Instruction Manual for unicore models including: UM980 All Constellation Multi Frequency High Precision RTK Positioning Module, UM980, All Constellation Multi Frequency High Precision RTK Positioning Module, Constellation Multi Frequency High Precision RTK Positioning Module, Multi Frequency High Precision RTK Positioning Module, Frequency High Precision RTK Positioning Module, High Precision RTK Positioning Module, Precision RTK Positioning Module, RTK Positioning Module, Positioning Module
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DocumentDocumentINSTALLATION AND OPERATION USER MANUAL WWW.UNICORECOMM.COM UM980 BDS/GPS/GLONASS/Galileo/QZSS All-constellation Multi-frequency High Precision RTK Positioning Module Copyright© 2009-2023, Unicore Communications, Inc. Data subject to change without notice. Revision History Version Revision History Date R1.0 R1.1 R1.2 First release 2022-08 If hot start is not used, V_BCKP should be connected to VCC; Update the IO threshold in Table 2-4; Add section 3.1: UM980 minimal design; Update the recommended thickness of the stencil in Chapter 4 2022-10 Update the supported frequencies; Update the TTFF; Add chapter 3.5: Recommended PCB Package Design; Optimize Chapter 3.2 Antenna Feed Design; Optimize Chapter 3.3 Power-on and Power-off 2023-04 i UM980 User Manual Legal right notice This manual provides information and details on the products of Unicore Communication, Inc. ("Unicore") referred to herein. All rights, title and interest to this document and the information such as data, designs, layouts contained in this manual are fully reserved, including but not limited to the copyrights, patents, trademarks and other proprietary rights as relevant governing laws may grant, and such rights may evolve and be approved, registered or granted from the whole information aforesaid or any part(s) of it or any combination of those parts. Unicore holds the trademarks of "", "UNICORECOMM" and other trade name, trademark, icon, logo, brand name and/or service mark of Unicore products or their product serial referred to in this manual (collectively "Unicore Trademarks"). This manual or any part of it, shall not be deemed as, either expressly, implied, by estoppel or any other form, the granting or transferring of Unicore rights and/or interests (including but not limited to the aforementioned trademark rights), in whole or in part. Disclaimer The information contained in this manual is provided "as is" and is believed to be true and correct at the time of its publication or revision. This manual does not represent, and in any case, shall not be construed as a commitments or warranty on the part of Unicore with respect to the fitness for a particular purpose/use, the accuracy, reliability and correctness of the information contained herein. Information, such as product specifications, descriptions, features and user guide in this manual, are subject to change by Unicore at any time without prior notice, which may not be completely consistent with such information of the specific product you purchase. Should you purchase our product and encounter any inconsistency, please contact us or our local authorized distributor for the most up-to-date version of this manual along with any addenda or corrigenda. ii Foreword This document describes the information of the hardware, package, specification and the use of Unicore UM980 modules. Target Readers This document applies to technicians who possess the expertise on GNSS receivers. iii UM980 User Manual Contents 1 Introduction ............................................................................................... 1 1.1 Key Features.....................................................................................................................2 1.2 Key Specifications ...........................................................................................................2 1.3 Block Diagram..................................................................................................................5 2 Hardware ................................................................................................... 6 2.1 Pin Definition....................................................................................................................6 2.2 Electrical Specifications ............................................................................................... 