User Manual for Fn-Link models including: 3161A-SL Wi-Fi Single-band, Wi-Fi Single-band, Single-band, SDIO

WMDM-110G

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User manual

HUNAN FN-LINK TECHNOLOGY LIMITED 3161ASL WIFI Module 3161A-SL 2AATL3161ASL 2AATL3161ASL 3161asl


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3161A-SL
Wi-Fi Single-band 1X1 802.11b/g/n SDIO Module Datasheet

FN-LINK TECHNOLOGY LIMITED

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3161A-SL Module Datasheet
Office: 6 Floor, Building U6, Junxiang U8 Park, Hangcheng Avenue, Bao'an District, Shenzhen City, CHINA
Factory: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA TEL: +86-755-2955-8186 Website: www.fn-link.com

Customer Approval :

Company Title Signature Date Fn-Link

FN-LINK TECHNOLOGY LIMITED

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Revision History

Version 1.0 1.1

Date 2020/04/22 2020/05/30

Revision Content New version Add 1line sdio application

3161A-SL

Draft Lxy Lxy

Approved Szs Szs

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CONTENTS

3161A-SL

1 Overview....................................................................................................................................1 1.1 Introduction......................................................................................................................... 1 1.2 Features.............................................................................................................................. 1 1.3 General Specification........................................................................................................ 2 1.4 Recommended Operating Rating....................................................................................2
2 Wi-Fi RF Specification........................................................................................................... 3 2.1 2.4GHz RF Specification.................................................................................................. 3
3 Pin Assignments..................................................................................................................... 3 3.1 Pin Outline...........................................................................................................................4 3.2 Pin Definition.......................................................................................................................5
4 Dimensions...............................................................................................................................7 4.1 Module Picture................................................................................................................... 7 4.2 Marking Description...........................................................................................................7 4.3 Module Physical Dimensions........................................................................................... 8 4.4 Layout Recommendation..................................................................................................8
5 Host Interface Timing Diagram......................................................................................... 10 5.1 SDIO Pin Description...................................................................................................... 10 5.2 SDIO CLK Timing Diagram............................................................................................ 10
6 Reference Design................................................................................................................. 19 6.1 Low Power Dissipation Reference Design.................................................................. 19 6.2 Normal Power dissipation Reference Design............................................................. 20
7 Ordering Information........................................................................................................... 21 8 The Key Material List........................................................................................................... 21 9 Power on Sequence............................................................................................................. 22 10 Design Attention................................................................................................................. 22 11 Recommended Reflow Profile.........................................................................................22 12 Packing Information...........................................................................................................23
12.1 Reel................................................................................................................................. 23 12.2 Carrier Tape Detail........................................................................................................ 24 12.3 Packaging Detail............................................................................................................24 12.4 Moisture sensitivity........................................................................................................ 25

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3161A-SL
1 Overview
1.1 Introduction
3161A-SL is a highly integrated 2.4 GHz Wi-Fi module that support the IEEE 802.11b/g/n baseband and RF circuit. It supports 20 MHz standard bandwidth and 5 MHz/10 MHz narrow bandwidth, and provides a physical layer rate up to 72.2 Mbit/s. Wi-Fi baseband supports the orthogonal frequency division multiplexing (OFDM) technology and is backward compatible with the direct sequence spread spectrum (DSSS) and complementary code keying (CCK) technologies, offering various data rates defined in the IEEE 802.11 b/g/n protocol. Module chipset integrates a high-performance 32-bit microprocessor, a hardware security engine, and various peripheral interfaces, including the SPI, UART, I2C, PWM, GPIO, and multi-channel ADC. In addition, it provides high-speed SDIO2.0 slave interfaces, with clock frequency up to 50 MHz. Its built-in SRAM and flash can operate independently and even programming is allowed on the flash.
Block Diagram:

