MEMS and Sensors - STMicroelectronicsX-NUCLEO-IKS4A1 - Motion MEMS and environmental sensor expansion board for STM32 Nucleo - STMicroelectronics
User Manual for STMicroelectronics models including: X-NUCLEO-IQS4A1, LSM6DSO16IS, LSM6DSV16X, UM3239, UM3239 Motion Mems and Environmental Sensor Expansion Board, Motion Mems and Environmental Sensor Expansion Board, Mems and Environmental Sensor Expansion Board, Environmental Sensor Expansion Board, Sensor Expansion Board, Expansion Board, Board
11 ott 2023 — The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X- · NUCLEO-IQS4A1, which hosts the motion ...
GitHub - STMicroelectronics/X-CUBE-MEMS1: X-CUBE-MEMS1 is an expansion software package for STM32Cube. The software runs on the STM32 and includes drivers that recognize the sensors and collect temperature, humidity, pressure and motion data.
File Info : application/pdf, 23 Pages, 2.35MB
DocumentDocumentUM3239
User manual
Getting started with the X-NUCLEO-IKS4A1 motion MEMS and environmental sensor expansion board for STM32 Nucleo
Introduction
The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board XNUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVALMKE001A, which hosts the Qvar swipe electrodes. It is compatible with the Arduino UNO R3 connector layout and features the LSM6DSO16IS and LSM6DSV16X MEMS 3D accelerometers, the LIS2MDL 3-axis magnetometer, the LIS2DUXS12 3-axis accelerometer, the LPS22DF MEMS pressure sensor, the SHT40AD1B humidity and temperature sensor, and the STTS22H temperature sensor. The X-NUCLEO-IKS4A1 interfaces with the STM32 microcontroller via the I²C pin or, for external sensors mounted on DIL24 adaptor, SPI Pins.
Figure 1. X-NUCLEO-IKS4A1 expansion board
UM3239 - Rev 1 - October 2023 For further information contact your local STMicroelectronics sales office.
www.st.com
UM3239
Getting started
1
Getting started
1.1
Hardware requirements
The X-NUCLEO-IKS4A1 is designed to be used with STM32 Nucleo boards (visit www.st.com for further information).
Figure 2. X-NUCLEO-IKS4A1 plugged on an STM32 Nucleo board
Note:
The X-NUCLEO-IKS4A1 must be connected on the matching pins of any STM32 Nucleo board with the Arduino UNO R3 connector. X-NUCLEO-IKS4A1 components are ESD sensitive and, as the board has male/female pass-through connectors, it is important to handle it with care to avoid bending or damaging the pins.
Related links
See the X-CUBE-MEMS1 product page for firmware and related documentation
UM3239 - Rev 1
page 2/23
UM3239
System requirements
2
System requirements
To complete the system setup, you need:
·
a Windows® (7, 8, 10) PC
·
a USB type A to mini-B USB cable to connect the STM32 Nucleo to the PC
·
board firmware and software package (X-CUBE-MEMS1) installed on the user PC
UM3239 - Rev 1
page 3/23
UM3239
Hardware description
3
Hardware description
The board lets you test the functionality of the motion MEMS accelerometer, gyroscope and magnetometer, and environmental humidity, temperature and pressure sensors, via the I²C communication bus.
It also allows complete testing of all LSM6DSO16IS and LSM6DSV16X functionalities and Qvar touch and swipe gestures. There is also the possibility to attach the STHS34PF80 IR sensor to enable presence and motion detection applications.
The board features:
·
LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000
dps) with ISPU (Intelligent Processing Unit)
·
LIS2MDL: MEMS 3D magnetometer (±50 gauss)
·
LIS2DUXS12: ultralow power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing
·
LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output
barometer
·
SHT40AD1B
·
STTS22H: Low-voltage, ultralow power, 0.5 °C accuracy temperature sensor (-40°C to +125°C)
·
LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope
(±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
·
DIL 24-pin socket available for additional MEMS adapters and other sensors
·
Free comprehensive development firmware library and example for all sensors compatible with
STM32Cube firmware
·
Equipped with Qvar touch/swipe electrode
·
I²C sensor hub features on LSM6DSO and LSM6DSV16X available
·
MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF
·
Compatible with STM32 Nucleo boards
·
Equipped with Arduino UNO R3 connector
·
Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be
connected at the same time of external MEMS through DIL24 adapter
·
Available interface for external camera module applications coupled with LIS2DUXS12 through aux SPI
(3/4 w)
·
RoHS compliant
·
WEEE compliant
·
UKCA compliant
Each device has a separate power supply to allow power consumption measurement of every sensor.
