Silicon Labs MG26 and PG26 Families: High-Performance Wireless SoCs and MCUs
Introduction
The Silicon Labs MG26 and PG26 families represent the company's latest advancements in wireless System-on-Chips (SoCs) and general-purpose Microcontrollers (MCUs) for the Internet of Things (IoT) market. These devices offer a compelling combination of large memory capacities, advanced AI/ML acceleration, robust security features, and extensive multiprotocol support, designed to future-proof deployed devices and enable more complex applications.
MG26 Family: Wireless SoC
The MG26 family is Silicon Labs' highest performance wireless SoC for Series 2, leading the market with an optimal combination of link budget, Flash, RAM, and GPIOs. It is particularly well-suited for applications requiring Matter compatibility, concurrent multiprotocol operations (Zigbee, Thread, Bluetooth), and advanced AI/ML capabilities.
Key Features of MG26:
- Large Flash and RAM: Up to 3200 kB Flash and 512 kB RAM, enabling more features, complex applications, and future-proofing against evolving specifications like Matter. Eliminates the need for external flash for Over-The-Air (OTA) updates.
- Rich Peripheral Set: Up to 64 GPIOs and 4 dedicated analog pins for enhanced system integration. An integrated LCD driver supports up to 288 segments for simplified UI design and Bill of Materials (BOM) consolidation.
- High-Performance Compute: A tri-core architecture featuring a 78MHz Arm Cortex-M33 application core, with dedicated cores for radio and security subsystems. An AI/ML accelerator offloads compute-intensive tasks for machine learning, with more RAM supporting more complex ML applications.
- Robust RF Performance: Best-in-class RF performance provides reliable, long-range communication without requiring an external Front End Module (FEM).
- Robust Security: Secure Vault High is designed for PSA Level 3 certification, protecting data and devices against local and remote attacks.
- Low Power: Low active and sleep currents enable operation on coin cell batteries with battery life measured in years.
- Concurrent Multiprotocol (CMP): Supports simultaneous operation of protocols like Zigbee and Thread, either on the same or different channels with hardware-based fast channel switching and concurrent listening.
- Pin Compatibility: Pin-compatible options with MG24 SoCs and Modules allow for easy migration for devices needing more memory and ML capabilities.
MG26 Package Options:
The MG26 family is available in various package sizes:
- 6x6 QFN48 (32 GPIO)
- 6x6 QFN48 (28 GPIO + 4 Analog Input pins)
- 8x8 QFN68 (49 GPIO)
- 8x8 QFN68 (45 GPIO + 4 Analog Input pins)
- 7x7 BGA136 (64 GPIO + 4 Analog Input pins)
MG26 Technical Specifications Summary:
- Core: Arm Cortex-M33 @ 78 MHz
- Max Flash: Up to 3200 kB
- Max RAM: Up to 512 kB
- Security: Secure Vault Mid, Secure Vault High
- RF Sensitivity (802.15.4): -105.4 dBm @ 250 kbps
- RF Sensitivity (BLE 1Mbps): -97.6 dBm
- Active Current (CoreMark): 53.9 µA/MHz
- Sleep Current (EM2): 1.4 µA
- TX Current @ +0 dBm: 5.9 mA
- TX Current @ +10 dBm: 19.5 mA
- RX Current (802.15.4): 6.2 mA
- RX Current (BLE 1 Mbps): 5.4 mA
- Peripherals: USART, EUSART, I2C, 20-bit ADC, ACMP, VDAC, Die Temp Sensor, Segment LCD
- Operating Voltage: 1.71 to 3.8 V
- Operating Temperature: Up to +125°C
- Protocols: Matter, Thread, Zigbee, Bluetooth (1M/2M/LR), Bluetooth mesh, Proprietary, DMP, CMP
MGM260P: Wireless Module
The MGM260P is a 2.4 GHz wireless module based on the xG26 SoC, offering pre-certified radio hardware for reduced development time and cost. It features a compact 12.9 x 15.0 mm package and shares many of the core benefits of the MG26 SoC.
