HP t530 Thin Client QuickSpecs

Overview

The HP t530 Thin Client is designed for modern virtualized environments, offering a balance of performance, connectivity, and security. This document provides a comprehensive overview of its technical specifications.

Front and Rear Views

Visual identification of ports and features on the HP t530 Thin Client.

Front View

• 1. Power button
• 2. Flash memory activity indicator light
• 3. 1 x USB-A 3.1 Gen 1 port for accessories
• 4. 1 x USB-C 3.1 Gen 1 port for accessories
• 5. 3.5mm headset jack
• 6. System stand

Rear View

• 1. DisplayPort™ 1.2 digital video outputs (2)
• 2. 2 x USB-A 2.0 ports for keyboard and mouse
• 3. 2 x USB-A 3.1 Gen 1 ports for accessories
• 4. RJ45 Gigabit Ethernet interface
• 5. 19V DC power input
• 6. Cable lock support
• 7. Optional I/O Port: Can be configured as one of the following:
  • Blank; no optional port
  • Serial port
  • VGA video output
  • External Wi-Fi antenna connector

At a Glance

• Processor: AMD GX-215JJ System on Chip; 1.5 - 2.0 GHz dual-core with Radeon™ R2E graphics core.
• Memory: DDR4 single-channel SDRAM, up to 1,866 MT/s transfer rate, one SODIMM slot, up to 16 GB supported.
• Video Outputs: 2 x DisplayPort™ 1.2 supporting up to Ultra High Definition (UHD)/4K (3840 x 2160) resolutions. Models can be configured with an optional VGA analog video port.
• Storage: Solid-state flash memory storage; single M.2 slot supporting up to a 512 GB flash drive.
• Thermal Management: Active thermal management technology monitors component operating temperatures.
• Networking: Gigabit Ethernet (GbE) network connection. Optional Wi-Fi/Bluetooth® adapters with integrated or external antennas.
• USB Ports: Located on front and back panels, including USB-C 3.1.
• Optional Ports: Configurable with an optional serial port.
• Audio: Integrated PC speaker; 3.5 mm headset audio port on front (configurable as line in or line out).
• Security: TCG certified Trusted Platform Module (TPM) chipset; system UEFI designed to address NIST SP 800-147 guidelines; cable lock slot; power cord retention clip.
• Environmental Certifications: ENERGY STAR® certified and EPEAT® Gold registered in the United States.
• Materials: Greater than 25% post-consumer recycled plastics content (by weight). Low halogen material content.
• Compliance: Models can be configured as TAA compliant.

Warranty

HP Customer Support provides a limited three-year hardware limited warranty in most regions. HP Care Packs offer extended service contracts. For more details, visit http://www.hp.com/go/cpc.

Technical Specifications

Operating Systems

• HP Smart Zero Core (Linux®-based)
• Firmware based SmartZero Core
• HP ThinPro (Linux®-based)
• Microsoft Windows Embedded Standard (WES) 7E
• Microsoft Windows 10 IoT Enterprise

Processor

NOTE: CPU Maximum frequency is based on AMD Turbo Core Technology.

Graphics

• Number of displays supported: 2
• Video outputs: 2 x DisplayPort™ (standard), 1 x VGA port (optional).

NOTE: The optional VGA port does not increase the number of displays supported.

Graphics Performance Table

NOTE: For 4K @ 30fps video on Windows 10 IoT and ThinPro, resolution is scaled down.

Memory

• Type: Single channel DDR4 SDRAM
• Data Transfer Rate: up to 1,866 MT/s
• Peak Transfer Rate: 14,944 MB/s
• Number of slots: 1 x SODIMM
• Capacities offered: 4, 8 and 16 GB
• Reserved for graphics: 256 MB, 512 MB (default) or 1 GB

NOTE: WES 7E is a 32-bit operating system and only recognizes up to 3.2 GB SDRAM. The system's Graphics Processing Unit (GPU) uses part of total system memory.

UEFI (Unified Extensible Firmware Interface)

• UEFI Specification Revision: 2.3.1
• Meets requirements for Common Criteria certification.
• Designed to address NIST SP800-147 guidelines.

Trusted Platform Module (TPM)

• TPM 1.2 when configured with Microsoft WES 7E.
• TPM 2.0 when configured with HP ThinPro / Smart Zero Core, Windows 10 IoT Enterprise, or with no operating system.

NOTE: TPM 2.0 (Infineon SLB9660) is Common Criteria ELA4+ Certified and convertible to FIPS 140-2 certified mode.

Storage

• Type: NAND flash memory; non-volatile
• Number of sockets: 1 x M.2
• Capacities offered: 0, 8, 16, 32, 64, 128, 256 and 512 GB.

WES 7E requires a minimum of 16 GB. Windows 10 IoT Enterprise requires a minimum of 32 GB. Solid-state flash-based memory modules are used for operating system storage in virtualized environments. The HP t530 Thin Client uses MLC, Ultra MLC, and TLC flash memory types.

Input/Output

• USB ports:
  • 1 x USB-C 3.1 (front access)
  • 1 x USB-A 3.1 (front access)
  • 2 x USB-A 2.0 (rear access)
  • 2 x USB-A 3.1 Gen1 (rear access)
• Video outputs:
  • 2 x DisplayPort™ 1.2 digital video ports (standard)
  • 1 x VGA analog video port (optional)

  NOTE: The optional VGA port does not increase the number of supported displays.

• Other:
  • 1 x RJ45 Gigabit Ethernet interface
  • 1 x serial port (optional)
  • 1 x 3.5mm headset jack (front access)
  • 1 x coaxial connector for external Wi-Fi antenna (optional)

NOTE: A single position at the back of the system is used for one of three optional I/O features: blank, VGA video port, or serial port, or external Wi-Fi antenna connector.