The expansion board is power supply compatible with STM32 Nucleo boards: it mounts an LDO to generate 1.8 V for all the MEMS sensors except for the external sensor mounted on DIL24 adapter, which can be supplied both from 1.8 V and 3.3 V (main supply from Nucleo board).
All signals between the sensors and the main board are translated by a level shifter.
3.1
Default solder bridge configuration
The user can configure several aspects of the X-NUCLEO-IKS4A1 through several solder bridges which can be left open (not mounted) or closed (mounted) to configure different hardware settings.
UM3239 - Rev 1
page 4/23
UM3239
Block diagram
3.2
Block diagram
The LSM6DSO16IS and the LSM6DSV16X have an I²C sensor hub that allows them to behave as the I²C master for other slave devices connected via an I²Caux bus. Various bus configurations are possible to select the I²C master of the environmental/DIL24 sensors.
Mode 1: standard I²C bus connection (all sensors)
In standard I²C mode, all devices are connected to an external main board via the same I²C bus.
The board configuration is:
·
J4: 1-2, 11-12 (STM_SDA = SENS_SDA, HUB_SDx = GND)
·
J5: 1-2, 11-12 (STM_SCL = SENS_SCL, HUB_SCx = GND)
Figure 3. X-NUCLEO-IKS4A1 standard I²C
Mode 2: LSM6DSO16IS I²C sensor hub (all sensors)
In this sensor hub I²C mode, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities by collecting external data through a direct control of the on-board environmental sensors (temperature, pressure and magnetometer) and external sensor (DIL24) through the auxiliary I²Cz bus "SENS_I2C". LSM6DSV16X, LIS2DUXS12 and SHT40AD1B remains connected to the main bus "uC_I2C" coming from the external board.
The board configuration is:
·
J4: 5-6 (HUB2_SDx = SENS_SDA)
·
J5: 5-6 (HUB2_SCx = SENS_SCL)
Figure 4. X-NUCLEO-IKS4A1 LSM6DSO16IS I²C sensor hub
UM3239 - Rev 1
page 5/23
UM3239
Block diagram
Mode 3: LSM6DSV16X I²C sensor hub
In this sensor hub, it is possible to power-up the 6-axes IMU (Inertial Measurement Unit) functionalities by collecting external data through a direct control of the on-board environmental sensors (temperature, pressure and magnetometer) and external sensor (DIL24) through the auxiliary I2C bus "SENS_I2C". LSM6DSO16IS, LIS2DUXS12 and SHT40AD1B remains connected to the main bus "uC_I2C" coming from the external board.
The board configuration is:
·
J4: 7-8 (HUB1_SDx = SENS_SDA)
·
J5: 7-8 (HUB1_SDx = SENS_SDA)
DIL24 adapter (to I²C2): SB16, SB21
Not mounted: SB6, SB10, SB12, SB14, SB18, SB19, SB20, SB22
Figure 5. LSM6DSV16X I²C sensor hub
Mode 4: DIL24 I²C sensor hub (all sensors)
In case a sensor with sensor hub embedded functionality is mounted to the board through DIL24 adapter, it is possible to exploit this functionality as for LSM6DSO16IS and the LSM6DSV16X.
In this configuration, may be necessary to connect the DIL24 to the external board through SPI lines in order to avoid an address conflict on I2C bus with the LSM6DSO16IS and the LSM6DSV16X. This is done by changing the SBx configuration.
The board configuration is:
·
J4: 9-10 (DIL_SDx = SENS_SDA)
·
J5: 9-10 (DIL_SDx = SENS_SDA)
Figure 6. X-NUCLEO-IKS4A1 DIL24, I²C sensor hub (all sensors)
Mode 5: LSM6DSO16IS as Qvar controller
In this configuration, it is possible to use the equipped Qvar swipe electrode (by plugging it on JP6 and JP7 connectors) through the LSM6DSO16IS.
The board configuration is:
·
J4: 3-4 (HUB1_SDx = QVAR1)
·
J5: 3-4 (HUB1_Scx = QVAR2)
UM3239 - Rev 1
page 6/23
3.3
3.4
Note:
3.5
UM3239
Sensor I²C address selection
Sensor I²C address selection
Most sensors allow I²C address LSB selection by pulling the SD0 pin low or high. The board has solder bridges to control SD0 level.
