User Manual for ABLUE TECHNOLOGY models including: PTR5638 Bluetooth Module, PTR5638, Bluetooth Module, Module

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Users Manual

Shenzhen Chuanghongxin Intelligent technology Co.,Ltd PTR5638 Bluetooth module5.2 2AWMN-PTR5638 2AWMNPTR5638 ptr5638


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ABLUE TECHNOLOGY Coin-size Ultra Low Power Bluetooth Low Energy
PTR5638 System on Module Embedded CortexTM M4F 32 bit processor
The PTR5638 ultra-low power Bluetooth Low Energy/Mesh/ANT/2.4GHz Proprietary Multi-protocol modules based on the nRF52832 from Nordic Semiconductor. The module with an ARM® CortexTM M4F 32 bit processor, embedded 2.4GHz transceiver, and integrated antenna, provide a complete solution with no additional RF design, allowing faster time to market, while simplifying designs, reducing BOM costs, also reduce the burden of Regulatory approvals to enter the world market. Making you more quickly into the bluetooth smart application and remove the worries.
Features
 System on Module(SOM) base on Nordic nRF52832  Bluetooth Low Energy/Mesh/ANT/2.4GHz Proprietary Multi-protocol support  Complete Bluetooth Low Energy stack/profiles solution (Bluetooth 5.0 and Higher)  ARM® CortexTM M4F 32 bit processor, 512 kB flash memory, 64 kB RAM  11 General Purpose I/O, Configurable mapping Pins, Simple layout of external application  12-bit/200KSPS ADC, PWM, SPI Master/Slave (8 Mbps)  Low power comparator, Temperature sensor, Random Number Generator  Two 2-wire Master/Slave (I2C compatible)  I2S audio interface, PDM audio interface  UART (w/ CTS/RTS and DMA)  20 channel CPU independent Programmable Peripheral Interconnect (PPI)  Quadrature Demodulator (QDEC)  128-bit AES HW encryption  5 x 32bit Timers, 3 x 24bit Real Timer Counters (RTC), Watchdog Timer  Internal RC Oscillator 32.768 kHz(± 250 ppm).  No external components required  Over-the-Air (OTA) firmware updates available  Ultra small size(smaller than CR2032 coin battery), about 19x12x1.9mm with Antenna.

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Typical Applications:
 2.4 GHz Bluetooth low energy systems  Proprietary 2.4 GHz systems  Sports and leisure equipment  Mobile phone accessories, Connected Appliances  Health Care and Medical  Consumer Electronics, Game pads  Human Interface Devices, Remote control  Building environment control / monitoring  RFID, Security ApplicationsLow-Power Sensors  Bluetooth Low Energy GateWay  iBeaconsTM, Indoor navigation  Lighting Products  Fitness devices  Wearables

Quick Specifications:

Bluetooth

Version

Bluetooth 5.0 and Higher

Security

AES-128

Radio

Frequency

2.360GHz to 2.500GHz

Modulations

GFSK at 1 Mbps, 2 Mbps data rates

Transmit power

+4 dBm

Receiver sensitivity

-96 dBm (BLE mode)

Antenna

Integrated

Current Consumption

TX only @ +4 dBm, @ 3V, DC/DC enabled

7.5 mA

TX only @ 0 dBm, @ 3V, DC/DC enabled

5.3 mA

TX only @ +4 dBm

16.6 mA

TX only @ 0 dBm

11.6 mA

RX only @ 1 Mbps @ 3V, DC/DC enabled

5.4 mA

RX only @ 1 Mbps

11.7 mA

CPU @ 64MHz from flash

7.5 mA

CPU @ 64MHz from RAM

6.7 mA

CPU @ 64MHz from flash @ 3V, DC/DC

3.7 mA

CPU @ 64MHz from flash RAM @ 3V, DC/DC

3.3 mA

System On

1.2 A

System Off

0.7A

Additional current for RAM retention

20 nA / 4K block

Operating conditions

Power supply

1.7~3.6V

Operating temperature

-25~+85 °C

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Block diagram:

Pin Description of ModuleTop View:

Pin No. 1 2 3 4 5 6 7 8 9 10

Name P0.05 P0.06 P0.11 P0.14 P0.17 P0.20 P0.21 SWDCLK SWDIO GND

Description I/O I/O I/O I/O I/O I/O Reset/ IO Debug and flash programming I/O Debug and flash programming I/O Power Ground

Note Configurable as pin reset.

