User Manual for ON Semiconductor models including: RSL10 Evaluation and Development Board, RSL10, Evaluation and Development Board, and Development Board, Development Board, Board
File Info : application/pdf, 17 Pages, 732.57KB
DocumentDocumentEVAL BOARD USER'S MANUAL www.onsemi.com RSL10 Evaluation and Development Board User's Manual EVBUM2529/D INTRODUCTION Purpose This manual provides detailed information about the configuration and use of the RSL10 Evaluation and Development Board (RSL10-002GEVB). The Evaluation and Development Board is designed to be used with the software development tools to evaluate the performance and capabilities of the RSL10 radio System-on-Chip (SoC). Manual Organization The Evaluation and Development Board Manual contains the following chapters and appendices: · Chapter 1: Introduction describes the purpose of this manual, describes the target reader, explains how the book is organized, and provides a list of suggested reading for more information. · Chapter 2: Overview provides an overview of the Evaluation and Development Board described in this manual. · Chapter 3: Evaluation and Development Board provides the details of the Evaluation and Development Board. The chapter is divided into the following topics: Development Board Setup Development Board Design Power Supply Level Translators LED Circuitry RSL10 SoC Measuring the Current Consumption SWJ-DP Debug Port Digital Input/Output (DIO) Power Supply and Test Points · Appendix A: Connectors provides a complete list of the connectors and jumpers on the Evaluation and Development Board. · Appendix B: Schematics contains the schematics for the Evaluation and Development Board. · Appendix C: Bill of Materials contains a list of the parts that are used to manufacture the Evaluation and Development Board. Further Reading For more information, refer to the following documents: · Getting Started with RSL10 · RSL10 Firmware Reference · RSL10 Hardware Reference · RSL10 Datasheet OVERVIEW Introduction The RSL10 Evaluation and Development Board is used for evaluating the RSL10 SoC and for application development. The board provides access to all input and output connections via 0.1 standard headers. The on-board communication interface circuit provides communication to the board from a host PC. The communication interface translates RSL10 SWJ-DP debug port signals to the USB of the host PC. There is also an on-board 4-bit level shifter for debugging; it translates the I/O signal level of RSL10 to the 3.3 V digital logic level. It is not enabled by default; you enable it when it is needed. Evaluation and Development Board Features The Evaluation and Development Board enables developers to evaluate the performance and capabilities of the RSL10 radio SoC in addition to developing, demonstrating and debugging applications. Key features of the board include: · J-Link onboard solution provides a SWJ-DP (serial-wire and/or JTAG) interface that enables you to debug the board via a USB connection with the PC · Alternate onboard SWJ-DP (serial-wire and/or JTAG) interface for Arm® Cortex®-M3 processor debugging · Access to all RSL10 peripherals via standard 0.1 headers · Onboard 4-bit level translator to translate the LPDSP32 debug interface at low voltage to a 3.3 V JTAG debugger · Antenna matching and filtering network · Integrated PCB antenna · Compliance with the Arduino form factor · Support for PMOD (i.e., J4 is a standard connector) © Semiconductor Components Industries, LLC, 2017 1 September, 2022 - Rev. 4 Publication Order Number: EVBUM2529/D