OnLogic Karbon 800 Product Manual

Revision History

DateRevision History
6/21/2022First release of Karbon 800 manual
09/19/2022Added section 2.12 (Modbay Expansions)
09/20/2022Removed : Pykarbon paragraph in section 5.1
11/10/2022Removed mentions of support for AMT
01/10/2023Appendix E, Spec table details & MCU infographic Updates
01/19/2023Reinstated mentions of support for AMT

1 - System Overview

The Karbon 800 series offers a range of high-performance, rugged, low-profile computers designed for demanding environments. This manual provides detailed information on the system's features, specifications, I/O, and compliance.

1.1 - Accessories

  • 5-pin Power Terminal Block Connector (Dinkle 2ESDVM-05P)
  • 20-pin DIO/CAN/SW Terminal Block Connector (Dinkle 0159-0320)
  • SATA Power and Data Cables if not installed (OnLogic CBD123)

Additional items such as mounting brackets, power supplies, or antennas may be included in the system box or shipping carton. All drivers and product guides are available on the corresponding product page. For more information on accessories and additional features, visit the Karbon 800 pages:

US:
https://www.onlogic.com/k801/
https://www.onlogic.com/k802/
https://www.onlogic.com/k803/
https://www.onlogic.com/k804/

EU:
https://www.onlogic.com/eu-en/k801/
https://www.onlogic.com/eu-en/k802/
https://www.onlogic.com/eu-en/k803/
https://www.onlogic.com/eu-en/k804/

1.2 - Product Specifications

OnLogic Karbon 800 Series
VariantsK801 - High-Performance Rugged Low-Profile Computer
K802 - High-Performance Rugged Computer w/ModBay
K803 - High-Performance Rugged Computer w/PCIe
K804 - High-Performance Rugged Computer w/ModBay & PCIe
ProcessorIntel 12th Gen Alder Lake-S (LGA1700)
Core i3, i5, i7 & i9 up to 16-core 24-thread
Memory2x DDR4-2666 SO-DIMM up to 64GB total (non-ECC or ECC)
ChipsetIntel W680
Integrated GraphicsIntel UHD Graphics 730 (i3) or 770 (i5, i7, i9)
Front I/O4x USB 3.2 Gen 2 Type-A 2xM2.5x0.45 threaded hole
2x Serial RS-232/422/485
20-pin GPIO terminal block (DIO, CAN bus, Ext. switch)
1x 3.5 mm audio jack
2x 3FF Mini-SIM slots
1x External fan connector
Back I/O2x Hot-swap drive bays (optional, K802 & K804)
8x Status LEDs
1x Power button
2x or 6x 2.5 GbE LAN (optional 2x PoE)
2x USB 3.2 Gen 2 Type-A with 1xM2.5x0.45 threaded hole
2x DisplayPort (full-size, DP 1.4, DP++, HDMI 1.4)
2x ModBay expansion slots (K802 & K804)
5-pin Power input
Expansion & Storage1x M.2 2280 M-key (PCIe Gen 4 x4)
1x M.2 2280 M-key (PCIe Gen 4 x4, SATA)
1x M.2 3042/3052/2280 B-key (PCIe x2, SATA, USB 3.0, USB 2.0)
1x M.2 2230 E-key (PCIe x1, USB 2.0)
1x mPCIe (PCIe x1, USB 2.0)
1x PCIe Gen 5 x16 slot (K803 & K804)
2 x 2.5" SATA SSD/HDD drives 0-15mm max (hot-swap optional, 7-9.5mm max) (1x K803, 2x K802 & K804)
K804 Options:
1) 1x PCIe x16 in x16 PCIe slot with dual slot height (4.4" H x 9.5" L)
2) 2xPCIe x16 (8 lanes each) with single slot height (4.4" H x 9.5" L)
K803:
1x PCIe x16 in x16 PCIe slot with single slot height (4.4" H x 9.5" L)
Special FeaturesUser-Programmable OnLogic Microcontroller (MCU)
Automotive Ignition Power Sensing
Optional TPM 2.0 module (Nuvoton NPCT750)
Operating SystemsWindows 11
LAN Controllers1x Intel I225-LM with AMT support
1x or 5x Intel I225-IT
Voltage Input12 ~ 48V DC up to 30A (19 ~ 48V DC with PCIe expansion over 75W)
DimensionsK801 = 240 x 50 x 267mm (9.45 x 1.97 x 10.51")
K802 & K803 = 240 x 82 x 267mm (9.45 x 3.23 x 10.51")
K804 = 240 x 143 x 267mm (9.45 x 5.63 x 10.51")
MountingWall Mount
Wall Mount with Vibration Isolation
DIN Rail Mount
Operating Temperature-40°C ~ 70°C (35W TDP CPU)
-40°C ~ 50°C (65W TDP CPU)
Storage Temperature-40°C ~ 85°C
Operating Humidity10~95% relative, non-condensing
Storage Humidity0~95% relative, non-condensing
Shock & VibrationShock: Tested according to IEC 60068-2-27 and MIL-STD-810H
Vibration: Tested according to IEC 60068-2-64 and MIL-STD-810H
CertificationsFCC 47 CFR Part 15 Subpart B (Class A)
EN 60950-1 & EN 63268-1
CISPR 32/EN 55032
CISPR 35/EN 55035
Radio Equipment Directive (2014/53/EU)
RoHS 3 (2015/863/EU)
WEEE Directive (2012/19/EU)
IEC 60068-2-27
IEC 60068-2-64
MIL-STD-810H
Power Immunity According to E-Mark ISO 7637-2 & ISO 16750-2
EN 50121-3-2
IEC 60601-1-2, 4th ed.
EN 60945, 4th ed.

