LSD1WFC1073-01D0 IEEE 802.11 a/b/g/n Wireless LAN IoT Module Datasheet

Lierda Technology Group Co., Ltd.

Document Version: V1.2

Revision History

Version Author Participant(s) Date Description of Changes
V1.0 Yin Han Yao Dandan 2021-02-05 Initial Release
V1.1 Yin Han Yao Dandan 2021-06-21 Updated Figures 2-3-1 & 2-4-1
V1.2 Yin Han Yao Dandan 2021-07-21 Modified Cover Page & Figure 1-1-1

Directory

Chapter 1 Product Introduction

Chapter 2 Product Description

Chapter 3 Electrical Characteristics

Chapter 4 Design Guidelines

Chapter 5 Manufacturing Guidelines

Chapter 6 Packaging Information

Chapter 7 Contact Us

Chapter 1 Product Introduction

1.1 Product Overview

The LSD1WFC1073-01D0 (referred to as "1073") is a compact, high-performance wireless LAN communication module designed to meet customer demands for small form factors and superior performance. Supporting UART/SPI interfaces and compliant with IEEE 802.11 a/b/g/n standards, this module integrates an MCU, MAC, baseband, RF, and memory units. It is ideal for smart devices such as cameras, air conditioners, refrigerators, robotic vacuum cleaners, and air purifiers.

The LSD1WFC1073-01D0 module offers exceptional design flexibility, shortened development cycles, and rapid time-to-market, enabling customers to seamlessly implement Wi-Fi embedded development and applications. Additionally, it ensures robust security by supporting WPA/WPA2/WPA3 and WEP encryption protocols for enhanced data protection.

[Image of LSD1WFC1073-01D0 module with QR code and Lierda branding]

Figure 1-1-1: 1073 Module Pic

1.2 Product Features

1.2.1 Package

1.2.2 Processor

1.2.3 Memory

1.2.4 Wireless Performance

1.2.5 Peripheral Interfaces

1.2.6 Other Features

1.3 Application Fields

Chapter 2 Product Description

2.2 Key Specifications

Table 2-2-1: 1073 Module Parameters
Parameter Category Detailed Description
Package Type QFN 63 PINS
Interface Type WLAN: UART
WLAN Standard IEEE 802.11 a/b/g/n
Supported Modes STA/SoftAP
Operating Channels 1~14
Frequency Range 2.4GHz+5GHz Band
Supported System Built-in RTOS
Antenna Type Surface-mount pad x1
RF Port Impedance 50 Ω
Module Coplanarity TBD
Module Dimensions 17.7mm(L) x20.7mm x2.6mm (H)
Module Weight TBD

2.3 Pin Definitions

2.3.1 Pin Assignment

[Diagram showing pin assignment of the 1073 module, bottom view, with pins numbered 1-63]

Figure 2-3-1: Pin Assignment Diagram of 1073 (Bottom View)

