µEZ® GUI User's Manual

1. Introduction

The UEZGUI-4357-70WVN-BA/UEZGUI-4357-70WVN (Dev Kit) provides a quick and easy solution for implementing a Graphical User Interface (GUI) based design by providing the basic functions necessary for most customer products.

2. Block Diagram

uEZGUI-4357-70WVN Block Diagram

The block diagram illustrates the core components of the uEZGUI-4357-70WVN. It features an LPC4357 microcontroller (Cortex-M4 and Cortex-M0 cores) operating up to 50MHz, connected to various peripherals including SDRAM, QSPI Flash, Micro SD Card, Accelerometer, Temperature sensor, and an optional Real-Time Clock (RTC). Connectivity is provided via USB (mini-AB), JTAG (9-pin), Tag-Connect, PMOD, and expansion connectors (J5/J6). It also includes interfaces for LCD display, Touch Panel, Audio (Amplifier, Speaker/Buzzer, Audio Jack), and power input.

Figure 1: UEZGUI-4357-70WVN-BA Block Diagram

3. Kit Contents for FDI PN: UEZGUI-4357-70WVN

• UEZGUI-4357-70WVN-BA module with 7.0” Capacitive Touch Screen LCD
• SEGGER J-Link Lite Cortex-M Debug Probe
• 9 Pin Samtec Cable (Keyed)
• Micro SD card
• USB Type A to USB Type Mini B Cable (2x)
• Universal AC to 5V USB plug Power Supply
• Quick Start Guide

4. Useful links

Complete Users Manuals, Schematics, and documentation are available on the Micro-SD card provided with the µEZ GUI Kit and are also available from the following websites (please refer to the websites for the latest updates):

• Future Designs Support Page - https://www.teamfdi.com/support/
• µEZ Source Code, user's manuals, and quick start guides - https://sourceforge.net/projects/uez/
• SEGGER J-Link Debugger - https://www.SEGGER.com/cms/jlink-software.html
• Rowley CrossWorks IDE download for 30-day evaluation - https://www.rowley.co.uk/arm/index.htm

5. Functional Description

• LPC4357 Microcontroller with 204 MHz Cortex-M4 and Cortex-M0 Cores
• SDRAM 32MB, optional up to 64MB
• QSPI (Serial Flash operating in quad mode) 16MB, optional up to 128MB memory mapped.
• Internal on-chip 16KB EEPROM
• RTC - Real Time Clock with Optional Super Capacitor backup
• Temperature Sensor
• 3-axis Accelerometer
• Speaker
• Micro-SD Card Socket for up to 64GB SDHC storage, microSD card included with kit only
• Cortex-M 9-pin JTAG connector
• PMOD Type 2A connector
• Power-on Reset Generator - power-on reset supervisor and voltage monitor (SW1)
• Expansion Connector for customer specific applications

6. Startup procedure

The µEZ GUI kit comes with a pre-installed micro-SD card that contains files required for the various demos to run. It also contains users' manuals, schematics, and documentation for the product.

Power is supplied via the USB cable provided in the kit. To power on the unit, connect the USB cable to the USB 5V 2A power adapter provided in the kit and to P2, the mini-B USB connector. DO NOT try to power the unit from a standard computer USB port, as it does not provide enough power.

The following screen should appear once power has been applied to the kit:

[Image description: A screenshot showing the "Example Applications" screen with icons for "UEZ Demo", "Project Maker", "Bowling", "Temp Graph", "Test App", "3DEnc", and "Inst. Clust.". Text "Example Display Images shown for Reference Only" is also present.]

At this point, the unit is ready for software demonstrations and user operation.

7. Demonstration Software

Note: The Demonstration Software is subject to change at any time.

The following software demonstrations are available from the Main Menu:

a) Example Applications

• uEZ Demo: This installs the main µEZ GUI demo application, demonstrating capabilities like slideshows, video playback, and data storage.
• Bowling: An example of a bowling alley user interface.
• Project Maker: A demonstration application developed using the Project Maker utility from Future Designs, Inc., currently showcasing Temperature and Time/Date functionality.
• Sensors: Select the Sensor button to display on-board accelerometer readings and temperature. Select 'Back' to return to the main menu.
• Time and Date: Use this feature to display and set the current time and date from the internal real time clock (RTC). To change the time or date, select the field, enter the numeric value, and select 'Enter'. Selecting 'Cancel' or waiting for the screen to time out will revert changes. Invalid entries default to the maximum valid value. An on-board super capacitor backs up the time and date when power is off. Select 'Back' to return to the Settings Menu.

