Abstract
The CC2564MODNEM is a low-cost evaluation board for TI's CC2564MODN device. It is designed to plug into TI hardware development kits like MSP430 or TM4C microcontroller platforms, creating a complete evaluation platform. This guide helps users quickly get started with the CC2564MODNEM board and integrate it with multiple platforms for prototyping Bluetooth applications. The CC2564MODN device is a complete Bluetooth BR/EDR/LE HCI solution based on TI's CC2564B dual-mode Bluetooth single-chip device, reducing design effort and enabling fast time to market. It includes TI's seventh-generation Bluetooth core, is Bluetooth 4.1 compliant, and offers best-in-class RF performance with a transmit power and receive sensitivity providing approximately twice the range compared to other Bluetooth Low Energy-only solutions.
1 Introduction
The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes. For a complete evaluation solution, the CC2564MODNEM board plugs directly into the following TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, DK-TM4C129X, and other MCUs. A certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for MSP430™ and TM4C12x MCUs. The CC2564MODNEM hardware design files (schematics, layout, and bill of materials [BOM]) are provided as a reference to aid in the implementation of the CC2564MODN device.
2 Features
- Features a CC2564MODN device (MOE package)
- Supports Bluetooth Specification v4.1
- Supports dual-mode – Bluetooth + Bluetooth low energy
- Offers class 1.5 transmit power (+10 dBm)
- Offers high sensitivity (–93 dBm typical)
- Offers a 32.768-kHz oscillator
- Offers a UART interface for control and data
- Offers a PCM/I2S interface for voice and audio
- Offers 4-layer PCB design
- Offers a 1.8 LDO (LP2985-18)
- Offers three voltage level translators (SN74AVC4T774)
- Offers a chip antenna (LTA-5320-2G4S3-A1)
- Offers a RF connector (U.FL-R-SMT-1)
- Offers EM connectors that plug directly into TI hardware development kits (MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, DK-TM4C129X, Other MCU)
- Offers COM connectors that plug directly into TI hardware development kits
- Features Certified and royalty-free TI dual-mode Bluetooth stack (TIBLUETOOTHSTACK-SDK) for MSP430™ (CC256XMSPBTBLESW), TM4C (CC256XM4BTBLESW), and Other MCUs (CC256XSTBTBLESW).
3 CC2564MODNEM Board Applications
Example embedded wireless applications include:
- Cable replacement
- Printer adapters
- Personal digital assistants (PDAs)
- Printers and scanners
- Computers and peripherals
- Wireless sensors
- Industrial control applications
- Low-power medical
4 Introduction to CC2564MODNEM Board
This user's guide is intended for use with TI's Bluetooth development platform, the CC2564MODNEM board. It helps users quickly get started with the board and integrate it with TI's evaluation platforms and software SDKs. The guide describes the board's components and configurations, providing information about the module to apply board specifics to your application. Module information and capabilities, including pin descriptions, available software, and tools, enhance the out-of-box experience.
Figure 4-1. CC2564MODNEM Board
This figure shows a photograph of the CC2564MODNEM evaluation board, a compact printed circuit board (PCB) featuring the CC2564MODN module, a chip antenna, various connectors (EM, COM, debug header), jumpers, and other electronic components.
5 Kit Contents
- One CC2564MODNEM board with TI dual-mode Bluetooth CC2564 module
- One block jumper for MSP-EXP430F5438 board
- Four jumpers for MSP-EXP430F5529 board
6 Requirements
Hardware
- One MSP430 experimenter board (sold separately): MSP-EXP430F5529 board or MSP-EXP430F5438 board
- One TM4C Development Kit (sold separately): DK-TM4C123G Development Kit or DK-TM4C129X Development Kit
Software
- TI dual-mode Bluetooth stack: CC256XMSPBTBLESW (for MSP430 MCUs), CC256XM4BTBLESW (for TM4C MCUs), CC256XSTBTBLESW (for Other MCUs like STM32F4)
Tools
- TI dual-mode Bluetooth Service Pack for CC256x (optional)
- CC256x Bluetooth Hardware Evaluation Tool (optional)
- IDE Versions – Platform Dependent: Code Composer Studio (CCS), IAR 7.2/7.3 for ARM, Keil µVision 4.70.0.0
Hardware Setup Examples
Figure 6-1. MSP430 Hardware Setup Examples
This figure illustrates hardware setup examples using the CC2564MODNEM board with MSP430 development kits, showing the CC2564MODNEM board connected to MSP-EXP430F5529 and MSP-EXP430F5438 boards.