1.3 - Exterior Features & Dimensions

1.3.1 - Front I/O

The front panel features various connectors and indicators. From left to right, these include:

  • Fan connector
  • Micro SIM slots (2x 3FF)
  • Status LEDs (SET, WT, IGN, 1-4)
  • USB 3.2 ports
  • COM port (RS-232/422/485)
  • DIO (Digital Input/Output) terminal block
  • Power Button
  • HDD LED

1.3.2 - Back I/O

The rear panel includes:

  • Power Input terminal
  • Grounding Nut
  • Automotive Ignition (IGN) terminals (+, -)
  • Display Ports (DP1, DP2)
  • LAN ports (multiple, depending on configuration)
  • USB 3.2 ports

1.3.3 - K801 System Dimensions

The K801 model has dimensions of 240mm (width) x 50mm (height) x 267mm (depth).

1.3.4 - K802 System Dimensions

The K802 model has dimensions of 240mm (width) x 82mm (height) x 267mm (depth).

1.3.5 - K803 System Dimensions

The K803 model has dimensions of 240mm (width) x 82mm (height) x 267mm (depth).

1.3.6 - K804 System Dimensions

The K804 model has dimensions of 240mm (width) x 143mm (height) x 267mm (depth).

1.4 - Motherboard Overview

1.4.1 - System Block Diagram

The system block diagram illustrates the interconnection of major components. Key elements include:

  • CPU (Intel Alder Lake-S LGA 1700)
  • Memory (DDR4 SO-DIMM slots)
  • Chipset (ADL-S PCH)
  • Various expansion interfaces: PCIe Gen 5 x16 slot, M.2 slots (M-key, B-key, E-key), mPCIe slot.
  • I/O interfaces: USB ports (3.2 Gen 2, 2.0), Serial ports (RS-232/422/485), DIO, CAN, DisplayPort, LAN ports, SATA headers, Power Button, User LEDs, etc.
  • Expansion modules: Modbay 1, Modbay 2.
  • Other components: Microcontroller, TPM 2.0, Audio Codec, Super IO.

1.4.2 - Motherboard Features

ItemDescription
A1Power button
A2Audio Jack
A38-bit Isolated DIO (4-in, 4-out), CAN bus, External Switch
A4COM RS-232/422/485 ports (2x)
A5USB 3.2 Gen 2 Type-A ports (4x)
A63FF Mini-SIM slots (2x)
A7External fan header
A85-pin Power input with ignition sense
A9Auxiliary power for GPU Power card
A10DisplayPorts (2x)
A112.5 GbE LAN ports (2x or 6x)
A12USB 3.2 Gen 2 Type-A ports (2x)
A13PCIe Gen 5.0 x16 connector
A14PCIe Aux power and fan control header
A15CMOS battery
A16TPM header
A17Onboard PoE header
A18SATA III ports (2x)
A19M.2 2280 M-key (PCIe Gen 4 x4)
A20ModBay connectors (2x)
A21SATA power headers (2x)
A224-pin Aux power expansion (12V, 5V)
A23mPCIe slot (PCIe Gen 3 x1, USB 2.0)
A24DDR4 SO-DIMM slots (2x)
A25M.2 2280 M-key slot (PCIe Gen 4 x4, SATA)
A26M.2 2230 E-key slot (PCIe Gen 3 x1, USB 2.0)
A27M.2 3042/3052/2280 B-key slot (PCIe Gen 3 x2, USB 3.0, USB 2.0)

2 - I/O Definitions

2.1 - Serial Ports

The serial ports on the Karbon 800 series motherboard support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Additionally, 5V & 12V power can be enabled on pin 9, which is rated to provide 250mA of current. Refer to the BIOS manual for configuration instructions.