b) uEZ Demo

• Slideshow: Selecting the film reel icon demonstrates the uEZGUI's capability to display a series of slides from different subfolders. The process for creating a slideshow is detailed in section 8.
• Brightness: Selecting the brightness icon under Settings displays a menu with color bars and a brightness adjustment slider. Move the slider to adjust brightness. Select 'Back' to return to the Settings Menu.
• Time/Date: Located under Apps, this application sets the time and date from the internal real time clock (RTC). To change the time or date, select the field, enter the numeric value, and select 'Enter'. Selecting 'Cancel' or waiting for the screen to time out will revert changes. Invalid entries default to the maximum valid value. An on-board super capacitor backs up the time and date when power is off. Select 'Back' to return to the Settings Menu.
• Video Player: Demonstrates the uEZ GUI's capability to play videos. The process for creating a video is detailed in section 9.
• emWin Demo: emWin is software used by uEZGUI for creating UI elements like buttons and icons. This is a short, automated demo showcasing various GUI applications that emWin software can be used for.

• Temp Graph: Demonstrates emWin and interfacing with the on-board temperature sensor and RTC to graph temperature and humidity, along with time and date.
• Test App: A simple GUI app for testing uEZ GUI features like SD card storage, reading/writing files, and touchscreen interaction.

8. Setting up a Slideshow

Future Designs has created a document and tools for creating slideshows for µEZ GUI units. Production module units require 24-bit uncompressed Targa (.TGA) format for all images. Development kit units require bitmap (.BMP) format for all slideshow images.

See: https://fdiwebdocs.s3.us-east-2.amazonaws.com/2024/wp-content/uploads/Converting-a-PowerPoint-Slideshow-for-use-on-uEZGUI-Products-.pdf

This guide also covers making speaker notes that can play alongside your slides.

9. Setting up a Video

Suggested procedures for creating videos for playback using the µEZ video player (v2.13.100 and later) on supported µEZ GUI hardware are available in the FDI Video Creation Guide (included in uEZ). This guide also suggests procedures for downloading videos from YouTube. It assumes a source video is available in AVI uncompressed format with a resolution of 480×272 or greater.

For this uEZGUI, up to 800x480 full-screen video running at 8 FPS is supported from the microSD card. For lower resolutions, 15-24 FPS video is typically supported. A lower resolution video can be displayed on a white or black screen or a background frame; for example, a 20 FPS boot-up animated logo could be played centered on a black background.

10. µEZ Doxygen online HTML documentation

µEZ has built-in comment documentation that follows the Doxygen comment standard, writing code comments and annotations compiled into HTML documentation.

FDI provides pre-compiled HTML documentation at: https://fdiwebdocs.s3.us-east-2.amazonaws.com/2024/uez/docs/index.html

In the µEZ source code, “uEZ/uEZDoxyfile” is the main project file for the Doxygen generator. When Doxygen is recompiled, new Doxygen files will be found in: uEZ\Docs\ Doxygen_Documentation.html

FDI updates documentation periodically. Review your device for updates as you learn a new µEZ® release or drivers are added.

For more information, see the Doxygen website: https://www.stack.nl/~dimitri/doxygen/

11. µEZ Bootloader

The uEZ bootloader allows users to install their own applications without special tools like J-Link. It requires an SD card or USB drive. The bootloader has two primary components: The Base Bootloader (BBL), containing base functions, and the Application Bootloader (ABL), which programs internal and external flash memory and can be updated dynamically as it is loaded from local memory (SD card or USB drive).

12. µEZ Project Maker

FDI provides a project maker to help create new projects for µEZ GUI hardware, available for download at https://sourceforge.net/projects/uez/.

To create a new project, run the executable file included with uEZ and follow the onscreen instructions. It creates a demo project using an emWin example GUI with basic peripheral functionality. The project maker speeds up development for new applications. Example projects are ready to be compiled and programmed onto µEZ GUI hardware using the included J-Link debugger, with no extra project configuration.

For this uEZGUI, the Crossworks project option generates a second project for the secondary M0 core. Both projects should be opened and built in Crossworks. The primary project (M4 core) automatically programs the secondary project's application. Using the secondary project, the J-Link can be connected to the second core.

