User Guide for Microsemi models including: M2S150-ADV-DEV-KIT SmartFusion2 SoC FPGA Advanced Development Kit, M2S150-ADV-DEV-KIT, SmartFusion2 SoC FPGA Advanced Development Kit, Advanced Development Kit, Development Kit
SmartFusion 2 FPGAs | Microchip Technology
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DocumentDocumentSmartFusion2 SoC FPGA Advanced Development Kit Quickstart Card Kit Contents--M2S150-ADV-DEV-KIT Quantity 1 1 1 1 1 1 Description Development board with SmartFusion2 SoC FPGA 150K LE M2S150TS-1FCG1152 USB A male to micro-B male cable, three feet long 28/28AWG USB 2.0 USB A to mini-B cable 12 V, 5 A AC power adapter Quickstart card Software ID letter for Libero Gold License The M2S150-ADV-DEV-KIT is RoHS-compliant. 1 SmartFusion2 SoC FPGA Advanced Development Kit Quickstart Card Overview Microsemi's SmartFusion®2 Advanced Development Kit has a full featured 150K LE SmartFusion2 system-on-chip (SoC) FPGA. This 150K LE device inherently integrates reliable flash-based FPGA fabric, a 166 MHz ARM®Cortex®-M3 processor, digital signal processing (DSP) blocks, static random-access memory (SRAM), embedded nonvolatile memory (eNVM), and industry-required high-performance communication interfaces all on a single chip. It also supports all the data security features that are available in the SmartFusion2 devices. The Advanced Development Kit board has numerous standard and advanced peripherals, such as PCIe®x4 edge connector, two FMC connectors for using many off-the-shelf daughter cards, USB, Philips inter-integrated circuit (I2C), two gigabit Ethernet ports, serial peripheral interface (SPI), and UART. A high precision operational amplifier circuitry on the board helps to measure core power consumption by the device. The SmartFusion2 Advanced Development Kit includes 1 Gb of on-board double data rate3 (DDR3) memory and 2 Gb SPI flash--1 Gb connected to the Microcontroller Subsystem (MSS) and 1 Gb connected to the FPGA fabric. The serializer and deserializer (SERDES) blocks can be accessed through the peripheral component interconnect express (PCIe) edge connector or high speed sub-miniature push-on (SMA) connectors or through onboard FPGA mezzanine card (FMC) connector. This kit enables you to design applications that involve one or more of the following: · Embedded ARM Cortex-M3 processor-based systems · Motor control · Industrial automation · FMC expansion · High speed I/O applications · Universal serial bus (USB) applications (OTG support) · Power measurement · Imaging and Video application · Security applications Hardware Features · SmartFusion2 SoC FPGA in the FCG1152 package (M2S150TS-1FCG1152, 150K LE) · DDR3 synchronous dynamic random access memory (SDRAM) 4x256 MB for storing data. 256 MB for storing the ECC bits · SPI flash memory 1 Gb SPI flash connected to SPI port 0 of the SmartFusion2 MSS. 1 Gb SPI flash connected to SmartFusion2 FPGA fabric · PCI Express Gen 2 x1 interface · One pair SMA connectors for testing of the fullduplex SERDES channel · Two FMC connectors with HPC/LPC pinout for expansion · PCIe x4 edge connector · RJ45 interface for 10/100/1000 Ethernet · USB micro-AB connector · Headers for I2C, SPI, GPIOs · FTDI programmer interface to program the external SPI flash · JTAG/SPI programming interface · RVI header for application programming and debug · Embedded trace macro (ETM) cell header for debug 2 SmartFusion2 SoC FPGA Advanced Development Kit Quickstart Card · QUAD 2:1 MUX/DEMUX high bandwidth bus switch · Dual in-line package (DIP) switches for user application · Push-button switches and LEDs for demo purposes · Current measurement test points Programming SmartFusion2 Advanced Development Kit implements an on-board programmer and does not require a standalone FlashPro hardware to program the board. FlashPro5 programming procedure needs to be used to program the device using on-board programmer. For more information regarding programming procedures refer to SmartFusion2 SoC FPGA Advanced Development Kit User Guide at www.microsemi.com/document-portal/doc_download/134215-ug0557smartfusion2-soc-fpga-advanced-development-kit-user-guide 3 SmartFusion2 SoC FPGA Advanced Development Kit Quickstart Card Software and Licensing Libero® SoC Design Suite offers high productivity with its comprehensive, easy-to-learn, easy-to-adopt development tools for designing with Microsemi's low-power Flash FPGAs and SoC. The suite integrates industry standard Synopsys Synplify Pro® synthesis and Mentor Graphics ModelSim® simulation with best-in-class constraints management and debug capabilities. Download the latest Libero SoC release www.microsemi.com/products/fpga-soc/design-resources/design-software/libero-soc#downloads A Software ID letter enclosed with the kit contains Software ID and instructions on how to generate a Libero Gold license. For further details on how to generate a gold license please visit www.microsemi.com/products/fpga-soc/design-resources/dev-kits/smartfusion2/smartfusion2advanced-development-kit#licensing Documentation Resources For more information about the SmartFusion2 SoC FPGA Advanced Development Kit, including user's guides, tutorials, and design examples, see the documentation at www.microsemi.com/products/fpgasoc/design-resources/dev-kits/smartfusion2/smartfusion2-advanced-development-kit#documents Support Technical support is available online at www.microsemi.com/soc/support and by email at soc_tech@microsemi.com Microsemi sales offices, including representatives and distributors, are located worldwide. To find your local representative, go to www.microsemi.com/salescontacts Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com www.microsemi.com ©20152017 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California and has approximately 4,800 employees globally. Learn more at www.microsemi.com. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. 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