Audio/Video

• Audio: Realtek ALC3252 high definition audio Codec with 4-channel DAC and ADC. Supports 16/20/24-bit PCM for stereo or 2.1-channel outputs. Meets WLP requirements.
• Video: Supports MPEG-4 part 2 (DivX, Xvid), MPEG-4 part 10 (H.264), MPEG-H part 2 (H.265), WMV 7/8/9, VC-1 & ASF. Includes hardware acceleration.

NOTE 1: Playback of 2160p videos is not supported.

NOTE 2: Playback of multiple 1080p videos and stretching 1080p videos is supported if the OS resolution is set to 2560 x 1600 or lower.

Hardware Security

• Security lock support (cable lock sold separately).
• Trusted Platform Module (version 1.2 or 2.0 depending on the operating system).

Networking

• Wired networks: Realtek Gigabit Ethernet (GbE), Wake on LAN, PXE, TCP/IP with DNS DHCP, Secure Socket Tunneling Protocol (SSTP) with Microsoft OS.
• Wireless networks: Intel® Dual Band Wireless-AC 3168 with Bluetooth®; Intel® Dual Band Wireless-AC 8265 with Bluetooth®.

NOTE: Wireless features require an access point and Internet access.

NOTE: Tested and compliant with Internet Protocol version 4 (IPv4) and Internet Protocol version 6 (IPv6).

Software Support

Host Environment and Protocol Support

Protocol Clients

Browser Support

Security Features

Management Tools

Additional Components

NOTE: Other add-on software is available. Refer to http://www.hp.com/support for the latest list.

Audio/Video CODEC

NOTE: Other add-on software is available. Refer to http://www.hp.com/support for the latest list.

Recommended TC Configuration for Microsoft Teams Media Optimization

Key: - Not recommended, ✅ recommended

Weights & Dimensions

• W x D x H (without stand): 35 x 200 x 200 mm (1.38 x 7.87 x 7.87 in.)
• Vertical orientation
• Volume: 1.4 liter
• System Weight (including stand): 962.8 g (2.12 lb.)
• Shipping Weight: 1919.7 g (4.23 lb.)

NOTE: All measurements are approximate; the addition of optional modules will increase the weight.

Power Supply

• 45W external power adapter
• Worldwide auto-sensing 100-240 VAC, 50-60 Hz
• Energy saving automatic power-down
• Surge tolerant

Agency Compliance

• Accessibility: Section 508 Accessibility. VPAT report available.
• Environmental Stewardship: Worldwide (ENERGY STAR®, EPEAT, ROHS, ERP, TCO, MEPS, CECP, HP GSE, etc.).
• Product Safety: Worldwide (UL, CB, GS, CCC, etc.).
• Electromagnetic Compliance (EMC): Worldwide (FCC/CISPR/EN/VCCI/ICES/AS/NZS/CNS/KCC) “Class B” EMI regulations.

Environmental

• Operating Temperature Range: 50° to 104° F (10° to 40° C)
• Non-operating Temperature Range: -22° to 140° F (-30° to 60° C)
• Humidity: Condensing: 20% to 80%; Non-condensing: 10% to 90%.

NOTE: Specifications are at sea level with altitude derating. Upper limit may be limited by installed options.

Eco-Label Certifications & Declarations

This product is certified or in the process of being certified with the following marks:

• US ENERGY STAR®
• EPEAT® Gold registered in the United States. See http://www.epeat.net for registration status.
• IT ECO declaration

Energy Consumption and Heat Dissipation

*NOTE: Heat dissipation is calculated based on measured watts, assuming service level is attained for one hour.

Additional Information & Compliance

• Compliance: In compliance with Restrictions of Hazardous Substances (RoHS) directive -2011/65/EC, WEEE Directive – 2002/96/EC, California Proposition 65, and IEEE 1680 (EPEAT) standard.
• Recycled Content: Contains 13.9% post-consumer recycled plastic (by wt.). 93.4% recyclable at end of life.
• Packaging Materials: External: PAPER/Corrugated (455 g). Internal: PLASTIC/Polyethylene Expanded - EPE (44 g), PLASTIC/Polyethylene low density - LDPE (5 g).
• Material Usage: HP Inc. is committed to environmental compliance. The product does not contain certain hazardous substances in excess of regulatory limits, including Asbestos, Cadmium, Lead, Halogenated Diphenyl Methanes, etc. Refer to HP General Specification for the Environment for details.
• Packaging Guidelines: HP follows guidelines to decrease environmental impact, including elimination of heavy metals and ozone-depleting substances, use of recycled content, and recyclable materials.
• End-of-life Management and Recycling: HP offers product return and recycling programs. Information for treatment facilities is available at http://www.hp.com/go/recyclers.

HP, Inc. Corporate Environmental Information

For more information about HP's commitment to the environment:

• Global Citizenship Report: http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
• Eco-label certifications: http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
• ISO 14001 certificates: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

Summary of Changes

Legal Notices

© 2021 HP Development Company, L.P. Information is subject to change without notice. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. DisplayPort™ and the DisplayPort™ logo are trademarks of VESA®. Amazon Web Services, Amazon WorkSpaces are trademarks of Amazon.com, Inc. Bluetooth® is a trademark of its proprietor. ENERGY STAR is a registered trademark of the U.S. EPA. Linux® is a registered trademark of Linus Torvalds. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation. Intel® is a trademark of Intel Corporation. VMware Horizon and VMware Horizon View are registered trademarks or trademarks of VMware, Inc. Citrix and Citrix Receiver are trademarks of Citrix Systems, Inc.