Table 1. Solder bridges for I²C address
Address in bold are the default I2C addresses Sensor
SD0 low
STTS22H (U8)
ADD= 71h
LIS2DUXS12 (U5)
SB19 ADD=31h
LSM6DSO16IS (U9)
SB35 ADD=D5h
LPS22DF (U6)
SB31 ADD=B9h
LIS2MDL (U7)
ADD =3Ch
SHT40AD1B (U10)
ADD= 89h
DIL24 Adapter (J1)
SB43/SB44
LSM6DSV16X (U4)
SB17 ADD=D5h
SD0 high
SB20 ADD=33h SB34 ADD=D7h SB29 ADD=BBh
ADD =3Ch ADD= 89h SB41/SB42 SB15 ADD=D7h
Sensor current consumption measurement
The X-NUCLEO-IKS4A1 expansion board is equipped with OR resistors that allow separate current consumption measurement for each sensor. To measure current consumption, connect an ammeter to the appropriate pads.
As the sensors have very low current consumption, you should set a suitable range and use an ammeter with low burden voltage.
Table 2. Resistors/jumpers for current consumption measurement
Sensor LIS2MDL (U7) LSM6DSO16IS (U9) SHT40AD1B (U10) LIS2DUXS12 (U5) STTS22H (U8) LPS22DF (U6) DIL24 Adapter (J1) LSM6DSV16X
Resistor/jumper R18 R21 R22 R16 R19 R32 JP5 R33
Sensor disconnection
To disconnect a sensor, you should disconnect the I²C bus as well as the power supply. See the table below for the relevant jumpers and solder bridges.
Table 3. Link between sensors, jumpers and I²C solder bridges
Sensor LIS2MDL (U7) LSM6DSO16IS (U9) SHT40AD1B (U10) LIS2DUXS12 (U5)
SDA SB30 SB38 SB39 SB22
SCL SB26 SB36 SB37 SB16
UM3239 - Rev 1
page 7/23
UM3239
Adapter board for DIL24 socket
Sensor STTS22H (U8) LPS22DF (U6) DIL24 Adapter (J1) LSM6DSV16X
SDA SB33 SB28 SB47, SB49, SB48 SB21
SCL SB32 SB25 SB51, SB53, SB52 SB18
3.6
Adapter board for DIL24 socket
An additional sensor can be connected as an adapter board to J6 DIL24 socket.
As there are a few different interrupt signal assignments for DIL24 pins, the appropriate pin can be selected using the J2 header.
Related links
Please visit the ST website to find other available sensors
3.7
Connectors
Connector CN5 CN6 CN8
CN9 1. unlisted pins are not connected.
Table 4. Arduino R3 UNO connectors
Pin(1) 7 9 10 2 4 6 7 8 3 4 5 6 3 4 5 6 7 8
Signal GND I²C SDA I²C SCL 3.3 V 3.3 V GND GND N.C.[FT1] LIS2MDL DRDY LIS2DUXS12 INT STTS22H INT LSM6DSO16IS INT1 USER INT SPI CLK LSM6DSV16X INT2 LSM6DSV16X INT1 LPS22DF INT1 LSM6DSO16IS INT2
UM3239 - Rev 1
page 8/23
Connector CN7
CN10 1. The unlisted pins are not connected.
Table 5. ST morpho connectors
Pin(1) 12 16 20 22 32 34 36 38 3 5 23 25 27 29 31 33
Signal 3.3 V 3.3 V GND GND LIS2MDL DRDY LIS2DUXS12 INT STTS22H INT LSM6DSO16IS INT1 I²C SCL I²C SDA LSM6DSO16IS INT2 LPS22DF INT1 LSM6DSV16X INT1 LSM6DSV16X INT2 SPI CLK USER INT
UM3239
Connectors
UM3239 - Rev 1
page 9/23
page 10/23
UM3239 - Rev 1
SPI
M_INT1
M_INT2
M_INT_Pin16 M_INT_Pin17
M_INT_Pin24
M_SA0/DRDY
M_SA0/DEN
4
Schematic diagrams