10 2.2.1 Absolute Maximum Ratings......................................................................................10 2.2.2 Operating Conditions.................................................................................................10 2.2.3 IO Threshold ...............................................................................................................11 2.2.4 Antenna Feature.........................................................................................................11 2.3 Dimensions ................................................................................................................... 12 3 Hardware Design ..................................................................................... 14 3.1 Recommended Minimal Design................................................................................... 14 3.2 Antenna Feed Design ................................................................................................... 14 3.3 Power-on and Power-off ............................................................................................. 16 3.4 Grounding and Heat Dissipation ................................................................................. 16 3.5 Recommended PCB Package Design ......................................................................... 17 4 Production Requirement.......................................................................... 18 5 Packaging................................................................................................ 19 5.1 Label Description .......................................................................................................... 19 5.2 Product Packaging ....................................................................................................... 19 I 1 Introduction UM980 is a new generation of GNSS high precision RTK positioning module from Unicore. It supports all constellations and all frequencies, and can simultaneously track BDS B1I/B2I/B3I/B1C/B2a/B2b, GPS L1/L2/L5, GLONASS G1/G2/G3, Galileo E1/E5a/E5b/E6, QZSS L1/L2/L5, NavIC L5 and SBAS. The module is mainly used in surveying and mapping, precise agriculture, UAVs, and autonomous robots. UM980 is based on NebulasIVTM, a GNSS SoC which integrates the RF-baseband and high precision algorithm. Besides, the SoC integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor with 22 nm low power design, and it supports 1408 super channels. All these above enable stronger signal processing. With the built-in JamShield adaptive anti-jamming technology, UM980 can fulfill a strengthening RTK engine solution of multi-mode multi-frequency, which ensures a good performance on RTK initialization speed, measurement accuracy and reliability even in the most challenging environments such as urban canyons and tree shades. Furthermore, UM980 supports abundant interfaces such as UART, I2C*, SPI*, as well as 1PPS, EVENT, CAN*, which meets the customers' needs in different applications. Figure 1-1 UM980 Module * I2C, SPI, CAN: reserved interfaces, not supported currently UC-00-M32 EN R1.2 Introduction 1 UM980 User Manual 1.1 Key Features Based on the new generation GNSS SoC -NebulasTM, with RF-baseband and high precision algorithm integrated 17 mm × 22 mm × 2.6 mm, surface-mount device Supports all-constellation multi-frequency on-chip RTK positioning solution Supports BDS B1I/B2I/B3I/B1C/B2a/B2b + GPS L1/L2/L5 + GLONASS G1/G2/G3 + Galileo E1/E5a/E5b/E6 + QZSS L1/L2/L5 + NavIC L5 + SBAS All-constellation multi-frequency RTK engine and advanced RTK processing technology Instantaneous RTK initialization technology Independent tracking of different frequencies, and 60 dB narrowband anti-jamming technology 1.2 Key Specifications Table 1-1 Technical Specifications Basic Information Channels Constellations Frequencies Power Voltage Power Consumption 1408 channels, based on NebulasIVTM BDS/GPS/GLONASS/Galileo/QZSS BDS: B1I, B2I, B3I, B1C, B2a, B2b GPS: L1 C/A, L1C, L2P (Y), L2C, L5 GLONASS: G1, G2, G3 Galileo: E1, E5a, E5b, E6 QZSS: L1, L2, L5 NavIC: L5 +3.0 V ~ +3.6 V DC 480 mW (Typical) 2 Introduction UC-00-M32 EN R1.2 Performance