2.3.2 Pin Descriptions

Table 2-3-1: Pin Description Table of 1073
No. Name Type Description
1 GND G Ground
2 GND G Ground
3 GPIO10 I/O General-purpose I/O
4 GPIO11 I/O General-purpose I/O
5 GPIO14 I/O General-purpose I/O
6 GPIO15 I/O General-purpose I/O
7 GPIO16 I/O General-purpose I/O
8 GPIO17 I/O General-purpose I/O
9 GPIO12 I/O General-purpose I/O
10 GPIO13 I/O General-purpose I/O
11 GPIO22 I/O General-purpose I/O
12 JTAG TDI I JTAG data input
13 FLASH SPI MISO I Flash programming: SPI input
14 FLASH SPI nCS IN I Flash programming: SPI chip select
15 FLASH_SPI_CLK I Flash programming: SPI clock
16 GND G Ground
17 FLASH SPI MOSI O Flash programming: SPI output
18 JTAG_TDO O JTAG data output
19 GPIO28 I/O General-purpose I/O
20 NC No connect (floating)
21 JTAG_TCK I JTAG clock input
22 JTAG_TMS I JTAG mode select
23 SOP2 I Programming mode selection pin (see chip manual), internally pulled down with 69.8KΩ
24 SOP1 I Programming mode selection pin (see chip manual), internally pulled down with 69.8KΩ
25 NC No connect (floating)
26 NC No connect (floating)
27 GND G Ground
28 GND G Ground
29 NC No connect (floating)
30 GND G Ground
31 RF BG I/O WLAN RF I/O port
32 GND G Ground
33 NC No connect (floating)
34 SOP0 I Programming mode selection pin (see chip manual), internally pulled down with 100K Ω
35 nRESET I Reset pin
36 VBAT_DCDC_ANA P 3.3V power supply input
37 VBAT_DCDC_PA P 3.3V power supply input
38 GND G Ground
39 NC No connect (floating)
40 VBAT_DCDC_DIG_IO P 3.3V power supply input
41 NC No connect (floating)
42 GPIO30 I/O General-purpose I/O
43 GND G Ground
44 GPIO0 I/O General-purpose I/O
45 NC No connect (floating)
46 GPIO1 I/O General-purpose I/O
47 GPIO2 I/O General-purpose I/O
48 GPIO3 I/O General-purpose I/O
49 GPIO4 I/O General-purpose I/O
50 GPIO5 I/O General-purpose I/O
51 GPIO6 I/O General-purpose I/O
52 GPIO7 I/O General-purpose I/O
53 GPIO8 I/O General-purpose I/O
54 GPIO9 I/O General-purpose I/O
55 GND G Ground
56 GND G Ground
57 GND G Ground
58 GND G Ground
59 GND G Ground
60 GND G Ground
61 GND G Ground
62 GND G Ground
63 GND G Ground

2.4 Mechanical Dimensions

[Diagram showing structural dimensions of the 1073 module, including length, width, height, and pad layout]

Figure 2-4-1: Structural Dimensions of 1073

Chapter 3 Electrical Characteristics

3.1 Voltage Range

3.1.1 Absolute Maximum Ratings

Table 3-1-1: Absolute Maximum Ratings
Symbol Description Min Max Unit
VBAT Input supply voltage -0.5 3.8 V

Note: Exceeding these ratings may cause permanent hardware damage.

3.1.2 Operating Voltage Range

Table 3-1-2: Operating Voltage Range
Symbol Description Min Typical Max Unit
VBAT Input supply voltage 2.3 3.3 3.6 V

3.2 Current Consumption

2.4GHz Band Current Consumption

Table 3-2-1: 2.4GHz Band Current Consumption
Mode Test Condition Min Typical Max Unit
MCU ACTIVE 1 DSSS 272 mA
6 OFDM 248 mA
54 OFDM 223 mA
NWP ACTIVE 1 DSSS 59 mA
54 OFDM 59 mA
NWP idle connected(DTIM=1) 15.3 mA
MCU SLEEP 1 DSSS 269 mA
6 OFDM 245 mA
54 OFDM 220 mA
NWP ACTIVE 1 DSSS 56 mA
54 OFDM 56 mA
NWP idle connected(DTIM=1) 12.2 mA
MCU LPDS 1 DSSS 266 mA
6 OFDM 242 mA
54 OFDM 217 mA
NWP ACTIVE 1 DSSS 53 mA
54 OFDM 53 mA
64KB SRAM Retention 120 uA
256KB SRAM Retention 135 uA
NWP idle connected(DTIM=1) 710 mA
MCU SHUTDOWN 1 uA
MCU HIBERNATE 5.5 mA
Peak calibration current VBAT 3.6V 420 mA
VBAT 3.3V 450 mA
VBAT-2.3V 610 mA

Notes:

5GHz Band Current Consumption

Table 3-2-2: 5GHz Band Current Consumption
Mode Test Condition Min Typical Max Unit
MCU ACTIVE 6 OFDM 318 mA
54 OFDM 293 mA
RX 54 OFDM 67 mA
NWP idle connected(DTIM=1) 15.3 mA
MCU SLEEP 6 OFDM 315 mA
54 OFDM 290 mA
RX 54 OFDM 64 mA
NWP idle connected(DTIM=1) 12.2 mA
MCU LPDS 6 OFDM 312 mA
54 OFDM 287 mA
RX 54 OFDM 61 mA
64KB SRAM Retention 120 uA
256KB SRAM Retention 135 uA
NWP idle connected(DTIM=1) 710 mA
MCU SHUTDOWN 1 uA
MCU HIBERNATE 5.5 mA
Peak calibration current VBAT 3.6V 290 mA