1.2 Features
 Operate at ISM frequency bands (2.4GHz)

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3161A-SL

 Maximum rate of 72.2 Mbit/s@HT20 MCS7  SDIO interface for Wi-Fi  Low power dissipation  High transmitting power  High receiving sensitivity  PHY supporting IEEE 802.11b/g/n  MAC supporting IEEE802.11 d/e/h/i/k/v/w  Module integrated 32K clock  WFA WPA, WFA WPA2 personal, and WPS2.0 for Wi-Fi  Built-in 352 KB SRAM and 288 KB ROM  Main chipset Built-in 32bit MCU and 2 MB flash memory
1.3 General Specification

Model Name Product Description Dimension Wi-Fi Interface Ambient temperature Storage temperature
RoHS

3161A-SL Support Wi-Fi functionality L x W x H: 12 x 12 x2.3 (typical) mm Support SDIO -40°C to 85°C -40°C to 85°C All hardware components are fully compliant with EU RoHS directive

1.4 Recommended Operating Rating

Ambient temperature VCC
VDDIO
Sleep Mode TX Test mode Power Consumption (2.4G HT20@17dbm) RX Test mode (2.4G HT20) Note: Suggested power input range in 3.3V.

Min.
-40 2.3
-

Typ.

Max. Unit

25

85 deg.C

3.3

3.6

V

1.8V/3.3V -

V

VCC = 3.3V(Unit:mA)

5uA

288

53

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3161A-SL

2 Wi-Fi RF Specification

2.1 2.4GHz RF Specification

Feature

Description

WLAN Standard

IEEE 802.11 b/g/n Wi-Fi compliant

Frequency Range

2.4002.4835GHz

Wi-Fi:

Number of Channels

US: channel 1~11; EU: channel 1~13;

Japan: channel 1~14;

Spectrum Mask

Min. b/g/n Typ. b/g/n Max. b/g/n Unit b/g/n

1st side lobes(to fc ± 11MHZ) -

-43/-30/-40 -

dBr

2st side lobes(to fc ± 22MHZ) -

-52/-33/-58 -

dBr

Freq. Tolerance

-20/-20/-20 -

20/20/20 ppm

Test Items

Typical Value

EVM

802.11b /11Mbps : 16dBm ± 1.5 dB EVM  -10dB

Output Power

802.11g /54Mbps : 16dBm ± 1.5 dB EVM  -25dB

802.11n /MCS7 : 16dBm ± 1.5 dB EVM  -28dB

Test Items

Test Value

Standard Value

- 1Mbps

PER @ -97 dBm -94 dBm

SISO Receive Sensitivity

- 2Mbps

PER @ -95 dBm -92 dBm

(11b,20MHz) @8% PER

- 5.5Mbps PER @ -92 dBm -89 dBm

- 11Mbps

PER @ -90 dBm -87 dBm

- 6Mbps

PER @ -94 dBm -89 dBm

- 9Mbps

PER @ -92 dBm -88 dBm

SISO Receive Sensitivity (11g,20MHz) @10% PER

- 12Mbps - 18Mbps - 24Mbps

PER @ -91 dBm PER @ -88 dBm PER @ -85 dBm

-87 dBm -86 dBm -84 dBm

- 36Mbps PER @ -82 dBm -80 dBm

- 48Mbps PER @ -79 dBm -77 dBm

- 54Mbps PER @ -77 dBm -75 dBm

- MCS=0

PER @ -93 dBm -89 dBm

SISO Receive Sensitivity (11n,20MHz) @10% PER

- MCS=1 - MCS=2 - MCS=3

PER @ -90 dBm PER @ -89 dBm PER @ -85 dBm

-86 dBm -84 dBm -82 dBm

- MCS=4

PER @ -82 dBm -79 dBm

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Maximum Input Level Antenna Reference