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11 VDD 12 P0.26 13 P0.27 14 P0.28 15 P0.29 16 P0.30 17 P0.00 18 P0.01

Power Supply I/O I/O I/O I/O I/O I/O I/O

1.7~3.6V
ADC IN ADC IN ADC IN

Note: An internal 4.7F bulk capacitor has been included on the module. For those application that with heavy GPIO usage and/or current draw, it is good design practice to add additional bulk capacitance as required for your application.

General Purpose I/O:
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features:
 Input/output direction  Output drive strength  Internal pull-up and pull-down resistors  Wake-up from high or low level triggers on all pins  Trigger interrupt on all pins  All pins can be used by the PPI task/event system; the maximum number of pins that can be
interfaced through the PPI at the same time is limited by the number of GPIOTE channels  All pins can be individually configured to carry serial interface or quadrature demodulator
signals

Hardware RESET:
There is on-chip power-on reset circuitry, But can still be used in external reset mode, in this case, GPIO pin P0.21 as an external hardware reset pin(Active Low). In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as RESET, the internal pull-up is automatically enabled.

HW debug and flash programming of Module :

The Module support the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful

mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and

instruction trace capture of code execution flow are part of this support.

Pin

Flash Program interface

SWDIO

Debug and flash programming I/O

SWCLK

Debug and flash programming I/O

This is the hardware debug and flash programming of module, J-Link Lite support, please refer

www.segger.com.

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PCB Footprint Top View:

Recommended RF Layout & Ground Plane:
The module integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane will reduce the effective radiated power.

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Reflow Welding Curve:

Absolute Maximum Ratings:

Symbol Parameter

Min.

Max.

Unit

VCC_MAX

Voltage on supply pin

-0.3

3.9

V

VIO_MAX

Voltage on GPIO pins (VCC > 3.6V) -0.3

3.9

V

VIO_MAX

Voltage on GPIO pins (VCC  3.6V) -0.3

VCC + 0.3V

V

TS

Storage Temperature Range

-40

125

°C

Important Notice:

 Reserves the right to make corrections, modifications, and/or improvements to the product and/or its specifications at any time without notice.
 Assumes no liability for the user's product and/or applications.  Products are not authorized for use in safety-critical applications, including but not limited to
life-support applications.

 ATTENTION!
Electrostatic Sensitive Device Humidity Sensitive Device Observe Precaution for handling

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Ordering Information:

Part Number PTR5638 PTR5638-X PTR5638-N
PTR5638-EVB

Description Bluetooth Low Energy System on Module,PCB Antenna Bluetooth Low Energy System on Module,IPX Ext Antenna Bluetooth Low Energy System on Module,Connect the antenna externally through the antenna pin Evaluation boards for modulewith key, LED, I/O extendsock for coin cell battery.

ORI GI NAL EQUI PMENT MANUFACTURER ( OEM) NOTES

The OEM must cer t i f y t he f i nal end pr oduct t o compl y wi t h uni nt ent i onal r adi at or s ( FCC Sect i ons 15. 107 and 15. 109) bef or e decl ar i ng compl i ance of t he f i nal pr oduct t o Par t 15 of t he FCC
r ul es and r egul at i ons. I nt egr at i on i nt o devi ces t hat ar e di r ect l y or i ndi r ect l y connect ed t o AC l i nes must add wi t h Cl ass I I Per mi ssi ve Change.

