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User Manual for NXP models including: UM12024, RD33774PC3EVB, MC33774ATP, UM12024 Battery Cell Controller IC, Battery Cell Controller IC, Cell Controller IC, Controller IC
UM12024, RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC, user manual
7 févr. 2024 — This user manual describes the RD33774PC3EVB. The RD33774PC3EVB features three MC33774ATP battery-cell controller integrated circuits (IC).
File Info : application/pdf, 20 Pages, 5.41MB
DocumentDocumentUM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Rev. 1 -- 7 February 2024 User manual Document information Information Content Keywords RD33774PC3EVB, MC33774ATP, HVBMS cell monitoring unit, centralized evaluation board Abstract This user manual describes the RD33774PC3EVB. The RD33774PC3EVB features three MC33774ATP battery-cell controller integrated circuits (IC). With the evaluation board (EVB), the key functions of the MC33774ATP can be explored. NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 1 Introduction This user manual describes the RD33774PC3EVB. The RD33774PC3EVB features three MC33774ATP battery-cell controller integrated circuits (IC). The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products. These development boards support a range of analog, mixed signal, and power solutions. These boards incorporate monolithic integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost, and improved performance in powering state-of-the-art systems. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 2 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Important notice IMPORTANT NOTICE For engineering development or evaluation purposes only NXP provides the product under the following conditions: This evaluation kit is for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed-circuit board to make it easier to access inputs, outputs and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by connecting it to the host MCU computer board via off-theshelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application heavily depends on proper printed-circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The product provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end device incorporating the product. Due to the open construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge. In order to minimize risks associated with the customers' applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 3 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 2 Finding kit resources and information on the NXP website NXP Semiconductors provides online resources for this evaluation board and its supported device(s) on http:// www.nxp.com. The information page for the RD33774PC3EVB evaluation board is at http://www.nxp.com/RD33774PC3EVB. The information page provides overview information, documentation, software and tools, parametrics, ordering information and a Getting Started tab. The Getting Started tab provides quick-reference information applicable to using the RD33774PC3EVB evaluation board, including the downloadable assets referenced in this document. The tool summary page for RD33774PC3EVB is at HVBMS Cell Monitoring Unit (CMU). The overview tab on this page provides an overview of the device, a list of device features, a description of the kit contents, links to supported devices and a Getting Started section. The Getting Started section provides information applicable to using the RD33774PC3EVB. 1. Go to http://www.nxp.com/RD33774CNT3EVB. 2. On the Overview tab, locate the Jump To navigation feature on the left side of the window. 3. Select the Getting Started link. 4. Review each entry in the Getting Started section. 5. Download an entry by clicking the linked title. After reviewing the Overview tab, visit the other related tabs for additional information: · Documentation: Download current documentation. · Software & Tools: Download current hardware and software tools. · Buy/Parametrics: Purchase the product and view the product parametrics. After downloading the files, review each file, including the user guide, which includes setup instructions. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 4 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 3 Getting ready Working with the RD33774PC3EVB requires the kit contents, additional hardware, and a Windows PC workstation with installed software. 3.1 Kit contents/packing list The kit contents include: · Assembled and tested evaluation board/module in antistatic bag · Three cell terminal cables · Transformer physical layer (TPL) cable 3.2 Additional hardware The following equipment is necessary to use this kit: · A 4-cell to 18-cell battery pack or a battery pack emulator, such as BATT-18EMULATOR. · A TPL communication system. If a user-specific system is not available, the evaluation setup or the 800 V HVBMS reference design can be used. The 800 V HVBMS reference design consists of the HVBMS battery management unit (RD-K358BMU) and the 800 V HVBMS battery junction box (RD772BJBTPL8EVB). For the 800 V HVBMS reference design, a graphical user interface (GUI) based on FreeMASTER is available. The evaluation setup consists of the FRDMDUALK3364EVB (EVB for MC33664A) in combination with the S32K3X4EVB-T172 (S32K3X4 EVB) For the evaluation setup, EvalGUI 7 is available. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 5 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 4 Getting to know the hardware 4.1 Board overview The RD33774PC3EVB is a hardware evaluation tool supporting the NXP MC33774ATP device. The RD33774PC3EVB implements three MC33774ATP battery-cell controller ICs. The MC33774ATP is a batterycell controller that monitors up to 18 lithium-ion battery cells. It is designed for use in both automotive and industrial applications. The device performs analog-to-digital conversions on the differential cell voltages. It is also capable of temperature measurements and can forward communication via I2C-bus to other devices. The RD33774PC3EVB is an ideal platform for rapid prototyping of MC33774ATP-based applications that involve voltage and temperature sensing. The RD33774PC3EVB uses no capacative isolation for offboard communication. The galvanic isolation for onboard communication is established via capacitors. The RD33774PC3EVB is also used as part of the 800 V high-voltage battery management system (HVBMS) reference design consisting of the HVBMS battery management unit (BMU) and the 800 V HVBMS battery junction box (BJB). UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 6 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 4.1.1 Board description With the RD33774PC3EVB, the user can explore all functions of the MC33774ATP battery-cell controller. Figure 1.Board description 4.2 Board features The main features of the RD33774PC3EVB are: · Reference design with three MC33774ATP, showing optimized BOM as outlined in data sheet · Capacitive isolation for onboard communication · Based on NXP core layout for MC33774ATP; core layout is used for NXP internal electromagnetic compatibility (EMC) and hotplug tests · Four-layer board, all components are assembled only on the top side · Cell electrostatic discharge (ESD) capacitors package 0805 · 0805 packages used for all signals with a voltage higher than approximately 25 V · Three 1206 surface-mounted device (SMD) resistors per balancing channel for individual cell-voltage balancing · All eight external thermistor inputs are available · Placeholder for I2C-bus EEPROM · Can be used together with the 800 V HVBMS reference design or the evaluation setup 4.2.1 MC33774ATP features and benefits · The MC33774ATP is a battery-cell controller IC designed to monitor battery characteristics. such as voltage and temperature. The MC33774ATP contains all the circuit blocks necessary to perform battery-cell voltage, cell temperature measurement, and integrated cell balancing. The device supports the following functions: · AEC-Q100 grade 1 qualified: -40 °C to 125 °C ambient temperature range · ISO 26262 ASIL D support for cell-voltage and cell-temperature measurements from the host microcontroller unit (MCU) to the cell · Cell-voltage measurement 4 cells to 18 cells per device Supports busbar voltage measurement with -3 V to 5 V input voltage UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 7 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 16-bit resolution and ±0.8 mV typical measurement accuracy with ultra low long-term drift 136 s synchronicity