User Guide for SILICON LABS models including: Si826X Led Emulator Input Isodriver Evaluation Board, Si826X, Led Emulator Input Isodriver Evaluation Board, Isodriver Evaluation Board

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270237692372909si826x-evb
Si826x-EVB
Si826X LED EMULATOR INPUT ISODRIVER EVALUATION BOARD USER'S GUIDE
1. Introduction
The Si826x evaluation board allows designers to evaluate Silicon Lab's Si826x family of CMOS based LED Emulator Input ISOdrivers. The Si826x ISOdrivers are pin-compatible, drop-in upgrades for popular opto-coupled gate drivers, such as 0.6 A ACPL-0302/3020, 2.5 A HCPL-3120/ACPL-3130, HCNW3120/3130, and similar optodrivers. The devices are ideal for driving power MOSFETs and IGBTs used in a wide variety of inverter and motor control applications. The Si826x isolated gate drivers utilize Silicon Laboratories' proprietary silicon isolation technology, supporting up to 5.0 kVRMS withstand voltage per UL1577. This technology enables higher-performance, reduced variation with temperature and age, tighter part-to-part matching, and superior common-mode rejection compared to opto-coupled gate drivers. While the input circuit mimics the characteristics of an LED, less drive current is required, resulting in higher efficiency. Propagation delay time is independent of input drive current, resulting in consistently short propagation times, tighter unit-to-unit variation, and greater input circuit design flexibility. As a result, the Si826x series offers longer service life and dramatically higher reliability compared to opto-coupled gate drivers. The evaluation kit consists of four separately orderable boards with each board featuring either the DIP8, SOIC8, SDIP6, or LGA8 package. For more information on configuring the ISOdriver itself, see the Si826x product data sheet and application note "AN677: Using the Si826x Family of Isolated Gate Drivers".
1.1. Kit Contents
Each Si826x Evaluation Kit contains the following items:
Si826x based evaluation board as shown in Figures 1 through 4. Si826x LED Emulator Input ISOdriver (installed on the evaluation board)
Si8261 (DIP8, SOIC8, SDIP6, LGA8)

Figure 1. Si826x DIP8 Evaluation Board Overview

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Figure 2. Si826x SOIC8 Evaluation Board Overview
Copyright © 2013 by Silicon Laboratories

Si826x-EVB

Si826x-EVB
Figure 3. Si826x SDIP6 Evaluation Board Overview Figure 4. Si826x LGA8 Evaluation Board Overview

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2. Required Equipment
The following equipment is required to demonstrate the evaluation board:
1 digital multimeter 2 multimeter test leads (red and black) 1 oscilloscope (Tektronix TDS 2024B or equivalent) 1 function generator (Agilent 33220A, 20 MHz or equivalent) 1 dc power supply (HP6024A, 30 V dc, 0­100 mA or equivalent) 1 BNC splitter 3 coaxial cables 2 BNC to clip converters (red and black) 2 Banana to clip wires (red and black) Si826x Evaluation Board (board under test) Si826x LED Emulator Input Evaluation Board User's Guide (this document)

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3. Hardware Overview and Demo
Figure 5 illustrates the connection diagram to demonstrate the Si826x-DIP8 EVB. The other footprint boards demonstrate in a similar fashion. This demo transmits a 500 kHz (5 V peak, 50 percent duty cycle) square wave through the ISOdriver to its output (Vo). In this example, VDD is powered by a 15 V supply. Figure 6 shows a scope shot of CH1 (input) and CH2 (output). Note that if a user wants to evaluate an LED Emulator Input ISOdriver other than the ones pre-populated, this can be accomplished by removing the installed device and replacing it with the desired footprint-compatible ISOdriver device.

Input to Scope
CH1

Output to Scope
CH2

Signal Input (500 kHz, 5 Vpk)
Square Wave

+

++

Power Supply (15 V, 100 mA)

