial logs with the debugging tools, and the default baud rate is 921600 bps. The following is reference design of UART2.

UART2_TXD UART2_RXD

Test Points

TVS
Module Figure 3: UART2 Reference Design

3.4.2. SPI
In the case of multiplexing, the module provides 1 SPI that supports both master and slave modes. The maximum clock frequency of the interface can reach 30 MHz in master mode, and 20 MHz in slave mode.

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Table 8: Pin Definition of SPI Alternate
Pin Name Pin No. Function

GPIO15 16

SPI_CS

GPIO14 17

SPI_CLK

GPIO17 18 GPIO16 21

SPI_MISO SPI_MOSI

I/O Description

Comment

DIO SPI chip select DIO SPI clock

In master mode, it is an output signal; In slave mode, it is an input signal.
In master mode, it is an output signal; In slave mode, it is an input signal.

DIO SPI master-in slave-out

DIO SPI master-out slave-in

The following figure shows the SPI connection between the host and the slave:

SPI_CS SPI_CLK SPI_MOSI SPI_MISO
Module

SPI_CS SPI_CLK SPI_MOSI SPI_MISO
SPI (Slave)

Figure 4: SPI Connection (Master Mode)

SPI_CS SPI_CLK SPI_MOSI SPI_MISO
Module

SPI_CS SPI_CLK SPI_MOSI SPI_MISO
SPI (Master)

Figure 5: SPI Connection (Slave Mode)

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3.4.3. I2C Interface
In the case of multiplexing, the module provides 1 I2C interface which supports the master and slave modes. The interface supports standard (up to 100 kbps) and fast (up to 400 kbps) modes with 7-bit addressing. If low level on SCL or bus idle duration is greater than the software-defined threshold, it will generate an interrupt to the MCU.

Table 9: Pin Definition of I2C Interface

Pin Name GPIO17 GPIO15 GPIO24 GPIO26

Pin No. Alternate Function

I2C_SDA

I2C_SCL

I2C_SDA

I2C_SCL

I/O

Description

DIO

I2C serial data

I2C serial clock

DIO

I2C serial data

I2C serial clock

NOTE Reserve 110 k pull-up resistors to VBAT when I2C interface is connected to an external equipment.

3.4.4. PWM Interfaces
In the case of multiplexing, the module supports up to 6 32-bit PWM interfaces.

Table 10: Pin Definition of PWM Interfaces

Pin Name GPIO6 GPIO7 GPIO8 GPIO9 GPIO24 GPIO26

Pin No.

Alternate Function

I/O

PWM0

PWM1

PWM2

PWM3

PWM4

PWM5

Description PWM0 out PWM1 out PWM2 out PWM3 out PWM4 out PWM5 out

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3.4.5. ADC Interfaces
In the case of multiplexing, the module supports up to 6 10-bit ADC interfaces, whose voltage range is 0~3.3 V. To improve ADC accuracy, surround ADC traces with ground.

Table 11: Pin Definition of ADC Interfaces

Pin Name

Pin No.

UART2_RXD 20

UART1_RXD 30

GPIO28

GPIO20

GPIO24

GPIO26

Alternate Function ADC5 ADC6 ADC4 ADC3 ADC2 ADC1

I/O Description AI General-purpose ADC interface AI General-purpose ADC interface AI General-purpose ADC interface AI General-purpose ADC interface AI General-purpose ADC interface AI General-purpose ADC interface

Table 12: ADC Features

Parameter

Min.

Typ.

Max.

Unit

ADC Voltage Range

3.3

ADC Resolution

bit

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4 Operating Characteristics

4.1. Power Supply
Power supply pin and ground pins of the module are defined in the following table.

Table 13: Pin Definition of Power Supply and GND Pins

Pin Name VBAT GND

Pin No.

I/O

Description

Min.