Note: The M0 core project now has full FreeRTOS, SEGGER RTT/SystemView, and uEZ API support.

Note: When connected to the M0 core, the J-Link cannot program the LPC4357's flash banks. This is why the M4 project automatically programs the M0 project's output. The option “Additional Load File[0]” enables this programming and can be easily removed if the M0 core is not used.

Note: The second core must be enabled in the shared Config_Build.h file, otherwise it will not be started.

Note: Crossworks projects use variables to subtract RAM or Flash from the M4 core to assign to the M0 core. By default, the last 64KB of each 512KB Flash bank (128KB total), the entirety of SRAM2, and the last 512KB of SDRAM is assigned. See “Memory Map Macros” for typical application configuration: SDRAM_CM0_SIZE, FLASHA_CM0_SIZE, FLASHB_CM0_SIZE, SPIFI_CM0_SIZE. When changing a macro size, ensure the same size is used in both *.hzp project files to prevent overlap. If SRAM banks were swapped between cores, assembly startup code will need modification. uEZ_Platform_Start_Additonal_Cores() needs to be updated to match the starting flash address if changed.

13. Software

µEZ® takes its name from the Muses of Greek mythology. The µEZ® platform inspires rapid development by supplying customers with an extensive library of open-source software, drivers, and processor support under a common framework. µEZ® development works on the premise of “design once, reuse many times”, providing an open-source standard for embedded developers. µEZ® allows companies to focus on innovation and value-added applications while minimizing development time and maximizing software reuse.

The diagram below shows a typical embedded application stack. µEZ® has three primary categories of components that simplify embedded application development:

1. Operating System Abstraction Layer (µEZ® OSAL)
2. Sub-system drivers (µEZ® TCP/IP, µEZ® USB, µEZ® Driver)
3. Hardware Abstraction Layer (µEZ® HAL)

[Diagram description: A layered software stack diagram showing "Applications" at the top, including "µEZ® OSAL" (with FreeRTOS), "µEZ® TCP/IP" (with lwip), "µEZ® USB" (Host/Device OTG), and "µEZ® DRIVER" (LCD Touchscreen, File System, I2C, SPI, etc.). Below this is "µEZ® HAL" (Hardware Peripheral API), and at the bottom is "Embedded Microprocessor".]

The selection of an RTOS is a daunting aspect of embedded system development. µEZ® abstracts the primary features of common multi-tasking operating systems, easing the transition to an open source or low-cost RTOS. The µEZ® OSAL provides applications access to the following features in an OS-independent fashion:

• Pre-emptive multitasking
• Stack overflow detection
• Unlimited number of tasks
• Queues
• Semaphores (binary, counting, mutex)

The µEZ® sub-system drivers utilize the OSAL functions to provide protected access to processor peripherals. The sub-system driver API functions are typically protocol layer interfaces (TCP/IP, USB, etc.) designed as high-level access routines like open, close, read, write, etc.

µEZ® is ideally suited for Embedded Systems with standard features such as:

• Processor and Platform BSPs (Board Support Packages)
• Real Time Operating System (RTOS)
• Memory Management
• NAND/NOR Flash
• SDRAM and DDR Memory
• TCP/IP stack
• USB Device/Host Libraries
• Mass Storage Devices
• LCD Displays with Touch Screen
• Input / Output Devices

14. Code Read Protection (CRP) in LPC Devices

WARNING: Code Read Protection (CRP) in LPC Devices

NXP LPC MCUs can use CRP to protect Intellectual Property (IP) within the MCUs memory. Refer to NXP's application notes, User's Manuals, or community forums for details on using CRP.

CRP is controlled by values written into specific memory locations of the MCU. When CRP is not used, these locations are all 0xFF's (not protected). All FDI projects utilize no CRP.

Memory section .crp1 and, when needed, .crp2 are set up with 4 bytes, initialized to 0xFFFFFFFF (no CRP). Changing memory sections in product demos is not recommended as they are configured for the uEZGUI's available memory. Refer to the Memory Usage Map and Memory placement section in uEZGUI-4357-70WVN.c for an example.

Important Note – Take particular care when modifying the CRP word, as some CRP settings can disable access to your MCU (including debug). Before using CRP, read NXP's documentation on this functionality. Access documentation for your MCU at Microcontrollers and Processors | NXP.

See “LPC Code Read Protection Readme.pdf” for important details and examples.

