seeed studio BM3301 Wi-Fi 6 and BLE 5.4 Wireless Module Owner's Manual

Owner's Manual for seeed studio models including: Z4T-BM3301-1216, Z4TBM33011216, bm3301 1216, BM3301 Wi-Fi 6 and BLE 5.4 Wireless Module, BM3301, Wi-Fi 6 and BLE 5.4 Wireless Module, BLE 5.4 Wireless Module, Wireless Module, Module

Rain Lei

User Manual

Seeed Technology Co., Ltd. BM3301-1216 Z4T-BM3301-1216 Z4TBM33011216 bm3301 1216

File Info : application/pdf, 15 Pages, 946.89KB

GetApplicationAttachment.html?id=7299860

BM3301 1216 Module
Wi-Fi 6 and BLE 5.4 Wireless Module - Powered by TI CC3301
Datasheet
V0.9
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

Content
Content ......................................................................................................................................................... 2 1 Introduction ................................................................................................................................................1
Features .................................................................................................................................................... 1 Application ................................................................................................................................................ 1 2 Description ................................................................................................................................................. 5 2.1 Pin Diagram ..........................................................................................................................................5 2.2 Pin Attributes ....................................................................................................................................... 5 3 Electrical characteristics .............................................................................................................................. 9 3.1 Absolute Maximum Ratings ................................................................................................................... 9 3.2 Normal working conditions ....................................................................................................................9 3.3 Electrical Characteristics ........................................................................................................................9 3.4 Module specifications ........................................................................................................................... 9 4 Timing and Switching Characteristics ..........................................................................................................10 4.1 Power Supply Sequencing ................................................................................................................... 10 4.2 Clocking Specifications ........................................................................................................................ 10
4.2.1 Slow Clock Generated Internally ....................................................................................................10 4.2.2 Slow Clock Using an External Oscillator ..........................................................................................10 5 Application information .............................................................................................................................11 5.1 Package information ........................................................................................................................... 11 5.1.1 BM3301-1216 Module Package information ............................................................................ 11 5.2 Land Pattern .......................................................................................................................................11 5.3 Reference design based on BM3301-1216 Module ............................................................................... 12 5.3.1 BM3301-1216 Module Block Diagram ............................................................................................12 5.3.2 SDIO Iines .................................................................................................................................12 6 Ordering information ................................................................................................................................ 13 7 Reversion ..................................................................................................................................................13 8 FCC ........................................................................................................................................................ 14
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

1 Introduction
BM3301 1216 is a 2.4-GHz Wi-Fi6 and Bluetooth Low Energy wireless module based on TI's 10th-generation connectivity combo chip CC3301, which is based upon proven technology. This Module is ideal for use in costsensitive embedded application with a Linux or RTOS host running TCP/IP. This Module is an ideal platform for developing wireless communication product solutions.
Features
Wi-Fi 6
2.4 GHz, 20 MHz, single spatial stream
MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
Hardware-based encryption and decryption using supporting WPA2 and WPA3 Excellent interoperability Support for 4-bits SDIO or SPI host interfaces Bluetooth Low Energy 5.4
LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension Host controller interface (HCI) transport with option for UART or shared SDIO
Security Secured host interface Firmware authentication Anti-rollback protection
Application throughput up to 50 Mbps 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee) Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF
channels (Wi-Fi networks) 1 integrated antenna port (supporting Wi-Fi and Bluetooth Low Energy coexistence) Compact footprint and pins with SMT package Integrated 2.4-GHz PA for complete wireless solution with up to +20dBm output power Using an IPEX Gen4 socket to connect an external antenna (ex: Rubber ducky antenna, PCB antenna, FPC
antenna) Operation temperature: -40 to 85 Operation humidity: 10%~ 85%
Application
Internet of Things (IoT) Multimedia Home Electronics Home Application and White Goods
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

Industrial and Home Automation Smart Gateway and Metering Video Conferencing Video Camera and Security This product specification includes a detailed description of the BM3301 1216 Module's performance and functions. For the latest firmware, product updates or errata, please contact Seeed Studio.
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

2 Description
BM3301 1216 Module is embedded with TI CC3301, which is very suitable for the design of various embedded devices. The module, as seen in below diagram, comprise of:
- 40Mhz XTAL - Bandpass filter - Decoupling capacitors - IPEX Gen 4 connector (BM3301-1216)
2.1 Pin Diagram

Figure 2-4. BM3301-1216 Module Pin arrangement

2.2 Pin Attributes

Number
1 2 3

Name
NC NC NC

Table 2-1. BM3301-1216 Module pinout

Voltage Level

Type

Not connected

Description

VDD_3.3V

GND

3.3V 3.3V

Logger

1.8V

COEX_GRANT

1.8V

COEX_REQ

1.8V

COEX_PRIORITY

1.8V

GND

22 NC

GND

24 NC

GND

Slow_CLK

1.8V

GND

Power Power
-
O
O I I I -

3.3V Power Supply 3.3V Power Supply Ground UART TX Debug Logger (Reuse as working mode configuration Not connected Not connected Not connected External Coexistence Interface -Grant External Coexistence Interface -Request External Coexistence Interface -Priority Not connected Not connected Not connected Ground Not connected Not connected Ground Not connected Not connected Ground Not connected Not connected Ground External Slow Clock Input Not connected Not connected Not connected Not connected Ground Not connected Not connected Ground Not connected Not connected Ground Not connected

Not connected

GND

Ground

VDD_1.8V

1.8V

Power 1.8V Power Supply (Not Required)

VDD_1.8V

1.8V

Power 1.8V Power Supply (Not Required)

Not connected

Disable or enable the Module (Active low). A

45 RESET

1.8V

200k pull-up resistor is internally connected to

VIO.