Power supply for the

3.0

module

FGM842D: 1, 2, 11, 14, 3646, 4861 FGM842D-P: 1, 2, 11, 14, 3646, 4861

Typ. Max. Unit

3.3

3.6

4.1.1. Reference Design for Power Supply
The module is powered by VBAT, and it is recommended to use a power supply chip that can provide at least 0.6 A output current. For better power supply performance, it is recommended to parallel a 22 F decoupling capacitor, and two filter capacitors (1 F and 100 nF) near the module's VBAT pin. C4 is reserved for debugging and not mounted by default. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.
VBAT reference circuit is shown below:

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VBAT

Wi-Fi&Bluetooth Module Series VBAT

D1 C1 C2 C3 C4
22 F 1 F 100 nF NM

Module

Figure 6: Reference Circuit of Power Supply

4.2. Turn On
After the module VBAT is powered on, keep the CHIP_EN at high level to realize the automatic startup of the module.

Table 14: Pin Definition of CHIP_EN

Pin Name

Pin No.

I/O

CHIP_EN

The turn-on timing is shown below:

Description Enable the module

Comment
Hardware enable. Internally pulled up to 3.3 V. Active high.

10 ms

VBAT CHIP_EN
Module Status

> 1 s
Booting Active

Figure 7: Turn-on Timing

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4.3. Reset
When the voltage of CHIP_EN drops below 0.3 V or pull CHIP_EN down for at least 1 ms, the module can be reset. The reference design for hardware resetting of the module are shown below. An open collector driving circuit can be used to control the CHIP_EN pin.
CHIP_EN

Control

4.7 k R1

Q1 47 k
R2

Figure 8: Reference Circuit of CHIP_EN by Using a Driving Circuit
Another way to control the CHIP_EN is by using a button directly. When pressing the button, an electrostatic strike may generate from finger. Therefore, a TVS component shall be placed near the button for ESD protection.
S1
CHIP_EN

TVS

Closed to S1
Figure 9: Reference Circuit of RESET with a Button

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The module reset timing is illustrated in the following figure.

Wi-Fi&Bluetooth Module Series

VBAT CHIP_EN

T 1 ms VIL 0.3 V

VIH 2.4 V

Figure 10: Reset Timing

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5 RF Performances

5.1. Wi-Fi Performances

Table 15: Wi-Fi Performances

Operating Frequency

2.4 GHz: 2.4002.4835 GHz

Modulation

DSSS, CCK, BPSK, QPSK, 16QAM, 64QAM

Operating Mode
AP STA AP + STA
Encryption Mode

WPA-PSK, WPA2-PSK, WPA3-SAE, AES-128, TRNG

Transmission Data Rate

802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 0MCS 7)

Condition (VBAT = 3.3 V; Temp.: 25 °C) EVM

Typ.; Unit: dBm, Tolerance: ±2 dB Transmitting Power Receiver Sensitivity

802.11b @ 1 Mbps

-98

35 %

802.11b @ 11 Mbps

-90

2.4 GHz

802.11g @ 6 Mbps

-5 dB 16

-90

802.11g @ 54 Mbps

-25 dB 15

-76

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802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7

-5 dB 15 -27 dB 14

Wi-Fi&Bluetooth Module Series
-90 -72

5.2. Bluetooth Performances

Table 16: Bluetooth Performances

Operating Frequency

2.4002.4835 GHz

Modulation

GFSK

Operating Mode

BLE

Condition (VBAT = 3.3 V; Temp.: 25 °C)

Typ.; Unit: dBm, Tolerance: ±2 dB

Transmitting Power

Receiver Sensitivity

BLE (1 Mbps)

-96

BLE (2 Mbps)

-94

BLE (S = 2)

-96

BLE (S = 8)

-101

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5.3. Antenna/Antenna Interfaces
Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

5.3.1.1. Antenna Design Requirements

Table 17: Antenna Design Requirements

Parameter Frequency Range (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max. input power (W) Input impedance () Polarization type

Requirement 2.4002.4835 < 1 2 (Typ.) 1 (Typ.) 50 50 Vertical

5.3.2. FGM842D RF Coaxial Connector
5.3.2.1. Receptacle Specifications The mechanical dimensions of the receptacle supported by the module are as follows.

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Figure 11: Dimensions of the Receptacle (Unit: mm)

Table 18: Major Specifications of the RF Connector

Item Nominal Frequency Range Nominal Impedance Temperature Rating
Voltage Standing Wave Ratio (VSWR)

Specification
DC to 6 GHz
50
-40 °C to +105 °C Meet the requirements of: Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz)

5.3.2.2. Antenna Connector Installation The mated plug listed in the following figure can be used to match the connector.

