Foxconn T99W175 5GNR/LTE-Advanced PCI Express M.2 Module
Engineering Requirements Specification
General Description
The T99W175 is a data card solution designed to enable wireless wide-area network (WWAN) connectivity for notebook computers and other devices compatible with the PCI Express M.2 Specification 3042 type Key B slot. It supports 5GNR (Sub 6G/mmWave), LTE, UMTS (HSDPA/HSUPA/HSPA+DC-HSPA+), and GPS/Glonass/Beidou/Galileo protocols in a single hardware configuration.
Key Features
- SKU: WW-1-5G / T99W175
- Carrier Support: NA (AT&T, Verizon, Sprint), WW (Vodafone, Swisscom, Telefonica-02), EU (Deutsche Telekom, Swisscom), APAC (Telstra, Optus, Docomo, KDDI, Softbank), China (CMCC/CUCC/CTCC). Carrier engagement is based on real business agreements.
- QCT Solution: SDX55+SDR865+SMR526+PMX55
- 5G: FR1 (Sub 6G) with various Low, Mid, and High bands; FR2 (mmWave) supporting n257/258/260/261. Supports 4x4 MIMO.
- 4G: Supports various bands with 4x4 MIMO. LAA support for B46 (DL only).
- 3G: WCDMA support for B1/2/4/5(6/19)/8/9.
- GNSS: Dual-Frequency GNSS supporting GPS, Glonass, Beidou, Galileo (L1 and L5).
- eSIM: Dual SIM with eSIM on board (eSIM is optional).
- Interface: PCIe 3.0
- Form Factor: 3042 PCIe M.2 Key B
System Main Feature
| Feature | Description |
|---|---|
| Physical | PCI express M.2 module, size 3042, Key B, 75Pin golden finger |
| Electrical | Single VCC supply (3.135V~3.63V) |
| Dimension | 42 mm × 30 mm × 2.6 mm (max height 2.75mm with 0.15mm tolerance) |
| Shielding design | Shield case on board design, no additional shielding required |
| Weight | Approximately 8g |
| USIM | Off-board USIM connector supported via USIM1; e-SIM embedded via USIM2 |
Operating Bands
Details on WCDMA, LTE FDD/TDD, and 5GNR Sub 6GHz operating bands are provided, including specific frequency ranges for UL and DL.
Hardware Features
Modem Engine
- Soft Baseband: SDX-55
- RF: SDR865
- Power: PMX55
Connectivity Engine
- PCIe: PCI Express (EP and RC modes)
- USIM: located off board
- Antenna: connectors for the off-board antennas
Mobile Data Modem (SDX55 Chipset)
- Processor: 7 nm process, 1.5 GHz ARM Cortex-A7 application processor, 1.5 GHz (Turbo) Qualcomm Hexagon DSP modem processor, and Cortex-M3 up to 400 MHz.
- Memory: 4 Gb LPDDR4X at 1866 MHz; EBI2 for 8-bit NAND.
- Air Interface: Supports WCDMA, LTE (R15 Cat20/22, FDD/TDD), 5GNR Rel 15 compliant (mmW TDD, Sub-6), and GNSS (GPS, GLONASS, BeiDou, Galileo, QZSS).
- Advance RX operation: Mobile receive diversity, 4x4 MIMO HORxD (LTE/ 5GNR Sub6G).
- Connectivity: PCIe Express (Gen 3, 2 lanes), USB 2.0 or USB 3.1 Gen2, QLink3.0, SDIO 3.0.
- UIM support: Two dual-voltage (1.8/2.85 V) ports.
RF Transceiver (SDR865)
- Qualcomm Technologies, Inc. 14 nm RF CMOS device.
- Single-chip RF transceiver implementing 2G/3G/4G and 5G NR sub-6.
- Supports 3GPP Rel15 5G NR sub-6.
- Supports 256 QAM for LTE and 5G NR uplink and downlink.
- Supports Downlink 4x4 MIMO and uplink 2x2 MIMO for Sub6G.
- Multimode support: 3GPP WCDMA, HSDPA, HSUPA, HSPA+, DC-HSPA+, 3C-HSPA+, LTE FDD/TDD, TD-SCDMA, Licensed assist access (LAA), 5G NR sub-6 GHz.
- LTE CA capability: DLCA, Inter-band DLCA, Intra band contiguous CA, Intra band non-contiguous ULCA, Inter band ULCA, Intra band contiguous CA.
- LTE MIMO capability: 4x4 DL MIMO.
- LTE Modulation: UL: 256 QAM; DL: 256 QAM.
- 3GPP 5G NR standard: Sub-6 GHz.
- 5G Modulation: UL: 256 QAM; DL: 256 QAM.
- Waveform: UL: CP-OFDM and DFT-S-OFDM; DL: CP-OFDM.
- Sub-Carrier Spacing (SCS): 15 KHz, 30 KHz.
- Duplex mode: FDD and TDD.
- Operation mode: Standalone mode (SA) and Non-Standalone mode (NSA).
- CA support: DLCA MIMO DL: 4x4 MIMO; UL: 2x2 MIMO.
- EN-DC: LTE and NR sub-6 GHz dual connectivity.
- Transmit signal paths: Three Tx chains (Tx0, Tx1, Tx2) with multiple Tx ports.
- Receiver signal paths: 18 single-ended PRx inputs, 18 single-ended DRx inputs.
- GNSS Rx path: Supports GPS, GLONASS, Galileo, and BeiDou with two GNSS paths for simultaneous L1 and L2/L5.
- WAN and GNSS modes: Simultaneous GNSS (WAN + GNSS), Standalone GNSS (without WAN).