Figure 7. X-NUCLEO-IKS4A1 circuit schematic (1 of 4)
U_Arduino_Nucleo Connectors Arduino_Nucleo Connectors.SchDoc
3V3
1V8
STHS34PF80_INT LPS22DF_INT STTS22H_INT
LIS2MDL_DRDY LIS2DUXS12_INT2 LIS2DUXS12_INT1
LSM6DSV16X_INT1 LSM6DSV16X_INT2
LSM6DSO16IS_INT1 LSM6DSO16IS_INT2
I2C2
U_Sensors Sensors.SchDoc
STHS34PF80_INT LPS22DF_INT STTS22H_INT LIS2MDL_DRDY LIS2DUXS12_INT2 LIS2DUXS12_INT1 LSM6DSV16X_INT1 LSM6DSV16X_INT2 LSM6DSO16IS_INT1 LSM6DSO16IS_INT2
STM_I2C
1V8
DIL24_I2C SENS_I2C HUB2_I2C
QVAR2 QVAR1
STM_I2C M_SA0/DEN M_SA0/DRDY M_INT_Pin24 M_INT_Pin17 M_INT_Pin16 M_INT2 M_INT1
U_Adapter Board Adapter Board.SchDoc
DIL_I2C SENS_I2C HUB2_I2C
Q2 Q1
SPI
1V8
3V3
UM3239
Schematic diagrams
UM3239 - Rev 1
2 Morpho connector 1 2 3 1 2 3 Morpho connector
Figure 8. X-NUCLEO-IKS4A1 circuit schematic (2 of 4)
3V3 3V3
Vio
R1 R2 4k7 4k7
SCL SDA
CN7
12 34 56 78 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
Header 19x2
Vout = 0.8*(1+R3/R4)
U1
LDK130M-R
1V8
3V3
1 Vin
Vout 5
1V8
3 EN
Adj 4
R3
C4 10uF
C3 100nF
GND
15k
C2
C5
10uF
100nF
GND GND
GND
R4 12k
GND
GND
GND
Arduino & Morpho Connectors
GND
Vio
CN5
Arduino Connector
LIS2MDL_DRDY_O
LIS2DUXS12_INT_O
LIS2MDL_DRDY_O LIS2DUXS12_INT_O
Arduino Connector Arduino Connector
5V 3V3
CN6
1
JP1
JP2
2
3
4
5
6
7
8
Arduino Connector
10 9 8 7 6 5 4 3 2 1
CN9
SPI_MISO_O SPI_MOSI_O SPI_CS_O
CN8
GND
1
8
7 6
2
5
3
4
4
3
5
2
6
1
SB5 SB6 SB9
SB12
BT_Irq
STTS22H_INT_O LSM6DSO16IS_INT1_O
SB3 SPI_CK_O SB4
USER_INT_O LSM6DSV16X_INT2_O LSM6DSV16X_INT1_O LPS22DF_INT_O
LIS2DUXS12_INT2_O
LSM6DSO16IS_INT2_O
SB7 SB8 SB10 SB11
SB13
SB14
SB1
SDA
SCL
SB2
CN10
12 34 56 78
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
25 26 27 28 29 30 31 32 33 34 35 36 37 38
Header 19x2
I2C2 Vio header
4 3
SCL SDA
2
Vio
1
J1
USER_INT
USER_INT routing selector
J2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TMM-108-01-G-D
C6 100nF
1V8 C8 100nF
Vio
GND
M_INT_Pin24 M_INT1 M_INT2
M_INT_Pin16 M_INT_Pin17
STHS34PF80_INT M_SA0/DRDY M_SA0/DEN
Vio
LSM6DSV16X_INT2_O LIS2DUXS12_INT2_O LSM6DSO16IS_INT2_O LPS22DF_INT_O LSM6DSV16X_INT1_O USER_INT_O LSM6DSO16IS_INT1_O STTS22H_INT_O
1V8
U2 19 VCC(B)
VCC(A) 2
20 18 17 16 15 14 13 12
B1 B2 B3 B4
B5 B6 B7 B8
A1 A2 A3 A4
A5 A6 A7 A8
1 3 4 5 6 7 8 9
10 OE
GND EPAD
11 21
NXS0108BQX
1V8
USER_INT
LSM6DSV16X_INT2 LIS2DUXS12_INT2 LSM6DSO16IS_INT2 LPS22DF_INT LSM6DSV16X_INT1
LSM6DSO16IS_INT1 STTS22H_INT
GND
C7 100nF 1V8
C9 100nF Vio
GND
Vio
LIS2MDL_DRDY_O LIS2DUXS12_INT_O SPI_CK_O SPI_MISO_O SPI_MOSI_O SPI_CS_O SCL SDA
1V8
1V8
U3 19 VCC(B)
VCC(A) 2
20 18 17 16 15
14 13 12
B1
B2 B3 B4 B5 B6 B7 B8
A1
A2 A3 A4 A5 A6 A7 A8
1 3 4 5 6
7 8 9
10 OE
GND EPAD
11 21
NXS0108BQX
GND
LIS2MDL_DRDY LIS2DUXS12_INT1
SPI SCK MISO MOSI CS
I2C I2C_SCL2 SCL I2C_SDA2 SDA