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Figure 12: Space Factor of the Mated Connectors (Unit: mm)
5.3.2.3. Recommended RF Connector Installation The pictures for plugging in a coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

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Figure 13: Plug in a Coaxial Cable Plug
The pictures of pulling out the coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

Figure 14: Pull out a Coaxial Cable Plug
The pictures of installing the coaxial cable plug with a jig is shown below, = 90° is acceptable, while 90° is not.

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Figure 15: Install the Coaxial Cable Plug with Jig 5.3.2.4. Recommended Manufacturers of RF Connector and Cable RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com.

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6 Electrical Characteristics & Reliability

6.1. Absolute Maximum Ratings

Table 19: Absolute Maximum Ratings (Unit: V)

Parameter VBAT Voltage at Digital Pins Voltage at ADC[1:6]

Min. -0.3 -0.3 0

Max. 3.6 3.6 3.6

6.2. Power Supply Ratings

Table 20: Module Power Supply Ratings (Unit: V)

Parameter VBAT

Description
Power supply for the module

Condition

Min.

The actual input voltages must be kept between the minimum and maximum 3.0 values.

Typ. 3.3

Max. 3.6

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6.3. Power Consumption

6.3.1. Wi-Fi Power Consumption

Table 21: Power Consumption in Non-signaling Mode (Unit: mA)

Condition 802.11b
2.4 GHz 802.11g 802.11n

Tx 1 Mbps @ 18 dBm Tx 11 Mbps @ 18 dBm Tx 6 Mbps @ 16 dBm Tx 54 Mbps @ 15 dBm Tx HT20 MCS 0 @ 15 dBm Tx HT20 MCS 7 @ 14 dBm

IVBAT (Typ.) 267.11 271.50 246.18 245.68 245.40 233.00

6.3.2. Bluetooth Power Consumption

Table 22: Power Consumption in Non-signaling Mode (Unit: mA)

Condition BLE (1 Mbps) BLE (2 Mbps) BLE (S = 2) BLE (S = 8)

IVBAT (Typ.) 90.54 65.13 81.73 103.67

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6.4. Digital I/O Characteristics

Table 23: VBAT I/O Requirements (Unit: V)

Parameter VIH VIL VOH VOL

Description High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage

Wi-Fi&Bluetooth Module Series

Min. 0.7 × VBAT 0 0.9 × VBAT -

Max. VBAT 0.3 × VBAT 0.1 × VBAT

6.5. ESD Protection
Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 24: ESD Characteristics (Unit: kV)

Model Human Body Model (HBM) Charged Device Model (CDM)

Test Result ±2 ±0.5

Standard ANSI/ESDA/JEDEC JS-001-2017 ANSI/ESDA/JEDEC JS-002-2018

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Wi-Fi&Bluetooth Module Series
7 Mechanical Information
This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
7.1. Mechanical Dimensions

Figure 16:FGM842D Top and Side Dimensions

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Figure 17:FGM842D Bottom Dimensions (Bottom View) NOTE The package warpage level of the module refers to the JEITA ED-7306 standard.

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7.2. Top and Bottom Views

Wi-Fi&Bluetooth Module Series

Figure 18: FGM842D Top and Bottom Views
NOTE 1. Images above are for illustrative purposes only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel.

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8 Storage, Manufacturing & Packaging
8.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 3560 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the third requirement mentioned above; Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours; Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.

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NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be TBD mm. For more details, see document [3].
The recommended peak reflow temperature should be 235246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Temp. (°C)

246 235 217 200
Soak Zone

150

Reflow Zone
Ramp-up slope: Cool-down slope:
03 °C/s C -30 °C/s

100

Ramp-to-soak slope: 03 °C/s

Figure 19: Recommended Reflow Soldering Thermal Profile

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Table 25: Recommended Thermal Profile Parameters

Factor Soak Zone Ramp-to-soak slope Soak time (between A and B: 150 °C and 200 °C) Reflow Zone Ramp-up slope Reflow time (D: over 217 °C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle

Recommended Value
03 °C/s 70120 s
03 °C/s 4070 s 235246 °C -30 °C/s
1

NOTE
1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module's shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours' Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