-

-

-

Figure 5. Summary Diagram and Test Setup

Figure 6. Oscilloscope Display of Input and Output

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3.1. Board Jumper Settings
To run the demo, follow the instructions below. Review Figure 5 and Figures 11 through 14 if necessary.
1. Ensure that JP1 and JP6 are installed as shown in Figure 1, 2, 3, or 4.
3.2. DC Supply Configuration
1. Turn OFF the dc power supply and ensure that the output voltage is set to its lowest output voltage. 2. Connect the banana ends of the black and red banana to clip terminated wires to the outputs of the dc
supply. 3. Then, connect the clip end of the red and black banana to clip wires to P2. The red wire goes to Pin1. The
black wire goes to Pin3. 4. Turn ON the dc power supply. 5. Adjust the dc power supply to provide 15 V on its output. 6. Ensure that the current draw is less than 25 mA. If it is larger, this indicates that either the board or Si826x
has been damaged or the supply is connected backwards.
3.3. Wave Form Generator
1. Turn ON the arbitrary waveform generator with the output disengaged. 2. Adjust its output to provide a 500 kHz, 0 to 5 V peak square wave (50 percent duty cycle) to its output. 3. Split the output of the generator with a BNC splitter. 4. From the BNC splitter, connect a coaxial cable to CH1 of the scope. This will be the input. 5. Connect a second coaxial cable to the BNC splitter, and connect a BNC-to-clip converter to the end of the
coaxial cable. 6. From here, connect the clip ends of the BNC-to-clip converter to P1, Pin1 (red wire here) and Pin3 (black
wire here). The positive terminal is Pin1 on P1. 7. Connect one end of a third coaxial cable to a BNC-to-clip converter (note that a scope probe can be used
here instead). 8. From here, connect the clip end of the BNC-to-clip converter to P2, Pin2 (red wire here) and Pin3 (black
wire here). Vo is on P2 Pin2. 9. Connect the other end of the coaxial cable to CH2 of the oscilloscope. This will be the output. 10. Engage the output of the waveform generator.
3.4. Oscilloscope Setup
1. Turn ON the oscilloscope. 2. Set the scope to Trigger on CH1 and adjust the trigger level to 1 V minimum. 3. Set CH1 to 2 V per division. Set CH2 to 5 V per division. 4. Adjust the seconds/division setting to 250 ns/division. 5. Adjust the level indicator for all channels to properly view each channel as shown in Figure 6. A 500 kHz square wave should display on Channel 1 of the scope for the input and a slightly delayed 5 V version of this square wave should display the output on Channel 2, as shown in Figure 6. This concludes the basic demo. For more advanced demos, see the following section.

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3.5. Adjusting Input Signal Frequency and VDD
Now is a good time to explore some additional functionality of the board. From here the user can do the following:
1. Slowly adjust VDD down to 13 V and up to 30 V. Then, take the VDD voltage below 12 V. Once below 12 V, it can be seen that the Si826x's UVLO turns on. In this condition, the output should turn off in which case the square wave disappears.
2. Next, adjust the supply back to 15 V. 3. Another dial the user can adjust is the frequency dial on the square wave generator. Turn this dial from tens
of Hz up to several MHz and observe the scope output.

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4. Open Loop POL Evaluation Board

The power and jumper connections descriptions are summarized here:

P1 P2 JP1 JP2 JP3 JP4 JP5 JP6

External input signal connections to drive the LED Emulator. External output signal and VDD connections. Jumper when installed bypasses the external bootstrap circuitry. Jumper when installed used to accommodate common-anode drive. Jumper when installed can be used to enable the fast reverse recovery diode. Jumper when installed can be used to add additional load to output. Jumper when installed can be used to bypass the output gate resistor. Jumper when installed used to accommodate common-cathode drive.

4.1. Voltage and Current Sense Test Points

The Si826x evaluation board has several test points. These test points correspond to the respective pins on the Si826x integrated circuits as well as other useful inspection points. See Figures 7 through 10 for a silkscreen overview. See schematics in Figures 11 through 14 for more details as well.

Figure 7. Si826x DIP8 Evaluation Board Silkscreen

Figure 8. Si826x SOIC8 Evaluation Board Silkscreen

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Figure 9. Si826x SDIP6 Evaluation Board Silkscreen Figure 10. Si826x LGA8 Evaluation Board Silkscreen

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5. Si826x Evaluation Board Schematics

