User Manual for LG Electronics models including: LCWB009, BEJ-LCWB009, BEJLCWB009, LCWB-009 WiFi 4 BLE5.2 Module, LCWB-009, WiFi 4 BLE5.2 Module, BLE5.2 Module, Module
LG Electronics USA, Inc. LCWB009 BEJ-LCWB009 BEJLCWB009 lcwb009
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DocumentDocumentLCWB-009 User Manual WIFI 4 + BLE5.2 MODULE 1 CONTENTS 1 CONTENTS ............................................................................................................................................................................... 1 1 Overview ................................................................................................................................................................................... 3 2 Software information........................................................................................................................................................... 3 3 Features ..................................................................................................................................................................................... 3 4 Block Diagram ........................................................................................................................................................................ 4 4.1 Overall Block Diagram ............................................................................................................................................ 4 4.2 SoC Internal Power Distribution......................................................................................................................... 4 5 Physical photo......................................................................................................................................................................... 5 6 PIN Description ...................................................................................................................................................................... 6 7 Physical Dimensions...........................................................................................................................................................10 8 General Specification.........................................................................................................................................................11 9 Product Specifications.......................................................................................................................................................11 9.1 Electrical Specifications.........................................................................................................................................11 9.1.1 Absolute Maximum Ratings ...................................................................................................................11 9.1.2 Operating conditions ................................................................................................................................11 9.1.3 ESD spec.........................................................................................................................................................11 9.1.4 Current Consumption (Wi-Fi)................................................................................................................12 9.1.5 Current Consumption (BLE) ...................................................................................................................13 9.2 Standard Rated Specification ............................................................................................................................13 9.2.1 WIFI...................................................................................................................................................................13 9.2.2 BLE.....................................................................................................................................................................13 10 RF Specifications.........................................................................................................................................................14 10.1 RF Characteristics for Wi-Fi............................................................................................................................14 10.2 RF Characteristics for BLE ...............................................................................................................................15 11 Recommended Reflow Profile..............................................................................................................................15 12 Packing information..................................................................................................................................................16 12.1 Carrier size Detail:...............................................................................................................................................16 13 FCC Statement.............................................................................................................................................................16 13.1 FCC Part 15.19 Statements:............................................................................................................................16 