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8.3. Packaging Specification
This chapter outlines the key packaging parameters and processes. All figures below are for reference purposes only, as the actual appearance and structure of packaging materials may vary in delivery. The modules are packed in a tape and reel packaging as specified in the sub-chapters below.
8.3.1. Carrier Tape
Carrier tape dimensions are illustrated in the following figure and table:

Figure 20: Carrier Tape Dimension Drawing (Unit: mm)

Table 26: FGM842D Carrier Tape Dimension Table (Unit: mm)

0.4

13.6

12.6

2.3

3.2

14.2

1.75

Table 27: FGM842D-P Carrier Tape Dimension Table (Unit: mm)

0.4

13.6

2.3

3.2

14.2

1.75

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8.3.2. Plastic Reel
Plastic reel dimensions are illustrated in the following figure and table:

Figure 21: Plastic Reel Dimension Drawing

Table 28: Plastic Reel Dimension Table (Unit: mm)

øD1

øD2

380

100

32.5

8.3.3. Mounting Direction

Figure 22: Mounting Direction FGM842D_Hardware_Design

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8.3.4. Packaging Process

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Place the modules onto the carrier tape cavity and cover them securely with cover tape. Wind the heat-sealed carrier tape onto a plastic reel and apply a protective tape for additional protection. 1 plastic reel can pack 1000 modules.

Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, and vacuumize it.

Place the vacuum-packed plastic reel into a pizza box.

Place the 4 packaged pizza boxes into 1 carton and seal it. 1 carton can pack 4000 modules.
Figure 23: Packaging Process
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9 Appendix References

Table 29: Reference Documents
Document Name [1] Quectel_FGM842D_TE-B_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note

Table 30: Terms and Abbreviations

Abbreviation ADC AES AP BLE BPSK CCK CDM DSSS ESD EVM GFSK GND GPIO

Description Analog-to-Digital Converter Advanced Encryption Standard Access Point Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Charged Device Model Direct Sequence Spread Spectrum Electrostatic Discharge Error Vector Magnitude Gauss frequency Shift Keying Ground General-Purpose Input/Output

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HT I/O I2C IEEE JTAG LCC Mbps MCU MISO MOSI OTA PCB PSK PWM QAM QPSK RAM RF RoHS SAE SMD SMT SPI STA TBD TRNG TVS

Wi-Fi&Bluetooth Module Series
High Throughput Input/Output Inter-Integrated Circuit Institute of Electrical and Electronics Engineers Joint Test Action Group Leadless Chip Carrier (package) Million Bits Per Second Microcontroller Unit Master In Slave Out Master Out Slave In Over-the-Air Printed Circuit Board Pre-Shared Key Pulse Width Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Random Access Memory Radio Frequency Restriction of Hazardous Substances Simultaneous Authentication of Equals Surface Mount Device Surface Mount Technology Serial Peripheral Interface Station To Be Determined True Random Number Generator Transient Voltage Suppressor

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Tx UART (U)SIM VIH VIL Vmax Vmin Vnom VOH VOL VSWR WPA

Wi-Fi&Bluetooth Module Series
Transmit Universal Asynchronous Receiver/Transmitter (Universal) Subscriber Identity Module High-level Input Voltage Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage Value High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio Wi-Fi Protected Access

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FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023FGM842D. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: Bluetooth/Bluetooth LE/Wi-Fi 2.4G:-0.10 dBi
5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:"Contains Transmitter Module FCC ID: XMR2023FGM842D." or "Contains FCC ID: XMR2023FGM842D." must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may

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be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. IC Certification Requirements.
This device contains licence-exempt transmitteris)/receivers) that comply with Innovation, Science and EconomicDevelopment Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device.
To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: Bluetooth/Bluetooth LE/Wi-Fi 2.4G:-0.10 dBi
L'appareil contient un émetteur / récepteur exempté de licence conforme au CNR exempté de licence d'innovation, sciences et développement économique Canada. Les opérations sont soumises aux deux conditions suivantes:
1. Cet appareil peut ne pas causer d'interférence.
L'appareil doit accepter toute interférence, y compris celles qui peuvent entraîner un fonctionnement ind ésirable de l'appareil.
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. To comply with RSS-102 RF Exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for the transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word "Contains" or similar wording expressing the same meaning, as follows: " Contains IC: 10224A-2023FGM842D " or " where: 10224A-2023FGM842D is the module ' s

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certification number".

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References

Microsoft Word 2019