Positioning Accuracy Observation Accuracy (RMS) B1I/B1C/L1C/L1 C/A/G1/E1 Pseudorange B1I/B1C/L1C/L1 C/A/G1/E1 Carrier Phase B3I/L2P(Y)/L2C/G2/E6 Pseudorange B3I/L2P(Y)/L2C/G2/E6 Carrier Phase B2I/B2a/B2b/L5/G3/E5a/E5b Pseudorange B2I/B2a/B2b/L5/G3/E5a/E5b Carrier Phase Time Pulse Accuracy (RMS) Velocity Accuracy3 (RMS) Single Point Positioning1 (RMS) Horizontal: 1.5 m Vertical: 2.5 m DGPS (RMS)1,2 Horizontal: 0.4 m Vertical: 0.8 m RTK (RMS)1,2 Horizontal: 0.8 cm + 1 ppm Vertical: 1.5 cm + 1 ppm BDS GPS GLONASS Galileo 10 cm 10 cm 10 cm 10 cm 1 mm 1 mm 1 mm 1 mm 10 cm 10 cm 10 cm 10 cm 1 mm 1 mm 1 mm 1 mm 10 cm 10 cm 10 cm 10 cm 1 mm 1 mm 1 mm 20 ns 0.03 m/s 1 mm 1 Test results may be biased due to atmospheric conditions, baseline length, GNSS antenna type, multipath, number of visible satellites, and satellite geometry 2 The measurement uses a 1 km baseline and a receiver with good antenna performance, regardless of possible errors of antenna phase center offset 3 Open sky, unobstructed scene, 99% @ static UC-00-M32 EN R1.2 Introduction 3 UM980 User Manual Time to First Fix4 (TTFF) Initialization Time1 Initialization Reliability1 Data Update Rate Cold Start < 12 s Hot Start < 4 s < 5 s (Typical) > 99.9% 50 Hz5 Positioning Differential Data RTCM 3.X Data Format NMEA-0183, Unicore Physical Characteristics Package 54 pin LGA Dimensions 22 mm × 17 mm × 2.6 mm Weight 1.88 g ± 0.03 g Environmental Specifications Operating Temperature -40 °C ~ +85 °C Storage Temperature -55 °C ~ +95 °C Humidity 95% No condensation Vibration GJB150.16A-2009, MIL-STD-810F Shock GJB150.18A-2009, MIL-STD-810F Functional Ports UART × 3 I2C* × 1 SPI* × 1 CAN* × 1 Slave Shared with UART3 * I2C, SPI, CAN: reserved interfaces, not supported currently 4 -130dBm @ more than 12 available satellites 5 Supports 50 Hz after firmware upgrade 4 Introduction UC-00-M32 EN R1.2 1.3 Block Diagram RF in SAW Filter LNA NebulasIV GNSS RF GNSS BB Interface UART1/2/3 I2C SPIS PPS EVENT PVT/RTK/ERR RESET_N TCXO CLOCK UM980 Interface PMU RF Part Figure 1-2 UM980 Block Diagram The receiver gets filtered and enhanced GNSS signal from the antenna via a coaxial cable. The RF part converts the RF input signals into the IF signals, and converts IF analog signals into digital signals required for NebulasIVTM chip (UC9810). NebulasIVTM SoC (UC9810) NebulasIV (UC9810) is UNICORECOMM's new generation high precision GNSS SoC with 22 nm low power design, supporting all constellations all frequencies and 1408 super channels. It integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor, which can fulfill the high precision baseband processing and RTK positioning independently. External Interfaces The external interfaces of UM980 include UART, I2C*, SPI*, CAN*, PPS, EVENT, RTK_STAT, PVT_STAT, ERR_STAT, RESET_N, etc. * I2C, SPI, CAN: reserved interfaces, not supported currently UC-00-M32 EN R1.2 Introduction 5 UM980 User Manual 2 Hardware 2.1 Pin Definition GND NC NC NC GND V_BCKP RSV VCC VCC GND RXD3 TXD3 BIF BIF TXD1 42 RXD1 43 SDA 44 SCL 45 NC 46 NC 47 GND 48 RESET_N 49 NC 50 EVENT 51 NC 52 PPS 53 NC 54 41 40 39 38 37 36 35 34 33 32 31 30 29 28 Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 27 TXD2 26 RXD2 25 NC 24 NC 23 RSV 22 RSV 21 ERR_STAT 20 RTK_STAT 19 PVT_STAT 18 NC 17 NC 16 NC 15 NC GND ANT_IN GND ANT_DETECT ANT_OFF ANT_SHORT_N VCC_RF SPIS_CSN SPIS_MOSI SPIS_CLK SPIS_MISO GND RSV GND Table 2-1 Pin Description No. Pin 1 GND 2 ANT_IN 3 GND 4 ANT_DETECT 5 ANT_OFF Figure 2-1 UM980 Pin Definition I/O Description -- Ground I GNSS antenna signal input -- Ground I Antenna signal detection O Disable external LNA 6 Hardware UC-00-M32 EN R1.2 No. Pin 6 ANT_SHORT_N 7 VCC_RF6 8 SPIS_CSN 9 SPIS_MOSI 10 SPIS_CLK 11 SPIS_MISO 12 GND 13 RSV 14 GND 15 NC 16 NC 17 NC 18 NC 19 PVT_STAT 20 RTK_STAT I/O Description Antenna short circuit detection; I active low O External LNA power supply I Chip select pin for SPI slave Master Out / Slave In. This pin is used to I receive data in slave mode. I Clock input pin for SPI slave Master In / Slave Out. This pin is used to O transmit data in slave mode. -- Ground -- Reserved -- Ground -- No connection inside -- No connection inside -- No connection inside -- No connection inside PVT status: active high; O outputs high when positioning and low when not