EVBUM2529/D EVALUATION AND DEVELOPMENT BOARD Evaluation and Development Board Setup This section is an overview of how to configure the Evaluation and Development Board. Details of the development board configuration are discussed later in this manual. Figure 1 represents an overview of the board setup. RSL10 Evaluation and Development Board Micro USB Cable Figure 1. Evaluation and Development Board Setup If you want to use an external J-Link debugger instead of the onboard one, connect the debugger to connector P2 on the QFN board, as shown in Figure 2. Notice that for this setup, you also need a power supply. RSL10 Evaluation and Development Board Power Supply P2 or JTAG Port 10/9 Pin Connector J-Link Debugger Micro USB Cable Figure 2. Evaluation and Development Board Setup with External J-Link Debugger Evaluation and Development Board Design The following sections detail the various sub-circuits of the RSL10 Evaluation and Development Board. The block diagram in Figure 3 shows the locations of the various circuit sections. Figure 5 and Figure 6 provide 3-dimensional illustrations of the QFN board. www.onsemi.com 2 EVBUM2529/D Figure 3. Circuit Location Block Diagram (Top View) www.onsemi.com 3 EVBUM2529/D Figure 4. Circuit Location Block Diagram (Bottom View) www.onsemi.com 4 EVBUM2529/D Figure 5. Three-Dimensional Line Drawing of the Board (Top View) www.onsemi.com 5 EVBUM2529/D Figure 6. Three-Dimensional Line Drawing of the Board (Bottom View) www.onsemi.com 6 EVBUM2529/D Power Supply The Evaluation and Development Board can be powered by one of the following: · Micro USB port with regulator · External power supply connector (P5) with regulator · External power supply connector (P5) without regulator Use the jumpers on pin headers P4, P7 and P10 to select a power supply option as show in Table 1. Table 1. POWER SUPPLY SELECTION Power Source Micro USB Port with Regulator External Power Supply with Regulator External Power Supply without Regulator Jumper Position on P4 1&2 3&4 5&6 Jumper Position on P7 2&3 2&3 2&3 Jumper Position on P10 1&2 1&2 2&3 Table 2. MINIMUM/MAXIMUM EXTERNAL REGULATED VOLTAGES Power Supply RSL10 and J-Link OB MCU RSL10 and J-Link OB MCU RSL10 Header EXT-PSU Regulated USB EXT-PSU Unregulated Minimum 3.3 V - 1.1 V Input Voltage Typical 3.6 V 5.0 V 1.25 V Maximum 5.0 V - 3.6 V Level Translators The board has level translators for the DIO signals of RSL10, including the clock signal. The level translators facilitate interfacing to external devices that operate at a higher voltage than RSL10. VDDO and 3.3 V are two different power rails. The translator allows a logic signal on the VDDO side to be translated to either a higher or a lower logic signal voltage on the 3.3 V side, and vice-versa. The level translation circuitry consists of components U4 and the 2x4 header. Signals are translated from the VDDO voltage reference to 3.3 V (default) voltage provided by the regulator output or by an external supply. The VDDO voltage is configured by the pin on header P11 (located on the board edge) to either VBAT_DUT, 3.3 V or other level within the VDDO voltage range, which is 1.1 to 3.3 V. The NLSX5014 level translators are bi-directional. They have the following features: · Wide voltage operating range: 0.9 V to 4.5 V · VDDO and 3.3 V are independent · VDDO can be equal to, or less than, 3.3 V when connected to the power rail To enable the level translators, populate positions R34 and R35 with 0 ohms. By default, the level translators are disabled. NOTE: Enabling the level translator