Figure 6-2. TM4C Hardware Setup Examples
This figure illustrates hardware setup examples using the CC2564MODNEM board with TM4C development kits, showing the CC2564MODNEM board connected to DK-TM4C123G and DK-TM4C129X boards.
Figure 6-3. Other MCU Hardware Setup Examples
This figure illustrates hardware setup examples using the CC2564MODNEM board with other MCU platforms, showing connections to STM3240G-EVAL Board and CC256X-STADAPT, and STM32F4 DISCOVERY Board and CC256X-STADAPT.
7 Overview
The CC2564MODNEM board serves as the development environment for the CC2564MODN module, plugging directly into TI's MSP430 and TM4C experimenter boards via EM connectors for simplified prototype wiring and field trials. This module utilizes TI's CC2564B device and a host controller interface (HCI), offering a cost-effective and flexible way to implement a Bluetooth network. The HCI architecture reduces Bill of Materials (BOM) cost by allowing designers to choose a controller and eliminating redundant processing capacity, with the Bluetooth stack residing and executing on the host processor. The CC2564MODNEM board features two connectors: EM and COM. The EM connector's I/Os operate at 3.3V (default configuration), while the COM connector's I/Os operate at 1.8V and may require hardware modification. TI provides this board for evaluation purposes and to work with TI's Hardware Development Kit. Schematic and layout files for this reference design are available on the CC2564MODN product page.
Figure 7-1. CC2564MODNEM Board Front Overview
This figure displays the front of the CC2564MODNEM evaluation board, highlighting key components with labels: CC2564MODN module, Chip Antenna, 32.768 kHz Oscillator, Debug Header, COM Connector, and Power Jumpers. It also shows the EM connector and other board components.
Figure 7-2. CC2564MODNEM Board Back Connectors
This figure shows the back of the CC2564MODNEM evaluation board, clearly indicating the locations of the EM Connectors and the COM Connector.
8 Hardware Description
8.1 Overview
Figure 8-1 presents a high-level block diagram of the CC2564MODNEM board. The board's default clock is an oscillator with a frequency accuracy of 32.768 kHz ±250 ppm. Signals from the dual-mode Bluetooth CC2564 module include UART, PCM, nSHUTD, and slow clock. The CC2564MODNEM board has three connectors: EM (default), COM, and a debug header. Power can be supplied to the CC2564MODN via VBAT_EDGE or VBAT_MCU. The EM connector signals are managed by level shifters. The hardware can be configured to use the slow clock from the connectors. The debug header is available for testing. The EM connector I/Os operate at 3.3V, while the COM connector and debug header I/Os operate at 1.8V and may require hardware modification.
Figure 8-1. CC2564MODNEM Block Diagram
This block diagram illustrates the CC2564MODNEM board's architecture. It shows the CC2564MODN module connected to an EM Connector and a COM Connector via Level Shifters. Signals like UART, PCM, nSHUTD, and Slow Clock are depicted. An Oscillator (32.768-kHz) provides the slow clock. Power is supplied via VBAT_MCU and VBAT_EDGE, regulated by an LDO to VDD_IO. The diagram also shows the Antenna and U.FL connector for RF interface, and a Debug Header.
8.2 Connectors
8.2.1 The EM Connector
The EM connectors are designed to interface with various TI MCU platforms, including the MSP430 (MSP-EXP430F5529 and MSP-EXP430F5438) and TM4C (DK-TM4C123G and DK-TM4C129X). The EM connector I/Os operate at 3.3V. The pin assignments listed are for the CC2564MODN side; for instance, MODULE_UART_RX on the CC2564MODN connects to the UART TX pin on the MCU. Figure 7-2 shows the EM connector on the board, and Table 8-1 details the standard pinout.
