Belkin AUD005 Over-Ear Headphones Die Layout

Brand: Belkin

Document Revision: A 00

Die Layout Overview

This section details the layout for the packaging of the Belkin AUD005 Over-Ear Headphones. It includes various components and their specifications.

Components and Materials:

Outer Box: 350gsm C1S paper. Dimensions are detailed in the layout.
Paper Hanger: Material: 400gsm C2S + 4000gsm C2S.
Cable Slot Filler: 70gsm Wood Free Paper.
FCC/Legal Statement: Printed on 70gsm Wood Free Paper.
QIG (Quick Start Guide): Printed on 70gsm Wood Free Paper.
Paper Wafer Seal (2pcs): Material details not specified in this view.

Diagram Description: The main visual shows a flat, unfolded representation of the outer box (die cut) with various fold lines and cutouts. To the right, there are smaller diagrams illustrating the components like the paper hanger, cable slot filler, QIG, and seals, along with their respective dimensions and material callouts. A grid of smaller product images is also present, likely for placement or reference.

Material and Dimension Specifications

Retail Outside Dimension (Including Hang Tab):

L x W x D (in): Not explicitly stated in numerical format, but visual cues suggest dimensions.
L x W x D (mm): Not explicitly stated in numerical format.

Blank Size Specifications:

Material: Please refer to drawing for specific material details.
Blank Size (in): 65.053 x 24+3/8
Blank Size (mm): 1652.335 x 619+1/8

General Specifications:

Unit: IN/MM
Side Shown: PRINT SIDE
Flute/Grain: horizontal
Tolerance: +/- 1/32" (0.8mm)
Drawing Scale: 1:1

Release Date: 05/30/2023

Dieline: Intermediate

Print Specifications

Color Plates: Not specified.
Finish: Not specified.
Notes: Do not print die lines, printers notes.

Confidentiality Notice

This document and the information within it are the confidential property of Belkin International and must not be copied, reproduced, or used in any manner without the written consent of Belkin Corporation. It must be returned upon request.

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