Key Features of MGM260P:
- Large Memory: Up to 512 kB RAM and 3200 kB Flash.
- Concurrent Multiprotocol Support: Zigbee & Thread CMP for end devices.
- AI/ML Accelerator: Faster inferencing with 8x speed and 6x lower power, improved audio inferencing with large RAM.
- Secure Vault High: PSA Level 3 certified security.
- PLFRCO: Eliminates the need for a 32 kHz crystal.
- Advanced Sensing: 16-bit ADC.
- Easy Migration: Pin compatible with xGM240P modules.
- Certifications: Shielded, fully certified (FCC, IC, CE, MIC, KCC).
MGM260P Technical Specifications Summary:
- Core: Arm Cortex-M33 @ Up to 78 MHz
- Max Flash: Up to 3200 kB
- Max RAM: Up to 512 kB
- RF Performance: -98.3 dBm RX @ BLE 1 Mbps, -106.1 dBm RX @ 802.15.4, Up to +20 dBm output power.
- Low Power: 1.4 µA EM2 sleep current, 5.7 mA RX current @ 1 Mbps, 6.8 mA @ 0 dBm TX current, 19.4 mA @ +10 dBm TX current.
- Operating Range: 1.8 to 3.8 V, -40°C to +125°C operating temperature.
PG26 Family: General-Purpose MCU
The PG26 family is a more general-purpose Series 2 MCU designed to address a broader range of applications. It offers larger memory options, more GPIOs, and an AI/ML hardware accelerator, while maintaining firmware and package compatibility with other Series 2 devices.
Key Features of PG26:
- Large Memory Options: Up to 3200 kB Flash and 512 kB RAM, enabling more features and applications.
- High GPIO Count: Up to 64 GPIOs and 4 additional analog-only pins reduce the need for external components and allow for better system integration.
- AI/ML Hardware Accelerator: Provides 8x faster inferencing at 6x lower power, improving latency and efficiency for machine learning tasks. Large RAM supports more complex AI/ML algorithms and larger customer applications.
- Segment LCD Driver: Integrated driver supports up to 288 segments for simplified UI design and BOM consolidation.
- Robust Security: Secure Vault High provides upgraded security over previous Series, consistent across wired and wireless platforms.
- Compatibility: Firmware and package compatibility with other Series 2 Wireless SoCs (like MG26) and MCUs, simplifying designs and SKU management. Software compatible with xG2x Wireless SoCs.
- Multi-Core Architecture: An isolated security subsystem and core ensure best-in-class security and dedicate more MCU cycles to customer applications.
PG26 Package Options:
The PG26 family is available in various package sizes:
- 6x6 QFN48 (28 GPIO + 4 Analog Input pins)
- 8x8 QFN68 (48 GPIO + 4 Analog Input pins)
- 7x7 BGA136 (64 GPIO + 4 Analog Input pins)
PG26 Technical Specifications Summary:
- Core: Arm Cortex-M33 @ Up to 80 MHz
- Max Flash: Up to 3200 kB
- Max RAM: Up to 512 kB
- Ultra Low Power: 42.8 µA/MHz EM0 @ 80 MHz, 1.4 µA EM2 with 16 kB RAM retention.
- Low Power Peripherals: 4x EUSART, 3x USART (7x UART), 4x I2C, 16-bit ADC, 2x 12-bit VDAC, 2x ACMP, Temperature sensor (+/- 1.5°C).
- Operating Range: 1.71 to 3.8 V, +125°C operating temperature.
AI/ML Capabilities (MVP)
The Matrix Processor Unit (MVP) is a dedicated hardware accelerator for ML inferencing, significantly enhancing performance and efficiency for AI applications.
- Performance: Up to 8x faster inferencing and 6x lower power consumption compared to a standard Cortex-M core.