15. Configuring Micro SD Card for High Clock Frequency

The LPC4357 can run the High-Speed SD Card Interface at a much higher speed, configured by default in the software. Cards should be of good quality and have at least a class 10 rating. Examples of cards tested and qualified by FDI include:

• SanDisk Industrial 8GB+ U1 rated microSDHC
• Kingston SDC10G2/16GBSP
• Kingston SDCA10/16GBSP

Note: This uEZGUI does NOT support full-size SD cards rated for only 25MHz mode. All SDA compliant microSD cards should be compatible with the current fixed-speed implementation.

SD Card Formatting

For best results, format the SD card properly, especially when playing videos. Follow these steps on a Windows-based PC:

1. Insert the card into the PC.
2. Open My Computer.
3. Right-click on the Removable Disk.
4. Select Format from the menu.
5. Change the File System to “Fat32” if not already selected.
6. Change Allocation unit size to “4096 bytes”.
7. Enter a volume label if desired (optional).
8. Click <Start>.

[Image description: A screenshot of the Windows "Format Removable Disk" dialog box showing options for File system (FAT32), Allocation unit size (4096 bytes), Volume label, and Format options (Quick Format). Buttons for "Start" and "Close" are visible.]

9. Before Clicking <OK> in the warning dialog box, be sure the card does not have important information on it.

10. Click <OK> on the format complete dialog box.

The SD Card is now ready for use with the uEZGUI-4357-70WVN.

16. Configuring Rowley CrossWorks for ARM® for J-Link Flashing

1. See the document “uEZ® Software Quick Start Guide” for details on downloading the µEZ® source code and setting up the Rowley CrossWorks compiler: https://fdiwebdocs.s3.us-east-2.amazonaws.com/2024/wp-content/uploads/MA00015-uEZ-Software-Quickstart-Guide.pdf
2. Plug in the J-Link device into the PC and install any drivers as directed. SEGGER J-Link drivers can be found at https://www.SEGGER.com/cms/jlink-software.html with additional information at https://www.SEGGER.com/cms/development-tools.html.
3. Plug in the J-Link's JTAG connector to the µEZ GUI board at J1 with the JTAG adapter.
4. Select the Target menu and choose Connect. The following list will appear:

[Image description: A screenshot of the Rowley CrossWorks IDE showing the "Search Target Connections" window with a list of debug probes including "ARM Simulator", "CMSIS-DAP", "SEGGER J-Link", "ST-LINK/V2", etc.]

5. Click on “SEGGER J-Link”.

6. Open the Targets view by clicking Target > Targets.

7. Right-click on SEGGER J-Link and select Properties.

[Image description: A screenshot of the "SEGGER J-Link Properties" dialog box showing various settings like "Current Speed", "DLL Version", "Enable Adaptive Clocking", "Firmware Version", etc.]

8) If programming a blank LPC4357 part, select a Speed of 100 kHz. If the part has already been programmed, select a Speed up to 50,000 kHz.

9) Press OK.

17. Configuring IAR EWARM v9.30.1 for J-Link Flashing

The IAR tools do not require special configuration for J-Link. To update IAR's J-Link dll, run SEGGER’s J-Link DLL Updater (located in the SEGGER directory under Program Files) and select the IAR installation(s) to update, then click Ok.

[Image description: A screenshot of the "SEGGER J-Link DLL Updater" dialog box showing a list of IAR Embedded Workbench versions that can be updated, with checkboxes to select them.]

18. Board Layout

The following figure illustrates the layout of the various components of the UEZGUI-4357-70WVN kit. They are for reference only and are subject to change.

[Image description: A top-down view of the UEZGUI-4357-70WVN PCB showing component placement, connectors, and labels like "PRIMARY EXPANSION", "SECONDARY", "USB", "JTAG", "LCD", "MICROSD", "PMOD", etc.]

19. I/O Connector Descriptions

J1 - JTAG Connector

The UEZGUI-4357-70WVN-BA uses a standard Cortex-M 9-pin 0.050” Header. This connector provides 100% of the functionality of the standard 20-pin JTAG connector but uses 70% less board space. It is a standard Samtec FTSH part (defined by ARM) available from most major vendors.

The connector part number is PN: SAMTEC FTSH-105-01. Kits come with the SEGGER J-Link Lite Cortex-M, so no adapter is needed.