SPI I2C2
UM3239
Schematic diagrams
page 11/23
UM3239 - Rev 1
Figure 9. X-NUCLEO-IKS4A1 circuit schematic (3 of 4)
Accelerometer
VDD
R32 0R C11 100nF
STM_SCL SB19
I2C ADDw = 30h
STM_SDA
C10 10uF
SB16 SB20 I2C ADDw = 32h SB22
1 SCL/SPC 2 CS 3 SDO/SA0 4 SDA/SDI/SDO
Vdd_IO 10 Vdd 9
R34 4k7
INT1 - QV1 12 INT2 - QV2 11
GND 8
ALT INT 7
5 Res 6 GND
U5 LIS2DUXS12
R33 VDD
0R
LIS2DUXS12_INT1 LIS2DUXS12_INT2
LSM6DSV16X_INT1
R15 4k7
SB18 STM_SCL
STM_SDA
SB21
LSM6DSV16X_INT2
SB23
LIS2MDL_DRDY
1 2
JP3
Accelerometer + Gyroscope (HUB 1)
U4 5 VDD_IO
12 13 14
CS SCL SDA
4 9
INT1 INT2
VDD 8
SDO/SA0 SDO_AUX OCS_AUX
1
11 10
SDx/AH1/QVAR1 SCx/AH2/QVAR2
2 3
6 GND 7 GND
LSM6DSV16XTR
I2C ADDw = D6h SB15
SB17
C13 100nF
C12 10uF
I2C ADDw = D4h
VDD
VDD
VDD
R9 R10 R11 R12 R13 R14 4k7 4k7 4k7 4k7 4k7 4k7
STM_SDA STM_SCL HUB2_SCx HUB2_SDx SENS_SCL SENS_SDA
VDD 1V8
SDO_AUX OCS_AUX
HUB1_SCx HUB1_SDx
OCS_AUX SDO_AUX
J7
1 2 3 4
5
1 2 3 4 5
M50-3530542
STM_SCL STM_SDA
I2C SCL
SDA
SENS_SCL SENS_SDA
I2C SCL SDA
STM_I2C SENS_I2C
Pressure sesnsor
SB25 SENS_SCL SENS_SDA
SB28 I2C ADDw = BAh SB29
I2C ADDw = B8h SB31
U6 1 VDD_IO
VDD 10
2 SCL/SPC 4 SDA/SDI/SDO 6 CS
INT_DRDY 7 SDO/SA0 5
8 GND_IO 9 GND 3 RES
LPS22DF
Relative humidity + Temperature
STM_SCL STM_SDA
SB37 SB39
U10
2 SCL 1 SDA
R22
0R VDD 3
VSS
C22 100nF 4
SHT40-AD1B-R3
I2C ADDw = 88h
VDD
DIL_SCx DIL_SDx
I2C SCL SDA
DIL24_I2C
HUB2_SCx HUB2_SDx
I2C SCL SDA
HUB2_I2C
R16 0R C17 100nF
LPS22DF_INT R35 4k7
Magnetometer sesnsor LIS2MDL
VDD
C14 10uF
SB26 SENS_SCL I2C ADDw = 3Ch
SB30 SENS_SDA
1 SCL 2 NC 3 CS 4 SDA/SDI/SDO
NC 12 NC 11
U7 LIS2MDL
C15 100nF
1V8_IO 10 1V8 9 GND 8
INT/DRDY 7
R18 VDD
0R LIS2MDL_DRDY LIS2MDL_DRDY
R17 VDD
0R STHS34PF80_INT
C18
5 C1 6 GND
LPS22DF_INT
C19 220nF
100nF
Accelerometer + Gyroscope (HUB 2)
R21 VDD
0R
I2C ADDw =
70h
R20 0R
SENS_SCL SB32 SENS_SDA
SB33
R23
U9
4k7
I2C ADDw = D6h
C21 100nF
C20 10uF
Infra-red sesnsor connector
C16 100nF
J3
1 3
5 7 9 11
1 3 5 7 9 11
2 4 6 8 10 12
2 4
6 8 10 12
SB24 SB27
SHF-106-01-L-D-SM
I2C ADDw= B4h
R19 VDD
0R
Temperature sesnsor
U8
3 VDD 4 ADDR 1 SCL 6 SDA
AL/INT 2
7 PAD 5 GND
STTS22H
STM_SDA STM_SCL
STTS22H_INT
VDDIO 5 GND 6 GND 7
LSM6DSO16IS_INT1
LSM6DSO16IS_INT2
SB40
LPS22DF_INT
4 INT1 9 INT2
VDD 8 SDO / SA0 1
SB34 SB35
HUB2_SCx 3 HUB2_SDx 2
MSCL MSDA
1 2
JP4
10 RES 11 RES
CS 12 SCL 13 SDA 14
SB36 SB38
STM_SCL STM_SDA
I2C ADDw = D4h
LSM6DSO16IS
SDA ROUTING
SCL ROUTING
HUB1_SDx
HUB2_SDx DIL_SDx STM_SDA
J4 1
3 5 7 9 11
2
4 6
QVAR1
8
10
12 SENS_SDA
TMM-106-01-G-D
HUB1_SCx
HUB2_SCx DIL_SCx STM_SCL
J5
1
2
3
4
5
6
7
8
9
10
11
12
TMM-106-01-G-D
QVAR2 SENS_SCL
I2C routing description
- Place the shunt in order to select the master for the environmental sensors U6,U7,U8 and Adapter, or to enable the Qvar electrode control.