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JP2

R1

267

ANODE_EXT
CATHODE_EXT GND_EXT

P1

TP8

TP6 TP7
C6 200pF
NI

R4

267 NI

JP6

4

3

2 43 1

21

R2 0
NI

TP2 TP4

D1 US1K
NI

JP1

C1

C2

C3

10uF 1uF 0.1uF

U1
1 NC
2 ANODE
3 CATHODE
4 NC

TP1

8 VDD
7 VO
6 VO
5 GND

TP3 TP5

SI826X PDIP8

GND2

GND2
BAS16X JP3 CR1
R3 4.7

P2
VDD VO GND2

JP4

GND2

JP5

C4

C5

200pF 200pF

NI

NI

GND2

Rev. 0.1

Si826x-EVB

SF1 BUMPER

SF2 BUMPER

SF3 BUMPER

SF4 BUMPER

Figure 11. Si826x DIP8 Evaluation Board Schematic

JS1 Jumper Shunt JS2 Jumper Shunt

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Si826x-EVB

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JP2

R1

267

ANODE_EXT
CATHODE_EXT GND_EXT

P1

TP8

TP6 TP7
C6 200pF
NI

R4

267 NI

JP6

4

3

2 43 1

21

R2 0
NI

TP2 TP4

D1 US1K
NI

JP1

C1

C2

C3

10uF 1uF 0.1uF

U1
1 NC
2 ANODE
3 CATHODE
4 NC

TP1

8 VDD
7 VO
6 VO
5 GND

TP3 TP5

SI826X SOIC8

GND2

GND2
BAS16X JP3 CR1
R3 4.7

P2
VDD VO GND2

JP4

GND2

JP5

C4

C5

200pF 200pF

NI

NI

GND2

Rev. 0.1

SF1 BUMPER

SF2 BUMPER

SF3 BUMPER

SF4 BUMPER

Figure 12. Si826x SOIC8 Evaluation Board Schematic

JS1 Jumper Shunt JS2 Jumper Shunt

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JP2

R1

267

ANODE_EXT
CATHODE_EXT GND_EXT

P1

TP8

TP6 TP7
C6 200pF
NI

R4

267 NI

JP6

4

3

2 43 1

21

R2 0
NI

TP2 TP4

D1 US1K
NI

JP1

C1

C2

C3

10uF 1uF 0.1uF

U1
1 ANODE
2 NC
3 CATHODE

6 VDD
5 VO
4 GND

SI826X SDIP6

TP1 TP3
TP5
GND2

GND2
BAS16X JP3 CR1
R3 4.7

P2
VDD VO GND2

JP4

GND2

JP5

C4

C5

200pF 200pF

NI

NI

GND2

Rev. 0.1

Si826x-EVB

SF1 BUMPER

SF2 BUMPER

SF3 BUMPER

SF4 BUMPER

Figure 13. Si826x SDIP6 Evaluation Board Schematic

JS1 Jumper Shunt JS2 Jumper Shunt

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Si826x-EVB

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ANODE_EXT
CATHODE_EXT GND_EXT

