User Manual for GSD models including: WL1KM1000 Low Energy Iot Module, WL1KM1000, Low Energy Iot Module, Energy Iot Module, Iot Module
Reolink Innovation Limited 2403C 2AYHE-2403C 2AYHE2403C 2403c
File Info : application/pdf, 24 Pages, 1.59MB
DocumentDocumentPRODUCT SPECIFICATION
Version 1.1
IEEE 802.11 b/g/n 1T/1R IOT Module
Model Number: WL1KM1000
(MediaTekMT7682SN )
reolink 48.01.001.0048A
Custom Name Department Approval
Custom Approval Section
Date
DESIGN
2022-09-09
CHECK
2022-09-09
APPROVAL
2022-09-09
HUIZHOU GAOSHENGDA TECHNOLOGY CO.,LTD
2
No.2 Jinda Road,Huinan High-tech Industrial Park, HuizhouCity,Guangdong
TEL07522096578
E-mail heng@gaosd.com
Revision Version 1.0 Version 1.1
PRODUCTS SPECIFICATION
WL1KM1000
Document revision history
Date
Approved by
Remarks
2021-08-30 heng
Draft
2022-09-09 heng
R7 from 10K to NC
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Version 1.1
Content
PRODUCTS SPECIFICATION
WL1KM1000
1. General Description ...................................................................................................................................................4
2. Features..........................................................................................................................................................................4
3. Application Diagrams................................................................................................................................................5
3.1 Functional Block Diagram.........................................................................................................................................5
3.2 Schematic....................................................................................................................................................................6
3.3 General Requirements................................................................................................................................................8
3.3.1 IEEE 802.11b Section ..................................................................................................................................8 3.3.2 IEEE 802.11g Section ..................................................................................................................................8 3.3.3 IEEE 802.11n Section ..................................................................................................................................9 4. Electrical and Thermal Characteristics.................................................................................................................9
4.1 Temperature Limit Ratings ...............................................................................................................................9
4.2 General Section ....................................................................................................................................................9
5. Mechanical Characteristics ....................................................................................................................................10
5.1 Mechanical Requirements..............................................................................................................................10
5.2 Mechanical Dimensions ..................................................................................................................................10
5.3 Pin Description...................................................................................................................................................10
5.4 Product Picture ..................................................................................................................................................12
6. BOM (Part List) .............................................................................................................................................................12
7. Module Package...........................................................................................................................................................13
8. Note ...............................................................................................................................................................................15
8.1 ESD..........................................................................................................................................................................15
8.2 Recommended Reflow Profile.........................................................................................................................15
8.3 Wireless module before the SMT note......................................................................................................16
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Version 1.1
PRODUCTS SPECIFICATION
1. General Description
WL1KM1000
This document is to specify the product requirements for 802.11b/g/n 1T1R IOT Module. It is based on MediaTek MT7682SN that is a low power chipset ,MT7682SN is a highly integrated chipset an application processor,a low power 1x1 11n single-band Wi-Fi subsystem and a power management unit(PMU) that complied with 4MB PSRAM and 1MB flash memory.