- HUB1 must be connected to GND if not used!
I2C BUS ROUTING + QVAR
UM3239
Schematic diagrams
page 12/23
page 13/23
UM3239 - Rev 1
1V8_IO
R24 R25 4k7 4k7
DIL_I2C SPI
STM_I2C SENS_I2C HUB2_I2C
I2C SCL SDA
DIL24_SCL DIL24_SDA
SPI CS
MISO MOSI
SCK
I2C SCL SDA
I2C SCL SDA
I2C SCL SDA
SPI_CS SPI_MISO SPI_MOSI SPI_CK
SCL2 SDA2
SCL1 SDA1
HUB2_SCL HUB2_SDA
M_INT_Pin24 M_INT_Pin17 M_INT_Pin16 INT2 INT1 M_SA0/DRDY
M_SA0/DEN
M_INT_Pin24 M_INT_Pin17
M_INT_Pin16 M_INT2 M_INT1 M_SA0/DRDY M_SA0/DEN
DIL24_SCL DIL24_SDA
1 2 3
Figure 10. X-NUCLEO-IKS4A1 circuit schematic (4 of 4)
3V3_IO 1V8_IO
1V8 3V3
JP5
DIL24 Socket for Adapter Board
1V8_IO
3V3_IO
J6
1
24
1V8_IO
2
23
DIL24_SCL DIL24_SDA
3 4 5
22 21 20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
DIL24 Socket
M_INT_Pin24 M_SA0/DEN M_SA0/DRDY
M_INT_Pin17 M_INT_Pin16 INT2 INT1
GND
SB41
R26
1V8_IO
SB42
2k2
GND
SB46 SB47 SB48 SB49
SPI_MOSI SDA1 HUB2_SDA
SDA2
SB50 SB51 SB52 SB53
SPI_CK SCL1 HUB2_SCL SCL2
SB54 SB55 SB56
SPI_CS 1V8_IO 1V8_IO
R27 2k2
SB45
SB43 SB44
1V8_IO GND
SPI_MISO
2 x Header 3pin SMD for QVAR electrode
1V8_IO JP6
1
R28
2
Q2
3
4k7
C23
220pF D1
GND
ESDAXLC6 GND
C24 100nF
1V8_IO
JP7
GND
1
R29
2
Q1
3
4k7
C25
220pF D2
ESDAXLC6 GND
GND
GND
QVAR Swipe electrode
Header 3pin SMD for QVAR electrode
QVAR1
1 2
3
1 2 3
VDD_QVAR QVAR1
GND_QVAR
VDD_QVAR
R5 10M
Header 3pin SMD for QVAR electrode
QVAR2
1 2 3
1 2 3
VDD_QVAR QVAR2
QVAR1
R7 10M
GND_QVAR
GND_QVAR
VDD_QVAR
R6 10M
QVAR2
R8 10M
GND_QVAR
UM3239
Schematic diagrams
UM3239
Bill of materials
5
Bill of materials
Item Quantity Reference
1
2
C23, C25
C2, C4,
2
6
C10, C12,
C14, C20
C3, C5,
C6, C7,
C8, C9,
3
12 C11, C13,
C15, C16,
C17, C18,
C21, C22
4
1
C19
5
1
CN5
6
2
CN9, CN6
7
1
CN8
8
2
9
1
10
1
D1, D2 J1 J2
11
1
J3
12
2
J4, J5
13
1
J6
JP1, JP2,
14
5
JP5, JP6,
JP7
15
2
JP3, JP4
16
2
QVAR1, QVAR2
Table 6. X-NUCLEO-IKS4A1 bill of materials
Part / value 220pF 10uF
Description
Multilayer Ceramic Capacitors 220pF ±5% 100V C0G
SMD 0402
CAP CER 0603 10uF 6.3V X5R
20%
Manufacturer TDK Walsin
Part number C1005C0G2A221J050BA
0603X106M6R3CT
100nF
CAP CER 0603 100nF 25V X7R
10%
MULTICOMP
MC0603B104K250CT
220nF SOD-882
CAP CER 0603 220nF 25V X7R
10%
KEMET
1x10 Pin elevated socket
Samtec
1x8 Pin elevated socket
Samtec
1x6 Pin elevated socket
Samtec
Trans Voltage Suppressor Diode, 40W, Bidirectional, 1 Element, Silicon
STMicroelectronics
Header 4
MULTICOMP
16 Position, Dual Row, Shrouded Terminal Strip, 2mm pitch
Adam Tech
12 Position, Dual Row, Shrouded Terminal Strip, 2mm pitch
Samtec
12 Position, Dual Row, Shrouded Terminal Strip, 2mm pitch
Adam Tech
Adapter DIL24
E-TEC
C0603X224K4RACTU ESQ-110-24-T-S ESQ-108-24-T-S ESQ-106-24-T-S ESDAXLC6-1BT2 2211S-04G 2PH2-16-UA
SHF-106-01-L-D-SM
2PH2-12-UA 2BL1-036-G-700-01
Header 3
MULTICOMP
2211S-03G
Header 1x2 pins, 2.54mm, stright
Header_3pin_SMD
MULTICOMP GCT
2211S-02G
BG125-03-A-1-1-0440-ND
UM3239 - Rev 1
page 14/23
Item Quantity Reference
R1, R2,
R9, R10,
R11, R12,
17
15
R13, R14, R15, R23,
R24, R25,
R28, R29,
R34
18
1
R3
19
1
R4
R32, R33,
R16, R17,
20
9
R18, R19,
R20, R21,
R22
21
2
R26, R27
22
4
R5, R6, R7, R8
SB1, SB2,
SB4, SB5,
SB6, SB7,
SB8, SB9,
SB10,
SB11,
SB12,
SB14,
SB15,
SB16,
SB18,
SB20,
SB21,
SB22,
SB23,
SB24,
SB25,
23