PinRS-232RS-422RS-485
1DCDTX-TX-/RX-
2RXTX+TX+/RX+
3TXRX+NC
4DTRRX-NC
5GNDNCNC
6DSRNCNC
7RTSNCNC
8CTSNCNC
9RI/PWRNC/PWRNC/PWR

NC = Not Connected

2.2 - DIO, CAN, Ext. Power Switch

The 20-Pin header provides interfaces for 8-bit Digital Input/Output (DIO) or General Purpose Input Output (GPIO) with optically isolated terminals, one CAN bus connection, and an optional external power switch. The DIO is optically isolated for protection and requires external power (5~48V DC) through Pin 20 with GND to Pin 19. The Isolated Power Supply (ISO PSU) should not exceed 0.6A. Individual DOut pins have a limit of 150mA. Remote power switch cables should be twisted-pair with a floating shield and kept under 3 meters. Momentary contact switches are recommended for pins 1 and 2.

PinDefinitionPinDefinition
1SW+2GND
3GND4GND
5GND6CANH
7GND8CANL
9GND10GND
11In012Out0
13In114Out1
15In216Out2
17In318Out3
19V_DIO-20V_DIO+

Karbon 800 CAN Bus Connection:

  • CAN H: Pin 6
  • CAN L: Pin 8
  • GND: Pin 10

2.2.1 - DIO Connection Diagram

The DIO connection diagram shows three configurations:

  • VISO Input: Pin 20 (VISO) connects to ISO PSU +, Pin 19 (GND ISO) connects to ISO PSU -. Digital Inputs (Din) are on pins 11, 13, 15, 17.
  • Remote Switch Input: Pin 20 (VISO) connects to X, Pin 19 (GND ISO) connects to ISO PSU -. Remote switch connects between pins 11, 13, 15, 17 (Din) and the remote signal.
  • DOut Output: Pin 20 (VISO) connects to ISO PSU +. Pin 19 (GND ISO) connects to ISO PSU -. Digital Outputs (DOut) are on pins 12, 14, 16, 18, with a load (up to 150 mA) connected between DOut and ISO PSU -.

2.4 - Status LEDs

The system features several status LEDs on the front panel:

  • LEDs 1-4: Indicate the currently selected user mode.
  • Watchdog LED: Indicates MCU status (Off: MCU not functioning normally; Blink: Firmware bootloader active; Pulse: MCU functioning normally).
  • Automotive Ignition LED: Indicates ignition status (On: Ignition input is on; Off: Ignition input is off).
  • Power LED: Indicates device power status (On: Device is on; Off: Device is off; Blink: Device is asleep).
  • HDD LED: Indicates internal storage drive activity.

Detailed LED functions and colors:

LED 1LED 2LED 3LED 4LED 5LED 6LED 7LED 8
ColorWhiteBlueWhiteWhiteWhiteWhiteWhiteWhite
FunctionSSD Activity Off = None On = R/WPowerAutomotive Ignition SensingWatchdog Timer & User ConfigurableUser ConfigurableUser ConfigurableUser ConfigurableUser Configurable

2.5 - Automotive Ignition Power Sensing (IGN)

The 5-pin power input terminal supports automotive ignition sensing. Timing for power on/off delays can be adjusted via serial commands through the OnLogic microcontroller (MCU). This allows enabling/disabling ignition sensing, setting startup delays after ignition detection, and setting shutdown delays after ignition loss. For more details, visit: https://support.onlogic.com/onlogic-systems/rugged/karbon-series/

Ignition Timing Diagram:

The diagram illustrates the relationship between VEHICLE IGNITION STATE and PC POWER STATE, showing periods of PC 'BOOT' TIME, COUNTDOWN ACTIVE, and SOFTWARE ADJUSTABLE DELAY.