Notes:

3.3 RF Parameters

Table 3-3-1: RF Specifications
Category Standard Description
Modulation 802.11 b DSSS With DQPSK, DBPSK, CCK
802.11 a/g OFDM With 16-QAM, 64-QAM, QPSK, BPSK
802.11 n OFDM With 16-QAM, 64-QAM, QPSK, BPSK
Data Rate 802.11 b 1, 2, 5.5, 11Mbps
802.11 g 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11 n MCS0~MCS7
Tx Power 802.11 a 12±1.5dBm(@5GHz,54Mbps)
802.11 b 16.3±1.5dBm(@2.4GHz,11Mbps)
802.11 g 12.5±1.5dBm(@2.4GHz,54Mbps)
802.11 n 11±1.5dBm(@2.4GHz,MCS7)
802.11 a 11±1.5dBm(@5GHz,MCS7)
Rx Sensitivity 802.11 a -72dBm±1dBm(@5GHz,54Mbps, OFDM, 10%PER)
802.11 b -86.5dBm±1.5dBm(@2.4GHz,11Mbps,CCK, 8%PER)
802.11 g -73dBm±1.5dBm(@2.4GHz, 54Mbps, OFDM, 10%PER)
802.11 n -70dBm±1.5dBm(@2.4GHz, MCS7, OFDM, 10%PER)
802.11 n -68dBm±1.5dBm(@5GHz, MCS7, OFDM, 10%PER)

3.4 Temperature & Humidity Characteristics

Table 3-4-1: Environmental Specifications
Parameter Min Max Unit
Operating temp -20 85 °C
Storage temp -40 85 °C
Operating humidity 20 90 %
Storage humidity 5 95 %

3.5 ESD Performance

Table 3-5-1: ESD Specifications
Symbol Description Standard Class Max Unit
VESD (HBM) Human Body Model TA=+25°C JESD22-A114 2 2000 V
VESD (CDM) Charged Device Model TA=+25°C JESD22-C101 II 500 V

Chapter 4 Design Guidelines

4.1 Reference Circuit

N/A

4.2 Antenna Design

The 1073 module features a surface-mount pad antenna interface. RF signals can be routed from Pin 31 to either integrated or external antennas. Regardless of antenna type, π-matching circuits (recommended: 2 sets) must be implemented on the RF path.

4.2.1 Integrated Antenna

Follow standard PCB antenna design principles when using integrated antennas.

4.2.2 External Antenna

External antennas must meet specifications in Table 4-2-1:

Table 4-2-1: External Antenna Requirements
Parameter Specification
Frequency Range 2.4GHz+5GHz
Impedance 50 Ω
Return loss ≤-10dB

Chapter 5 Manufacturing Guidelines

5.1 Recommended Reflow Profile

Complies with IPC/JEDEC standards (max 2 reflow cycles).

[Diagram illustrating the recommended reflow temperature profile with key points like Tsmin, Tsmax, TL, Tp, and time intervals]

Figure 5-1-1: Recommended Reflow Temperature Profile
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat/Soak Temperature Min (Tsmin) 100 °C 150 °C
Preheat/Soak Temperature Max (Tsmax) 150 °C 200 °C
Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds
Ramp-up rate (T₁ to Tp) 3 °C/second max. 3 °C/second max.
Liquidous temperature (TL) 183 °C 217 °C
Time (t₁) maintained above TL 60-150 seconds 60-150 seconds
Peak package body temperature (Tp) For suppliers T, must not exceed the Classification temp in Table 4-1. For suppliers T, must not exceed the Classification temp in Table 4-2.
Time (tp)* within 5 °C of the specified classification temperature (Tc), see Figure 5-1. For suppliers T, must equal or exceed the Classification temp in Table 4-1. For suppliers T, must equal or exceed the Classification temp in Table 4-2.
Ramp-down rate (Tp to TL) 20* seconds 30* seconds
Time 25 °C to peak temperature 6 °C/second max. 6 °C/second max.
6 minutes max. 8 minutes max.

Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

5.2 Production Precautions

Chapter 6 Packaging Information

6.1 MOQ Specifications

Table 6-1-1: Minimum Order Quantity
Packaging Type Reels per Carton Units per Reel MOQ
Tape & Reel 5 500PCS 2500PCS

6.2 Packaging Methods

6.2.1 Tape & Reel Packaging

As shown in Figure 6-2-2, the 1073 modules are packaged in tape-and-reel format, with each reel containing 500PCS. After loading, reels are sealed in aluminum foil bags.

[Diagram illustrating tape and reel dimensions and components, including PO, P1, P2, E, F, D0, D1, E1, P0, P2, A0, B0, Ko, F0, P0, P2, A0, B1, Ko, F0, T]

Figure 6-2-1: Tape & Reel Dimension Diagram

[Illustration of tape and reel packaging, showing a reel and a sealed tape]

Figure 6-2-2: Tape & Reel Packaging Illustration

6.2.2 Inner Box Packaging

As shown in Figure 6-2-3, the inner box dimensions are 352×348×56mm. Each inner box contains one tape reel (500PCS of 1073 modules).

[Illustration of inner box packaging, showing an open and a closed box with a reel inside]

Figure 6-2-3: Inner Box Packaging Illustration

6.2.3 Outer Box Packaging

As shown in Figure 6-2-4, the outer box dimensions are 354×250×362mm. Each outer box holds 5 inner boxes (totaling 2500PCS of 1073 modules).

[Illustration of outer box packaging, showing an open box]

Figure 6-2-4: Outer Box Packaging Illustration

6.3 Storage Conditions

Chapter 7 Regulatory Compliance

A. FCC Radiation Exposure Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

This Module complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Labelling instruction for Host Product integrator

Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains FCC ID: 2BN5S-25031" or any similar wording that expresses the same meaning may be used.

Installation Notice to Host Product Manufacturer

The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install the module.

The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to §2.1093 and different antenna configurations.

Antenna configurations.

Antenna Change Notice to Host manufacturer

If you desire to increase antenna gain and either change antenna type or use same antenna type certified, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.

FCC other Parts, Part 15B Compliance Requirements for Host product manufacturer

This modular transmitter is only FCC authorized for the specific rule parts listed on our grant; host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.

Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

B. ISED Regulatory Compliance

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.

L'émetteur/récepteur exempt de licence contenu dans le present appareil est conforme aux CNR d'Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :(1)L'appareil ne doitpas produire de brouillage; (2) L'appareil doit accepter tout brouillage radioélectrique subi, même si lebrouillage est susceptible d'en compromettre le fonctionnement.

This equipment complies with IC RSS 102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm betweenthe radiator and your body.

Cet éauipement est conforme aux limites d'exposition aux radiations 1C CNR 102 établies pour un environnement non contrôlé, Cet équipement doit être installe et utilisé avec une distance minimale de 20cm entre le radiateur et votre corps.

Please notice that if the IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains IC: 33667-25031" or any similar wording that expresses the same meaning may be used.

L'étiquette d'homologation d'un module d'Innovation, Sciences et Développement économique Canadadevra être posée sur le produit hote à un endroit bien en vue, en tout temps. En l'absence d'étiquette. le produit hote doit porter une êtiquette sur laquelle figure le numéro d'homologation du module d'Innovation, Sciences et Développement économique Canada, précédé du mot « contient », ou d'une formulation similaire allant dans le meme sens et qui va comme suit : Contient IC: 33667-25031 est le numéro d'homologation du module.

Models: LSD1WFC1073-01D0, LSD1WFC1073-01D0 Wireless LAN IoT Module, Wireless LAN IoT Module, LAN IoT Module, IoT Module

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