2. Features
IEEE 802.11 b/g/n (2.4GHz,1x1) Supports 20MHz, 40MHz bandwidth in 2.4GHz band Supports all data rates of 802.11g including 6, 9, 12, 18, 24, 36, 48 and 54Mbps Supports short GI and all data rates of 802.11n including MCS0 to MCS7 Dynamically switching between STA and SoftAP modes at runtime Wi-Fi security WEP/WPA2/WPS Support Wi-Fi coexistence Supports interfaces including UART, I2C, SPI, I2S, PWM, SDIO and ADC RoHS compliant
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PRODUCTS SPECIFICATION
3. Application Diagrams 3.1 Functional Block Diagram
WL1KM1000
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PRODUCTS SPECIFICATION
3.2 Schematic
U1 XTAL / 322 5 / 26MHz
2. 0x2. 5
3
2
4
1
2
1
XO
C1 C / 1.5 / pF / 0 201
1V5 AVDD15_XO
C2 C / 0.1 / uF / 0 201
DVDD_CORE
GPIO0 GPIO1 GPIO3 GPIO2 GPIO4
U2
41 EPAD
40 AVSS33 _WF0 _G_PA_R
39 AVDD15_WF0_TRX
38 AVDD15_XO
37 XO
36 GPIO0
35 GPIO1
34 GPIO3
33 GPIO2
32 GPIO4
31 DVDD_ CORE
WF0_RF_2 G_ TRX
C3 C / 1.2 / pF / 0 201
1
2
L1 L / 3.9 / nH / 0 201
2
C4 C / 1.2 / pF / 0 201
50ohm
1
DVDD_IO_0
C8 C / 0.1 / uF / 0 201
3V3 WF0_G_RFIO
3V3 GPIO17 GPIO16 GPIO15 GPIO14
GPIO13 GPIO12
1 AVDD33 _WF0 _G_TX
2 WF0_G_RFIO
3 AVDD33 _WF0 _G_PA
4 GPIO17
5 GPIO16
6 GPIO15
7 GPIO14
MT7682
8 DVDD_IO_0
9 GPIO13
10 GPIO12
30 DVDD_IO_1
29 GPIO21
28 GPIO22
27 DVDD_MLDO
26 LXBK
25 AVSS33_BUCK
24 AVDD33 _BUCK
23 AVDD15 _CLDO
22 AVDD12 _CLDO
21 AVDD18 _MLDO
GPIO21 GPIO22
C26 C / 1 / uF / 020 1
DVDD_IO_0
C30 C / 0.1 / uF / 0 201
DVDD18 24mil
L2 ZADM-25 2012 MEH-2R2M
LXBK
1
2
15mil 12mil
DVDD18
C9
C / 1 / uF / 020 1
1V5 DVDD_CORE
C10 C / 2.2 / uF / 0 402
WL1KM1000
2
GPIO0
2
GPIO1
2
GPIO2
2
GPIO3
2
GPIO4
2
GPIO11
2
GPIO12
2
GPIO13
2
GPIO14
2
GPIO15
2
GPIO16
2
GPIO17
2
GPIO21
2
GPIO22
1 WF0_RF_2 G_ TRX
2 CHIP_EN 2 VRTC 2 EXT_PWR_EN 2 RTC_EINT
3V3 C7 C / 10 / uF / 04 02
1V5
C6 C / 10 / uF / 04 02
11 GPIO11
12 DVDD_ CORE
13 XIN
14 XOUT
15 RTC_EINT
16 AVDD33_VRTC
17 EXT_ PWR_EN
18 GND
19 CHIP_EN
20 AVDD33_MISC
RTC_EINT VRTC
EXT_ PWR_EN CHIP_EN 3V3
DVDD_CORE
GPIO11
1
C11 C / 0.1 / uF / 0 201
EXT_32K_ 1
XTAL_3 2K / 3215 SMD / XTL 721-S9 99-32 8
U3
1
2
EXT_32K_ 2
1
C / 18 / pF / 02 01 C12
C / 18 / pF / 02 01 C13
3V3
C29 C / 2.2 / uF / 0 402
R7
3V3
NC
C31 C / 0.1 / uF / 0 201
2
2
1 WF0_RF_2 G_ TRX
WF0_RF_2 G_ TRX
C19 C / 10 / pF / 02 01 ANTE1E_2
RF3V3_WF
3V3
C35 C / 6.8 / pF / 0 201
C27 C / 2.2 / uF / 0 201
AVDD33_WF0_G_PA AVDD33_WF0_G_TX
1V5Power
PMU_BUCK_1V6
RF1V5_RF
1V5
1V5
C33 C / 2.2 / uF / 0 402
AVDD15_WF0_TRX
C34 C / 100 / pF / 0 201
R2
R / 0 / Oh m / 0201
C32 C / 1 / uF / 020 1
AVDD15 _XO
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Version 1.1
PRODUCTS SPECIFICATION
Strap Pin
XTAL Select
GPIO17
R4
{GPIO17} 0:26MHz (default) 1:40MHz
R / 10K / Ohm / 020 1
SLOW_SRC_B
GPIO14
R5 R / 10K / Ohm / 020 1
{GPIO14} 0:External 1:Internal (from 26/40MHz clock) (default)
Host Interface Enable
GPIO4 R3
R / 10K / Ohm / 020 1
{GPIO4} 0:Disable Host Interface at boot(default) 1:Enable Host Interface
Host Interface Select(active if HIF_EN=1)