PinDefinition
112~48V DC Ignition
212~48V DC Input
312~48V DC Input
4GND
5GND

The system requires all 4 power pins (2~5) from the 5-pin terminal block. It operates from 12V~48V DC with a maximum rated current of 15A per pin. A minimum 16 AWG wire gauge is recommended for 24V installations. Heavier gauge wire may be needed for higher power or lower voltage configurations. Use multi-strand wire with a crimped ferrule end and torque screws to 0.5 Nm.

2.7 - Networking

The Karbon 800 series offers up to six 2.5 GbE LAN ports. Two ports can be PoE capable with an optional module, providing up to 32W combined power (up to 25.5W per port for 802.3at, or 15.4W each for 802.3af). The system supports additional LAN expansion via ModBay cards, adding up to eight RJ45 LAN or PoE ports, or six M12 X-coded LAN or PoE ports, using Intel I210-IT controllers for 1 GbE speeds.

LEDColorStateCondition
Link-OffLAN link not established
LinkGreenOnLAN link established
LinkGreenBlinkingLAN activity occurring
SpeedYellowOn1000 Mb/s data rate
SpeedGreenOn2500 Mb/s data rate
Speed-Off100 or 10 Mb/s data rate

2.8 - USB Ports

Six USB 3.2 Gen 2 Type A ports are available, each supporting 10 Gbps bandwidth and rated at 5V @ 900mA. Up to eight additional USB 3.2 Gen 2 ports can be added via ModBay cards. All USB ports also support USB 2.0.

2.9 - DisplayPort

Two full-size DisplayPorts support DP 1.4 at 4K 60Hz and MST (Multi Stream Topology). An MST hub can extend support to up to four independent displays. Refer to Intel documentation for Alder Lake-S display output specifications: https://ark.intel.com/

2.10 - SIM Cards

Two 3FF Micro-SIM card slots on the front panel support 4G LTE and 5G cellular modems. SIM signals can be directed to the mPCIe or M.2 3042/3052/2280 B-key slots for SIM failover capability, configurable in BIOS. The default setting routes SIM1 to mPCIe and SIM2 to M.2 B-key. SIM cards use a Push-Push slot for insertion and removal.

2.11 - RTC Reset Button

An RTC reset button is accessible via a paperclip or SIM card removal tool, located next to the power button. The system must be powered off and unplugged before resetting.

2.12 - Modbay Expansion

Models K802 and K804 feature two Modbay expansion slots, supporting PCIe Gen 3 x2, USB 3.1 Gen 2, and USB 2.0. OnLogic offers various ModBay cards, including RJ45 LAN/PoE, M12 LAN/PoE, USB 3, and a carrier for two additional mPCIe slots.

2.12.1 - Modbay 4x LAN Expansion

The MODBAY-4LAN01 adds four RJ45 GbE LAN ports to K802 and K804, using Intel I210-IT controllers for speeds up to 1 Gbps. Operating Temperature: -40~70°C.

2.12.2 - Modbay 4x PoE Expansion

The MODBAY-4POE01 adds four RJ45 GbE PoE LAN ports to K802 and K804, using Intel I210-IT controllers for speeds up to 1 Gbps. Each port supports PoE output. PoE power budget depends on system voltage input. Refer to Appendix C for details. Operating Temperature: -40~70°C.

2.12.3 - Modbay 3x M12 LAN Expansion

The MODBAY-M12LAN01 adds three M12 X-coded GbE LAN ports to K802 and K804, using Intel I210-IT controllers for speeds up to 1 Gbps. Supported cables include CABLE-M12-RJ45-5M and CABLE-M12-RJ45-10M. Operating Temperature: -40~70°C.

2.12.4 - Modbay 3x M12 PoE Expansion

The MODBAY-M12POE01 adds three M12 X-coded GbE PoE LAN ports to K802 and K804, using Intel I210-IT controllers for speeds up to 1 Gbps. Each port supports PoE output. PoE power budget depends on system voltage input. Refer to Appendix C for details. Supported cables include CABLE-M12-RJ45-5M and CABLE-M12-RJ45-10M. Operating Temperature: -40~70°C.

2.12.5 - Modbay 2x 10Gb LAN Expansion

The MODBAY-10GLAN01 adds two RJ45 10 GbE LAN ports to K802 and K804, using a single X550 controller for speeds up to 10 Gbps per port and 15 Gbps combined. Operating Temperature: -40~40°C.

2.12.6 - Modbay 4x USB3 Expansion

The MODBAY-4USB01 adds four USB 3.2 Gen 2 Type-A ports to K802 and K804, utilizing ASM3142 and USB7206i controllers for speeds up to 10 Gbps per port and 15 Gbps combined. Ports are rated at 5V @ 900mA and can wake in Modern Standby. Operating Temperature: -40~50°C.