affects power consumption. LED Circuitry There are two LEDs on the board. One is a dual color LED, called LD1, connected to the J-Link emulator microcontroller unit (MCU). The other is the green LED, connected to DIO 6 of RSL10. You can use this LED within your applications as an indication LED by programming DIO 6. If DIO 6 is high, this LED is on. Measuring the Current Consumption This section deals with measuring current consumption for the Evaluation and Development Board. Headers are provided for each of the regulated voltages for additional capacitance and/or for measurements. RSL10 has 16 digital I/Os. The VDDO pin in header P9 configures the I/O voltages for power domains to VBAT. The VBAT pin in header P10 configures the VBAT source. The power select pin in header P4 configures the power source of the RSL10. In addition the measurements should be done by connecting an ammeter to current measure header P3 to measure the device power consumption in isolation. To measure the current consumption of RSL10 only, you need to source the chip using the external power supply without the regulator as shown in Table 2. To remove leakage currents during current measurement, remove the jumpers on header SWD. Removing the jumpers between the MCU and RSL10 that connect nRESET, SWDIO and SWCLK prevents current leakage from the JTAG interface, avoiding inaccurate current measurements. In addition, DIOs 4, 5 and 6 must be configured to High-Z (disabled) with no pull up in software. DIOs 4 and 5 are directly connected to the Atmel chip and will leak power into it. DIO 6 is directly connected to the transistor driving the LED and can leak power into it. www.onsemi.com 7 EVBUM2529/D SWJ-DP DEBUG Port The J-Link adapters are typically used to communicate with RSL10 using the standard Coresight SWJ-DP debug port in a JTAG/SW communication protocol. The 9-pin 0.05 in Samtec FTSH header (P1), defined by the Arm Cortex-M3 core on the board, connects RSL10 to external adapters compatible with the Arm Cortex-M3 processor's SWJ-DP interface. Alternatively, you can connect the micro USB port on the board to a PC. DIGITAL Input/Output (DIO) RSL10 contains 16 digital I/O (DIO) signals. The DIO voltage domain is VDDO, while the input voltage can be VBAT or external voltage as outlined in Section "Measuring the Current Consumption" on page 7. The DIO signals on RSL10 are multiplexed with several interfaces, including: · One I2C interface (DIO [7:8]) · Four external inputs to the low-speed analog to digital converters (DIO [0:3]) · One PCM interface · Two PWM drivers · Two SPI interfaces (DIO [13:15]) · One UART interface (DIO [4:5]) · Support interfaces that can be used to monitor control of the RF front-end and Bluetooth® baseband controller For more information about the DIO multiplexed signals, refer to the RSL10 Hardware Reference. The board provides access to any of the DIOs or their multiplexed signals via the Arduino Headers (Power1, AD1, IOL1, and IOH1). The LED circuit provides visual monitoring of the DIOs; refer to Section "LED Circuitry" on page 7 for further information. Power Supplies There are several external power supplies available on your Evaluation and Development Board. The user can also access signals on various headers on boards, as described throughout this document. The external power supplies available for QFN boards are: · VBUS, 5 V from USB connection - available only when USB is plugged in · V3.3, 3.3 V from LDO - available when regulated supply is selected · VEXT, (P5 header) unregulated external supply - available when unregulated supply is selected · Battery (J5 Battery Holder, 12 mm coin cell battery) Export Control Classification Number (ECCN) The ECCN designation for RSL10 is 5A991.g. www.onsemi.com 8 EVBUM2529/D APPENDIX A - CONNECTORS Overview This appendix lists all connectors on the Evaluation and Development Board. The sections that follow provide descriptions for: · Jumpers and their possible configurations · Headers · Switches and their possible configurations · Connectors Configuration Header Jumpers Table 3. JUMPER DESCRIPTIONS Designator Description P4 Regulated or Unregulated power supply selection P10 VBAT Power Source selection (3.3 V, Vext or Battery) P9 VDDO selection (VBAT_DUT, 3.3 V) P8 VDD_AT selection (3.3 V, VDDO) P1 Onboard JTAG debugger connection Headers Table 4. HEADER DESCRIPTIONS Designator Description POWER1 AD1 Arduino Power header 3.3 V, VDDO, nRESET, GND Arduino Analog Inputs header A [0:3] IOL1 Arduino IOL header UART, INT [0:1], SPI2 IOH1 P2 Arduino IOH header I2C, SPI1 External JTAG debug connection header P3 Current measurement header P5 External power supply header P6 Input and output of level shifter Switches Table 5. SWITCH DESCRIPTIONS Designator SW1 Pushbutton switch to reset RSL10 SW2 Pushbutton switch for DIO5 Description Connectors Table 6. CONNECTOR DESCRIPTIONS Designator Description J1 RF switch connector J2 Micro USB port for power supply, JTAG and UART emulation J3 MCU programming connector J4 Digilent PMOD peripheral connector I2C, SPI1, INT0 J5 Battery Holder (12 mm coin cell) www.onsemi.com 9 EVBUM2529/D APPENDIX B - SCHEMATICS This appendix contains schematics for the Evaluation and Development Board, version 1.3: · The Top-level (Arduino interface) schematic · The RSL10 schematic · The Interface MCU schematic · The Power Supply schematic www.onsemi.com 10 EVBUM2529/D Figure 7. Top-Level (Arduino Interface) Schematic www.onsemi.com 11 J20-BB POWER1 3V3_KNX IOREF RESET IOREF 5V GND GND VCOM IOREF RESET 3V3 5V GND GND VIN VIN3.3V VDDO 1 2 3 RESET 4 5V 5 6 7 8 GND DIO[7..0] DIO[7..0] J21-BB AD1 A0 A1 A2 A3 I2C_EXP_GPIO12 I2C_EXP_GPIO13 AD0 AD1 AD2 AD3 AD4 AD5 1 2 3 4 5 6 DIO0 DIO1 DIO2 DIO3 TDOin TDIin TRSTin TDOin TDIin TRSTin JTAG_TMS JTAG_TCK RESET TMSin TCKin TRESin 12 34 JTAG_TMS JTAG_TCK 56 U_RSL10 RSL10.SchDoc DIO[15..8] DIO[15..8] DIO12 DIO11 DIO10 SCL SDA GND SPI_CS IOH1 10 9 8 7 6 5 4 3 2 1 SCL SDA AREF GND IO13 IO12 IO11 IO10 IO9 IO8 IOH P1 2x3 Pin Header U_Interface MCU Interface MCU.SchDoc DIO15 DIO14 DIO13 INT0 IOL1 8 7 6 5 4 3 2 1 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 IOL J7-BB I2C_SCK1 I2C_SDA1 AREF GND SPI_CLK1 SPI_DATAI1 SPI_DATAO1 SPI1_CS1 SWO/DIO11 SWDIO/DIO13 J8-BB SWDCLK/DIO12 SPI_DATAI2/DIO16 INT2 SPI_CLK2/DIO14 PWM1 INT0 UART1_TX UART1_RX TDOin TDIin TRSTin TMSin TCKin TRESin DIO5 DIO4 DIO4 DIO5 DIO[7..0] U_Power Power.SchDoc DIO[15..8] SCL SDA INT0 SPI_CS SCL SDA INT0 SPI_CS SPI_CS DIO10 DIO11 DIO12 VDDO GND J4 PMOD 17 28 39 4 10 5 11 6 12 INT0 DIO13 SCL SDA GND EVBUM2529/D Figure 8. RSL10 SoC Schematic www.onsemi.com 12 VDDO VDDPA VDDM VDDC VDDRF VDDA C1 C2 1uF DNP C3 DNP C4 DNP C5 DNP C6 C7 C8 DNP 2.2uF 1uF VBAT_DUT C9 4.7µF 0603 C10 C11 100nF 100pF VDDPA VPP VDDSYN_SW VDDA VBAT_DUT VDDC VDDM VDDRF VDDO VCC L4 C15 2.2uF 0402 DNP C16 4.7µF 0603 2.2uH 0805 GND DIO[7..0] DIO[7..0] DIO5 SW1 PB SW DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 X1 4 2 G O/I G I/O 3 1 ECS 48MHz XTAL V3.3 TP1 R4 68 LED 1 L0603G Q1 NMOS D3 U1 RSL10 9 2 19 17 21 45 47 48 5 36 VBAT VDDPA VDDC VPP VDDM VDDSYN_SW VDDRF_SW VDDRF