positioning RTK status: active high; O outputs high for RTK fixed solution and low for other positioning status or no positioning 6 Not recommended to take VCC_RF as ANT_BIAS to feed the antenna. See section 3.2 for more details. UC-00-M32 EN R1.2 Hardware 7 UM980 User Manual No. Pin 21 ERR_STAT 22 RSV 23 RSV 24 NC 25 NC 26 RXD2 27 TXD2 28 BIF 29 BIF 30 TXD3 31 RXD3 32 GND 33 VCC 34 VCC 35 RSV I/O Description Error status: active high; O outputs high when failing self-test, and low when passing self-test -- Reserved, recommended to be floating -- Reserved, recommended to be floating -- No connection inside -- No connection inside I COM2 input, LVTTL level O COM2 output, LVTTL level Built-in function; recommended to add a through-hole testing point and a 10 k pull- -- up resistor; cannot connect ground or power supply, and cannot input/output data, but can be floating Built-in function; recommended to add a through-hole testing point and a 10 k pull- -- up resistor; cannot connect ground or power supply, and cannot input/output data, but can be floating COM3 output, which can be used as CAN O TXD, LVTTL level COM3 input, which can be used as CAN RXD, I LVTTL level -- Ground I Power supply I Power supply -- Reserved 8 Hardware UC-00-M32 EN R1.2 No. Pin 36 V_BCKP 37 GND 38 NC 39 NC 40 NC 41 GND 42 TXD1 43 RXD1 44 SDA 45 SCL 46 NC 47 NC 48 GND 49 RESET_N 50 NC 51 EVENT 52 NC UC-00-M32 EN R1.2 I/O Description When the main power supply VCC is cut off, V_BCKP supplies power to RTC and relevant register. Level requirement: 2.0 V ~ 3.6 V, and I the working current should be less than 60 A at 25 °C. If you do not use the hot start function, connect V_BCKP to VCC. Do NOT connect it to ground or leave it floating. -- Ground -- No connection inside -- No connection inside -- No connection inside -- Ground O COM1 output, LVTTL level I COM1 input, LVTTL level I/O I2C data I/O I2C clock -- No connection inside -- No connection inside -- Ground System reset; active Low. The active time I should be no less than 5 ms. -- No connection inside Event mark input, with adjustable frequency I and polarity -- No connection inside Hardware 9 UM980 User Manual No. Pin 53 PPS 54 NC I/O Description Pulse per second, with adjustable pulse O width and polarity -- No connection inside 2.2 Electrical Specifications 2.2.1 Absolute Maximum Ratings Table 2-2 Absolute Maximum Ratings Parameter Symbol Power Supply Voltage VCC Input Voltage Vin GNSS Antenna Signal Input ANT_IN Antenna RF Input Power ANT_IN input power External LNA Power Supply VCC_RF VCC_RF Output Current ICC_RF Storage Temperature Tstg Min. -0.3 -0.3 -0.3 -0.3 -55 Max. 3.6 3.6 6 +10 3.6 100 95 Unit V V V dBm V mA °C 2.2.2 Operating Conditions Table 2-3 Operating Conditions Parameter Symbol Min. Power Supply Voltage7 VCC 3.0 Maximum VCC Ripple Vrpp 0 Working Current8 Iopr Typ. Max. Unit Condition 3.3 3.6 V 50 mV 145 180 mA VCC=3.3 V 7 The voltage range of VCC (3.0 V ~ 3.6 V) has already included the ripple voltage. 8 Since the product has capacitors inside, inrush current occurs during power-on. You should evaluate in the actual environment in order to check the effect of the supply voltage drop caused by inrush 10 Hardware UC-00-M32 EN R1.2 Parameter Symbol Min. VCC_RF Output Voltage VCC_RF VCC_RF Output Current ICC_RF Operating Temperature Topr -40 Power Consumption P Typ. Max. Unit Condition VCC-0.1 V 50 mA 85 °C 480 mW 2.2.3 IO Threshold Table 2-4 IO Threshold Parameter Symbol Min. Typ. Low Level Vin_low 0 Input Voltage High Level Input Voltage Vin_high Low Level Vout_low Output Voltage High Level Vout_high Output Voltage VCC × 0.7 0 VCC 0.45 Max. 0.6 Unit Condition V VCC + 0.2 V 0.45 V Iout = 2 mA VCC V Iout = 2 mA 2.2.4 Antenna Feature Table 2-5 Antenna Feature Parameter Symbol Min. Typ. Max. Optimum Input Gant Gain 18 30 36 Unit Condition dB current in the system. UC-00-M32 EN R1.2 Hardware 11 UM980 User Manual 2.3 Dimensions Table 2-6 Dimensions Parameter Min. (mm) A 21.80 B 16.80 C 2.40 D 3.75 E 0.95 F 1.80 G 1.00 H 0.70 K 1.40 M 3.55 N 3.15 P 2.00 R 1.00 X 0.72 Typ. (mm) 22.00 17.00 2.60 3.85 1.05 1.90 1.10 0.80 1.50 3.65 3.25 2.10 1.10 0.82 Max. (mm) 22.50 17.50 2.80 3.95 1.15 2.00 1.20 0.90 1.60 3.75 3.35 2.20 1.20 0.92 12 Hardware UC-00-M32 EN R1.2 Figure 2-2 UM980 Mechanical Dimensions