13.2 FCC Part 15.105 statement(Class B) ...........................................................................................................16 13.3 FCC Part 15.21 statement ...............................................................................................................................17 13.4 Responsible Party Information .....................................................................................................................17 1 13.5 Modular Approval Statement........................................................................................................................17 14 ISED Statement ...........................................................................................................................................................19 14.1 Licensed-exempt Statement ..........................................................................................................................19 14.2 RF Exposure Statement (MPE) ......................................................................................................................19 14.3 End Product Labeling........................................................................................................................................19 15 Customer Support .....................................................................................................................................................20 16 Regulatory Notice (CE) ............................................................................................................................................20 16.1 Single Point of Contact....................................................................................................................................20 16.2 RF Exposure...........................................................................................................................................................20 17 UK...................................................................................................................................................................................... 21 17.1 Simplified Declaration of Conformity ........................................................................................................21 17.2 Single Point of Contact....................................................................................................................................21 17.3 RF Exposure...........................................................................................................................................................21 2 1 Overview LCWB-009 is a highly integrated 1x1 single-band 2.4 GHz Wi-Fi 4(802.11b/g/n) and Bluetooth Low Energy (LE) 5.2 system designed for applications requiring high security and rich resources. A 32-bit integrated Armv 8-M STAR-MC1 microcontroller and a comprehensive set of peripherals for advanced Internet Internet of Things (IoT) applications. LCWB-009 provides state-of-the-art security based on a powerful security architecture. The module integrates a Platform Security Suite (IPSS) for the Internet of Things for encryption and system security control. IPSS embed the features of comprehensive and powerful security to set up a topsecret execution environment for IoT devices. Using advanced design technology and ultra-low power process technology, LCWB-009 provides high integration, efficient security, and minimal power consumption for a wide range of advanced IoT applications. 2 Software information LCWB-009 software information is shown in the table below. Model LCWB-009 software information Check Sum TBD Version TBD 3 Features IEEE 802.11b/g/n 1x1 compliant 20 MHz channel bandwidth for 2.4 GHz Supports Orthogonal Frequency Division Multiple Access (OFDMA) Supports Target Wake Time (TWT) TX and RX Low-Density Parity Check (LDPC) support for extended range WPA/WPA2/WPA3-Personal support for enhanced security Operating modes: STA and SoftAP Concurrent SoftAP + STA Bluetooth Low Energy (LE) 5.2 Supports Bluetooth Low Energy 1 Mbps and long range (125 kbps and 500 kbps) Supported Bluetooth Low Energy features: LE Audio,1 Mbps, advertising extensions, and long range Security S/W: Beken 3 6 PIN Description 6 Module disk interface PIN NO. NAME 1 GND 2 GND 3 P1_UART1_RX 4 P0_UART1_TX 5 GPIO32_TX_5V GPIO34_RX_5V 6 7 GND 8 D5V 9 GND P14/SD_CLK/SPI_ 10 SCK TYPE Power ground Power ground I/O I/O I/O I/O Power ground Power VBAT FUNCTION Ground Ground GPIO1: general-purpose I/O UART1_RX: receive data input I2C1_SDA: serial data SWDIO: serial wire data ADC13: analog input channel LIN_RXD: receive data input GPIO0: general-purpose I/O UART1_TX: transmit data output I2C1_SCL: serial clock SWCLK: serial wire clock ADC12: analog input channel LIN_TXD: transmit data output GPIO32: general-purpose I/O PWMG1_PWM0: PWMG1 channel PWM0 TOUCH6: touch sensing I/O GPIO34: general-purpose I/O PWMG1_PWM2: PWMG1 channel PWM2 TOUCH8: touch sensing I/O SPI0_CSN: chip select Ground power supply Power ground I/O Ground GPIO14: general-purpose I/O SDIO_CLK: clock SPI0_SCK: serial clock BT_ANT0: Bluetooth antenna select I2C1_SCL: serial clock 7 P15/SD_CMD/SPI_ 11 CSN I/O P16/SD_D0/SPI_M 12 OSI I/O 13 P17/SD_D1/SPI_M I/O ISO 