VDDA VDDO 10 12 VDC VCC RFIO 1 AOUT 4 18 20 23 25 24 27 29 30 DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 RSL10 DIO8 DIO9 DIO10 DIO11 DIO12 DIO13 DIO14 DIO15 26 22 32 38 37 39 41 40 43 44 7 C17 1uF 6 31 XTAL48M_N XTAL48M_P CAP0 CAP1 EXT_CLK VSSPA VSSA VSSD VSSD VSS VSSRF EP XTAL32K_IN XTAL32K_OUT 14 13 JTMS JTCK 34 33 WAKEUP EN_TEST RESET 15 11 16 3 8 28 35 42 46 49 VBAT_DUT GND R7 10k DIO6 1 G 2S SW2 PB SW VDDO P2 12 34 56 78 9 10 FTSH-105 JTAG_TMS JTAG_TCK TDOin TDIin RESET L1 3nH C12 1.5pF MM8130-2600 L2 J1 C14 1.8nH C13 1.5pF L3 15nH 12pF A1 2.4G PCB antenna TP2 DIO8 DIO9 DIO10 DIO11 DIO12 DIO13 DIO14 DIO15 DIO[15..8] DIO[15..8] VDDO R54 100k X2 32.768kHz TP3 DIO13 DIO14 DIO15 R1 68 R2 68 R3 DNP R5 DNP R6 DNP JTAG_TMS JTAG_TCK TRSTin TDIin TDOin JTAG_TMS JTAG_TCK TRSTin TDIin TDOin R9 RESET 68 RESET GND EVBUM2529/D Figure 9. Interface MCU Schematic www.onsemi.com 13 J2 VBUS D- D+ GND 1 2 3 5 Shield ID 4 MicroUSB-B R17 6k8 C20 100nF TRSTin TDIin TMSin TCKin TRESin TDOin VBUS R10 DFSD_P 39 R11 DFSD_N 39 DHSD_N DHSD_P D1 3 IO2 IO1 2 C24 10µF 4 VCC GND 1 PRTR5V0U2X C25 100nF ENSPI R19 6k8 VCORE C19 100nF C21 100nF R22 TRSTout 150 TRSTin R23 TDIout 150 TDIin R24 TMSout 150 TMSin R25 TCKout 150 TCKin R28 TRESout 150 TRESin TDOin VDD_AT VDD_AT C27 100nF GND VDD_AT TCKin R21 0 VCORE TDIin C30 100nF TMSin TCKout TMSout TDIout TDOin ENSPI TCKout R26 R27 0 DNP 0 DNP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VDDANA ADVREF GNDANA AD12BVREF PA22/TXD2/RTS1/AD12B0 PA30/TF/TIOA2/AD12B1 PB3/PWMH3/A5/AD12BAB2 PB4/TCLK1/A6/AD12BAB3 VDDCORE PA13/MISO PA14/MOSI PA15/SPCK/PWMH2 PA16/NPCS0/NCS1 PA17/SCK0/ADTRG PB16/D7/PWMH3 PB15/D6/PWMH2 PA18/TXD0/PWMFI2 PA19/RXD0/NPCS3 PA20/TXD1/PWMH3 PA21/RXD1/PCK0 PA23/RXD2/CTS1 VDDIO PA24/TWD1/SCK1 PA25/TWCK1/SCK2 PA26/TD/TCLK2 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PA0/TIOB0/NPCS1 PA1/TIOA0/NPCS2 PA2/TCLK0/AD12BTRG PA3/MCCK/PCK1 PA4/MCCDA/PWMH0 PA5/MCDA0/PWMH1 PA6/MCDA1/PWMH2 PA7/MCDA2/PWML0 VDDCORE GND VDDIO PA8/MCDA3/PWML1 PA9/TWD0/PWML2 PA10/TWCK0/PWML3 PA11/URXD/PWMFI0 PA12/UTXD/PWMFI1 FWUP ERASE TEST VDDBU GNDBU NRSTB JTAGSEL XOUT32 XIN32 CTS0/A1/AD3/PB8 RTS0/A0/NBS0/AD2/PB7 TIOB1/D15/AD1/PB6 TIOA1/A7/AD0/PB5 RD/PCK0/PA27 D4/PWMH0/PB13 D3/RI0/PB12 D2/DCD0/PB11 PWMH2/A4/PB2 PWMH1/A3/PB1 PWMH0/A2/PB0 GND VDDIO VDDCORE RF/TIOB2/PA31 RK/PWMH1/PA29 TK/PWMH0/PA28 VDDCORE GNDUTMI DFSDP DFSDM VDDUTMI VBG DHSDM DHSDP 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 VDD_AT R15 R16 220 220 GR LD1 LTST-C195KGJRKT VCORE C18 100nF VDD_AT DFSD_P DFSD_N DHSD_N DHSD_P R18 C22 6k8 C23 10pF 100nF VDD_AT VBUS VDD_AT R12 R13 R14 4k7 4k7 4k7 IMCU_TMSS IMCU_TCKS IMCU_TDOS IMCU_TDIS IMCU_RESET J3 1 10 29 38 47 56 TC2050-IDC R20 4k7 XIN XOUT VDDPLL GNDPLL D0/DTR0/PB9 D1/DSR0/PB10 D5/PWMH1/PB14 NANDOE/PWML0/PB17 NANDWE/PWML1/PB18 NRD/PWML2/PB19 NCS0/PWML3/PB20 A21(NANDALE/RTS2/PB21 A22/NANDCLE/CTS2/PB22 NWR0/NWE/PCK2/PB23 GND VDDIO VDDCORE NANDRDY/PCK1/PB24 NRST TCK TMS TDO VDDIN VDDOUT TDI 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 C26 X3 12MHz 18pF C28 18pF VCORE C29 100nF VCORE VDD_AT IMCU_RESET IMCU_TCKS IMCU_TMSS IMCU_TDOS C31 100nF C32 100nF IMCU_TDIS VCORE C35 10µF VDD_AT C33 C34 100nF 10µF U2 ATSAM3U2CA-AU TRSTin TRSTout TRESin TRESout CTS RTS RxD TxD VDD_AT C38 100nF C39 100nF VDD_AT R29 6k8 C37 100nF C36 100nF R30 DIO4 DIO4 68 R31 DIO5 DIO5 68 1 2 3 1 2 3 2 1 VIN3.3V V3.3 VBUS C40 4.7uF VEXT P5 1 C43 2 4.7uF DNP GND P4 12 34 56 Power Select 31 J5 BAT-HLD-012 2 VDD_AT Select VDD_AT V3.3 VDDO 5V C42 1uF P7 U3 1 Vin Vout 5 1 2 3.3V Select 3 2 GND C41 