User Manual for Cnstar Electronic models including: HC03RFM, ISM Transceiver Module, HC03RFM ISM Transceiver Module, Transceiver Module, Module
Shenzhen Cnstar Electronic CO., LTD HC03RFM 2A7I8HC03RFM 2A7I8HC03RFM hc03rfm
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DocumentDocumentHC03RFM HC03RFM V1.1 ISM Transceiver Module With +13dBm Output Power Notes: The purpose of this HC03RFM specification covers mainly for the hardware and RF parameter information of the module, and for the software information, please refer to CMT2300A chip datasheet and demo program of HopeDuino Development Kit. HC03RFM 1. General Introduction HC03RFM module is based on the high performance CMOSTEK NextGenRF CMT2300A chip. It operates at 433.92MHz ISM frequency band, and provides down to 118dBm receiving sensitivity coupled with up to +13dBm output power. 2. Features Up to 131dB maximum link budget. Low RX current of 7mA. Up to +13dBm output power. Programmable bit rate up to 300kbps @FSK. High sensitivity: down to -118dBm. FSK modulation. SMD Package (16x16X3.0mm) 3. Applications Meter Reading Wireless data collection Automobile security system Home automation and security system 4. Pin Definition 4.1 HC03RFM Pin Definition HC03RFM V1.1 Figure 1. HC03RFM Pin Definition Table 1. HC03RFM Pin Description Number 1 2 3 Definition ANT 3.3V(VDD) GND 4 NC 5 CSB 6 SCK 7 FCSB 8 SDIO 9 GPIO1 10 GPIO3 11 GPIO2 12 NC 13 NC 14 GND Type AI/ AO PI G I I I I/O I/O G Function RF signal input/output. Power supply input, 1.8-3.6V. Ground. No Connect. SPI chip select input, active low. SPI clock input. SPI FIFO select input, active low. SPI data input and output. General Purpose Digital I/O that may be configured through the registers to perform various functions. No Connect. No Connect. Ground. Notes: [1]. INT1 and INT2 are interrupts. DOUT is demodulated output. DIN is a modulation input. DCLK is a modulation or demodulation data rate synchronization clock, automatic switching in TX/RX mode. [2]. The SCLK pin connects an internal pull-down resistor of 4.7k inside the chip. Thus in low-power applications, the MCU cannot output high level (pull up), otherwise it will generate leakage current and will cause low-power implementation failure. [3]. The SDIO pin connects an internal pull-up resistor of 15k inside the chip. Thus in HC03RFM V1.1 low-power applications, the MCU cannot output low level (pull down), otherwise it will generate leakage current and will cause low-power implementation failure. [4]. The GPIO pins connect an internal pull-up resistor of 15k inside the chip. Thus in low-power applications, the MCU cannot output low level (pull down), otherwise it will generate leakage current and will cause low-power implementation failure. 5. Electrical Parameter Absolute Maximum Rating parameter Positive Power Supply Voltage On Digital Control Inputs Voltage On Analog Inputs RX Input Power Storage Temperature Soldering Temperature(10s) ESD Rating (Human Body Model) minimum -0.3 -0.3 -0.3 -55 -2 maximum +3.6 VDD + 0.3 VDD + 0.3 +10 +125 +255 2 unit V V V dBm KV Recommended Working Range parameter Positive Power Supply Working Temperature Supply Voltage Slew Rate minimum +1.8 -40 1 maximum +3.6 +85 - unit V mV/us DC Characteristic parameter HC03RFM TX Working Current conditions 433.92MHz band, Pout =+13dBm minim um - typical maximum unit 30 mA HC03RFM RX Working Current 433.92MHz band, - 7 mA HC03RFM Sleep Current All band - - 1 uA Transmitter AC Characteristic parameter conditions HC03RFM 433.92MHz band Output Power Symbol Rate, FSK Mode Programmable Frequency Deviation, FSK Frequency Resolution Programmable minimum - typical +13 maximum unit - dBm 0.1 - 300 kbps 1 - 200 KHz - 24.8 - Hz Receiver AC Characteristic parameter conditions RX Sensitivity 433.92MHz band FSK Mode FDEV = 10 kHz, SR = 10.6 kbps, Receiver Bandwidth Blocking Immunity Image Rejection Ratio +/-1MHz offset +/-2MHz offset +/-10MHz offset IF=280KHz HC03RFM V1.1 minimum - typical -118 maximum unit - dBm 50 500 KHz - 52 - 74 - 75 - 35 - dB - - - dB 6. Typical Application Figure 2. HC03RFM Application HC03RFM V1.1 7. Mechanical DimensionAll units in mm Figure5. HC03RFM Mechanical Dimension HC03RFM V1.1 (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module is integrated" has to be labelled with an auxilliary lable stating the FCC ID of the RF Module, such as "Contains FCC ID: 2A7I8HC03RFM "This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation." NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/TV technician for help. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Additionally, this module was tested with a detachable antenna. The specification of rubber rod antenna are as follows. (1) Frequency Range (MHz): 433 ± 5; (2) V.S.W.R: 1.5; (3) Input Impedance (): 50; (4) Gain (dBi): 3.0; HC03RFM V1.1 Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The modular transmitter has its own power supply regulation. 4) The module contains a PR-SMA antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. This transmitter/module must not be collocated or operating in conjunction with any other antenna or transmitter. NOTE: This device complies with Innovation, Science and Economic Development Canada's (ISED)'s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. The equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. The ISED certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labelled to display the ISED certification number for the module, preceded by the word "contains" or similar wording expressing the same meaning, as follows: Contains IC: 28699-HC03RFM NOTE: Cet appareil est conforme aux CNR exemptes de licence d'Industrie Canada . Son fonctionnement est soumis aux deux conditions suivantes : ( 1 ) Ce dispositif ne peut causer d'interférences ; et ( 2 ) Ce dispositif doit accepter toute interférence , y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for the transmitter when the module is installed in the host.