40
SB26, SB27,
SB28,
SB29,
SB30,
SB32,
SB33,
SB35,
SB36,
SB37,
SB38,
SB39,
SB40,
SB42,
SB44,
SB47,
SB51,
SB55,
SB56
24
1
U1
Part / value 4k7 15k 12k 0R 2k2 10M
0R
SOT23-5L
Description
Manufacturer
UM3239
Bill of materials
Part number
RES 0603 4k7 1% 1/16W, RESISTOR
YAGEO
RC0603FR-074K7L
RES 0603 15k 1% 1/16W, RESISTOR RES 0603 12k 1% 1/16W, RESISTOR
RES 0603 0R0 1% 1/16W
RES 0603 2k2 1% 1/16W
RES Thick Film, 10M, 1%, 0.1W, 100ppm/°C, 0603
YAGEO YAGEO YAGEO YAGEO YAGEO
RC0603FR-1315KL RC0603FR-1312KL RC0603FR-070RL RC0603FR-132K2L RC0603FR-0710ML
RES 0603 0R0 1% 1/16W
YAGEO
RC0603FR-070RL
LDO Voltage Regulators 300mA
Low Quiescent Crnt low noise
LDO
STMicroelectronics
LDK130M-R
UM3239 - Rev 1
page 15/23
UM3239
Bill of materials
Item Quantity Reference
Part / value
Description
Manufacturer
25
2
U2, U3
IC TRANSLATOR BIDIRECTIONAL
20VQFN
Nexperia
26
1
6-axis IMU with
U4
VFLGA2.5X3X.86 14L P.5 L.475X.25
embedded sensor fusion, AI, Qvar for
high-end
STMicroelectronics
applications
27
1
Ultra-low-power 3-
axis smart
U5
LGA 2X2X0.74MAX 12 LEADS
accelerometer with
embedded
STMicroelectronics
machine learning
core and anti-
aliasing filter
28
1
Low-power and
U6
HLGA 2X2X.8 10L EXP. SILIC .91SQ
high-precision MEMS nano pressure sensor:
STMicroelectronics
260-1260 hPa
29
1
U7
LGA 2x2 12L
Ultra-low-power, high-performance
3-axis magnetometer
STMicroelectronics
30
1
Low-voltage,
ultralow-power, 0.5
U8
UDFN-6L_2X2X0P5_STM °C accuracy STMicroelectronics
temperature
sensor
31
1
3-axis
U9
VFLGA2.5X3X.86 14L P.5 L.475X.25
accelerometer and 3-axis gyroscope
STMicroelectronics
with ISPU
32
1
U10
Digital Relative Humidity
Temperature Sensor, ±1.8 / max 3.5 %RH, ±0.2 °C, Ultra-
Low-Power
Sensirion
Part number NXS0108BQX LSM6DSV16XTR
LIS2DUXS12TR
LPS22DFTR LIS2MDLTR STTS22HTR LSM6DSO16ISTR SHT40-AD1B-R3
UM3239 - Rev 1
page 16/23
UM3239
Kit versions
6
Kit versions
Table 7. X-NUCLEO-IKS4A1 versions
Finished good
Schematic diagrams
Bill of materials
X$NUCLEO-IKS4A1A (1)
X$NUCLEO-IKS4A1A schematic diagrams
X$NUCLEOIKS4A1A bill of materials
1. This code identifies the X-NUCLEO-IKS4A1 evaluation kit first version. The kit consists of the main board X-NUCLEOIQS4A1 whose version is identified by the code X$NUCLEO-IQS4A1A and the detachable board STEVAL-MKE001A whose version is identified by the code STEVAL$MKE001AA.
UM3239 - Rev 1
page 17/23
UM3239
Regulatory compliance information
7
Regulatory compliance information
Notice for US Federal Communication Commission (FCC)
For evaluation only; not FCC approved for resale FCC NOTICE - This kit is designed to allow: (1) Product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and (2) Software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter 3.1.2.
Notice for Innovation, Science and Economic Development Canada (ISED)
For evaluation purposes only. This kit generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to Industry Canada (IC) rules. À des fins d'évaluation uniquement. Ce kit génère, utilise et peut émettre de l'énergie radiofréquence et n'a pas été testé pour sa conformité aux limites des appareils informatiques conformément aux règles d'Industrie Canada (IC).
Notice for the European Union