14 P18/SD_D2 I/O P19/SD_D3 15 I/O 16 P41_UART2_TX_5V I/O GPIO15: general-purpose I/O SDIO_CMD: command/response SPI0_CSN: chip select BT_ANT1: Bluetooth antenna select I2C1_SDA: serial data GPIO16: general-purpose I/O SDIO_DATA0: data SPI0_MOSI: master out slave in BT_ANT2: Bluetooth antenna select GPIO17: general-purpose I/O SDIO_DATA1: data SPI0_MISO: master in slave out BT_ANT3: Bluetooth antenna select GPIO18: general-purpose I/O SDIO_DATA2: data PWMG0_PWM0: PWMG0 channel PWM0 GPIO19: general-purpose I/O SDIO_DATA3: data PWMG0_PWM1: PWMG0 channel PWM1 GPIO41: general-purpose I/O UART2_TX: transmit data output LIN_TXD: transmit data output 17 P40_UART2_RX_5V I/O GPIO40: general-purpose I/O UART2_RX: receive data input LIN_RXD: receive data input 18 GND Power ground Ground 8 CN1 pinhole interface PIN NO. NAME 1 CEN 2 P0_UART1_TX 3 P1_UART1_RX 4 GND 5 P10_DL_UART0_RX 6 P11_DL_UART0_TX 7 D5V TYPE I/O I/O I/O Power ground I/O I/O Power VBAT FUNCTION Chip enable, active high GPIO0: general-purpose I/O UART1_TX: transmit data output I2C1_SCL: serial clock SWCLK: serial wire clock ADC12: analog input channel LIN_TXD: transmit data output GPIO1: general-purpose I/O UART1_RX: receive data input I2C1_SDA: serial data SWDIO: serial wire data ADC13: analog input channel LIN_RXD: receive data input Ground GPIO10: general-purpose I/O DL_UART_RX: UART flash download receive data input UART0_RX: receive data input SDIO_DATA2: data CLK_AUXS_CIS: CIS master clock (derived from DCO/APLL/CLK_320M/ CLK_480M) GPIO11: general-purpose I/O DL_UART_TX: UART flash download transmit data output UART0_TX: transmit data output SDIO_DATA3: data power supply 9 7 Physical Dimensions 10 8 General Specification Model LCWB-009 Product Name WLAN 802.11b/g/n UART 1T1R + BLE 5.2 module Major Chipset BK7234 Standard 802.11 b/g/n WiFi Interface UART Supply Voltage Operating Temperature Storage Temperature DC5V OR DC3.3V -30° C ~ 85° C -40° C ~ 85°C Humidity 5% to 90% maximum ESD Protection Dimension Contact: ± 4KV, Air: ± 8KV; Condition test report, Contact: ± 30KV, Air: ± 30KV. 25.0x15.0x2.7mm (LxWxH) ±0.2mm 9 Product Specifications 9.1 Electrical Specifications 9.1.1 Absolute Maximum Ratings Description Storage Temperature Storage Humidity (40) Min. Ttyp Max. Unit -40 +85 5 90 % 9.1.2 Operating conditions Description Supply Voltage Ambient Temperature Ambient Humidity (40) Min. Typ 3 -30 5 9.1.3 ESD spec ESD Air discharge Contact discharge Unit ± 8KV ± 4KV 11 Max. Unit 5.5 Vdc +85 90 % 9.1.4 Current Consumption (Wi-Fi) 9.1.4.1 When, Supply voltage = 5V Parameter Active Mode Condition Min Typ 11b: 11 Mbps DSSS - 21 RX current TX current Sleep Mode Sleep Shutdown 11g: 54 Mbps OFDM 11n: MCS7, HT20 - 21 - 21 11b: 11 Mbps DSSS @ 19 - 235 dBm 11g: 54 Mbps OFDM @ 17 - 200 dBm 11n: MCS7, HT20 @ 16 dBm - 189 Supply Voltage = 5 V Supply Voltage = 5 V - 236 - 20 9.1.4.2 When, Supply voltage = 3.3V Parameter Active Mode Condition Min Typ 11b: 11 Mbps DSSS - 27 11g: 54 Mbps OFDM - 27 RX current TX current 11n: MCS7, HT20 - 27 11b: 11 Mbps DSSS @ 19 - 250 dBm 11g: 54 Mbps OFDM @ 17 - 215 dBm 11n: MCS7, HT20 @ 16 dBm - 205 Sleep Mode Sleep Supply Voltage = 3.3 V - 220 Shutdown Supply Voltage = 3.3 V - 20 12 Max unit - mA - mA - mA - mA - mA - mA - A - A Max unit - mA - mA - mA - mA - mA - mA - A - A 9.1.5 Current Consumption (BLE) 9.1.5.1 When, Supply voltage = 5V Device state Code rate Output power Min Typ Max unit ON_Transmit 1 Mbps 3.5dBm - 104 - mA 9.1.5.2 When, Supply voltage = 3.3V Device state Code rate Output power Min Typ Max unit ON_Transmit 1 Mbps 3.5dBm - 110 - mA 9.2 Standard Rated Specification Radio performance under typical conditions:VDD @5.0V,VD33@3.3V,temp.25 9.2.1 WIFI Division WLAN Standard Host Interface Frequency Range Modulation Data Rate Characteristic IEEE 802.11 b/g/n HT20 UART 2412MHz2462MHz 802.11b:DSSS,CCK,DPSK,DQPSK 802.11g/n:OFDM,BPSK,QPSK,16-QAM,64-QAM 802.11b:1,2,5.5,11Mbps 802.11g:6,9,12,18,24,36,48,54Mbps Data Rate (20MHz) 802.11n:MCSO,MCS1,MCS2,MCS3,MCS4,MCS5,MCS6,MCS7 9.2.2 BLE Frequency Range Spread Spectrum Modulation Data Rate 2402MHz2480MHz FHSS (Frequency Hopping Spread Spectrum) GFSK (Gaussian Frequency Shift Keying) 1 Mbps 13 10 RF Specifications 10.1 RF Characteristics for Wi-Fi Feature WLAN Standard Frequency Range Number of Channels Description IEEE 802.11b/g/n WiFi compliant 2412MHz2462MHz (2.4 GHz ISM Band) 2.4GHzCh1 ~ Ch11 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK Output Power 802.11b / 1Mbps : 17dBm ± 2 dB @ EVM -10dB 802.11b /11Mbps : 17dBm ± 2 dB @ EVM -15dB 802.11g / 6Mbps : 17dBm ± 2 dB @ EVM -5dB 802.11g /54Mbps : 15 dBm ± 2 dB @ EVM -28dB 802.11n /MCS0 : 16 dBm ± 2 dB @ EVM -5dB 802.11n /MCS7 : 14 dBm ± 2 dB @ EVM -30dB Receive - Sensitivity (11b,20MHz) - @8% PER - 1Mbps PER @ -93 dBm, typical 2Mbps PER @ -90 dBm, typical 5.5Mbps PER @ -88 dBm, typical - 11Mbps PER @ -85 dBm, typical - 6Mbps PER @ -91 dBm, typical - Receive - Sensitivity (11g,20MHz) - @10% PER - - 9Mbps 12Mbps 18Mbps 24Mbps 36Mbps PER @ -89 dBm, typical PER @ -86 dBm, typical PER @ -83 dBm, typical PER @ -80 dBm, typical PER @ -77 dBm, typical - 48Mbps PER @ -74 dBm, typical - 54Mbps PER @ -72 dBm, typical Receive - Sensitivity (11n,20MHz) - @10% PER - MCS=0 MCS=1 MCS=2 PER @ -90 dBm, typical PER @ -87 dBm, typical