- Functionality: Handles multi-dimensional array operations for real and complex data, offloading the main MCU. Includes an MVP Math Library usable for non-ML applications.
- Applications:
- Sensor Acceleration: Signal processing for time-series data, predictive/preventative maintenance, anomaly detection (air quality, usage, leaks), condition-based monitoring (machine health, cold chain, battery), bio-signal analysis (healthcare, EKG), accelerometer use-cases (fall detection, pedometer), agricultural monitoring (cow health).
- Audio: Audio pattern matching for security (glass break, scream, shot detection), cough detection, machine malfunction detection, breath monitoring.
- Voice: Voice commands (10-word sets for smart appliances), wake-word detection, smart device voice control, voice assistant integration.
- Vision: Low-resolution vision for wake-up on object detection, presence detection, people counting, movement detection, smart city monitoring (parking spots), fingerprint matching.
- Resource Needs: The MG26's increased RAM supports higher resolution, larger ML models, and greater accuracy for these applications.
Multiprotocol Support: DMP and CMP
Silicon Labs' Series 2 devices offer advanced multiprotocol capabilities:
- Dynamic Multiprotocol (DMP): Enables time-sliced operation of two protocols (e.g., BLE and Zigbee) on a single device. This allows for features like direct phone connectivity for enhanced user interfaces, such as commissioning.
- Concurrent Multiprotocol (CMP): Facilitates concurrent operation of protocols like Zigbee and Thread. This can be achieved on the same or different channels, utilizing hardware-based fast channel switching and concurrent listening. This is supported on MG21, MG24 for gateways/hubs (NCP/RCP) and on MG26 for both gateways/hubs and end devices (SoC).
Fast Channel Switching: The system can switch between channels rapidly. When a valid 802.15.4 preamble is detected, the device stays on that channel to receive the entire packet, verifies its validity, and transmits an acknowledgment if required. It then switches to the next channel to repeat the process.
Security: Secure Vault
Silicon Labs' Secure Vault provides robust security features for IoT devices, with different levels offering varying degrees of protection.
| Feature | Secure Vault Base | Secure Vault Mid | Secure Vault High |
|---|---|---|---|
| True Random Number Generator | ✓ | ✓ | ✓ |
| Crypto Engine | ✓ | ✓ | ✓ |
| Secure Application Boot | ✓ | ✓ | ✓ |
| VSE / HSE | -- | ✓ | ✓ |
| Secure Engine | -- | ✓ | ✓ |
| TrustZone | -- | ✓ | ✓ |
| Secure Boot with RTSL | -- | ✓ | ✓ |
| Secure Debug with Lock/Unlock | -- | ✓ | ✓ |
| DPA Countermeasures | -- | -- | ✓ |
| Anti-Tamper | -- | -- | ✓ |
| Secure Attestation | -- | -- | ✓ |
| Secure Key Management | -- | -- | ✓ |
| Advanced Crypto | -- | -- | ✓ |
Secure Vault High is designed for PSA Level 3 certification, offering comprehensive protection against sophisticated attacks.