P1

TP8

TP6 TP7
C6 200pF
NI

JP2

R1

267

R2 0
NI

R4

267 NI

JP6

4

3

2 43 1

21

TP2 TP4

D1 US1K
NI

JP1

C1

C2

C3

10uF 1uF 0.1uF

U1
1 NC
2 ANODE
3 CATHODE
4 NC

8 VDD
7 VO
6 VO
5 GND

SI826X LGA8

TP1 TP3
TP5
GND2

GND2
BAS16X JP3 CR1
R3 4.7

P2
VDD VO GND2

JP4

GND2

JP5

C4

C5

200pF 200pF

NI

NI

GND2

Rev. 0.1

SF1 BUMPER

SF2 BUMPER

SF3 BUMPER

SF4 BUMPER

Figure 14. Si826x LGA8 Evaluation Board Schematic

JS1 Jumper Shunt JS2 Jumper Shunt

Si826x-EVB

6. Bill of Materials

Table 1. Si826x DIP8 Evaluation Board Bill of Materials

Item Qty

1

1

Ref

Part #

Supplier

Description

Value

C1

GRM32DF51H106ZA01L Murata

CAP, 10 µF, 50 V,

10 µF

Electronics ­20% to +80%, Y5V, 1210

North America

2

1

C2

C1210X7R101-105K

Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1 µF

1210

3

1

C3

C0603X7R101-104M

Venkel

CAP, 0.1 µF, 100 V, ±20%, 0.1 µF

X7R, 0603

4

3 C4, C5, C6 C0805C0G500-201K

Venkel

CAP, 200 pF, 50 V, ±10%, COG, 0805

200 pF

5

1

CR1

BAS16XV2T1G

On Semi

DIO, SWITCH, 200 mA, 75 V, BAS16X SOD523

6

1

D1

US1K-13-F

Diodes Inc. DIO, SWITCH, ULT FAST 1 A US1K 800 V, SMA

7

5 JP1, JP2,

TSW-102-07-T-S

JP3, JP4,

JP5

Samtec

Header, 2x1, 0.1in pitch, Tin Plated

Jumper

8

1

JP6

TSW-102-07-T-D

Samtec

Header, 2x2, 0.1in pitch, Tin Plated

Header 2x2

9

2 JS1, JS2

SNT-100-BK-T

Samtec

Shunt, 1x2, 0.1in pitch, Tin Plated

Jumper Shunt

10

2

P1, P2

TSW-103-07-T-S

Samtec

Header, 3x1, 0.1in pitch, Tin Plated

Header 1x3

11

2

R1, R4

CR0805-10W-2670F

Venkel

Res, 267 , 1/10 W, ±1%,

267

ThickFilm, 0805

12

1

R2

CR0805-10W-000

Venkel

Res, 0 , 2 A, ThickFilm,

0

0805

13 1

R3

CR0805-10W-4R7J

Venkel

Res, 4.7 , 1/10W, ±5%,

4.7

ThickFilm, 0805

14

4 SF1, SF2,

SF3, SF4

SJ61A6

3M

HDW, Bumpon Cylindrical Bumper

.312X.215 BLK

15

8 TP1, TP2,

TP3, TP4,

TP5, TP6,

TP7, TP8

151-201-RC

Kobiconn

Testpoint, White, PTH

White

16

1

U1

Si8261BCC-C-IP

Silicon Labs

ISOdriver 3.75 kV emulator input, DIP8, RoHS

Si826X DIP8

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Table 2. Si826x SOIC8 Evaluation Board Bill of Materials

Item Qty

1

1

2

1

Ref

Part #

Supplier

Description

Value

C1

GRM32DF51H106ZA01L Murata

CAP, 10 µF, 50 V,

10 µF

Electronics ­20% to +80%, Y5V, 1210

North America

C2

C1210X7R101-105K

Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1 µF

1210

3

1

C3

C0603X7R101-104M

Venkel

CAP, 0.1 µF, 100 V, ±20%, 0.1 µF

X7R, 0603

4

3 C4, C5, C6 C0805C0G500-201K

Venkel

CAP, 200 pF, 50 V, ±10%, COG, 0805

200 pF

5

1

CR1

BAS16XV2T1G

On Semi

DIO, SWITCH, 200 mA, 75 V, BAS16X SOD523

6

1

D1

US1K-13-F

Diodes Inc. DIO, SWITCH, ULT FAST 1 A US1K 800 V, SMA

7

5 JP1, JP2,

TSW-102-07-T-S

JP3, JP4,

JP5

Samtec

Header, 2x1, 0.1in pitch, Tin Plated

Jumper

8

1

JP6

TSW-102-07-T-D

Samtec

Header, 2x2, 0.1in pitch, Tin Plated

Header 2x2

9

2 JS1, JS2

SNT-100-BK-T

Samtec

Shunt, 1x2, 0.1in pitch, Tin Plated

Jumper Shunt

10

2

P1, P2

TSW-103-07-T-S

Samtec

Header, 3x1, 0.1in pitch, Tin Plated

Header 1x3

11

2

R1, R4

CR0805-10W-2670F

Venkel

Res, 267 , 1/10 W, ±1%,

267

ThickFilm, 0805

12

1

R2

CR0805-10W-000

Venkel

Res, 0 , 2 A, ThickFilm,

0

0805

13 1

R3

CR0805-10W-4R7J

Venkel

Res, 4.7 , 1/10W, ±5%,

4.7

ThickFilm, 0805

14

4 SF1, SF2,

SF3, SF4

SJ61A6

3M

HDW, Bumpon Cylindrical Bumper

.312X.215 BLK

15

8 TP1, TP2,

TP3, TP4,

TP5, TP6,

TP7, TP8

151-201-RC

Kobiconn

Testpoint, White, PTH

White

16

1

U1

Si8261BCC-C-IS

Silicon Labs

ISOdriver 3.75 kV emulator input, SOIC8, RoHS

Si826X SOIC8

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Table 3. Si826x SDIP6 Evaluation Board Bill of Materials