of cell voltage measurements Integrated configurable digital filter · External temperature and auxiliary voltage measurements One analog input for absolute measurement, 5 V input range Eight analog inputs configurable as absolute or ratiometric, 5 V input range 16-bit resolution and ±5 mV typical measurement accuracy Integrated, configurable digital filter · Module voltage measurement 9.6 V to 81 V input range 16-bit resolution and 0.3 % measurement accuracy Integrated, configurable digital filter · Internal measurement Two redundant internal temperature sensors Supply voltages External transistor current · Cell voltage balancing 18 internal-balancing field-effect transistors (FET), up to 360 mA peak with 0.5 RDSon per channel (typ) Support for simultaneous passive balancing of all channels with automatic odd/even sequence Global-balancing timeout timer Timer-controlled balancing with individual timers with 10 s resolution and up to 45 h duration Voltage-controlled balancing with global and individual undervoltage thresholds Temperature-controlled balancing; if balancing resistors are in overtemperature, balancing is interrupted Configurable pulse width modulation (PWM) duty cycle balancing Automatic pausing of balancing during measurement with configurable filter settling time Configurable delay of the start of balancing after transition to sleep Automatic discharge of the battery pack (emergency discharge) Constant current cell balancing to compensate the balancing current variation due to cell voltage variation · I2C-bus master interface to control external devices, for example, EEPROMs and security ICs · Configurable alarm output · Cyclic wake-up to supervise the pack during sleep and balancing · Capability to wake-up the host MCU via daisy chain in case of a fault event · Host interface supporting SPI or transformer physical layer 3 (TPL3) 2 Mbit data rate for TPL3 interface 4 Mbit data rate for SPI · TPL3 communication supports Two-wire daisy chain with capacitive and inductive isolation Protocol supporting up to six daisy chains and 62 nodes per chain · Unique device ID · Operation modes Active mode (12 mA typ) Sleep mode (60 A typ) Deep Sleep mode (15 A typ) UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 8 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 4.3 Block diagram HV link+ 4 cells to 18 cells NTC and other sensor HV CONNECTOR EMC 4 cells to 18 cells NTC and other sensor HV CONNECTOR EMC 4 cells to 18 cells HV link- NTC and other sensor HV CONNECTOR EMC CELL BALANCING CELL BALANCING CELL BALANCING FILTER FILTER FILTER TPL CONNECTOR TPL CONNECTOR CAPACITIVE ISOL ATION AFE-3 MC33774 CAPACITIVE ISOL ATION AFE-2 MC33774 CAPACITIVE ISOLATION AFE-1 MC33774 CAPACITIVE ISOLATION Figure 2.Block diagram aaa-051172 4.4 Kit featured components 4.4.1 Connectors The cells and NTC connections are available on J1_1, J1_2 and J1_3. See Figure 3. Cell0 is connected between C0M(cell0M) and C1M(cell0P); Cell1 is connected between C1M(cell1M) and C2M(cell1P), and so on ... Cell17 is connected between C17M (cell17M) and C17P (cell17P). C17P-PWR and GND (pin21) are used to supply the AFE and are separated from C17P and C0M respectively, to avoid any voltage drop because of the EVB current consumption. Optional external 10 k NTCs can be connected between each NTCx terminal and one GND terminal. · Connector type: JAE MX34032NF2 (32 pins/right-angle version) · Corresponding mate connector reference: MX34032SF1 · Crimp reference for the mate connector: M34S7C4F1c UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 9 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Figure 3.Pinout cell connectors GND_1 C1M_1 C3M_1 C5M_1 C7M_1 C9M_1 C11M_1 C13M_1 C15M_1 C17M_1 C17P-PWR_1 GND_2 C1M_2 C3M_2 C5M_2 C7M_2 C9M_2 C11M_2 C13M_2 C15M_2 C17M_2 C17P-PWR_2 GND_3 C1M_3 C3M_3 C5M_3 C7M_3 C9M_3 C11M_3 C13M_3 C15M_3 C17M_3 C17P- PWR _3 J1_1 1 17 2 18 3 19 4 20 5 21 6 22 7 23 8 24 9 25 10 26 11 27 12 28 13 29 14 30 15 31 16 32 CON_2x16 J1_ 2 1 17 2 18 3 19 4 20 5 21 6 22 7 23 8 24 9 25 10 26 11 27 12 28 13 29 14 30 15 31 16 32 CON_2x16 J1_3 1 17 2 18 3 19 4 20 5 21 6 22 7 23 8 24 9 25 10 26 11 27 12 28 13 29 14 30 15 31 16 32 CON_2x16 NTC8_1 NTC7_1 NTC2_1 NTC1_1 GND_1 C0M_1 C2M_1 C4M_1 C6M_1 C8M_1 C10M_1 C12M_1 