{GPIO13} 1: host interface via SDIO slave (default) 0: host interface via SPI slave
JTAG_FIX_B
{GPIO15} 1: JTAG pins as gpio (default) 0: JTAG pins fixed for JTAG use BROM_BYPASS_B
{GPIO16} 1: run with bootrom (default) 0: bypass bootrom
DL_MODE_B
{GPIO12} 1: no download (default) 0: UART download
WL1KM1000
1 GPIO0 1 GPIO1 1 GPIO2 1 GPIO3 1 GPIO4
1 GPIO11 1 GPIO12 1 GPIO13 1 GPIO14 1 GPIO15 1 GPIO16 1 GPIO17 1 GPIO21 1 GPIO22
1 CHIP_EN 1 VRTC 1 EXT_PWR_EN 1 RTC_EINT
GND GND NC DVDD_ IO_1 RTC_EINT GND
3V3 3V3 CHIP_EN GND GND GND RF GND GND GND
43 43 42 42 41 41 40 40 39 39 38 38 37 37 36 36 35 35 34 34 33 33 32 32 31 31 30 30 29 29 28 28
U8
SPI_CS GPIO17 44
VRTC 45
UART_TX&A1GPIO22 46
GPIO21
47
GND
48
PIR_OUT_ADC&IO1 GPIO0
49
GND
50
GPIO21
51
UART_RX&PIR_Interrupt&PIR_OUT GPIO21
52
NC
53
NC
54
GPIO17 45 GPIO22 GPIO21 48 GPIO0 50 GPIO21 GPIO21 53 54
T*
1 21 32 4 GPIO2 5 GPIO3 6 GPIO16 7 GPIO14 8 GPIO15 98 10 GPIO22 11 10 12 GPIO1 13 GPIO4 14 13 15 14 16 15
16
27 27 26 26 25 25 24 24 23 GPIO12 22 GPIO11 21 21 20 20 19 GPIO13 18 GPIO12 17 17
GND GND
NC NC GPIO12 GPIO11 CC_OK NC NC GPIO13 KEY_RESET GPIO12 GM_OK&LED_B GND
UGPIO16 UGPIO15
U7
VCCB VCCA
OE
B1
A1
B2
A2
GND
MS455 3S
3V3 C55 C / 0.1 / uF / 0 201
GPIO1 GPIO16 GPIO15
GND GND SCL2 GPIO2 SDA2 GPIO3 SPI_CLK UGPIO16 SPI_MISO GPIO14 SPI_MOSIUGPIO15 NC GPIO22 NC GM_PWR_ON&OE GPIO1 LEDR GPIO4 NC
NC GND GND
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PRODUCTS SPECIFICATION
3.3 General Requirements
3.3.1 IEEE 802.11b Section
Feature
Detailed Description
3.3.1.1 3.3.1.2 3.3.1.3
Standard Radio and Modulation Schemes Operating Frequency
IEEE 802.11b DQPSK , DBPSK and CCK with DSSS 2400 2483.5MHz ISM band
WL1KM1000
3.3.1.4
Channel Numbers
13 channels for Worldwide
3.3.1.5 3.3.1.6 3.3.1.7
3.3.1.8
Data Rate Media Access Protocol Transmitter Output Power at Antenna Connector Receiver Sensitivity at Antenna Connector
at most 11Mbps
CSMA/CA with ACK
Typical RF Output Power at each RF chain,and at room Temp. 25
17±2 dBm at 11Mbps Typical Sensitivity at each RF chain. @Frame (1000-byte PDUs) Error Rate<8% at room Temp 25 -83 dBm for 11Mbps
3.3.2 IEEE 802.11g Section
3.3.2.1 3.3.2.2 3.3.2.3 3.3.2.4 3.3.2.5 3.3.2.6
3.3.2.7
3.3.2.8
Feature
Detailed Description
Standard Radio and Modulation Type Operating Frequency
IEEE 802.11g QPSK , BPSK , 16QAM ,64QAM with OFDM 2400 2483.5MHz ISM band
Channel Numbers
13 channels for Worldwide
Data Rate
at most 54Mbps
Media Access Protocol
CSMA/CA with ACK
Transmitter Output
Typical RF Output Power at each RF chain,
Power Antenna Connector
at
at room Temp. 25 15±2 dBm at 54Mbps
Receiver Sensitivity
Typical Sensitivity at each RF chain. @Frame (1000-byte PDUs) Error Rate<10% at room Temp 25
at Antenna
-71 dBm for 54Mbps
Connector
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PRODUCTS SPECIFICATION
3.3.3 IEEE 802.11n Section
Detailed Description 3.3.3.1 IEEE 802.11n 3.3.3.2 BPSK , QPSK , 16QAM ,64QAM with OFDM 3.3.3.3 2.4GHz :2400 ~ 2483.5MHz for ISM band
WL1KM1000
3.3.3.4 at most 150 Mbps
3.3.3.5 3.3.3.6
3.3.3.7
CSMA/CA with ACK Typical RF Output Power at each RF chain,and at roomTemp. 25