3 - Motherboard Connectors

This section details the various internal connectors and expansion slots on the Karbon 800 motherboard.

3.1 - M.2 2280 M-key 1

Supports PCIe Gen 4 x4, routed directly to the CPU, for NVMe storage drives. Pinout in Appendix C.

3.2 - M.2 2280 M-key 2

Supports PCIe Gen 4 x4 or SATA III, routed to the chipset, for NVMe or SATA storage drives. Pinout in Appendix C.

3.3 - M.2 3042/3052/2280 B-key

Supports PCIe Gen 3 x2, SATA III, USB 3.2 Gen 2, USB 2.0, and dual SIM card inputs. For expansion cards like SATA storage or 4G/5G cellular modems. Pinout in Appendix C. SIM1 and SIM2 slots connect here; routing is BIOS configurable.

3.4 - M.2 2230 E-key

Supports PCIe Gen 3 x1 and USB 2.0 signals, designed for M.2 2230 Wi-Fi expansion cards. Pinout in Appendix C.

3.5 - mPCIe

Supports PCIe Gen 3 x1, USB 2.0, and SIM card input. Designed for full-length cards; half-length cards can be used with an adapter. Pinout in Appendix C.

3.6 - TPM Header

Supports an optional discrete TPM 2.0 module, such as the Nuvoton NPCT750 (SKU: TPM01).

3.7 - Onboard PoE Header

Enables PoE on two of the onboard 2.5 GbE LAN ports using an optional module. Specific ports enabled depend on the number of LAN ports (2 or 6). Port 1 may be used for AMT remote management.

3.8 - Aux Power Expansion Header

Provides up to 2A of 5V and 12V power for internal expansion cards requiring additional power.

3.9 - SATA Headers

Two SATA data (SATA III 6Gbps) and two SATA power headers (12V and 5V output) are available. The OnLogic CBD123 cable is recommended for 2.5" SSD drives.

3.10 - PCIe Gen 5.0 x16 Connector

Features one PCIe x16 connector, paired with OnLogic risers for K803 and K804 models to support various PCIe configurations.

3.10.1 - PCIe x16 Riser (K803)

Supports a single-height PCIe Gen 4 x16 expansion card. Includes a fan header. Fits cards up to 4.4" H x 9.5" L x 0.57" W.

3.10.2 - PCIe x16 Riser (K804)

Supports a dual-height PCIe Gen 4 x16 expansion card. Includes six SATA power headers for RAID arrays and fan headers. Fits cards up to 4.8" H x 10" L x 1.37" W.

3.10.3 - Dual PCIe x8 Riser (K804)

Supports two single-height PCIe Gen 4 x16 expansion cards, each providing PCIe Gen 4 x8 lanes. K804 automatically detects this riser and enables bifurcation. Includes fan headers.

3.11 - DDR4 SO-DIMM Slots

Supports up to two DDR4 SO-DIMM slots rated up to 3200MHz. Supports non-ECC memory with all CPUs, and ECC memory with Core i5 (except i5-12400), i7, and i9 CPUs.

4 - Mounting Instructions

For a full set of mounting options and instructions, refer to the respective Spec Sheets and Dimensional Drawings for K801, K802, K803, and K804.

5 - OnLogic Microcontroller (MCU)

5.1 - Overview

The microcontroller on the Karbon 800 series manages several systems, including:

  • Automotive ignition power sensing
  • CAN bus
  • DIO
  • Status LEDs
  • DisplayPort CEC and persistent EDID
  • Input voltage monitoring
  • RTOS Capabilities

User control is available via two serial ports for CAN messages, DIO state, and configuration options. One port is for the CAN bus, the other serves as a serial terminal and DIO interface. Settings are saved to non-volatile memory. For further details and instructions, visit: https://support.onlogic.com/documentation/karbon800/

6 - Power Management

6.1 - Wake-Up Events

The Karbon 800 supports multiple power states with wake-up events configurable in the MCU and BIOS.

Wake-Up EventFrom ACPI StateComments
Power ButtonDeep S5, S5, S3
IgnitionUltra-low power, Deep S5, S5, S3Must be enabled in MCU
Digital InputS5, S3Must be enabled in MCU
LANS3Must be enabled in BIOS
USBS3Must be enabled in BIOS
RTC AlarmS5, S3Must be enabled in BIOS

6.2 - Protection Circuitry

The system includes protection circuitry for power adapters.