P3 3 EN N/C 4 1uF R40 10k NCP114ASN330T1G P10 VBAT 1 2 VBAT Select 3 R32 VBAT_DUT DNP VDDO Select VDDO V3.3 POWER SUPPLY CONFIGURATION HEADERS P4, P7, P10 ARDUINO ORION POWERED VIN3.3V: P4 (no jumper), P7(1-2), P10(1-2) STAND ALONE USB POWERED: P4(1-2), P7(2-3), P10(1-2) STAND ALONE Vext POWERED: P4(3-4), P7(2-3), P10(1-2) STAND ALONE USB and Vext POWERED: P4(1-2), (5-6), P7(2-3), P10(2-3) EVBUM2529/D Figure 10. Power Supply Schematic www.onsemi.com 14 SDA R53 0 SCL R52 0 INT0 DIO8 DIO7 P8 V3.3 INT0 SCL SDA DIO[7..0] DIO[15..8] R43 R42 R41 R51 U5 10k 10k 10k 10k 21 VDD R48 DNP R49 22 19 20 INT SCL SDA DNP R50 PCA9655 DNP DIO7 DIO6 DIO9 DIO8 18 23 24 AD0 AD1 AD2 9 25 VSS EP PCA9655 P9 VDDO is the digital IO ring supply (provided externally). Range : 1.1V - 3.3V R45 0 VDDO R35 DNI C48 100nF C46 C47 1uF 10nF IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 1 2 3 4 5 6 7 8 IO1_0 IO1_2 IO1_3 20 IO1_5 IO1_6 IO1_7 10 12 13 14 15 16 17 R44 DNP R46 DNP DIO6 DIO9 R47 SPI_CS SPI_CS 0 Optional Level Shifter R36 10k U4 1 2 3 4 5 6 7 VL EN I/O VL1 Vcc I/O VL2 I/O Vcc1 I/O VL3 I/O Vcc2 I/O VL4 I/O Vcc3 NC NC GND I/O Vcc4 14 13 12 11 10 9 8 NLSX5014 P6 87 65 43 21 2x4 Header V3.3 R34 DNI C44 C45 10nF 1uF EVBUM2529/D APPENDIX C - BILL OF MATERIALS Table 7. BILL OF MATERIALS FOR RSL10 QFN EVALUATION AND DEVELOPMENT BOARD VERSION 1.3 Designator AD1 C2, C3, C4, C5, C6 C7 C9, C16,C40 C11 C12, C13 C14 C10,C18, C19, C20, C21, C23, C25, C27, C29, C30, C31, C32, C33, C36, C37, C38, C39,C48 C22 C24, C34, C35 C26, C28 C1, C8, C17, C41, C42, C45, C46 C44, C47 D1 IOH1 IOL1, POWER1 J1 J2 J4 J5 L1 L2 L3 L4 LD1 LED 1 P1, P4 P2 P3, P5 P6 P7, P8, P9, P10 Q1 R1, R2, R4, R9, R30, R31 Description Arduino Stackable Header 6-pin Capacitor, NP0, ±2% CAP CER 2.2 mF 10 V X5R 0402 CAP CER 4.7 mF 10 V X5R 0603, CAP CER 4.7 mF 25 V X5R 0603 Capacitor, NP0, ±2% CAP CER 1.5 PF 50 V NP0 0402 Capacitor, NP0, ±2% Capacitor, NP0, ±2% Capacitor, NP0, ±2% Capacitor, X5R, ±10% Capacitor, NP0, ±2% Capacitor, NP0, ±10% Capacitor, NP0, ±2% Ultra low capacitance double rail-to-rail ESD protection diode Arduino Stackable Header 10-pin Arduino Stackable Header 8-Pin Coaxial Connector with Switch MicroUSB-B-SMT WR-PHD 2.54 mm Angled Dual Socket Header, 12p HOLDER BATTERY 12 MM COIN FIXED IND 3NH 800MA 170 MOHM SMD FIXED IND 1.8NH 950MA 100 MOHM Inductor, 320 mA, ±5% Imported Ultra bright AlInGaP Bi-Color LED LED SMARTLED GREEN 570NM 0603 Header 2x3 SMT SAMTEC - CONN HEADER 10POS DUAL .05 SMD KEYING SHROUD HEADER, 2POS, 1ROW; Series: 961; Pitch Spacing: 2.54 mm; RA 2x4 Pin Header HEADER, 3POS, 1ROW; Series: 961; Pitch Spacing: 2.54 mm; NMOS Transistor Resistor, ±1%, 0.063 W Footprint Doc n/a 0402 0402 0603 0402 0402 0402 0402 0402 0603 0402 0402 0402 SOT-143B COAXIAL-SWF FCI_10118193-0001LF 0402 0402 0402 0805 LED_DUAL_0606 0603 FTSH-105 SOT65P210X105-3N 0402 Manufacturer Part Number SSQ-106-03-G-S GRM1555C1E120GA01D GRM155R61A225KE95D GRM188R61A475KE15D GRM1555C1H101JA01J GCM1555C1H1R5CA16D GRM1555C1E120GA01D GRM155R61E104KA87D GRM1555C1E100JA01D GRM188R61A106KE69D GRM1555C1E180JA01D GRM155R61A105KE15D GRM155R71H103KA88D PRTR5V0U2X,215 SSQ-110-03-G-S SSQ-108-03-G-S MM8130-2600RA2 10118193-0001LF 613012243121 2996 LQG15HS3N0S02D LQG15HS1N8S02D HK100515NJ-T CKP2012N2R2M-T LTST-C195KGJRKT LNJ337W83RA 15-91-2060 FTSH-105-01-F-DV-K 961102-5604-AR 15-91-2080 961103-6404-AR RU1J002YNTCL ERJ-2RKF68R0X Supplier Part Number SAM1198-06-ND 490-8169-1-ND 490-10451-1-ND 490-10477-1-ND 490-7754-1-ND 490-13289-1-ND 490-8169-1-ND 490-5920-1-ND 490-6168-1-ND 490-10474-1-ND 