2.4GHz Band/HT20 14±2dBm at MCS7
2.4GHz Band/HT40 14±2dBm at MCS7
Typical Sensitivity at each RF chain. @Frame(1000-byte PDUs)Error Rate=10% and at room Temp. 25
2.4GHz Band/HT20 -68dBm at MCS7
2.4GHz Band/HT40 -66dBm at MCS7
4. Electrical and Thermal Characteristics
4.1 Temperature Limit Ratings
Parameter Storage Temperature Ambient Operating Temperature Junction Temperature
Minimum -55 -30 0
Maximum +125 +85 +125
Units
4.2 General Section
4.2.1 4.2.2 4.2.3
Feature Antenna Type Operating Voltage Current Consumption
4.2.4
Form Factor and Interface
Detailed Description No Antenna 3.3V±10% 120mA@RX 300mA@TX UART
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PRODUCTS SPECIFICATION
5. Mechanical Characteristics
5.1 Mechanical Requirements
4.3.1 4.3.2 4.3.3
Feature Length Width Height
Detailed Description 20.5mm 17.5mm 1.0mm(PCB)
5.2 Mechanical Dimensions
WL1KM1000
UNIT:mm, Range of dimensional error
DIM (mm) 0-5 5-10
10-50
Tolerance (mm) ±0.15 ±0.20 ±0.30
5.3 Pin Description
Pin
Definition
1
GND
2
GND
3
GPIO2
4
GPIO3
5
GPIO16
6
GPIO14
7
GPIO15
Remark
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I/O
Version 1.1
PRODUCTS SPECIFICATION
WL1KM1000
8
NC
9
GPIO22
10
NC
11
GPIO1
12
GPIO4
13
NC
14
NC
15
GND
16
GND
17
GND
18
GPIO12
19
GPIO13
20
NC
21
NC
22
GPIO11
23
GPIO12
24
NC
25
NC
26
GND
27
GND
28
GND
29
GND
30
GND
31
RF
32
GND
33
GND
34
GND
35
CHIP_EN
36
VDD3.3
37
VDD3.3
38
GND
39
RTC_EINT
40
DVDD_IO_1
41
NC
42
GND
43
GND
44
GPIO17
GND
3.3V 3.3V 3.3V GND
3.3V power supply 3.3V power supply 3.3V power supply Ground
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Version 1.1
PRODUCTS SPECIFICATION
45
VRTC
46
GPIO22
47
GPIO21
48
GND
49
GPIO0
50
GND
51
GPIO21
52
GPIO21
53
NC
54
NC
UTXD0 URXD0
5.4 Product Picture
WL1KM1000
TOP VIEW
BOTTOM VIEW
6. BOM (Part List) Important material information
Material Name 1 Integrated Circuit 2 Capacitor 3 Inductor 4 Resistor 5 Crystal XTAL 6 Chip Power Inductors 7 PCB
Company AIROHA/MediaTek MURATA/WALSIN/TAIYO MURATA /CHILISIN YAGEO/TA-I/ WALSIN /RALEC HARMONY/CREC/TXC CHILISIN/ TAIYO FZX-PCB/BXXW-PCB
Using State Using Using Using Using Using Using Using
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PRODUCTS SPECIFICATION
7. Module Package
Appendix : Schematic diagram of packaging
WL1KM1000
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PRODUCTS SPECIFICATION
WL1KM1000
Carton426*378*300mm Inner Box411*365*54mm Antistatic Vacuum Bag450X500mm Packing Quantity4000PCS per box5 boxes800PCS per box
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Version 1.1
8. Note
PRODUCTS SPECIFICATION
WL1KM1000
8.1 ESD
Can't get the module bare hands when needs, must we wear the gloves and static ring.
8.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard. Peak Temperature : 245±5°C Times : 2 s
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PRODUCTS SPECIFICATION
WL1KM1000
8.3 Wireless module before the SMT note
1.When customers Open stencil must be sure the hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm.