[Image description: A photograph of the SEGGER J-Link Lite Cortex-M debugger with a 9-pin connector, and a diagram showing the pinout: Vref, GND, SWDIO/TMS, SWCLK/TCK, SWO/TDO, TDI, NC, RESETn.]

SEGGER and OLIMEX provide adapters to convert the standard 20-pin ARM JTAG to the Cortex-M 9-pin JTAG. The SEGGER adapter also allows connecting TRST using a solder bridge. These adapters have female pins and are compatible with 20-pin JTAG units with male pins. Both adapters include the required cable.

• SEGGER 9-pin adapter - https://www.SEGGER.com/jlink-adapters.html#CM_9pin
• OLIMEX 9-pin adapter - https://www.olimex.com/Products/ARM/JTAG/ARM-JTAG-20-10/
• Note: By default, pin 9 TRST is connected.

J2 - Tag Connect

The UEZGUI-4357-70WVN-BA supports JTAG and programming using the Tag-Connect TC2050-ARM2010 ARM 20-pin to TC2050 Adapter.

• Adapter: https://www.tag-connect.com/TC2050-ARM2010
• Cable with legs: https://www.tag-connect.com/TC2050-IDC <-- Note: This cable will NOT fit.
• Cable with no legs: https://www.tag-connect.com/TC2050-IDC-NL
• Holding clip for no-legs cable version: https://www.tag-connect.com/TC2050-CLIP

[Image description: Photographs showing the Tag-Connect adapter and its connection to the board. A diagram shows the pinout for the 10-pin TC2050 connector: 3V3, TMS/SWDIO, TCK/SWDCLK, TDI, TDO/SWO, RESETn, TRST#, CON10, TAG-CONNECT, DNL.]

J3 - MicroSD Socket

The unit uses a MicroSD Socket for flexible mass storage. µEZ™ supports MicroSDHC and SDHC Cards up to 64GB. This interface uses 4-wire SD mode at up to 51MHz.

WARNING: The microSD card must only be removed using the spring-loaded “push-pull” mechanism on the microSD socket. Improper forceful removal will result in permanent damage to the socket (not covered under warranty). To insert the card, push it into the socket until a “click” sound is heard.

[Image description: A series of images demonstrating the insertion and removal of a microSD card into the socket. The process involves aligning the card, pushing it in until it clicks, and then gently pulling it out.]

J7 - Alternate Power and communication

The UEZGUI-4357-70WVN-BA includes an alternate power and communication header. This header provides access to UART 3, I2C Channel 1, SPI Channel 0, GPIO, Counter/Timer Input/Output, and a 5V power input. This connector is a 1.25mm Hirose male, shrouded connector (Hirose Part Number: DF13A-10P-1.25H (20), Digikey PN: H3375-ND). Refer to the schematic for specific connectivity.

Note (1) - This signal is not GPIO capable.

J11 - PMOD Type 2A Connector

The UEZGUI-4357-70WVN-BA includes a PMOD Type 2A (SPI) connection to an expansion board. Refer to the schematic for specific connectivity.

Note (1) - These signals are not available in the standard load configuration. Two nearby resistor footprints must be populated with 0-ohm resistors to connect I2C (see schematic for details).

Note (2) - Although the initial version of the Digilent spec documented PMOD Type 4A, subsequent versions of the PMOD spec do not show Type 4A, but instead show Type 3A.

Note (3) - The uEZGUI default configuration is for PMOD Type 2A (SPI). To use PMOD Type 3A (UART), two resistors must be reconfigured to set TXD & RXD as shown below.

[Diagram description: A diagram showing R57 R58 CONFIGURATION for DEFAULT SPI MODE and SWAPPED TXD <> RxD UART MODE. Text indicates: "TO USE PMOD IN UART TYPE 3A: SWAP TXD <> RxD AS SHOWN ABOVE".]

P1 – USB mini-AB port

The UEZGUI-4357-70WVN-BA has a mini-AB USB connector for Host or Device mode. By using a USB OTG adapter (with a Mini-A plug), it will short the ID pin 4 to ground. This can be used for Host mode detection in the application.

NOTE: Do not connect USB Device port to a powered host if the uEZGUI is not powered.

P2 – USB Power Input 5VDC

The UEZGUI-4357-70WVN-BA is normally powered via P2 (with the included 5V USB Wall Supply) or via J7. This power supply is only included in the development kit and is not included with the UEZGUI-4357-70WVN-BA.

NOTE: Do not connect P2 to a data USB port. It is designed for 5V power input only.