| Pin Number | EM Adaptor Assignment | Pin Number | EM Adaptor Assignment |
|---|---|---|---|
| 1 | GND | 2 | N/C |
| 3 | MODULE_UART_CTS | 4 | N/C |
| 5 | SLOW_CLK | 6 | N/C |
| 7 | MODULE_UART_RX | 8 | N/C |
| 9 | MODULE_UART_TX | 10 | N/C |
| Pin Number | EM Adaptor Assignment | Pin Number | EM Adaptor Assignment |
|---|---|---|---|
| 11 | N/C | 12 | N/C |
| 13 | N/C | 14 | N/C |
| 15 | N/C | 16 | N/C |
| 17 | N/C | 18 | N/C |
| 19 | GND | 20 | N/C |
| Pin Number | EM Adaptor Assignment | Pin Number | EM Adaptor Assignment |
|---|---|---|---|
| 1 | N/C | 2 | GND |
| 3 | N/C | 4 | N/C |
| 5 | 3.3V | 6 | N/C |
| 7 | 3.3V | 8 | MODULE_AUDIO_DATA_OUT |
| 9 | 3.3V | 10 | MODULE_AUDIO_DATA_IN |
| 11 | MODULE_AUDIO_FSINK | 12 | N/C |
| 13 | N/C | 14 | N/C |
| 15 | N/C | 16 | N/C |
| 17 | MODULE_AUDIO_CLK | 18 | MODULE_UART_RTS |
| 19 | nSHUTD | 20 | N/C |
8.2.2 The COM Connector
The COM connector interfaces with TI's MPU platforms, such as the AM335x evaluation module (TMDXEVM3358). The I/Os for the COM connector are at 1.8V. Some components may need to be not installed (DNI) to use the COM connector. Refer to Section 8.3 for more details. Table 8-3 provides the pinout for the COM connector.
| Pin Number | Relevant COM Connector Pin Assignment | Pin Number | Relevant COM Connector Pin Assignment |
|---|---|---|---|
| 1 | SLOW_CLK_EDGE | 8 | 1V8_IN |
| 52 | AUD_CLK_1V8 | 54 | AUD_FSYNC_1V8 |
| 56 | AUD_IN_1V8 | 58 | AUD_OUT_1V8 |
| 66 | HCI_TX_1V8 | 68 | HCI_RX_1V8 |
| 70 | HCI_CTS_1V8 | 72 | HCI_RTS_1V8 |
| 76 | TX_DEBUG_1V8 | 89 | nSHUTDOWN_1V8 |
| 3, 9, 19, 37, 47, 63, 77, 83, 87, 95, 97 | GND | 2, 6, 18, 22, 42, 60, 64, 92 | GND |
| (1) All other pins are N/C. | |||
8.2.3 Debug Header
The debug header provides access to important signals for testing and debugging, including power, ground, debug, UART, and audio signals. The I/Os are at 1.8V. Table 8-4 lists the physical location of the pin numbers.
| Pin Number | EM Adapter Pin Assignment | Pin Number | EM Adapter Pin Assignment |
|---|---|---|---|
| 1 | GND | 2 | VBAT |
| 3 | VIO_HOST | 4 | GND |
| 5 | AUD_FSYNC_1V8 | 6 | AUD_CLK_1V8 |
| 7 | AUD_OUT_1V8 | 8 | AUD_IN_1V8 |
| 9 | CLK_REQ_OUT_1V8 | 10 | SLOW_CLK_EDGE |
| 11 | HCI_TX_1V8 | 12 | HCI_RX_1V8 |
| 13 | HCI_CTS_1V8 | 14 | HCI_RTS_1V8 |
| 15 | TX_DEBUG_1V8 | 16 | nSHUTDOWN_1V8 |
| 17 | VDD_1V8 | 18 | GND |
8.3 Board Configurations
8.3.1 Power Supplies Configuration
The CC2564MODN device requires two main power sources: VDD_IN for the module's main power supply and VDD_IO for the 1.8-V I/O ring. The HCI module includes on-chip voltage regulators for enhanced noise immunity and can be connected directly to a battery.