3161A-SL

- MCS=5

PER @ -78 dBm -76 dBm

- MCS=6

PER @ -76 dBm -74 dBm

- MCS=7

PER @ -73 dBm -72 dBm

802.11b: -10 dBm

802.11g/n: -20 dBm

PCB antenna with 0~2 dBi peak gain

3 Pin Assignments
3.1 Pin Outline

<TOP VIEW>

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3.2 Pin Definition

NO

Name

1

GND

2

WL_ANT

3

GND

4

NC

5

NC

6 Host wake device

Type 
I/O   
I

7

GPIO8

I/O

8

NC



9

VCC

P

10

NC



11

NC



12 PMU_POWRON I

13

GPIO2

I/O

14 SDIO_DATA_2 I/O

15 SDIO_DATA_3 I/O

16 SDIO_DATA_CMD I/O

17 SDIO_DATA_CLK I

18 SDIO_DATA_0 I/O

19 SDIO_DATA_1 I/O

20

GND



21

NC



22

VDDIO

P

23

NC



24 RTC_CLK O

I/O

25 RTC_CLK I

I

26

NC



27

NC



28

NC



29

NC



30

NC



31

GND



32

NC



3161A-SL

Description Ground connections
RF I/O port Ground connections Floating (Don't connected to ground) Floating (Don't connected to ground) Host Wake up Wi-Fi,GPIO06 GPIO or configured as SDIO interrupt pin. (If not used keep Floating) Floating (Don't connected to ground) Main power voltage source input 2.3V-3.6V Floating (Don't connected to ground) Floating (Don't connected to ground) Enable pin for WLAN device Defualt ON: pull high ; OFF: pull low SDIO data interrupt,or GPIO function. SDIO data line 2, GPIO09 SDIO data line 3, GPIO10 SDIO command line, GPIO11 SDIO clock line, GPIO12 SDIO data line 0, GPIO13 SDIO data line 1, GPIO14 Ground connections Floating (Don't connected to ground) I/O Voltage supply input 1.8V/3.3V Floating (Don't connected to ground) Floating(module have 32K clock), GPIO00 Floating(module have 32K clock), GPIO01 Floating (Don't connected to ground) Floating (Don't connected to ground) Floating (Don't connected to ground) Floating (Don't connected to ground) Floating (Don't connected to ground) Ground connections Floating (Don't connected to ground)

Voltage
VDDIO VDDIO
3.3V
VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO VDDIO
VDDIO VDDIO VDDIO

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3161A-SL

33

GND



34

NC

-

35

NC



36

GND



37 UART_LOG_TX 

38 UART_LOG_RX 

39

WL_RST

I

40 Dev_Wake_Host O

41

NC



42

NC



43

NC



44

NC



P:POWER I:INPUT O:OUTPUT

Ground connections Floating (Don't connected to ground) Floating (Don't connected to ground)
Ground connections UART0_LOG_TX,GPIO03
For firmware download, can floating this pin
UART0_LOG_RX,GPIO04 For firmware download, can floating this pin Wi-Fi reset pin. GPIO07
Low: reset enable, Defualt High: reset disable
Wi-Fi wake up host. GPIO05
Floating (Don't connected to ground) Floating (Don't connected to ground) Floating (Don't connected to ground) Floating (Don't connected to ground)

VDDIO
VDDIO VDDIO VDDIO

3.3 Muti Pin definition

3861L all GPIO pin can configure as muti function,detail see below information.