The OEM must compl y wi t h t he FCC l abel i ng r equi r ement s. I f t he modul e s l abel i s not vi si bl e when i nst al l ed, t hen an addi t i onal per manent l abel must be appl i ed on t he out si de of t he f i ni shed pr oduct whi ch st at es: Cont ai ns t r ansmi t t er modul e FCC I D: 2AWMN- PTR5638
. Addi t i onal l y, t he f ol l owi ng st at ement shoul d be i ncl uded on t he l abel and i n t he f i nal pr oduct
s user manual : Thi s devi ce compl i es wi t h Par t 15 of t he FCC Rul es. Oper at i on i s subj ect t o t he f ol l owi ng
t wo condi t i ons: ( 1) Thi s devi ce may not cause har mf ul i nt er f er ences, and ( 2) t hi s devi ce must accept any i nt er f er ence r ecei ved, i ncl udi ng i nt er f er ence t hat may cause undesi r ed oper at i on.

The modul e i s l i mi t ed t o i nst al l at i on i n mobi l e or f i xed appl i cat i ons. Separ at e appr oval i s r equi r ed f or al l ot her oper at i ng conf i gur at i ons, i ncl udi ng por t abl e conf i gur at i on wi t h r espect t o Par t 2. 1093 and di f f er ent ant enna conf i gur at i ons.

A modul e or modul es can onl y be used wi t hout addi t i onal aut hor i zat i ons i f t hey have been t est ed and gr ant ed under t he same i nt ended end use oper at i onal condi t i ons, i ncl udi ng si mul t aneous
t r ansmi ssi on oper at i ons. When t hey have not been t est ed and gr ant ed i n t hi s manner , addi t i onal t est i ng and/ or FCC appl i cat i on f i l i ng may be r equi r ed. The most st r ai ght f or war d appr oach t o addr ess addi t i onal t est i ng condi t i ons i s t o have t he gr ant ee r esponsi bl e f or t he cer t i f i cat i on of at l east one of t he modul es submi t a per mi ssi ve change appl i cat i on. When havi ng a modul e gr ant ee f i l e a per mi ssi ve change i s not pr act i cal or f easi bl e, t he f ol l owi ng gui dance pr ovi des some addi t i onal opt i ons f or host manuf act ur er s. I nt egr at i ons usi ng modul es wher e addi t i onal t est i ng and/ or FCC appl i cat i on f i l i ng( s) may be r equi r ed ar e: ( A) a modul e used i n devi ces r equi r i ng addi t i onal RF exposur e compl i ance i nf or mat i on ( e. g. , MPE eval uat i on or SAR t est i ng) ; ( B) l i mi t ed and/ or spl i t modul es not meet i ng al l of t he modul e r equi r ement s; and ( C) si mul t aneous t r ansmi ssi ons f or i ndependent col l ocat ed t r ansmi t t er s not pr evi ousl y gr ant ed t oget her .

Thi s Modul e i s f ul l modul ar appr oval , i t i s l i mi t ed t o OEM i nst al l at i on ONLY. I nt egr at i on i nt o devi ces t hat ar e di r ect l y or i ndi r ect l y connect ed t o AC l i nes must add wi t h Cl ass I I Per mi ssi ve Change. ( OEM) I nt egr at or has t o assur e compl i ance of t he ent i r e end pr oduct
i ncl ude t he i nt egr at ed Modul e. Addi t i onal measur ement s ( 15B) and/ or equi pment aut hor i zat i ons ( e. g. Ver i f i cat i on) may need t o be addr essed dependi ng on co- l ocat i on or si mul t aneous t r ansmi ssi on i ssues i f appl i cabl e. ( OEM) I nt egr at or i s r emi nded t o assur e t hat t hese i nst al l at i on i nst r uct i ons wi l l not be made avai l abl e t o t he end user

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References

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