C14M_1 C16M_1 C17P_1 NTC8_2 NTC7_2 NTC2_2 NTC1_2 GND_2 C0M_2 C2M_2 C4M_2 C6M_2 C8M_2 C10M_2 C12M_2 C14M_2 C16M_2 C17P_2 NTC8_3 NTC7_3 NTC2_3 NTC1_3 GND_3 C0M_3 C2M_3 C4M_3 C6M_3 C8M_3 C10M_3 C12M_3 C14M_3 C16M_3 C17P_3 aaa - 051174 UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 10 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC OUT-_1 OUT+_1 SILK = TPL1 CONN SKT 2 2 OUT1 OUT+ J2_1 J2_3 IN+_3 IN-_3 1 IN+ 2 IN- CONN SKT 2 SILK = TPL3 aaa-051175 Figure 4.TPL connectors The TPL connections are available on J2_1 and J2_3. See Figure 4 · Connector type: Molex Micro-fit 3.0, 43650-0213 · Corresponding mate connector reference: 0436450200 · Crimp reference for the mate connector: 0436450201 · Figure 1 shows the location of connectors on the board. 4.5 Schematic, board layout and bill of materials The schematic, board layout and bill of materials for the RD33774PC3EVB evaluation board are available at http://www.nxp.com/RD33774PC3EVB. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 11 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 5 Accessory boards 5.1 NXP 800 V HVBMS reference design The NXP 800 V HVBMS reference design is a scalable ASIL D architecture for high-voltage applications, composed of three modules: BMU, CMU, and BJB. DC+ K1 HVSense_DC+ HVSense_HV+ HVSense_Fuse CH+ HVSense_CH+ K1 K1 + K5 R1 GND K5 + R1 temp K2 F2 K2 K2 + BMU K1 + K1 K2 + K2 K3 + K3 K4 + K4 FS0b FS1b VCU CAN CAN PHY TJA1145ATK T30 Crash Galvanic isolation RTC PCA2131 WUP WUP FSGPIO0 FSGPIO1 FS1b FS0b SBC FS2613D Vsup Contactor drivers 4xHB2000 4xPWM 4xSPI4 4xCSNS SPI5_cs0 SPI5_cs2 CAN0 RST 5 V 3.3 V 1.5 V VREF SPI0_cs0 FCCU0 FCCU1 GPIO CSNS Load drivers SPI3_cs1 MC40XS6500 Bat ter y cooling BJB_VSUP K5+ SPI5_cs3 Pressure sensor NBP8 WUP BMU controller S32K358 PWM_OUT PWM_IN Interlock SPI1 SPI2 Gateway MC33665A WUP TPLA TPLB TPLD TPLC K4 + K4 - CHHVSense_CHHVSense_DC- DC- K4 K3 + K3 K3 BJB_VSUP BJB1 DC/DC HVSense_DC+ TPL HVCtrl1 HVSense_DC+ HVCtrl5 HVSense_DCHVSense_CHR1Temp BS2 MC33772C HVCtrl2 HVCtrl3 HVCtrl4 HVSense_HV+ HVSense_CH+ HVSense_Fuse BS1 MC33772C ShuntTemp CS2 CS1 Shunt Isolation monitoring Figure 5.800 V HVBMS reference design block diagram CMU cluster 1a CMU cluster 2a AFE 6a MC33774 Li-Ion cells Voltage Bal. Temp. AFE 5a MC33774 Voltage Bal. Temp. AFE 4a MC33774 Voltage Bal. Temp. F1 AFE 3a MC33774 Voltage Bal. Temp. AFE 2a MC33774 Voltage Bal. Temp. AFE 1a MC33774 Voltage Bal. Temp. CMU cluster 3b CMU cluster 4b AFE 6b MC33774 Li-Ion cells Voltage Bal. Temp. AFE 5b MC33774 Voltage Bal. Temp. AFE 4b MC33774 Voltage Bal. Temp. F3 AFE 3b MC33774 Voltage Bal. Temp. AFE 2b MC33774 Voltage Bal. Temp. AFE 1b MC33774 Voltage Bal. Temp. aaa- 051182 UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 12 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 5.2 FRDMDUALK3664EVB The RD33774PC3EVB kit is designed for use with the FRDMDUALK3664EVB. The FRDMDUALK3664EVB is an evaluation board for MC33664ATL, an isolated network high-speed transceiver. The EVB can be used in high-voltage isolated applications and provides an SPI-to-high-speed isolated communication interface. The FRDMDUALK3664EVB includes two MC33664 isolated network high-speed transceivers that allow loopback connection. MCU SPI data bits are directly converted to pulse bit information. Figure 6.FRDMDUALK3664EVB UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 13 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 5.3 S32K3X4EVB-T172 The S32K3X4EVB provides the control signals for the FRDMDUALK3664EVB. Figure 7.S32K3X4 evaluation board UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 14 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC 6 Configuring the hardware 6.1 Battery emulator connection A minimum of four cells and a maximum of 18 cells can be monitored by one MC33774ATP. NXP provides an 18-cell battery emulator board, BATT-18EMULATOR. This board provides an intuitive way to change the voltage across any of the 18 cells of an emulated battery pack. The board RD33774PC3EVB can be connected to an 18-cell battery emulator board using the connectors J1_1, J1_2, and J1_3, with the provided supply cable. See Figure 8. Figure 8.Battery emulator connection 6.2 TPL communication connection In a high-voltage isolated application with a daisy-chain configuration, up to 63 RD33774PC3EVB boards may be connected. The TPL connections use the COMM connectors J1 and J2 of the FRDMDUALK3664EVB and J2_1 and J2_3 of the RD33774PC3EVB. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 15 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Figure 9.FRDMDUAL33664EVB setup UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 16 / 20 NXP Semiconductors 7 Revision history Revision history Document ID UM12024 v.1 UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Date 07 February 2024 Description initial version UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 17 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Legal information Definitions Draft -- A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. 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Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. Suitability for use in automotive applications (functional safety) -- This NXP product has been qualified for use in automotive applications. It has been developed in accordance with ISO 26262, and has been ASIL classified accordingly. If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as "Critical Applications"), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys' fees) that NXP may incur related to customer's incorporation of any product in a Critical Application. NXP B.V. -- NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP -- wordmark and logo are trademarks of NXP B.V. UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 18 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Figures Fig. 1. Fig. 2. Fig. 3. Fig. 4. Fig. 5. Board description .............................................. 7 Block diagram ................................................... 9 Pinout cell connectors ..................................... 10 TPL connectors ............................................... 11 800 V HVBMS reference design block diagram ............................................................12 Fig. 6. Fig. 7. Fig. 8. Fig. 9. FRDMDUALK3664EVB ................................... 13 S32K3X4 evaluation board ............................. 14 Battery emulator connection ............................15 FRDMDUAL33664EVB setup ..........................16 UM12024 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 19 / 20 NXP Semiconductors UM12024 RD33774PC3EVB featuring the MC33774ATP battery-cell controller IC Contents 1 2 3 3.1 3.2 4 4.1 4.1.1 4.2 4.2.1 4.3 4.4 4.4.1 4.5 5 5.1 5.2 5.3 6 6.1 6.2 7 Introduction ...................................................... 2 Finding kit resources and information on the NXP website .........................................4 Getting ready ................................................... 5 Kit contents/packing list ..................................... 5 Additional hardware ........................................... 5 Getting to know the hardware ........................ 6 Board overview ..................................................6 Board description ...............................................7 Board features ................................................... 7 MC33774ATP features and benefits .................. 7 Block diagram ....................................................9 Kit featured components ....................................9 Connectors .........................................................9 Schematic, board layout and bill of materials .......................................................... 11 Accessory boards ..........................................12 NXP 800 V HVBMS reference design ............. 12 FRDMDUALK3664EVB ................................... 13 S32K3X4EVB-T172 ......................................... 14 Configuring the hardware ............................. 15 Battery emulator connection ............................ 15 TPL communication connection .......................15 Revision history .............................................17 Legal information ...........................................18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © 2024 NXP B.V. For more information, please visit: https://www.nxp.com All rights reserved. Date of release: 7 February 2024 Document identifier: UM12024