User Manual for RF-star models including: BM2642B1, 2ABN2-BM2642B1, 2ABN2BM2642B1, RF-BM-2642B1 SimpleLink Bluetooth 5 Low Energy Wireless Module, RF-BM-2642B1, SimpleLink Bluetooth 5 Low Energy Wireless Module
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RF-BM-2642B1
V1.0 - Jan., 2020
RF-BM-2642B1 SimpleLinkTM Bluetooth® 5 Low Energy Wireless Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd. Jan. 19th, 2020
Shenzhen RF-star Technology Co., Ltd.
Page 1 of 20
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TI CC264X BLE Module List
RF-BM-2642B1
V1.0 - Jan., 2020
Chipset
Flash RAM Core
(Byte) (KB)
TX Power (dBm)
Model
Dimension Range
Antenna
(mm)
(M)
Photo
RF-BM-4044B2 PCB 11.2 16.6 300
CC2640 M3 128 28
R2FRSM
2
RF-BM-4044B3 IPEX 11.2 15.2
500
RF-BM-4044B4 CHIP
8 8
150
CC2640 R2FRGZ
M3 128 28 CC2640 R2FRGZ
Q1
RF-BM-4077B1 PCB
17 23.5
500
5
RF-BM-4077B2 PCB
17 23.5
500
CC2642R M4F 352 80
5
RF-BM-2642B1 PCB
17 23.5
500
CC2652R M4F 352 80
BLE:
500
5
RF-BM-2652B1 PCB
17 23.5
ZigBee:
300
BLE: 500 ZigBee: CC1352R M4F 352 80 5 / 14 RF-TI1352B1 IPEX 16.8 26.5 300 868 MHz: 1500 Note: 1. The communication distance is the longest distance obtained by testing the module's maximum transmission power in an open and interference-free environment in sunny weather. 2. Click the picture to buy modules.
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1 Device Overview
RF-BM-2642B1
V1.0 - Jan., 2020
1.1 Description
RF-BM-2642B1 is an RF module based on TI lower-power CC2642R SoC. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of in-system Programmable Flash, 256 KB ROM, 8 KB of cache SRAM, 80 KB of ultra-low leakage SRAM. Its ARM® Cortex®-M4F core application processor can operate at an extremely low current at flexible power modes. Its 2.4 GHz RF transceiver compatible with Bluetooth 5 Low Energy. It features small size, robust connection distance, and rigid reliability.
1.2 Key Features
· RF Section - 2.4GHz RF transceiver compatible with Bluetooth 5 Low Energy - Excellent receiver sensitivity -105 dBm for BLE 125 kbps (LE coded PHY) -97 dBm for 1 Mbps PHY - Output power up to +5 dBm with temperature compensation - Suitable for systems targeting compliance with worldwide radio frequency regulations
· Microcontroller - Powerful 48 MHz ARM® Cortex®-M4F processor - EEBMC CoreMark® score: 148 - 352 KB of in-system programmable flash - 256 KB of ROM for protocols and library functions - 8 KB of cache SRAM - 80 KB of ultra-low leakage SRAM - Support OTA upgrade
· Ultra-low power sensor controller with 4 KB of SRAM - Sample, store, and process sensor data - Operation independent from system CPU - Fast wake-up for low-power operation
· Peripherals - Digital peripheral pins can be routed to 31 GPIOs - 4 × 32-bit or 8 × 16-bit general-purpose timers
- 12-bit ADC, 200 ksamples/s, 8 channels - 2 × comparators with internal reference DAC - Ultra-low power analog comparator - Programmable current source - 2 × UART - 2 × SSI (SPI, Microwave, TI) - I2C - I2S - Real-time clock (RTC) - AES 128 and 256 bit Crypto accelerator - ECC and RSA public key hardware accelerator - SHA2 accelerator (full suite up to SHA-512) - True random number generator (TRNG) - Capacitive sensing, up to 8 channels - Integrated temperature and battery monitor · External system - On-chip buck DC/DC converter · Low Power - Wide supply voltage range: 1.8 V ~ 3.8 V - Active-mode RX: 6.9 mA - Active-mode TX at 0 dBm: 7.3 mA - Active-mode TX at +5 dBm: 9.6 mA - Active-mode MCU 48 MHz (CoreMark): 3.4 mA (71
A/MHz) - Sensor controller, low power-mode, 2 MHz, running
infinite loop: 30.8 A - Sensor controller, active-mode, 24 MHz, running
infinite loop: 808 A
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RF-BM-2642B1
V1.0 - Jan., 2020
- Standby: 0.94 µA (RTC on, 80 KB RAM and CPU retention)
- Shutdown: 150 nA (wakeup on external events)
1.3 Applications
· Personal electronics · Mobile phone accessories · Sports and fitness equipment · HID applications · Smart grid and automatic meter reading · Wireless sensor networks
· Active RFID · Energy harvesting applications · Electronic Shelf Label (ESL) · Home and building automation · Wireless alarm and security systems · Long-range sensor applications
1.4 Functional Block Diagram
48.0 MHz 32.768 kHz
31 GPIOs
Power EMI Filter
CC2642R
RF-N RF-P
LC Balun
ANT Matching
PCB Antenna
Reset Power Supply 1.8 V ~ 3.8 V
Figure 1. Functional Block Diagram of RF-BM-2642B1
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-2642B1 where the fields are defined as follows:
RF - BM - 2642 B1
RF-STAR Company Name
Module Version The First Version
Bluetooth Module Wireless Type
Figure 2. Part Number Conventions of RF-BM-2642B1
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Chipset TI CC2642R
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RF-BM-2642B1
V1.0 - Jan., 2020
Table of Contents
TI CC264X BLE Module List .......................................................................................................................................... 2 1 Device Overview ............................................................................................................................................................. 3