PER @ -84 dBm, typical - MCS=3 PER @ -81 dBm, typical - MCS=4 PER @ -78 dBm, typical 14 - MCS=5 PER @ -75 dBm, typical - MCS=6 PER @ -72 dBm, typical - MCS=7 PER @ -70 dBm, typical 10.2 RF Characteristics for BLE Wireless Standard Bluetooth® V5.2 specification Frequency Band 2402~2480 MHz RF TX Output Power 6dBm ± 1 dB RX Sensitivity -95dBm (typical) 15 11 Recommended Reflow Profile Referred IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times 60~ 120 sec 40~ 60 sec 12 Packing information 12.1 Carrier size Detail: 15 13 FCC Statement 13.1 FCC Part 15.19 Statements: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 13.2 FCC Part 15.105 statement(Class B) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 13.3 FCC Part 15.21 statement Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. 16 <Regulatory notice to host manufacturer according to KDB 996369 D03 OEM Manual v01 > List of applicable FCC rules This module has been granted modular approval as below listed FCC rule parts. -FCC Rule parts 15C(15.247) Summarize the specific operational use conditions -The OEM integrator should use equivalent antennas which is the same type and equal or less gain then an antenna listed below this instruction manual. Limited module procedures (N/A) Single Module Trace antenna designs (N/A) If trace antenna designs are applicable, full-detail design specifications are required per D02 Module Q&A Question 11. For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. RF exposure considerations The module has been certified for integration into products only by OEM integrators under the following condition: -The antenna(s) must be installed such that a minimum separation distance of at least 50mm is maintained between the radiator (antenna) and all persons at all times. -The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. -portable use As long as the three conditions above are met, further transmitter testing will not be required. OEM integrators should provide the minimum separation distance to end users in their end-product manuals. -This module is exclusively for LG Electronics' finished products. -If the host device equipped with this module does not meet the 50mm separation distance requirement, additional certification will be conducted. * Host device examples: washing machines, air conditioners, refrigerators, ovens, vacuum cleaners, etc. Antennas This module is certified with the following integrated antenna. - Ant. Type: PCB Pattern Antenna (Max. Antenna gain: -1.05 dBi ) Any new antenna type, higher gain than listed antennas should be met the requirements of FCC rule 15.203 and 2.1043 as permissive change procedure Label and compliance information End Product Labeling (FCC) The module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: * Contains FCC ID: BEJ-LCWB009 Information on test modes and additional testing requirements -OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. (for example, digital device emissions, PC peripheral requirements, additional transmitter in the host, etc.). Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Note EMI Considerations Note that a host manufacture is recommended to use D04 Module Integration Guide recommending as "best practice" RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement to host components or properties For standalone mode, reference the guidance in D04 Module Integration Guide and for simultaneous mode; see D02 Module Q&A Question 12, which permits the host manufacturer to confirm compliance. How to make changes Since only Grantees are permitted to make permissive changes, when the module will be used differently than granted, please contact the module manufacture on below contact information. -. Contact information: younguk.nam@lge.com / Tel: 82-31-8066-5539 Responsible Party Information -. Model name : LCWB-009 -. Responsible Party U.S. Contact Information : LG ELECTRONICS CANADA INC. (Name) David Kim (Phone number) 201-470-2696 (Address) 111 Sylvan Avenue, North Building, Englewood Cliffs,New Jersey 07632, United States 14. ISED Statement 14.1 Licensed-exempt Statement This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 14.2 RF Exposure Statement The antenna(s) must be installed such that a minimum separation distance of at least 50mm is maintained between the radiator (antenna) and all persons at all times. l'exposition aux RF L'antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance minimum de au moins 50mm entre la source de radiation (l'antenne) et toute personne physique. 14.3 End Product Labeling The module is labeled with its own IC Certification Number. If the IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: Contains IC: 2703N-LCWB009 É tiquetage du produit final (IC) Le module est étiqueté avec sa propre identification FCC et son propre numéro de certification IC. Si l'identification FCC et le numéro de certification IC ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre dispositif, la partie externe du dispositif dans lequel le module est installé devra également présenter une étiquette faisant référence au module inclus. Dans ce cas, le produit final devra être étiqueté sur une zone visible avec les informations suivantes : Contient module émetteur IC : 2703N-LCWB009 19Microsoft Word 2021