8.3.1.1 Jumper Configuration
The CC2564MODNEM board features four jumpers for controlling power. Power can be supplied via the COM or EM connector using the VBAT_MCU or VBAT_EDGE jumpers, respectively. VBAT_EDGE and VBAT_MCU supply power to the entire board. VDD_1V8 is used for power supply to pins going in and out of the module, while VBAT_CC is the main default power supply for the CC2564. Jumpers must be placed correctly to power the device.
| Jumper | Description |
|---|---|
| VDD_1V8 (J1) | Supplies power to CC2564 I/Os |
| VBAT_CC (J2) | Main power supply for CC2564 |
| VBAT_EDGE (J3) | Enable power supply through the COM connector |
| VBAT_MCU (J4) | Enable power supply through EM connectors |
Figure 8-2. Jumper Configuration
This figure shows the default jumper settings on the CC2564MODNEM board, illustrating the placement of the VDD_1V8, VBAT_CC, VBAT_MCU, and VBAT_EDGE jumpers.
8.3.1.2 Measuring Current Consumption
Current consumption can be measured by placing current sense resistors (R10 for VBAT_CC and R7 for VDD_1V8, both 0.10 Ω, 1/4 W) on the board. The VBAT_CC jumper (J2) measures power consumed by the CC2564 (including RF TX and RF RX), while the VDD_1V8 jumper (J1) measures power consumed by the digital VDD_IO.
8.3.2 RF Interface
The board allows routing the RF output from the CC2564MODN to either the on-board chip antenna or the on-board U.FL connector. This is achieved by placing a 0 Ω resistor at either R29 (for chip antenna) or R30 (for U.FL connector). The U.FL connector is intended for testing. The Bluetooth Hardware Evaluation Tool (BHET) can be used to test the basic RF functionality of this board.
Figure 8-3. Jumper Configuration
This figure illustrates the RF interface jumper configuration, showing the CC2564MODN module connected to the Antenna or the RF Interface (U.FL) connector.
8.3.3 Slow Clock
8.3.3.1 Clock Inputs
The slow clock can be sourced internally or externally. The CC2564MODNEM allows the slow clock to be placed on the board (default) or sourced externally. The CC2564MODN connects to SLOW_CLK_IN, which accepts a digital signal between 0V and 1.8V. For Bluetooth use, the slow clock frequency accuracy must be 32.768 kHz ±250 ppm, as per the Bluetooth specification.
Figure 8-4. Clock Input
This diagram depicts the clock input options for the CC2564MODN. It shows the EM Connector and COM Connector providing a Slow Clock signal, which passes through Level Shifters, to the CC2564MODN's SLOW_CLK_IN. The internal 32.768-kHz Oscillator is also shown as a default source for the slow clock.
8.3.4 UART Configuration
The UART for the CC2564MODNEM board can be routed to the EM or COM connector, and signals are also available at the debug header for probing. Figure 8-5 shows the EM connector as the default UART configuration, with a dotted line indicating the COM connector is not connected. To configure the COM connector for UART, the U3 level shifter must be removed or unpopulated, as illustrated in Figure 8-6.
Figure 8-5. UART Default Configuration
This diagram shows the default UART configuration where the EM Connector is connected to the CC2564MODN via Level Shifters, and the COM Connector is not connected.
Figure 8-6. UART COM Connector Configuration
This diagram illustrates the UART configuration for the COM Connector. It shows the EM Connector and COM Connector both connected to the CC2564MODN via Level Shifters, implying the COM connector is now active for UART communication.
8.3.5 PCM Configuration
For voice and assisted audio features, PCM signals from the CC2564MODN (master) must connect to an external audio host (slave). The CC2564MODN board provides the FSYNC and slow clock signals to the codec. PCM configuration is required for HFP, HSP, and A3DP profiles. Two configurations are available for the EM and COM connectors; Figure 8-7 shows the default configuration.
Figure 8-7. PCM Connector Configuration
This diagram illustrates the PCM connector configuration. It shows the EM Connector and COM Connector both providing PCM signals, passing through Level Shifters, to the CC2564MODN. The default configuration is indicated.
8.3.5.1 EM Configuration
The EM connector allows configuring the CC2564MODN as either master or slave. The default configuration is master mode via the EM connectors. To configure the module as a slave for PCM direction, connect resistor R18 and remove resistor R19 on the U4 level shifter (refer to Figure 8-8 for resistor positions). To enable audio features, resistor R11 on the U4 level shifter must be disconnected (DNI) (refer to Figure 8-9 for resistor positions).