IRQ_WL

1.8V

I/O

IRQ_WL to Host (Reuse as working mode configuration)

SDIO_D3

1.8V

I/O SDIO_D3_WL (SPI_CS)

SDIO_D2

1.8V

I/O SDIO_D2_WL

SDIO_D1

1.8V

I/O SDIO_D1_WL

SDIO_D0

1.8V

I/O SDIO_D0_WL (SPI_DOUT)

SDIO_CMD

1.8V

I/O SDIO_CMD_WL (SPI_DIN)

SDIO_CLK

1.8V

SDIO_CLK (SPI_CLK)

53 IRQ_BLE

1.8V

IRQ_BLE to Host (in shared SDIO mode) (Reuse as working mode configuration)

UART_CTS

1.8V

Device CTS signal flow control for BLE HCI

UART_TX

1.8V

UART TX for BLE HCI

UART_RX

1.8V

UART RX for BLE HCI

UART_RTS

1.8V

Device RTS signal flow control for BLE HCI

Not connected

GND

Ground

Not connected

Fast_CLK_REQ

1.8V

Fast clock request from the device

ANT_SEL

1.8V

I/O Default antenna select control line

SWCLK

1.8V

Serial Wire Debug CLK

SWDIO

1.8V

I/O Serial Wire Debug DIN/DOUT

GND

Ground

Not connected

GND

Ground

VDD_3.3V

3.3V

Power 3.3V Power Supply

VDD_3.3V

3.3V

Power 3.3V Power Supply

74 - 96 GND S1 - S12 GND

Ground

3 Electrical characteristics

3.1 Absolute Maximum Ratings

Reaching or exceeding the maximum ratings listed in the table below can cause equipment damage.

Table 3-1. Absolute Maximum Ratings

Parameter

Description

min

max

unit

VDD_3.3V 1216-Module 3.3V Supply Voltage

-0.5

4.2

VIO/1V8 1216-Module IO Voltage

-0.5

2.1

3.2 Normal working conditions

Table 3-2. Recommended Operating Conditions

Parameter

Description

min

TYP

VDD_3.3V 1216-Module 3.3V Supply Voltage

3.0

3.3

VIO

1216-Module IO voltage

1.62

1.8

Top

Operation temperature

-40

max

unit

3.6

1.98

+85

3.3 Electrical Characteristics

Table 3-3. BM3301-1x1x Module Electrical Characteristics

Parameter

Description

Test Condition

min

TYP

VIH

High level input voltage

0.65 x VIO

VIL

Low level input voltage

VOH

High level output voltage At 4mA

VIO 0.45

VOL

Low level output voltage At 4mA

max

unit

VIO

0.35 x VIO

VIO

0.45

3.4 Module specifications

Table 3-4. BM3301-1313 Module features

ITEMs Parameter

Specifications

Unit

Size

1216-Module 12(W) x 16(L) x 2.1(H)Max

Structure

Package

1216-Module 108 pins LGA Module

Sleep current

1216-Module 215(TBD)

Operation current (Transmitter)

1216-Moudle

3.3V

360 65

470 305

20.2dBm 6 OFDM 20dBm BLE 1M Channel 4

Operation current

TBD @ Wi-Fi Continous Receive

(Receiver) TX Output power(Max) Sensitivity

ITEMs
Peripheral Interface

Descriptions
SDIO 3.0 SPI UART
Coexistence
SWD

TBD @ Bluetooth Scan

TBD @ Wi-Fi Scan

20 @ 11ax SU ER MCS0 dBm
16 @ BLE 20dBm 1M Channel 4

Wi-Fi@20-MHz bandwidth. At <10% PER limit

Conditi ons

min

type

1 DSS

max dBm
-

2 DSS

4 Timing and Switching Characteristics
4.1 Power Supply Sequencing
For proper operation of the device, perform the recommended power-up sequencing as follows: 1. All supplies (VBAT, VIO) must be available before Reset is released. 2. For an external slow clock, ensure that the clock is stable before Reset is deasserted (high). 3. The Reset pin should be held low for 10 us after stabilization of the external power supplies.
4.2 Clocking Specifications
A slow clock running at 32.768 kHz for low power modes
4.2.1 Slow Clock Generated Internally
In order to minimize external components, the slow clock can be generated by an internal oscillator. However, this clock is less acurrate and consumes more power than sourcing the slow clock externally. For this scenario the Slow_CLK pin should be left not connected.
4.2.2 Slow Clock Using an External Oscillator
For optimal power consumption, the slow clock can be generated externally by an oscillator or sourced from elsewhere in the system. The external source must meet the requirements listed below. This
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

clock should be fed into the BMCC3301-1313 pin Slow_CLK and should be stable before nReset is deasserted and device is enabled.