Pin NAME F.0

F.1

F.2

F.3

F.4

F.5

F.6

24

GPIO00

GPIO00

UART1_TXD

SPI1_CLK

PWM3

I2C1_SDA

RTC_OSC_32K RTC32K_XOUT

25

GPIO01

GPIO01

UART1_RXD

SPI1_RXD

PWM4

I2C1_SCL

/

RTC32K_XINT

13

GPIO02

GPIO02

UART1_RTS

SPI1_TXD

PWM2

/

SSI_CLK

/

37

GPIO03

UART0_LOG_TX

UART1_CTS

SPI1_CS1

PWM5

I2C1_SDA

SSI_DATA

GPIO03

38

GPIO04

UART0_LOG_RX

/

/

PWM1

I2C1_SCL

/

GPIO04

40

GPIO05

UART1_RXD

GPIO05

I2S0_MCK

PWM2

/

BT_STATUS

SPI0_CS1

6

GPIO06

UART1_TXD

GPIO06

I2S0_TX

PWM3

/

COEX_SWITH

SPI0_CLK

39

GPIO07

UART1_CTS

GPIO07

I2S0_CLK

PWM0

/

BT_ACTIVE

SPI0_RXD

7

GPIO08

UART1_RTS

GPIO08

I2S0_WS

PWM1

/

WLAN_ACTIVE SPI0_TXD

14

GPIO09

GPIO09

UART2_RTS

SPI0_TXD

PWM0

I2C0_SCL

I2S0_MCK

SDIO_D2

15

GPIO10

GPIO10

UART2_CTS

SPI0_CLK

PWM1

I2C0_SDA

I2S0_TX

SDIO_D3

16

GPIO11

GPIO11

UART2_TXD

SPI0_RXD

PWM2

/

I2S0_RX

SDIO_CMD

17

GPIO12

GPIO12

UART2_RXD

SPI0_CS1

PWM3

/

I2S0_CLK

SDIO_CLK

18

GPIO13

GPIO13

UART2_RTS

UART0_LOG_TX PWM4

I2C0_SDA

I2S0_WS

SDIO_D0

F.7
/ / / / ADC1 ADC2 / ADC3 / ADC4 / ADC5 ADC0 ADC6

F.8
/ / / / / / / / / / / / / SSI_DATA

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19

GPIO14

GPIO14

Notes 1. IO Ispu/O. 2.  1mA. 3.  3.3/1.8V.

UART2_CTS

UART0_LOG_RX PWM5

I2C0_SCL

/

3161A-SL

SDIO_D1

/

SSI_CLK

4 Dimensions
4.1 Module Picture
L x W : 12 x 12 (+0.3/-0.1) mm

H: 2.3 (±0.2) mm Weight

0.66g

4.2 Marking Description

< TOP VIEW >

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3161A-SL

4.3 Module Physical Dimensions

(Unit: mm)

< TOP VIEW >

1,15
0,65 0,25

6 5,125
4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55

6 5,125
4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55 1,15 0,65 0,25

4.4 Layout Recommendation
(Unit: mm)

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3161A-SL

< TOP VIEW >

1,15
0,65 0,25

6,25
6 5,125
4,75 4,25 3,85 3,35 2,95 2,45 2,05 1,55

6,25 6
5,125 4,75
4,25 3,85 3,35 2,95 2,45 2,05 1,55 1,15 0,65 0,25

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3161A-SL
5 Host Interface Timing Diagram
5.1 SDIO Pin Description
The secure digital input/output (SDIO) interface supports three working modes: Default speed mode (DS)
The maximum frequency of the interface clock is 25 MHz. The interface clock can work in 1-bit or 4-bit mode.
High speed mode (HS)
The maximum frequency of the interface clock is 50 MHz.
SDR25 mode
The maximum frequency of the interface clock is 50 MHz
SDIO Pin Description SD 4-Bit Mode
DATA0 Data Line 0 DATA1 Data Line 1 DATA2 Data Line 2 DATA3 Data Line 3 CLK Clock CMD Command Line
5.2 SDIO CLK Timing Diagram
DS Mode The DS mode is the default mode after the SDIO is powered on. To ensure compatibility with various host components, the DS mode requires a low working rate and supports only the 25 MHz clock.

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3161A-SL

Figure 8-6 shows the output data timing in DS mode. tISU is the setup time, that is, the stability time required by the data of the SDIO interface before clock sampling in this mode. tIH is the hold time, that is, the time required by the data of the SDIO interface to retain the original level after clock sampling in this mode.

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3161A-SL

Figure 8-7 shows the input data timing in DS mode. Where, tODLY(max) is the maximum delay of the output data relative to the clock falling edge, and tODLY(min) is the minimum delay of the output data relative to the clock falling edge.

Table 8-12 describes the timing restrictions in DS mode.

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3161A-SL
Note: In DS mode, the output data is referenced to the clock falling edge, and the input data is referenced to the clock rising edge. HS Mode The HS mode is entered after the SDIO is powered on and initialized because a higher working rate than the DS mode is required. In HS mode, the clock supports 50 MHz. For details about the restrictions on the clock, see Table 8-13.