Figure 8-8. Resistors to Change the Direction of PCM
This figure shows a close-up view of the PCB, highlighting the locations of resistors R18 and R19 on the U4 level shifter, which are used to change the PCM signal direction for configuring the CC2564MODN as a slave.
Figure 8-9. R11 DNI to Enable Audio Features
This figure shows a close-up view of the PCB, highlighting the location of resistor R11 on the U4 level shifter. Disconnecting (DNI) this resistor enables audio features.
8.3.5.2 COM Configuration
To configure the COM connector, pull the resistors connected to U4 high to switch the direction on the level shifter. The signal in the COM connector can be configured to run in either direction without changing board components.
9 Software Tools
9.1 TI Dual-Mode Bluetooth Stack
TI's dual-mode Bluetooth stack supports Bluetooth + Bluetooth low energy, implementing the Bluetooth 4.0 specification with single-mode and dual-mode offerings. It provides simple command-line sample applications to accelerate development. The stack is compatible with MSP430 MCUs with at least 128KB flash and 8KB RAM (CC256XMSPBTBLESW), TM4C MCUs with at least 128KB flash (CC256XM4BTBLESW), and other MCUs (CC256XSTBTBLESW). For detailed documentation, refer to the Bluetooth Demo APPS page.
9.2 TI Dual-Mode Bluetooth Service Pack for CC256x
The CC256x Bluetooth Service Packs (SP) are essential initialization scripts containing bug fixes and platform-specific configurations. These scripts must be loaded into the CC256x device after every power cycle. SPs are delivered as Bluetooth Script (BTS) files, which are scripted binary files containing embedded HCI commands and events.
9.3 Bluetooth Hardware Evaluation Tool
The CC256x Bluetooth Hardware Evaluation Tool is a downloadable, comprehensive package from TI. It is an intuitive, user-friendly tool designed to test TI's Bluetooth chips, including the CC256xQFNEM board. This tool evaluates RF performance and allows modification of the service packs for Bluetooth chips.
10 Manual Information to the End User
OEM integrators must refrain from providing end-users with instructions on installing or removing this RF module in their end product's manual. The end-user manual must include all required regulatory information and warnings as presented in this guide.
10.1 RF Function
The CC2564MODN is a dual-mode Bluetooth HCI module. The maximum RF power transmitted in each band is 10 dBm.
10.2 FCC or IC Certification and Statement
This device is intended for OEM integrators under specific conditions: the antenna must be installed at least 20 cm from users, the transmitter module cannot be co-located with other transmitters or antennas, and the maximum antenna gain (including cable loss) must not exceed -1.69 dBi to comply with FCC/IC regulations on RF output power and human exposure. If these conditions cannot be met, the FCC/IC authorization is invalid, and the FCC/IC ID cannot be used on the final product. The OEM integrator is then responsible for re-evaluating the end product and obtaining separate authorization.
FCC Note: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions: This device may not cause harmful interference, and it must accept any interference received, including interference that may cause undesired operation.
CAUTION FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits for an uncontrolled environment and should be installed and operated with a minimum 20 cm separation between the radiator and the user's body. This equipment has been tested and found to comply with Class B digital device limits per Part 15 of FCC rules, designed to provide reasonable protection against harmful interference in residential installations. If interference occurs, users are encouraged to reorient/relocate the antenna, increase separation, connect to a different circuit, or consult a dealer/technician.
10.2.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement
The TI CC2564MODA module is certified for IC as a single-modular transmitter, meeting IC modular approval and labeling requirements, following similar FCC testing and rules. Note: This device complies with Industry Canada license-exempt RSS standards. (French: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.) Operation is subject to conditions: the device may not cause interference, and it must accept any interference. (French: L'exploitation est autorisée aux conditions suivantes: L'appareil ne doit pas produire de brouillage. L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.)
CAUTION IC RF Radiation Exposure Statement: This equipment complies with IC radiation exposure limits for an uncontrolled environment and should be installed and operated with a minimum 20 cm separation between the radiator and the user's body. (French: Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.)
This radio transmitter (4511-2564N) is approved by Industry Canada to operate with antenna types listed in the Antenna Specifications section with maximum permissible gain. Antenna types not on this list or with higher gain are strictly prohibited. Antennas verified in compliance testing must be used; separate approval is needed for other configurations.