1.1 Description............................................................................................................................................................ 3 1.2 Key Features ....................................................................................................................................................... 3 1.3 Applications .......................................................................................................................................................... 4 1.4 Functional Block Diagram .............................................................................................................................. 4 1.5 Part Number Conventions .............................................................................................................................. 4 Table of Contents................................................................................................................................................................ 5 Table of Figures................................................................................................................................................................... 6 Table of Tables..................................................................................................................................................................... 6 2 Module Configuration and Functions ...................................................................................................................... 7 2.1 Module Parameters........................................................................................................................................... 7 2.2 Module Pin Diagram ......................................................................................................................................... 8 2.3 Pin Functions....................................................................................................................................................... 8 3 Specifications .................................................................................................................................................................10 3.1 Recommended Operating Conditions .....................................................................................................10 3.2 Handling Ratings..............................................................................................................................................10 3.3 Power Consumption .......................................................................................................................................10
3.3.1 Power Mode..........................................................................................................................................10 3.3.2 Radio Mode...........................................................................................................................................12 4 Application, Implementation, and Layout.............................................................................................................13 4.1 Module Photos..................................................................................................................................................13 4.2 Recommended PCB Footprint....................................................................................................................13 4.3 Schematic Diagram.........................................................................................................................................14 4.4 Basic Operation of Hardware Design ......................................................................................................14 4.5 Trouble Shooting..............................................................................................................................................16 4.5.1 Unsatisfactory Transmission Distance........................................................................................16 4.5.2 Vulnerable Module..............................................................................................................................16 4.5.3 High Bit Error Rate .............................................................................................................................16 4.6 Electrostatics Discharge Warnings ...........................................................................................................16
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RF-BM-2642B1
V1.0 - Jan., 2020
4.7 Soldering and Reflow Condition.................................................................................................................17 4.8 Optional Packaging.........................................................................................................................................18 5 Revision History ............................................................................................................................................................19 6 Contact Us.......................................................................................................................................................................20