2.Can't get the wifi module bare hands when needs, must we wear the gloves and static ring. 3.The furnace temperature according to the size of the customer the mainboard ,generally like to stick on a tablet standard temperature of 250 +/- 5,can do 260+/- 5.
Storage and use Wifi module control should pay attention to the following matters: · Module of the storage life of vacuum packaging 1-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%R.H. 1-2.After this bag is opened , devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3.Check the humidity card :stored at 20%RH.If :30%~40%(pink)or greater than 40%(red). Labeling module has moisture absorption. Mounted within 168 hours at factory conditions of: t 30% 60%R.H. Once opened, the workshop the preservation of life for 168 hours. 1-4.If baking is required, devices may be baked for: Modules must be to remove module moisture problem. Baking temperature: 125 , 8 hours. After baking, put proper amount of desiccant to seal packages. 1-5. The actual number of module vacuum packing which is based on the actual number of packages to the customer requirements, 2.Module reel packaging items as follows. 2-1.Storage life:12 months. Storage conditions:<40. Relative humidity:<90%R.H. 2-2.Module apart packing after 168 hoursTo launch patch need to bake, to remove the module hygroscopic, baking temperature conditions125, 8hours. 2-3. The actual number of module reel packing which is based on the actual number of packages to the customer requirements, 3.Module pallet packaging items as follows 3-1.Storage life3 months. Storage conditions:<40. Relative humidity:<90%R.H. 3-2.Module if not used within 48 hours, before launch the need for baking, baking temperature: 125 , 8 hours. 3-3. Pallet packaging each plate is 100 PCS. The actual number of module pallet packing which is based on the actual number of packages to the customer requirements.
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Version 1.1
Requirement per KDB996369 D03
2.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3
Explanation: This module meets the requirements of FCC part 15C(15.247).
2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer 's instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands.
Explanation: The EUT has a FPC Antenna, and the antenna use a permanently attached antenna which is not replaceable.
2.4 Limited module procedures
If a modular transmitter is approved as a "limited module, " then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.
Explanation: The module is not a limited module.
2.5 Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance.
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.
Explanation: Yes, The module with trace antenna designs, and This manual has been shown the layout of trace design, antenna, connectors, and isolation requirements.
2.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person 's body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application).
Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC ID is: 2AYHE-2403C
2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an "omni-directional antenna " is not considered to be a specific "antenna type ")).
For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors.
Explanation: The EUT has FPC Antenna, and the antenna use a permanently attached antenna which is unique.
2.8 Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating "Contains FCC ID " with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748.
Explanation:The host system using this module, should have label in a visible area indicated the following texts: "Contains FCC ID: 2AYHE-2403C, Contains IC: 26839-2403C"
2.9 Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer 's determination that a module as installed in a host complies with FCC requirements. Explanation: Top band can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter.
2.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
FCC STATEMENT :
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
ISED Statement
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device." This equipment should be installed and operated with a minumum distance of 20 cm between the radiator and your body.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil nedoit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement." Cet équipement doit être installé et utilisé avec une distance minimale de 20 cm entre le radiateur et votre corps.
MODIFICATION: Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the device.
Toute modification non approuvé explicitement par le fournisseur de licence de l'appareil peut entraîner l'annulation du droit de l'utilisateur à utiliser l'appareil.
This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada
The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.
The OEM must comply with the FCC labeling requirements. If the module's label is not visible when installed,then an additional permanent label must be applied on the outside of the finished product which states: "Contains transmitter module FCC ID: 2AYHE-2403C". Additionally, the following statement should be included on the label and in the final product's user manual: "This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation."
The module is limited to installation in mobile or fixed applications. Separate approval is required for all other operating configurations, including portable configuration with respect to Part 2.1093 and different antenna configurations.
A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end-use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCC application filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations (e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable. (OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user
IC labeling requirement for the final end product:
The final end product must be labeled in a visible area with the following "Contains IC: 26839-2403C"
The Host Marketing Name (HMN) must be indicated at any location on the exterior of the host product or product packaging or product literature, which shall be available with the host product or online.
This radio transmitter [ lC:26839-2403C] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.
Frequency range
Manufacturer
Peak gain Impedance
2412~2462MHz
Shenzhen Be-
4.11dBi
50
Comfortable Technology
Co. Ltd
Antenna type FPC Antenna
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