490-6172-1-ND 490-3890-1-ND 490-4516-1-ND 568-4140-1-ND SAM1198-10-ND SAM1198-08-ND 490-4981-1-ND 609-4616-1-ND S5559-ND 36-2996-ND 490-6570-1-ND 490-2613-1-ND 587-1521-1-ND 587-2771-1-ND 160-1452-1-ND LNJ337W83RACT-ND WM17449-ND SAM8796-ND 3M9467-ND WM17450-ND 3M9448-ND RU1J002YNTCLCT-ND P68.0LCT-ND www.onsemi.com 15 EVBUM2529/D Table 7. BILL OF MATERIALS FOR RSL10 QFN EVALUATION AND DEVELOPMENT BOARD VERSION 1.3 Designator R3, R5, R6, R26, R27, R32,R44, R46, R48, R49, R50, Description Resistor, ±1%, 0.063 W R7, R36, R40, R41,R42, R43, R51 R10, R11 R12, R13, R14, R20 R15, R16 R17, R18, R19, R29 R21, R45, R47, R52, R53 R22, R23, R24, R25, R28 R54 SW1, SW2 U1 U2 U3 U4 U5 X1 X2 X3 See Jumper Location See Installation See Installation Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W Resistor, ±1%, 0.1 W ALPS - SKHUALE010 - Tactile Switch, SPNO, SMD, 6.5 x 6.2 x 2.5 mm RSL10 QFN IC MCU 32 bit 128 kB flash 100LQFP IC REG LIN 3.3 V 600MA 5TSOP TRANSLATOR LEVEL 4BIT 14-TSSOP Remote 16-bit expander ECS 48 MHz Crystal EPSON TOYOCOM - FC-135 32.768 kHz ±20 PPM XTAL SMD 3225, 12 MHz, 18 pF, ±30 ppm CONN JUMPER SHORTING GOLD FLASH MACHINE SCREW PAN PHILLIPS 4-40 HEX STANDOFF 4-40 NYLON 3/8 Footprint Doc 0402 0402 0402 0402 0402 0402 0402 0402 0402 ALPS_SKHUxxx010_WO_GND Manufacturer Part Number ERJ-2RKF68R0X, ERJ-2RKF68R0X, ERJ-2RKF68R0X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GEJ103X, ERJ-2GEJ103X, ERJ-2GEJ103X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GE0R00X, ERJ-2GEJ103X ERJ-2GEJ103X ERJ-2RKF39R0X ERJ-2RKF4701X ERJ-2RKF2200X ERJ-2RKF6801X ERJ-2GE0R00X ERJ-2RKF1500X ERJ-2RKF1003X SKHUALE010 Supplier Part Number P68.0LCT-ND, P68.0LCT-ND, P68.0LCT-ND, P0.0JCT-ND, P0.0JCT-ND, 173-8862, P10KJCT-ND, P10KJCT-ND, P10KJCT-ND, 173-8862, 173-8862, 173-8862, 173-8862, 173-8862, P10KJCT-ND P10KJCT-ND P39.0LCT-ND P4.70KLCT-ND P220LCT-ND P6.80KLCT-ND P0.0JCT-ND 173-8862 P100KLCT-ND 35-790-00 LQFP-100 TSOP-5IPC TSOP65P640X120-14N QFN50P400X400 XTAL 4 pads XTAL_3215 BT-XTAL_3225 CONN JUMPER (2.54mm) Gold n/a n/a ATSAM3U2CA-AU NCP114ASN330T1G NLSX5014DTR2G PCA9655EMTTXG ECS-480-8-47-JTN-TR FC-135 32.768KHZ ±20PPM 7M-12.000MAAJ-T SPC02SYAN NY PMS 440 0025 PH 1902B ATSAM3U2CA-AU-ND NCP114ASN330T1GOSCT-ND NLSX5014DTR2GOSCT-ND PCA9655EMTTXGOSDKR-ND XC1969CT-ND FC-135 32.7680KA-AC-ND 887-1121-1-ND S9001-ND H542-ND 36-1902B-ND NOTE: Designators C2, C3, C4, C5, C6 and R3, R5, R6, R26, R27, R32,R44, R46, R48, R49, R50 are not populated. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Arm and Cortex are registered trademarks of Arm Limited. www.onsemi.com 16 onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba "onsemi" or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. The evaluation board/kit (research and development board/kit) (hereinafter the "board") is not a finished product and is not available for sale to consumers. The board is only intended for research, development, demonstration and evaluation purposes and will only be used in laboratory/development areas by persons with an engineering/technical training and familiar with the risks associated with handling electrical/mechanical components, systems and subsystems. This person assumes full responsibility/liability for proper and safe handling. Any other use, resale or redistribution for any other purpose is strictly prohibited. THE BOARD IS PROVIDED BY ONSEMI TO YOU "AS IS" AND WITHOUT ANY REPRESENTATIONS OR WARRANTIES WHATSOEVER. WITHOUT LIMITING THE FOREGOING, ONSEMI (AND ITS LICENSORS/SUPPLIERS) HEREBY DISCLAIMS ANY AND ALL REPRESENTATIONS