4.2.2.1 External Slow Clock Requirement

Parameter

Description

Input slow clock frequency Square wave

Frequency accuracy

Inital + temperature + aging

Input Duty cycle

Rise and fall time

10% to 90% (rise) and 90% to 10%

(fall) of digital signal level

VIL (Input low level)

VIH (Input high level)

Input impedence

Input capacitance

min

TYP

32768

0 0.65 x VIO 1

max

Unit

±250

ppm

100

0.35 x VIO V

1.95

5 Application information
5.1 Package information
5.1.1 BM3301-1216 Module Package information

Figure 5-1-2. BM3301-1216 Module Package Outline Drawing
5.2 Land Pattern
The following figure shows the recommended pad dimensions.
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

5.3 Reference design based on BM3301-1216 Module
Considering different application scenarios, we provide two different reference designs.
5.3.1 BM3301-1216 Module Block Diagram
Figure 5-3-1. System Block Diagram Notes: 1. IRQ_WL, IRQ_BLE, Logger are used to configure the working mode. IRQ_WL, IRQ_BLE need to be pulled down, Logger needs to
be pulled up. 2. IRQ_WL, IRQ_BLE, Logger already have internal pull-up or pull-down resistors. External resistors are not required, but it is
recommended to reserve positions for resistors. 3. SWDIO, do not add pull-down resistor. 4. SWCLK, do not add pull-up resistor.
5.3.2 SDIO Iines
Due to the size of the module, the length of SDIO lines is not equal within the module, and it is necessary to compensate for the unequal length lines in your design.
The length of each SDIO lines of BM3301-1216 Module SDIO_CLK: 539.16 mil SDIO_CMD: 570.29 mil SDIO_D0: 481.10 mil SDIO_D1: 502.99 mil SDIO_D2: 506.48 mil SDIO_D3: 502.13 mil
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

6 Ordering information
Technical Support: Sales:

Part Number BM3301-1216 Module

Table 5 Ordering Information
Package size (mm) 12(W) x 16(L) x 2.1(H) max

7 Reversion
V0.9 2023-05-25 Draft release

IPEX GEN4 Yes

8 FCC
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID:Z4T-BM3301-1216"
The module is limited to OEM installation ONLY
The OEM integrators is responsible for ensuring that the end-user hasno manual instructions to remove or install module
The module is limited to installation in mobile or fixed applications,according to Part 2.1091(b)
The separate approval is required for all other operatingconfigurations, including portable configurations with respect to configurations
The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.
© 2008-2023 Seeed Technology Co., Ltd. All rights reserved. www.seeedstudio.com

IC This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2)This device must accept any interference, including interference that may cause undesired operation of the device. L'émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d'Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)L'appareil ne doit pas produire de brouillage; (2)L'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet émetteur ne doit pas être colocalisé ou fonctionner en conjonction avec une autre antenne ou un autre émetteur.

The device meets the exemption from the routine evaluation limits in section 2.5 of RSS-102 and compliance with RSS-102 RF exposure, users can obtain Canadian information on RF exposure and compliance. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Le dispositif rencontre l'exemption des limites courantes d'évaluation dans la section 2.5 de RSS 102 etla conformité à l'exposition de RSS-102 rf, utilisateurs peut obtenir l'information canadienne surl'exposition et la conformité de rf. Cet émetteur ne doit pas être Co-placé ou ne fonctionnant en même temps qu'aucune autre antenne ouémetteur. Cet équipement devrait être installé et actionné avec une distance minimum de 20 centimètres entre le radiateur et votre corps.

Please notice that if the ISED certification number is not visible when the module is installed inside another

device, then the outside of the device into which the module is installed must also display a label referring to the

enclosed module. This exterior label can use wording such as the following: "Contains IC: 21046-BM33011216"

any similar wording that expresses the same meaning may be used.

Veuillez noter que si le numéro de certification ISDE n'est pas visible lorsque le module est installé à l'intérieur

d'un autre dispositif, alors l'extérieur du dispositif dans lequel le module est installé doit également afficher une

étiquette se référant au module fermé. Cette étiquette extérieure peut utiliser des libellés tels que: «contient IC:

21046-BM33011216» toute formulation similaire qui exprime la même signification peut être utilisée.

Antenna information

Antenna Type

Antenna Gain

Rod antenna

2.81 dBi

PCB antenna

2.87 dBi

Trace antenna designs: Not applicable.

Type d'antenne

Max Gain d'antenne

Rod antenna

2.81 dBi

PCB antenna

2.87 dBi

References

Seeed Studio Bazaar, The IoT Hardware enabler.

WPS 文字