Item Qty

1

1

2

1

Ref

Part #

Supplier

Description

Value

C1

GRM32DF51H106ZA01L Murata

CAP, 10 µF, 50 V,

10 µF

Electronics ­20% to +80%, Y5V, 1210

North America

C2

C1210X7R101-105K

Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1 µF

1210

3

1

C3

C0603X7R101-104M

Venkel

CAP, 0.1 µF, 100 V, ±20%, 0.1 µF

X7R, 0603

4

3 C4, C5, C6 C0805C0G500-201K

Venkel

CAP, 200 pF, 50 V, ±10%, COG, 0805

200 pF

5

1

CR1

BAS16XV2T1G

On Semi

DIO, SWITCH, 200 mA, 75 V, BAS16X SOD523

6

1

D1

US1K-13-F

Diodes Inc. DIO, SWITCH, ULT FAST 1 A US1K 800 V, SMA

7

5 JP1, JP2,

TSW-102-07-T-S

JP3, JP4,

JP5

Samtec

Header, 2x1, 0.1in pitch, Tin Plated

Jumper

8

1

JP6

TSW-102-07-T-D

Samtec

Header, 2x2, 0.1in pitch, Tin Plated

Header 2x2

9

2 JS1, JS2

SNT-100-BK-T

Samtec

Shunt, 1x2, 0.1in pitch, Tin Plated

Jumper Shunt

10

2

P1, P2

TSW-103-07-T-S

Samtec

Header, 3x1, 0.1in pitch, Tin Plated

Header 1x3

11

2

R1, R4

CR0805-10W-2670F

Venkel

Res, 267 , 1/10 W, ±1%,

267

ThickFilm, 0805

12

1

R2

CR0805-10W-000

Venkel

Res, 0 , 2 A, ThickFilm,

0

0805

13 1

R3

CR0805-10W-4R7J

Venkel

Res, 4.7 , 1/10W, ±5%,

4.7

ThickFilm, 0805

14

4 SF1, SF2,

SF3, SF4

SJ61A6

3M

HDW, Bumpon Cylindrical Bumper

.312X.215 BLK

15

8 TP1, TP2,

TP3, TP4,

TP5, TP6,

TP7, TP8

151-201-RC

Kobiconn

Testpoint, White, PTH

White

16

1

U1

Si8261BCD-C-IS

Silicon Labs ISOdriver 5 kV emulator input, Si826X

SDIP6, RoHS

SDIP6

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Table 4. Si826x LGA8 Evaluation Board Bill of Materials

Item Qty

1

1

2

1

Ref

Part #

Supplier

Description

Value

C1

GRM32DF51H106ZA01L Murata

CAP, 10 µF, 50 V,

10 µF

Electronics ­20% to +80%, Y5V, 1210

North America

C2

C1210X7R101-105K

Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1 µF

1210

3

1

C3

C0603X7R101-104M

Venkel

CAP, 0.1 µF, 100 V, ±20%, 0.1 µF

X7R, 0603

4

3 C4, C5, C6 C0805C0G500-201K

Venkel

CAP, 200 pF, 50 V, ±10%, COG, 0805

200 pF

5

1

CR1

BAS16XV2T1G

On Semi

DIO, SWITCH, 200 mA, 75 V, BAS16X SOD523

6

1

D1

US1K-13-F

Diodes Inc. DIO, SWITCH, ULT FAST 1 A US1K 800 V, SMA

7

5 JP1, JP2,

TSW-102-07-T-S

JP3, JP4,

JP5

Samtec

Header, 2x1, 0.1in pitch, Tin Plated

Jumper

8

1

JP6

TSW-102-07-T-D

Samtec

Header, 2x2, 0.1in pitch, Tin Plated

Header 2x2

9

2 JS1, JS2

SNT-100-BK-T

Samtec

Shunt, 1x2, 0.1in pitch, Tin Plated

Jumper Shunt

10

2

P1, P2

TSW-103-07-T-S

Samtec

Header, 3x1, 0.1in pitch, Tin Plated

Header 1x3

11

2

R1, R4

CR0805-10W-2670F

Venkel

Res, 267 , 1/10 W, ±1%,

267

ThickFilm, 0805

12

1

R2

CR0805-10W-000

Venkel

Res, 0 , 2 A, ThickFilm,

0

0805

13 1

R3

CR0805-10W-4R7J

Venkel

Res, 4.7 , 1/10W, ±5%,

4.7

ThickFilm, 0805

14

4 SF1, SF2,

SF3, SF4

SJ61A6

3M

HDW, Bumpon Cylindrical Bumper

.312X.215 BLK

15

8 TP1, TP2,

TP3, TP4,

TP5, TP6,

TP7, TP8

151-201-RC

Kobiconn

Testpoint, White, PTH

White

16

1

U1

Si8261BCD-C-IM

Silicon Labs ISOdriver 5 kV emulator input, Si826X

LGA8, RoHS

LGA8

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7. Ordering Guide

Table 5. Si826x Evaluation Board Ordering Guide

Ordering Part Number (OPN) Si826xDIP8-KIT

Description Si826x ISOdriver Evaluation Board Kit featuring DIP8 Package

Si826xSOIC8-KIT

Si826x ISOdriver Evaluation Board Kit featuring SOIC8 Package

Si826xSDIP6-KIT

Si826x ISOdriver Evaluation Board Kit featuring SDIP6 Package

Si826xLGA8-KIT

Si826x ISOdriver Evaluation Board Kit featuring LGA8 Package

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Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
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References

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