J5 & J6 - Expansion Connectors

The UEZGUI-4357-70WVN-BA includes two expansion connectors that provide a wide variety of capabilities for user expansion, ranging from 10/100 Ethernet to USB Host, etc. Please Note: When using I/O signals on the µEZ GUI Expansion Connectors (J5 & J6) to connect via the customer's Expansion Board to external connectors or signals, it is the customer's responsibility to provide adequate ESD protection and filtering to prevent damage to any pins that are not directly protected on the µEZ GUI. Any damage caused by improper connectivity is not covered under warranty.

The tables below provide the pinout and signal names available on these connectors:

J6 Signal Details

J5 & J6 - Expansion Connector Cable Details

The maximum length for the expansion connector cables is as follows: General Purpose IO, TTL, Serial, 6" recommended maximum, 8" absolute maximum. Ethernet, high-speed IO, 3” recommended maximum, 4” absolute maximum.

The following table provides example part numbers for the expansion cables:

Note: These lengths are recommendations. Actual lengths depend on expansion board circuitry, layouts, and the application's environment. It is up to the customer to test and validate the functional operation and use of the expansion connectors.

20. Schematics, Documentation, and Support

Please see the product information tabs at https://www.teamfdi.com/product-details/uezgui-4357-70wvn for support and documentation.

21. Temperature Range

• UEZGUI-4357-70WVN-BA board w/o LCD: -30°C to +80°C
• UEZGUI-4357-70WVN-BA with LCD: -20°C to +70°C

22. ESD Warning

The UEZGUI-4357-70WVN-BA kit is shipped in a protective anti-static package. The kit must not be subjected to high electrostatic potential. Damage may occur to the boards and will not be covered under warranty. General practice for working with static-sensitive devices should be followed when working with the kit.

23. Real Time Clock Backup Time

The µEZ GUI's Real Time Clock is backed up with a Seiko Super Capacitor to preserve time when external power is removed. The calculated backup time is shown below.

For longer RTC backup time, an off-board RTC located on an expansion board is preferred.

24. Power Requirements

Power is supplied via the mini-USB connector (P2) using the USB cable and power supply provided in the kit. The power supply provides 5VDC output at 2A (min) and has an input voltage range of 100-240VAC with a standard U.S. 2-prong plug.

The following typical power requirements were measured at room temperature with LPC4357 M0 and M4 cores running, with a SanDisk Industrial microSD card installed:

µEZ GUI Input Power Requirements:

• +5VDC ±5% is the input power range specification. Due to reverse diode protection on the 5VDC input, a higher input voltage level of 5VDC may be needed to ensure the µEZ GUI 5VDC output level retains the specified tolerance. If the µEZ GUI input level drops to 4.75VDC, the µEZ GUI +5VDC output level to the Expansion Board or USB Host connector may be lower than 4.75VDC, as the worst-case drop from input to output is typically 0.25V.
• For reference on the USB output port from the µEZ GUI, the specifications are: USB High Power: 500mA maximum, 4.75V to 5.25V standard. USB Low Power: 100mA maximum, 4.4V to 5.25V standard.
• The µEZ GUI can provide a maximum of 300mA of 3.3V power for “external use” over the expansion connectors. If more than 300mA of 3.3V is needed for an expansion board:
• The primary power input (5V) should be located on the expansion board rather than on the µEZ GUI.
• The expansion board should have a separate 3.3V voltage regulator.
• Ensure the 3.3V voltage rails of the µEZ GUI & Expansion Board are not connected.
• The µEZ GUI should be powered using 5V from the expansion board over the 70-pin breakout, instead of powering the expansion board from the µEZ GUI unit.
• The UEZGUI-4357-70WVN may also optionally be powered via the following connectors:
• Alternate Power/Communication Connector, J7, with a maximum of 2A 5V input.
• Expansion Connector(s) J5 and/or J6 – refer to the expansion connector section for details.

Note: For running high current XBEE or Pmod modules, a combination of J5, J6, and J7 should be used to power the uEZGUI.

25. Mechanical Details

The following illustrations show the mechanical details of the UEZGUI-4357-70WVN-BA PCB.

[Image description: A diagram showing the mechanical dimensions of the UEZGUI-4357-70WVN-BA PCB, with various measurements indicated in mils.]

[Image description: A diagram showing the mechanical dimensions of the LCD Module View and Side View.]