- Tx feedback Rx path: Includes FBRx circuits for ILPC and CLPC, Tx power estimation, Tx factory calibration, and online fast autoPin/autodelay.
Power Management IC (PMX55)
- Integrates power management, housekeeping, and user interface support functions.
- Key features: Five HFS510 SMPS, two FTS510 SMPS, 16 LDO regulators, On-chip ADC, Overtemperature protection, Sleep clock and RTC with alarm, SPMI, 11 GPIOS.
- Key benefits: Ultra-low-power regulator retention mode, Switched-mode power supplies (HF-SMPS, FT-SMPS), Low dropout (LDO) linear regulators, On-chip ADC, Shared housekeeping (HK), Analog multiplexing for ADC, HK inputs, XO input, Overtemperature protection, Multistage smart thermal control, Special-purpose clock output, Real-time clock, IC-level interfaces (SPMI), Configurable I/Os.
Antenna Design
Antenna Specification
The T99W175 provides connectivity for off-board antennas via flexible RF coaxial cables. It features four RF connectors (MHF4 type) for 5GNR Sub 6G & LTE (primary Tx/Rx, diversity Rx, 4x4 MIMO Rx) and three 2-in-1 mmWave IF connectors.
LTE & 5GNR Sub 6G Antenna Specifications
| Parameter | Min. | Typ. | Max. | Units | Notes |
|---|---|---|---|---|---|
| Cable loss | / | / | 0.5 | dB | Maximum loss to antenna |
| Impedance | / | 50 | / | Ohm | Antenna load impedance |
| VSWR | / | / | 3:1 | / | Maximum allowed VSWR of antenna |
| Isolation | 20 | / | / | dB | For all antenna each other |
Notes on Antenna Peak Gain:
- Peak gain limit: 2.5dBi for frequency <1.5GHz and 4dBi for frequency >1.5GHz.
- For Japan, peak gain limit: 2.5dBi for frequency <1.5GHz and 3dBi for frequency >1.5GHz.
- Band 30 peak gain limit: 2.99dBi (FCC certified).
- Band 48 peak gain limit: 0.92dBi (FCC certified).
Antenna Connector Configuration
Diagrams and tables detail the LTE & Sub 6G antenna connector configurations (ANT0-ANT6) and mmWave IF connector configurations (ANT4-ANT6).
Mechanical Specifications
Overview
The T99W175 is compatible with the PCI Express M.2 Specification 3042 Key B type 75-pin card edge connector.
Mechanical Constraints
Detailed diagrams show the mechanical constraints, including dimensions and ground area specifications.
M.2 Card Assembly
Information on Mid-mount and Top-mount connections for single-sided modules, including component height limitations and remarks on thermal dissipation.
Connector Assembly
Instructions for mating and unmating connectors, including the use of a pulling tool.
Electrical Specifications
Recommended Operating Conditions
| Parameter | Min | Type | Max | Units |
|---|---|---|---|---|
| Storage temperature | -40 | +25 | +85 | °C |
| Recommended operating temperature (3GPP compliant) | -30 | +25 | +70 | °C |
| Extendable (with limited performance) | -40 | / | +85 | °C |
| Operating voltage | 3.135 | 3.3 | 3.63 | Vdc |
Notes on operating temperature reference point and extendable operation are provided.
Power Consumption
Table detailing radio system power consumption for various conditions like WCDMA/LTE suspend modes, connected standby, and radio off.
Thermal Dissipation Proposal
TBD (To Be Determined)
RF Performance Specifications
RF Maximum TX Power Specifications
Table provides conductive maximum transmit power for LTE bands, including standard, design specifications (Max, Typ, Min).
RF Minimum Rx Sensitivity Specifications
Table provides conductive minimum sensitivity for LTE bands and 5GNR Sub6G bands, including PRx, DRx, HORx_1, HORx_2, and MIMO Combined values.
Bandwidth Specifications
Tables detail LTE and 5G Sub6G support for various bandwidths (1.4M, 3M, 5M, 10M, 15M, 20M for LTE; 5M to 100M for 5G Sub6G) across different bands and SCS.
System Block Diagram
A block diagram illustrates the system architecture, showing the interaction between chipsets like SDX55, SDR865, PMX55, and RF FEMs, along with antenna connections.
Pin Definition
Detailed tables provide the M.2 Pin definitions, including pin numbers, signals, I/O types, and descriptions for various functions like power, data, control, and antenna interfaces.
Platform Connection Design
Configuration Pins
Details on M.2 module configuration pins for WWAN-PCIe-2.
Power and Ground
Information on operating voltage and the requirement for all power and ground pins to be connected.
Full_Card_Power_Off
Description of the pin used to control the module's power on/off state.
PCIe Interface
Recommendations for PCIe signal integrity, including choke and capacitor placement.
W_DISABLE#
Control setting for managing radio operation, allowing disabling/enabling of WWAN and GPS radios.
LED Indication
Explanation of LED signals for status indication and typical LED connection in a platform.
DPR (Dynamic Power Reduction)
Details on the DPR signal used for regulatory SAR requirements, including its connection and function.
USIM
Information on USIM interface, including 2 USIM interface, USIM card socket recommendations, UIM-PWR, SIM Detect functionality, and eSIM support.
Antenna Control
Details on the MIPI interface for external antenna tuner applications.
Antenna Tuner Mode Switch
Configuration options for antenna tuner modes (Notebook and Tablet scenarios).
Coexistence
Information on coexistence solutions between radios on the M.2 card and other off-card radios, including signals like COEX1, COEX2, LAA_n79_Tx_EN, and WLAN_Tx_EN.
RESET#
Description of the asynchronous RESET# pin and recommendations for its implementation.
Power off Timing Requirement
Timing diagrams and specifications for power off and warm boot/restart sequences.