ParameterValue
Nominal operating voltage (Rated DC value of input)12~48V
Undervoltage protection trip DC level (system turns off)7.6V
Overvoltage protection trip DC level (system turns off)52.5V
Maximum safe DC voltage (system not damaged)56V
Minimum safe reverse voltage (system not damaged)-36V
Ignition pin safe working voltage (system not damaged)56V

These DC levels are absolute maximum values. The protection circuitry allows for brief transient voltages above these levels.

7 - Regulatory Compliance

7.1 - CE

The computer system is evaluated for medical, IT, automotive, maritime, and railway EMC standards as a Class A device, complying with relevant IT equipment directives for the CE mark. Testing includes EN 55032, EN 55035, EN 60601-1, EN 62368-1, EN 60950-1, EN 50121-3-2, EN 60945, and UN Regulation No. 10 ISO 17650-2 & ISO 7637-2. Modification may void certifications.

7.2 - FCC Statement

This device complies with FCC Part 15 as a Class A device. Operation is subject to two conditions: it must not cause harmful interference, and it must accept any interference received.

7.3 - ISED

This device complies with Industry Canada license-exempt RSS standards. Operation is subject to two conditions: it must not cause interference, and it must accept any interference received. (French text follows: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.)

CAN ICES-003(A) / NMB-003(A)

7.4 - UKCA

The computer system is evaluated for medical, IT, automotive, maritime, and railway EMC standards as a Class A device, complying with relevant IT equipment directives for the UKCA mark.

7.5 - VCCI

This is a Class A product based on the Voluntary Control Council for Interference (VCCI) standard. Use in a domestic environment may cause radio interference, requiring user corrective actions.

(Japanese text follows: この装置は、クラスA 情報技術装置です。この装置を家庭環境で使用すると電波妨害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要求されることがあります。 VCCI-A)

8 - Appendices

8.1 - Appendix A: Software Documentation

Additional documentation, including drivers, BIOS manuals, and configuration examples for the K800 series, is available on the support website: https://support.onlogic.com/documentation/karbon800/

8.2 - Appendix B: System Thermal Results

Thermal performance was validated under high ambient temperatures. Two workloads were tested: a 16-core 35W load and a 16-Core 65W load up to 70°C in a K801 chassis. Analysis compared average clock speed to expected base clock speed.

8.2.1 - Testing Conditions

  • Temperature Range: -40 ~ 70°C
  • Step size: 10°C (except for a jump from 0°C to 30°C)
  • CPU, SSD, and RAM loaded

8.2.2 - Results Summary

The i9-12900 CPU (65W) maintained over 80% base clock speeds on performance and efficiency cores up to 50°C ambient temperature. Significant throttling occurred at higher temperatures, with no thermal headroom for turbo power.

8.3 Appendix C: PoE Power Budget

The nominal power budget for all PoE ports on the Karbon 800 series at room temperature is provided below. Increased ambient temperature may limit maximum safe operating power. Contact OnLogic for specific derating information.

Mobo PoE Exp (2 ports)Modbay 1 (3-4 ports)Modbay 2 (3-4 ports)Notes
12v802.3at Type II802.3at Type II802.3at Type IIMaximum of 100W distributed across all ports
24v802.3at Type II802.3at Type II802.3at Type IIMaximum of 200W distributed across all ports
36-48v802.3at Type II802.3at Type II802.3at Type IIMaximum of 275W distributed across all ports
NotesCombined power <30W

8.4 - Appendix D: Expansion Port Pinouts

Detailed pinout tables for various expansion slots are provided below.

8.4.1 - M.2 B-key Pinout

PinFunctionFunctionPin
1CONFIG_33.3V2
3GND3.3V4
5GNDFULL_CARD_POWER_OFF#6
7USB 2.0 D+W_DISABLE1#8
9USB 2.0 D-NC10
11GNDKEY12
13KEYKEY14
15KEYKEY16
17KEYKEY18
19KEYNC20
21CONFIG_0NC22
23NCNC24
25NCGPIO_10/W_DISABLE2#26
27GNDNC28
29PERn1/USB3.1-Rx-UIM-RESET30
31PERp1/USB3.1-Rx+UIM_CLK32
33GNDUIM_DATA34
35PETn1/USB3.1-Tx-UIM_PWR36
37PETp1/USB3.1-Tx+NC38
39GNDNC40
41PERn0/SATA-B+NC42
43PERp0/SATA-B-NC44
45GNDNC46
47PETn0/SATA-A-NC48
49PETp0/SATA-A+PERST#50
51GNDCLKREQ#52
53REFCLKnPEWAKE#54
55REFCLKpNC56
57GNDNC58
59NCNC60
61NCNC62
63NCNC64
65NCSIM_DETECT66
67RESET_NSUSCLK68
69CONFIG_13.3V70
71GND3.3V72
73GND3.3V74