AND WARRANTIES IN RELATION TO THE BOARD, ANY MODIFICATIONS, OR THIS AGREEMENT, WHETHER EXPRESS, IMPLIED, STATUTORY OR OTHERWISE, INCLUDING WITHOUT LIMITATION ANY AND ALL REPRESENTATIONS AND WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, NON-INFRINGEMENT, AND THOSE ARISING FROM A COURSE OF DEALING, TRADE USAGE, TRADE CUSTOM OR TRADE PRACTICE. onsemi reserves the right to make changes without further notice to any board. You are responsible for determining whether the board will be suitable for your intended use or application or will achieve your intended results. Prior to using or distributing any systems that have been evaluated, designed or tested using the board, you agree to test and validate your design to confirm the functionality for your application. Any technical, applications or design information or advice, quality characterization, reliability data or other services provided by onsemi shall not constitute any representation or warranty by onsemi, and no additional obligations or liabilities shall arise from onsemi having provided such information or services. onsemi products including the boards are not designed, intended, or authorized for use in life support systems, or any FDA Class 3 medical devices or medical devices with a similar or equivalent classification in a foreign jurisdiction, or any devices intended for implantation in the human body. You agree to indemnify, defend and hold harmless onsemi, its directors, officers, employees, representatives, agents, subsidiaries, affiliates, distributors, and assigns, against any and all liabilities, losses, costs, damages, judgments, and expenses, arising out of any claim, demand, investigation, lawsuit, regulatory action or cause of action arising out of or associated with any unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of any products and/or the board. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and may not meet the technical requirements of these or other related directives. FCC WARNING This evaluation board/kit is intended for use for engineering development, demonstration, or evaluation purposes only and is not considered by onsemi to be a finished end product fit for general consumer use. It may generate, use, or radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment may cause interference with radio communications, in which case the user shall be responsible, at its expense, to take whatever measures may be required to correct this interference. onsemi does not convey any license under its patent rights nor the rights of others. LIMITATIONS OF LIABILITY: onsemi shall not be liable for any special, consequential, incidental, indirect or punitive damages, including, but not limited to the costs of requalification, delay, loss of profits or goodwill, arising out of or in connection with the board, even if onsemi is advised of the possibility of such damages. In no event shall onsemi's aggregate liability from any obligation arising out of or in connection with the board, under any theory of liability, exceed the purchase price paid for the board, if any. The board is provided to you subject to the license and other terms per onsemi's standard terms and conditions of sale. For more information and documentation, please visit www.onsemi.com. ADDITIONAL INFORMATION TECHNICAL PUBLICATIONS: Technical Library: www.onsemi.com/design/resources/technical-documentation onsemi Website: www.onsemi.com ONLINE SUPPORT: www.onsemi.com/support For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales www.onsemi.com 1