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3161A-SL
Figure 8-8 shows the input data timing in HS mode. tISU is the setup time, that is, the stability time required by the data of the SDIO interface before clock sampling in this mode. tIH is the hold time, that is, the time required by the data of the SDIO interface to retain the original level after clock sampling in this mode

Figure 8-9 shows the input data timing in HS mode. Where, tODLY(max) is the maximum delay of the output data relative to the clock rising edge, and tOH is the minimum delay of the output data relative to the clock rising edge.

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3161A-SL Table 8-15 describes the timing restrictions in HS mode.

Table 8-16 Timing restrictions in HS mode (VDDIO = 1.8 V)

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3161A-SL
Note: The data signal timing in HS mode is different from that in DS mode. The output data and input data are referenced to the clock rising edge. SDR25 Mode The SDR25 mode is entered only after the voltage of the SDIO is switched. In this mode, the maximum interface clock frequency is 50 MHz. Table 8-17 describes the clock restrictions.

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3161A-SL

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3161A-SL

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6 Reference Design
6.1 4line SDIO Reference Design

3161A-SL

VDDIO

VDDIO

DEV WAKE HOST WL_RST
UART0_LOG_RX UART0_LOG_TX

R11 NC/4.7K


R10 NC/4.7K

C10

C11

NC/680pF NC/680pF

44 NC
43 NC
42 NC
41 NC
40 DEV2HOST_WAKE
39 WL_RST
38 UART_RX
37 UART_TX
36 GND
35 NC
34 NC

L1 10pF
C1 NP

WL_ANT
C2 NP

HOST WAKE DEV MUTI FUNCTION
3.3V

C3 4.7uF

1 GND
2 WL_ANT
3 GND
4 NC
5 NC
6 HOST2DEV_WAKE
7 GPIO8
8 NC
9 VBAT
10 NC
11 NC

33 GND
32 NC
31 GND
30 NC
29 NC
28 NC
27 NC
26 NC
25 RTC_CLK
24 RTC_CLK
23 NC

12 POW_EN
13 SD_interrupt
14 SDIO_DATA_2
15 SDIO_DATA_3
16 SDIO_DATA_CMD
17 SDIO_DATA_CLK
18 SDIO_DATA_0
19 SDIO_DATA_1
20 GND
21 NC
22 VDDIO

PWRON SD_INT
VDDIO

22R 22R 22R 22R 22R 22R R1 R5 R6 R7 R8 R9

VDDIO
C8 4.7uF
SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD SDIO_D3 SDIO_D2

VDDIO

R21 R20 R19 R18 NC/47KNC/47KNC/47KNC/47K

HOST

SDIO_D2 SDIO_D3 SDIO_CMD SDIO_CLK SDIO_D0 SDIO_D1

HOST WAKE DEV PWRON SD_INT
C39 NC/10pf
UART0_LOG_RX UART0_LOG_TX WL_RST DEV WAKE HOST MUTI FUNCTION

HOST WAKE DEV PWRON SD_INT SDIO_D2 SDIO_D3 SDIO_CMD SDIO_CLK SDIO_D0 SDIO_D1 UART0_LOG_TX UART0_LOG_RX WL_RST DEV WAKE HOST
GPIO

Notes: 1. 4line WLAN module application, all wake function may not supported; 2. Can using Power EN pin to shut down module for power saving;

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6.2 1line SDIO Reference Design

3161A-SL

 1. Hi3861L  Hi18EV300 
- GPIO8 - GPIO11 - GPIO12 - GPIO13  Hisyslink Hi3861L  SDIO  1  
2. 3161A WIFI  (PORPower On Reset)GPIO2/GPIO6/GPIO8 
 Flash   GPIO2/GPIO6/GPIO8 PIR  USB  Hi3861L  POR  
3.  WIFI UART  GPIO3/GPIO4  TX  GPIO_3
RX  GPIO4 UART  UART  900Kbps-2Mbps UART GPIO3/4  LED ( )