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-2642B1 ............................................................................. 4 Figure 2. Part Number Conventions of RF-BM-2642B1 ............................................................................ 4 Figure 3. Pin Diagram of RF-BM-2642B1........................................................................................................ 8 Figure 4. Recommendation of Antenna Layout ...........................................................................................15 Figure 5. Optional Packaging Mode.................................................................................................................18
Table of Tables
Table 1. Parameters of RF-BM-2642B1 ........................................................................................................... 7 Table 2. Pin Functions of RF-BM-2642B1 ....................................................................................................... 8 Table 3. Recommended Operating Conditions of RF-BM-2642B1......................................................10 Table 4. Handling Ratings of RF-BM-2642B1 ..............................................................................................10 Table 5. Table of Power Consumption on Power Mode............................................................................10 Table 6. Table of Power Consumption on Radio Mode.............................................................................12
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RF-BM-2642B1
V1.0 - Jan., 2020
2 Module Configuration and Functions
2.1 Module Parameters
Chipset Supply Power Voltage Frequency Maximum Transmit Power Receiving Sensitivity GPIO
Power Consumption
Support Protocol Crystal Package Communication Interface Dimension Type of Antenna Operating Temperature Storage Temperature
Table 1. Parameters of RF-BM-2642B1 CC2642R 1.8 V ~ 3.8 V, recommended to 3.3 V 2402 MHz ~ 2480 MHz +5.0 dBm -97 dBm 31 RX current: 6.9 mA TX current: 7.3 mA @ 0 dBm
9.6 mA @ 5 dBm MCU 48 MHz (CoreMark):3.4 mA (71 A/MHz) Sensor Controller30.8 A @ low power-mode, 2 MHz
808 A @ active-mode, 24 MHz Standby: 0.94 µA Shutdown: 150 nA Bluetooth 5 Low Energy 48 MHz, 32.768 kHz SMT packaging (Half hole) UART, SPI, I2C, I2S 23.50 mm × 17.0 mm × (2.2 ± 0.1) mm PCB Antenna -40 +85 -40 +125
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2.2 Module Pin Diagram
RF-BM-2642B1
V1.0 - Jan., 2020
2.3 Pin Functions
Pin
Name
1
P00
2
P01
3
P02
4
P03
5
P04
6
P05
7
P06
8
P07
9
P08
10
P09
11
P10
12
P11
13
P12
14
P13
Figure 3. Pin Diagram of RF-BM-2642B1
Table 2. Pin Functions of RF-BM-2642B1
Function
Description
GPIO
GPIO, Sensor Controller
GPIO
GPIO, Sensor Controller
GPIO
GPIO, Sensor Controller
GPIO
GPIO, Sensor Controller
GPIO
GPIO, Sensor Controller
GPIO
GPIO, Sensor Controller, high-drive capability
GPIO
GPIO, Sensor Controller, high-drive capability
GPIO
GPIO, Sensor Controller, high-drive capability
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
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15
P14
16
P15
17
JTAG_TMSC
18
JTAG_TCKC
19
P16
20
P17
21
P18
22
P19
23
P20
24
P21
25
P22
26
P23
27
P24
28
P25
29
P26
30
P27
31
P28
32
P29
33
P30
34
VDD_EB
35
GND
36
NRESET
RF-BM-2642B1
V1.0 - Jan., 2020
GPIO GPIO JTAG_TMSC JTAG_TCKC GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO VDD GND RESET_N
GPIO GPIO JTAG TMSC, high-drive capability JTAG TCKC GPIO, JTAG_TDO, high-drive capability GPIO, JTAG_TDI, high-drive capability GPIO GPIO GPIO GPIO GPIO GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog GPIO, Sensor Controller, Analog Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V Ground Reset, active-low. No internal pullup
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RF-BM-2642B1
V1.0 - Jan., 2020
3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Items
Table 3. Recommended Operating Conditions of RF-BM-2642B1
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
Operating Temperature
/
1.8
3.3
3.8
V
-40
+25
+85
Notes: To ensure the RF performance, the ripple wave on the source must be less than ±300 mV.
3.2 Handling Ratings
Items Storage Temperature Human Body Model Moisture Sensitivity Level Charged Device Model
Table 4. Handling Ratings of RF-BM-2642B1
Condition
Min.
Typ.
Max.
Unit
Tstg
-40
+25
+125
HBM
±2000
V
2
±500
V
3.3 Power Consumption
3.3.1 Power Mode
Table 5. Table of Power Consumption on Power Mode Measured on the RF-BM-2642B1 reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC converter, unless otherwise noted.
Parameter
Test Conditions
Typ. Unit
Core Current Consumption
Reset. RESET_N pin asserted or VDDS below power-on-reset
150
nA
Reset and Shutdown threshold
Icore
Shutdown. No clocks running, no retention
150
nA
Standby without cache RTC running, CPU, 80 KB RAM and (partial) register retention. 0.94
A
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RF-BM-2642B1
V1.0 - Jan., 2020
retention
RCOSC_LF
RTC running, CPU, 80 KB RAM and (partial) register retention.
XOSC_LF
1.09
A
Standby
RTC running, CPU, 80 KB RAM and (partial) register retention.
RCOSC_LF
3.2
A
with cache retention RTC running, CPU, 80 KB RAM and (partial) register retention.