SoC Family Comparison
A comparison of key features across Silicon Labs' Series 2 SoC families:
| Feature | xG12 | xG21 | xG24 | xG26 |
|---|---|---|---|---|
| Protocols | 2.4 GHz, Sub-GHz | 2.4 GHz | 2.4 GHz | 2.4 GHz |
| Core | Cortex-M4 (40 MHz) | Cortex-M33 (80 MHz) | Cortex-M33 (78 MHz) | Cortex-M33 (78 MHz) |
| Max Flash | 1024 kB | 1024 kB | 1536 kB | 3200 kB |
| Max RAM | 256 kB | 96 kB | 256 kB | 512 kB |
| Security | Secure Vault - Base | Secure Vault - Mid, Secure Vault - High | Secure Vault - Mid, Secure Vault - High | Secure Vault - Mid, Secure Vault - High |
| Rx Sensitivity (15.4) | -102.7 dBm | -104.3 dBm | -105.4 dBm | -105.4 dBm |
| Rx Sensitivity (BLE 1Mbps) | -94.8 dBm | -97.1 dBm | -97.6 dBm | -97.6 dBm |
| Active Current (CoreMark) | 85 µA/MHz | 50.9 µA/MHz | 49.1 µA/MHz | 53.9 µA/MHz |
| Sleep Current (EM2) | 1.5 µA | 4.5 µA | 1.3 µA | 1.4 µA |
| TX Current @ +0 dBm (2.4 GHz) | 9.5 mA | 9.9 mA | 5.0 mA | 5.9 mA |
| TX Current @ +10 dBm (2.4 GHz) | 34 mA | 34.9 mA | 19.1 mA | 19.5 mA |
| TX Current @ +20 dBm (2.4 GHz) | 131 mA | 186.5 mA | 156.8 mA | 152.7 mA |
| RX Current (802.15.4) | 12.5 mA | 9.4 mA | 5.1 mA | 6.2 mA |
| RX Current (BLE 1 Mbps) | 10.9 mA | 8.8 mA | 4.4 mA | 5.4 mA |
| Serial Peripherals | USART, I2C | USART, I2C | USART, EUSART, I2C | USART, EUSART, I2C |
| Analog Peripherals | 12-bit ADC, ACMP, VDAC | 12-bit ADC, ACMP, Die Temp Sensor | 20-bit ADC, ACMP, VDAC, Die Temp Sensor | 20-bit ADC, ACMP, VDAC, Die Temp Sensor, Segment LCD |
| Other | PCTN, LESENSE | -- | -- | -- |
| Operating Voltage | 1.8 V to 3.8 V | 1.71 V to 3.8 V | 1.71 V to 3.8 V | 1.71 V to 3.8 V |
| Package | 7x7 QFN48 (31 GPIO), 8x8 QFN68 (46 GPIO), 8x8 BGA125 (65 GPIO) | 4x4 QFN32 (20 GPIO) | 5x5 QFN40 (26 GPIO), 6x6 QFN48 (32 GPIO), 6x6 QFN48 (28 GPIO + 4 AIN) | 6x6 QFN48 (32 GPIO), 6x6 QFN48 (28 GPIO + 4 AIN), 8x8 QFN68 (49 GPIO), 8x8 QFN68 (45 GPIO + 4 AIN), 7x7 BGA136 (64 GPIO + 4 AIN) |
Development Tools and Kits
Silicon Labs provides a comprehensive ecosystem for developing with the MG26 and PG26 families, including development kits, explorer kits, and radio boards.
Development Kits:
- xG26-DK2608A: xG26 +10 dBm Dev Kit. Features an on-board debugger, signal breakouts, on-board sensors, 20-bit ADC, and AI/ML hardware accelerator.
- xG26-EK2709A: xG26 +10 dBm Explorer Kit. Includes a mikroBUS socket and Qwiic connector.
- PG26-EK2711A: PG26 MCU, QFN68 Explorer Kit.
- MGM260P-EK2713A: xGM260 +20 dBm Explorer Kit.
Pro Kits:
- xG26-PK6028A: xG26 +10 dBm Pro Kit. Designed for advanced development, RF measurements, energy profiling, and external device debug.
- PG26-PK2505A: PG26 MCU, BGA136 Pro Kit.
Radio Board Kits:
These kits utilize existing WSTK (Wireless Starter Kit) main boards and software tools, offering modular development.
- xG26-RB4120A: 8x8 QFN68, +10 dBm Radio Board.
- xG26-RB4121A: 8x8 QFN68, +20 dBm Radio Board.
- XG26-RB4118A: 7x7 BGA136, +10 dBm Radio Board.
- MGM260P-RB4350A: xGM260P +10 dBm Radio Board.
- MGM260P-RB4351A: xGM260P +20 dBm Radio Board.