10.2.3 Anatel Certification Label
Figure 10-1. Anatel Certification Label
This figure shows the Anatel certification label for the CC2564MODN, displaying the number 05418-19-09891.
10.2.4 End Product Labeling
For FCC compliance, the host system using this module must display a label stating: Contains FCC ID: Z64-2564N. For IC compliance, the host system must display: Contains IC: 4511-2564N.
10.2.5 Device Classifications
Module integrators must follow guidelines for device classification and simultaneous transmission, seeking advice from regulatory test labs for specific impacts on device compliance. Integrators must determine the minimum required distance between the host device and the user's body. Note: These classifications are guidelines; adherence may not satisfy regulatory requirements due to near-body design details. Your test lab can assist in determining the appropriate category and necessary submissions. Note: Modular approval is granted for mobile applications. Portable applications may require further RF exposure (SAR) evaluations. Host and module combinations may also need FCC Part 15 testing.
10.2.6 FCC Definitions
Portable: (§2.1093) A transmitting device designed for use where its radiating structure(s) is/are within 20 cm of the user's body.
Mobile: (§2.1091) (b) A transmitting device designed for use in non-fixed locations, typically maintaining at least 20 cm separation between its radiating structure(s) and the user's body or nearby persons. For modular or desktop transmitters, applicants must determine minimum distances for compliance based on SAR, field strength, or power density.
10.2.7 Simultaneous Transmission Evaluation
This module has not been evaluated or approved for simultaneous transmission due to the impossibility of determining all potential multi-transmission scenarios. Any simultaneous transmission condition established through module integration must be evaluated per KDB447498D01(8) and KDB616217D01,D03 requirements. These include: Transmitters and modules certified for mobile or portable exposure conditions can be used in mobile host devices without further testing if the closest separation among all simultaneous transmitting antennas is greater than 20 cm. Alternatively, if antenna separation and MPE compliance requirements for all simultaneous transmitting antennas are specified in the application filing of at least one certified transmitter, and if portable transmitters are used in a mobile host device, antennas must be greater than 5 cm from other simultaneous transmitting antennas. All antennas in the final product must be at least 20 cm from users and nearby persons.
10.3 EU Certification and Statement
10.3.1 RF Exposure Information (MPE)
This device has been tested and meets applicable Radio Frequency (RF) exposure limits. To comply with RF exposure requirements, this module must be installed in a host platform intended for operation with a minimum 20-cm separation distance to the user.
10.3.2 Simplified DoC Statement
10.3.2.1 CC2564MODN Module
Texas Instruments declares that the radio equipment type CC2564MODN complies with Directive 2014/53/EU. The full text of the EU declaration of conformity is available online.
10.3.2.2 CC2564MODNEM
Texas Instruments declares that the radio equipment type CC2564MODNEM complies with Directive 2014/53/EU. The full text of the EU declaration of conformity is available online.
10.3.3 Waste Electrical and Electronic Equipment (WEEE)
The WEEE symbol indicates that, according to local laws and regulations, your product or battery must be disposed of separately from household waste. At the end of its life, take the product to a designated collection point. Proper recycling protects human health and the environment.
10.3.4 OEM and Host Manufacturer Responsibilities
OEM and Host manufacturers are ultimately responsible for the compliance of the host and module. The final product must be reassessed against essential requirements of the RED before being placed on the EU market, including reassessing the transmitter module for Radio and EMF requirements. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment.
10.3.5 Antenna Specifications
In all cases, the final product assessment must meet the essential requirements of the RE Directive Article 3.1(a) and (b), safety, and EMC. The LTA-5320-2G4S3-A1 (-1.31 dBi) antenna was verified in conformity testing; it shall not be modified for compliance. Separate approval is required for other operating configurations or antenna types. If any other simultaneous transmission radio is installed, or if restrictions are not met, a separate RF exposure assessment and CE equipment certification is required.
11 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
- Changes from August 20, 2014 to August 31, 2021 (from Revision * (Aug 2014) to Revision A (Aug 2021)): Updated formatting and organization to match current TI standards (Page 0). Added Section 10 through Section 10.3.5 (Page 18).
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