This device is in conformity with the essential requirements of the Directive 2014/30/EU (EMC) and of the Directive 2015/863/EU (RoHS).
Notice for the United Kingdom
This device is in compliance with the UK Electromagnetic Compatibility Regulations 2016 (UK S.I. 2016 No. 1091) and with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012 (UK S.I. 2012 No. 3032).
UM3239 - Rev 1
page 18/23
Revision history
Date 11-Oct-2023
UM3239
Table 8. Document revision history
Version 1
Initial release.
Changes
UM3239 - Rev 1
page 19/23
UM3239
Contents
Contents
1 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 1.1 Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3 Hardware description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3.1 Default solder bridge configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.3 Sensor I²C address selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.4 Sensor current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.5 Sensor disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.6 Adapter board for DIL24 socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.7 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 5 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 6 Kit versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7 Regulatory compliance information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
UM3239 - Rev 1
page 20/23
UM3239
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8.
Solder bridges for I²C address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Resistors/jumpers for current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Link between sensors, jumpers and I²C solder bridges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Arduino R3 UNO connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ST morpho connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 X-NUCLEO-IKS4A1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 X-NUCLEO-IKS4A1 versions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
UM3239 - Rev 1
page 21/23
UM3239
List of figures
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10.
X-NUCLEO-IKS4A1 expansion board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 X-NUCLEO-IKS4A1 plugged on an STM32 Nucleo board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 X-NUCLEO-IKS4A1 standard I²C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 X-NUCLEO-IKS4A1 LSM6DSO16IS I²C sensor hub . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 LSM6DSV16X I²C sensor hub . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 X-NUCLEO-IKS4A1 DIL24, I²C sensor hub (all sensors) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 X-NUCLEO-IKS4A1 circuit schematic (1 of 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 X-NUCLEO-IKS4A1 circuit schematic (2 of 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 X-NUCLEO-IKS4A1 circuit schematic (3 of 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 X-NUCLEO-IKS4A1 circuit schematic (4 of 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
UM3239 - Rev 1
page 22/23
UM3239
IMPORTANT NOTICE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2023 STMicroelectronics All rights reserved
UM3239 - Rev 1
page 23/23