8.4.2 - M.2 M-key Pinout

PinFunctionFunctionPin
1GND3.3 V2
3GND3.3 V4
5PERn3NC6
7PERp3NC8
9GNDDAS/DSS (I/O)/LED_1# (I)(0/3.3V)10
11PETn33.3 V12
13PETp33.3 V14
15GND3.3 V16
17PERn23.3 V18
19PERp2NC20
21GNDNC22
23PETn2NC24
25PETp2NC26
27GNDNC28
29PERn1NC30
31PERp1NC32
33GNDNC34
35PETn1NC36
37PETp1DEVSLP (O)38
39GNDSMB_CLK (I/O)(0/1.8V)40
41PERn0/SATA-B+SMB_DATA (I/O) (0/1.8V)42
43PERp0/SATA-B-ALERT# (I) (0/1.8V)44
45GNDNC46
47PETn0/SATA-A-NC48
49PETp0/SATA-A+PERST# (O)(0/3.3V) or NC50
51GNDCLKREQ# (I/O)(0/3.3V) or NC52
53REFCLKnPEWAKE# (I/O)(0/3.3V) or NC54
55REFCLKpNC56
57GNDNC58
59KEYKEY60
61KEYKEY62
63KEYKEY64
65KEYKEY66
67NCSUSCLK(32kHz) (O)(0/3.3V)68
69PEDET (NC-PCIe/GND-SATA)3.3 V70
71GND3.3 V72
73GND3.3 V74

8.4.3 - M.2 E-key Pinout

PinFunctionFunctionPin
1GND3.3 V2
3USB_D+3.3 V4
5USB_D-NC6
7GNDPCM_CLK8
9RESERVEDCNV_RF_RESET#_R10
11RESERVEDBT_PCMIN12
13GNDBT_PCMOUT14
15RESERVEDNC16
17RESERVEDGND18
19GNDNC20
21RESERVEDRESERVED22
23RESERVEDKEY24
25KEYKEY26
27KEYKEY28
29KEYKEY30
31KEYRESERVED32
33GNDRESERVED34
35PETp0RESERVED36
37PETn0RESERVED38
39GNDRESERVED40
41PERp0RESERVED42
43PERn0RESERVED44
45GNDRESERVED46
47REFCLKp0RESERVED48
49REFCLKn0SUSCLK(32kHz)50
51GNDPERST0#52
53CLKREQ0#W_DISABLE2#54
55PEWAKE0#W_DISABLE1#56
57GNDNC58
59RESERVEDNC60
61RESERVEDNC62
63GNDRESERVED64
65RESERVEDNC66
67RESERVEDNC68
69GNDNC70
71RESERVED3.3V72
73RESERVED3.3V74
75GND

8.4.4 - mPCIe Pinout

PinFunctionFunctionPin
1WAKE#3.3V2
3NCGND4
5NC1.5V6
7CLKREQ#UIM_PWR8
9GNDUIM_DATA10
11REFCLK-UIM_CLK12
13REFCLK+UIM_RESET14
15GNDUIM_SPU16
17KEYKEY18
19NCGND20
21GNDW_DISABLE1#22
23PERn0PERST#24
25PERp03.3V26
27GNDGND28
29GND1.5V30
31PETn0SMB_CLK32
33PETp0SMB_DATA34
35GNDGND36
37GNDUSB 2.0_D-38
393.3VUSB 2.0_D+40
413.3VGND42
43GNDNC44
45NCNC46
47NC1.5V48
49NCGND50
51W_DISABLE2#3.3V52

8.5 - Appendix D: Errata

Linux requires Kernel 5.16 or higher to operate as expected.

8.6 - Appendix E: Compliance Information

Do not open or modify the device. The device uses components that comply with FCC and CE regulations. Modification of the device may void these certifications.