XOSC_LF
3.3
A
Idle
Supply Systems and RAM powered RCOSC_HF
Active
MCU running CoreMark at 48 MHz RCOSC_HF
Peripheral Current Consumption
Peripheral power domain
Delta current with domain enabled
Serial power domain Delta current with domain enabled
RF Core DMA
Delta current with power domain enabled, clock enabled, RF core idle Delta current with clock enabled, module is idle
Timer
Delta current with clock enabled, module is idle
Iperi
I2C
Delta current with clock enabled, module is idle
I2S
Delta current with clock enabled, module is idle
SSI
Delta current with clock enabled, module is idle
UART
Delta current with clock enabled, module is idle
675
A
3.39
mA
97.7
A
7.2
A
210.9
A
63.9
A
81.0
A
10.1
A
26.3
A
82.9
A
167.5
A
CRYPTO (AES)
Delta current with clock enabled, module is idle
25.6
A
PKA
Delta current with clock enabled, module is idle
84.7
A
TRNG
Delta current with clock enabled, module is idle
35.6
A
Sensor Controller Engine Consumption
Active mode ISCE
Low-power mode
24 MHz, Infinite loop 2 MHz, Infinite loop
808.5
A
30.1
A
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RF-BM-2642B1
V1.0 - Jan., 2020
3.3.2 Radio Mode
Table 6. Table of Power Consumption on Radio Mode Measured on the RF-BM-2642B1 reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC converter, unless otherwise noted.
Parameter
Test Conditions
Typ. Unit
Radio Receive Current
2440 MHz
6.9
mA
Radio Transmit Current
+5 dBm output power setting 2440 MHz +5 dBm output power setting 2440 MHz
7.3
mA
9.6
mA
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4 Application, Implementation, and Layout 4.1 Module Photos
RF-BM-2642B1
V1.0 - Jan., 2020
Figure 3. Photos of RF-BM-2642B1
4.2 Recommended PCB Footprint
Figure 4. Recommended PCB Footprint of RF-BM-2642B1
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4.3 Schematic Diagram
RF-BM-2642B1
V1.0 - Jan., 2020
Figure 5. Schematic Diagram of RF-BM-2642B1
4.4 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing. If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
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RF-BM-2642B1
V1.0 - Jan., 2020
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees; 6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly
affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended to stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation and shielding can be done. 8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for example: USB 3.0. 9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality antenna extension wire can be used to extend the antenna to the outside of the case. 10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened. 11. The recommendation of antenna layout. The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of antenna is a key factor to increase the data rate and transmission range. Therefore, the layout of the module antenna location and routing is recommended as follows: 1 Place the antenna on the edge (corner) of the PCB. 2 Make sure that there is no signal line or copper foil in each layer below the antenna. 3 It is the best to hollow out the red part of the antenna position in the following figure so as to ensure that S11 of the module is minimally affected.
Figure 4. Recommendation of Antenna Layout Note: The hollow-out position is based on the antenna used.
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RF-BM-2642B1
V1.0 - Jan., 2020
4.5 Trouble Shooting
4.5.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened. Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor. 3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell. 4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance. 5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is. 6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.5.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices. 3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.5.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability. 3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.6 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions below: 1. According to the anti-static measures, bare hands are not allowed to touch modules.
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RF-BM-2642B1
V1.0 - Jan., 2020
2. Modules must be placed in anti- static areas. 3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.7 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection. 2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent methods. 3. Solder paste composition: Sn/3.0 Ag/0.5 Cu 4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile. 5. Temperature profile: Reflow soldering shall be done according to the following temperature profile. 6. Peak temperature: 245 .
Figure 6. Recommended Reflow for Lead Free Solder
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4.8 Optional Packaging
RF-BM-2642B1
V1.0 - Jan., 2020
Note: Default tray packaging.
Figure 5. Optional Packaging Mode
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5 Revision History
Date 2019.09.11 2020.01.19
Version No.
Description
V1.0
The initial version is released.
V1.0
Add TI CC264X BLE module list.
RF-BM-2642B1
V1.0 - Jan., 2020
Author Aroo Wang
Sunny Li
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RF-BM-2642B1
V1.0 - Jan., 2020
6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Shenzhen HQ: Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China Tel.: 86-755-3695 3756 Chengdu Branch: Add.: No. B4-12, Building No.1, No. 1480 Tianfu Road North Section (Incubation Park), High-Tech Zone, Chengdu, China (Sichuan) Free Trade Zone, 610000 Tel.: 86-28-6577 5970
Email: sunny@szrfstar.com, sales@szrfstar.com Web.: www.szrfstar.com
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FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 PCB Antenna with Antenna gain0dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID: 2ABN2-BM2642B1 Or Contains FCC ID: 2ABN2-BM2642B1" When the module is installed inside another device, the user manual of the host must contain below warning statements; 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/TV technician for help.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with limit modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirementthen the host can be sold legally.
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