UC-00-M32 EN R1.2 Hardware 13 UM980 User Manual 3 Hardware Design 3.1 Recommended Minimal Design ANT ANT_BIAS L1 C1 3.3V 3.3V C3 R1 R1 V_BCKP VCC BIF BIF TXD C2 UM982 UM980 ANT_IN RXD RESET_N GND RXD (UART) TXD (UART) IO GND HOST Figure 3-1 Recommended Minimal Design L1: 68 nH RF inductor in 0603 package is recommended C1: 100 nF + 100 pF capacitors connected in parallel is recommended C2: 100 pF capacitor is recommended C3: N * 10 F + 1 * 100 nF capacitors connected in parallel is recommended, and the total inductance should be no less than 30 F R1: 10 k resistor is recommended 3.2 Antenna Feed Design UM980 just supports feeding the antenna from the outside of the module rather than from the inside. It is recommended to use devices with high power and that can withstand high voltage. Gas discharge tube, varistor, TVS tube and other high-power protective devices may also be used in the power supply circuit to further protect the module from lightning strike and surge. 14 Hardware Design UC-00-M32 EN R1.2 If the antenna feed supply ANT_BIAS and the module's main supply VCC use the same power rail, the ESD, surge and overvoltage from the antenna will have an effect on VCC, which may cause damage to the module. Therefore, it is recommended to design an independent power rail for the ANT_BIAS to reduce the possibility of module damage. ANT ANT_BIAS L1 D1 D2 C1 C2 ANT_IN VCC_RF UM980 GND Notes: Figure 3-2 UM980 External Antenna Feed Reference Circuit L1: feed inductor, 68 nH RF inductor in 0603 package is recommended C1: decoupling capacitor, recommended to connect two capacitors of 100 nF/100 pF in parallel C2: DC blocking capacitor, recommended 100 pF capacitor It is not recommended to take VCC_RF as ANT_BIAS to feed the antenna (VCC_RF is not optimized for anti-lightning strike, anti-surge and over current protection due to the compact size of the module) D1: ESD diode, choose the ESD protection device that supports high frequency signals (above 2000 MHz) D2: TVS diode, choose the TVS diode with appropriate clamping specification according to the requirement of feed voltage and antenna withstand voltage UC-00-M32 EN R1.2 Hardware Design 15 UM980 User Manual 3.3 Power-on and Power-off VCC The VCC initial level when power-on should be less than 0.4 V. The VCC ramp when power-on should be monotonic, without plateaus. The voltages of undershoot and ringing should be within 5% VCC. VCC power-on waveform: The time interval from 10% rising to 90% must be within 100 s ~1 ms. Power-on time interval: The time interval between the power-off (VCC < 0.4 V) to the next power-on must be larger than 500 ms. V_BCKP The V_BCKP initial level when power-on should be less than 0.4 V. The V_BCKP ramp when power-on should be monotonic, without plateaus. The voltages of undershoot and ringing should be within 5% V_BCKP. V_BCKP power-on waveform: The time interval from 10% rising to 90% must be within 100 s ~1 ms. Power-on time interval: The time interval between the power-off (V_BCKP < 0.4 V) to the next power-on must be larger than 500 ms. 3.4 Grounding and Heat Dissipation Grounding and heat dissipation pad Figure 3-3 Grounding and Heat Dissipation Pad (Bottom View) 16 Hardware Design UC-00-M32 EN R1.2 The 48 pads in the rectangle in Figure 3-3 are for grounding and heat dissipation. In the PCB design, the pads should be connected to a large sized ground to strengthen the heat dissipation. 3.5 Recommended PCB Package Design See the following figure for the recommended PCB package design. 1.79 1.79 2.29 2.44 3.25 1.10 1.90 2.10 17.00 1.19 1.09 3.25 1.90 3.73 3.58 Notes: Figure 3-4 Recommended PCB Package Design For the convenience of testing, the soldering pads of the pins are designed long, exceeding the module border much more. For example: The pads denoted as detail C are 1.79 mm longer than the module border. The pad denoted as detail A is 0.50 mm longer than the module border. It is relatively short as it is an RF pin pad, so we hope the trace on the surface is as short as possible to reduce the impact of external interference on the RF signals. UC-00-M32 EN R1.2 Hardware Design 17 UM980 User Manual 4 Production Requirement Recommended soldering temperature curve is as follows: Rising °C 250 217 200 Preheating Reflux Peak 245 °C 40~60s 150 Max. 3°C/s 