8.6.1 - Safe use and installation instructions

  1. Install the device securely. Be careful handling the device to prevent injury and do not drop.
  2. Equipment is intended for installation in Restricted Access Area.
  3. To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.
  4. Wall or ceiling mounting device requires use of a mounting plate or bracket. The plate or bracket must be of metal construction and have a minimum thickness of 1mm.
  5. Use M4x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
  6. Safe operating temperature and non-condensing humidity ratings must be adhered to; please refer to the specifications table for safe operating temperature and humidity ratings.
  7. Safe Storage temperature must be adhered to; please refer to the specifications table for safe storage temperature ratings.
  8. Keep the device away from liquids and flammable materials.
  9. Do not clean the device with liquids. The chassis can be cleaned with a cloth.
  10. Allow at least 2 inches of space around all sides of the device for proper cooling. If the device is mounted to a vertical surface then recommended device orientation is so that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.
  11. This device is intended for indoor operation only.
  12. Use UL Listed external power supply with rated output 24-36Vdc.
  13. Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.
  14. Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.
  15. Install the device only with shielded network cables.
  16. Only use SAE approved cables for automotive installation.
  17. The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics devices in vehicles.
  18. The device should not be installed in the driver's area of a vehicle.
  19. The device should be mounted in accordance with accepted aftermarket practices and materials for vehicle installation.
  20. Only use UL Listed connectors for connection to automotive fuse panels.
  21. Radio device is not intended for emergency service use.
  22. Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.
  23. Proper disposal of CMOS battery must comply with local governance.
  24. Product must only be connected to a certified router, switch or similar network equipment.
  25. Product is intended for indoor use only.
  26. Product cannot be connected to the public network.

⚠️ WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.

8.6.2 - Précautions et guide d'installation

Do not open or modify the device. The device uses components compliant with FCC and EC regulations. Modification may void certifications.

  1. Install the device securely. Handle with care to avoid injury and do not drop.
  2. Equipment is intended for installation in a restricted access area.
  3. To protect against excessive RF exposure, maintain at least 20 cm from users and RF antennas. Use only provided dual band antennas with 2dBi/2dBi gain.
  4. Wall or ceiling mounting requires a metal mounting plate or bracket with a minimum thickness of 1mm.
  5. Use M4x0.5mm flat head screws to attach mounting plates/brackets to threaded holes on the chassis bottom or rear. Screw length should be a minimum of 4mm, adding 1mm for every 1mm of plate/bracket thickness beyond 1.5mm.
  6. Operating ambient temperature must be between 0°C and 45°C, with non-condensing relative humidity of 10-90%.
  7. The device can be stored at temperatures between -10°C and 85°C.
  8. Keep the device away from liquids and flammable materials.
  9. Do not clean the device with liquids. The chassis can be cleaned with a cloth.
  10. Allow at least 2 inches of space around all sides for proper cooling. For vertical mounting, orient the device so heatsink fins allow unobstructed upward airflow. Alternative orientations may reduce the operational temperature range.

8.6.3 Safety Use and Installation Instructions

(Chinese text follows)

請勿打開或修改設備。該設備使用符合FCC和CE法規的組件。修改設備可能會使這些認證無效。

  1. 牢固地安裝設備。小心處理設備以防止受傷,不要跌落。
  2. 設備旨在安裝在受限訪問區域。
  3. 為防止過度暴露於射頻,請與任何用戶和射頻天線保持至少20厘米的距離。僅使用提供的 2dBi/2dBi 增益的雙頻天線。
  4. 牆壁或天花板安裝設備需要使用安裝板或支架。板或支架必須是金屬結構,並且最小厚度為1毫米。
  5. 使用 M4x0.5mm 平頭螺釘將安裝板或安裝支架連接到機箱底部或後部的螺紋孔。螺釘的最小長度應為 4毫米。超過1.5mm 的板或支架每增加1mm 的厚度,就增加1mm 的螺釘長度。
  6. 環境工作溫度必須在0℃ 至 45 °C 之間,非冷凝相對濕度為10-90%。
  7. 該設備可在-10 °C 至 85 °C 的溫度下儲存。
  8. 使設備遠離液體和易燃材料。
  9. 請勿使用液體清潔設備。機箱可以用布清潔。
  10. 在設備四周留出至少2英寸的空間,以便適當冷卻。如果設備安裝在垂直表面上,則推薦的設備方向 是散熱片允許空氣暢通無阻地上升。替代方向可能會導致工作溫度範圍減小。

8.6.4 Warnings

(Chinese and English text follows)

警告:為避免電磁干擾,本產品不應安裝或使用於住宅環境

Warning: To avoid electromagnetic interference, this product should not be installed or used in a residential environment


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OnLogic-K800-Manual-v7

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