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3161A-SL

4.  WIFI  GPIO3/GPIO5/GPIO7/GPIO14 
 WIFI
5.  GPIO7  GPIO 
 GPIO  ADC 
6. WIFI IO  VDDIO  VDDIO  3.3V WIFI IO  3.3V

button reset

or UART0 LED
LED

PIR_OUT ADC
UART0_LOG_RX UART0_LOG_TX

or MCU

44 NC
43 NC
42 NC
41 NC
40 DEV2HOST_WAKE
39 WL_RST
38 UART_RX
37 UART_TX
36 GND
35 NC
34 NC

GPIO03 GPIO04 GPIO07
GPIO05

or UART1

PIR

PIR_OUT
PIR_OUT
PIR_IN PIR_IN

L6 10pF
C49 NP

WL_ANT
C50 NP

ADC or GPIO  GPIO

SDIO INT 3.3V
C48 4.7uF

1 GND
2 WL_ANT
3 GND
4 NC
5 NC
6 HOST2DEV_WAKE GPIO06
7 GPIO8
8 NC
9 VBAT
10 NC
11 NC

33 GND
32 NC
31 GND
30 NC
29 NC
28 NC
27 NC
26 NC
25
GPIO01 RTC_CLK 24 GPIO00 RTC_CLK 23
NC

GPIO14

GPIO13

GPIO12

22 VDDIO

21 NC

20 GND

19 SDIO_DATA_1

18 SDIO_DATA_0

17 SDIO_DATA_CLK

16 SDIO_DATA_CMD GPIO11

GPIO10

GPIO09

GPIO02

15 SDIO_DATA_3

14 SDIO_DATA_2

13 SD_interrupt

12 POW_EN

PWRON GPIO02 GPIO09 GPIO10
VDDIO

VDDIO GPIO14



22R 22R 22R R36 R37 R38

I2C
ADC
battery
charge status
charge

VDDIO C51 4.7uF
SDIO_D0 SDIO_CLK SDIO_CMD
USB 

R44 NC/47K

PWRON SDIO_INT

C54 NC/10pf

HOST
PWRON SD_INT SDIO_D0 SDIO_CLK SDIO_CMD

7 Ordering Information

Part No. FG3161ASLX-00
FG3161ASLX-01

Description Hi3861L, b/g/n Wi-Fi, 1T1R, 12X12mm, SDIO, PCB V1.0 Halogen Free,with shielding. Hi3861L, b/g/n Wi-Fi, 1T1R, 12X12mm, SDIO, PCB V1.0 Halogen Free,no shielding.

8 The Key Material List

Main

2016 2.2uH ,±20%DCR=0.125ohmIsat=1.5AIrms=1.5A Inductor MPIE201610-2R2M-LF)

Main Shielding 3161A-SL-V1.0 Shielding cover, no insulation glue, no

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3161A-SL

Main Alt. Main Main

cover Crystal Crystal RTC Chipset

positioning foot (material: copper) Xintai
2520 40MHZ,13.8PF,7ppm,SR:50  ,E2SB40E00000GE (HOSONIC) 2520 40MHz 15pF ±10ppm -40~85 Q40000V024  
3215 32.768KHZ 12.5PF 20PPM -40~85 ° C SF32K32768D31T-12.5 () Hi3861LRNIV100 WiFi IoT Soc,802.11b/g/n, WiFi Mesh,  2M Flash, SDIO,UART,QFN32, 5x5mm ()

9 Power on Sequence

 VCC / VDDIO supreme electrical order requirements  In the process of power up, GPIO02 internal weak pull low ,the 40MHz crystal is
selected..
10 Design Attention
1. GPIO02 is the interrupt signal of SDIO, It also can be configured as dev wake host function. 2. GPIO8 can be setting as SDIO interrupt function. 3. PMU_PWRON is enable pin of the module. Default is pull high. 4. Wake function may not supported with recently applications, for power saving please using POWER EN pin enable or disable the module.
11 Recommended Reflow Profile
Referred to IPC/JEDEC standard. Peak Temperature : <250°C

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Number of Times : 2 times

3161A-SL

12 Packing Information
12.1 Reel
A roll of 1500pcs

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3161A-SL
12.2 Carrier Tape Detail

12.3 Packaging Detail

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3161A-SL

12.4 Moisture sensitivity
The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) "IPC/JEDEC J-STD-033A paragraph 5.2" is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more

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References

WPS 文字