100 60~120s 50 0 Time (s) Figure 4-1 Soldering Temperature (Lead-free) Temperature Rising Stage Rising slope: Max. 3 °C/s Rising temperature range: 50 °C ~ 150 °C Preheating Stage Preheating time: 60s ~ 120 s Preheating temperature range: 150 °C ~ 180 °C Reflux Stage Over melting temperature (217 °C) time: 40s ~ 60 s Peak temperature for soldering: no higher than 245 °C Cooling Stage Cooling slope: Max. 4 °C / s Cooling Max. 4°C/s 18 Production Requirement UC-00-M32 EN R1.2 In order to prevent falling off during soldering of the module, do not solder it on the back of the board during design, and it is not recommended to go through soldering cycle twice. The setting of soldering temperature depends on many factors of the factory, such as board type, solder paste type, solder paste thickness etc. Please also refer to the relevant IPC standards and indicators of solder paste. Since the lead soldering temperature is relatively low, if using this method, please give priority to other components on the board. The opening of the stencil needs to meet your design requirement and comply with the examine standards. The thickness of the stencil is recommended to be 0.15mm. 5 Packaging 5.1 Label Description Product Model Part Number Serial Number Figure 5-1 Label Description Product QR Code 5.2 Product Packaging The UM980 module uses carrier tape and reel (suitable for mainstream surface mount devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant inside to prevent moisture. When using reflow soldering process to solder modules, please strictly comply with IPC standard to conduct temperature and humidity control on the modules. As packaging materials such as the carrier tape can only withstand the temperature of 55 degrees Celsius, modules shall be removed from the package during baking. UC-00-M32 EN R1.2 Packaging 19 UM980 User Manual Figure 5-2 UM980 Package P0 P2 E F W S B B Reel Feed Direction Reel Packaging Diagram (For Reference Only) C A A Cover Tape Carrier Tape Dimensions E 1.75 0.10 F 20.20 0.10 S 40.40 0.10 P2 2.00 0.10 Do 1.50 +- 0.10 0.00 D1 Po 4.00 0.10 10Po 40.00 0.20 W 44.00 0.30 P 24.00 0.10 Ao 17.80 0.10 B0 22.80 0.10 K0 3.30 0.10 t 0.35 0.05 +0.15 1.70-0.05 24 0.35 0.3 3.3 22.8 17.8 A-A +0.10 1.50-0.00 B-B 330*180*44mm C(3:1) Note: 1. The cumulative tolerance of 10 side holes should not exceed ±0.2 mm. 2. Material of the tape: Black antistatic PS (surface impedance 105-1011) (surface static voltage <100 V), thickness: 0.35 mm. 3. Total length of the 13-inch reel package: 6.816 m (Length of the first part of empty packets: 0.408 m, length of packets containing modules: 6 m, length of the last part of empty packets: 0.408 m). 4. Total number of packets in the 13-inch reel package: 284 (Number of the first part of empty packets: 17; actual number of modules in the packets: 250; number of the last part of empty packets: 17). 5. All dimension designs are in accordance with EIA-481-C-2003. 6. The maximum bending degree of the carrier tape within the length of 250 mm should not exceed 1 mm (see the figure below). 20 Packaging UC-00-M32 EN R1.2 1m m 250mm Figure 5-3 UM980 Reel Package Diagram Table 5-1 Package Description Item Description Module Number 250 pieces/reel Reel Size Tray: 13" External diameter: 330 ± 2 mm, Internal diameter: 180 ± 2mm, Width: 44.5 ± 0.5 mm Thickness: 2.0 ± 0.2 mm Carrier Tape Space between (center-to-center distance): 24 mm Before surface mounting, make sure that the color of the 30% circle on the HUMIDITY INDICATOR is blue (see Figure 5-4). If the color of the 20% circle is pink and the color of the 30% circle is lavender (see Figure 5-5), you must bake the module until it turns to blue. The UM980 is rated at MSL level 3. Please refer to the IPC/JEDEC J-STD-033 standards for the package and operation requirements. You may also access to the website www.jedec.org to get more information. Figure 5-4 Normal Humidity Indication Figure 5-5 Abnormal Humidity Indication The shelf life of the UM980 module packaged in vacuum-sealed aluminum foil antistatic bags is one year. UC-00-M32 EN R1.2 Packaging 21 Unicore Communications, Inc. 7 F3, No.7, Fengxian East Road, Haidian, Beijing, P.R.China, 100094 www.unicorecomm.com Phone: 86-10-69939800 Fax: 86-10-69939888 info@unicorecomm.com www.unicorecomm.com