User Manual for woosim systems models including: WSM-M3W, WSMM3W, QDDWSM-M3W, QDDWSMM3W, WSM-M3W Bluetooth Module, WSM-M3W Module, Bluetooth Module, Module

M3W specification V1.1

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User Manual

WOOSIM SYSTEMS INC. WSM-M3W QDDWSM-M3W QDDWSMM3W wsm m3w


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Ref. No

:

Rev. No :

Issued Date :

M3W-2022-0506 1.1 2022.05.06

Specifications

Product Name : Bluetooth Module

Model No.

: WSM-M3W

Woosim Systems Inc. 60, Sandan-ro 388beon-gil, Galsan-myeon, Hongseong-gun, Chungcheongnam-do, Korea TEL : +82-41-339-3700 FAX : +82-41-339-3701 E-mail: woosimsystems@woosim.com

Change History

Rev.

Date

1.1

2022.5.6

Author jpaik

Reason for Change Initial version

Woosim Systems Inc.

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Contents
1. OVERVIEW ............................................................................................................................................... 4
1.1. GENERAL DESCRIPTION ................................................................................................................................ 4 1.2. SPECIFICATION ............................................................................................................................................ 5 1.3. APPLICATIONS ............................................................................................................................................. 5 1.4. BLOCK DIAGRAM .......................................................................................................................................... 6 1.5. MODULE SIZE .............................................................................................................................................. 6 1.6. PIN DESCRIPTION ........................................................................................................................................ 7 1.7. FACTORY SETTINGS...................................................................................................................................... 7
2. USAGE ...................................................................................................................................................... 8
2.1. CONNECT TO EXTERNAL HARDWARE............................................................................................................... 8 2.2. OPERATION FOR BR/EDR ............................................................................................................................ 8 2.3. OPERATION FOR LOW ENERGY...................................................................................................................... 9
3. BLE OPERATION DESCRIPT .................................................................................................................. 9
3.1. BLE SETUP ................................................................................................................................................. 9 3.2. BLE AND BR/EDR OPERATION ..................................................................................................................... 9 3.3. BLE SERVICE AND UUID .............................................................................................................................. 9
4. ELECTRICAL SPECIFICATION ............................................................................................................. 11
4.1. ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 11 4.2. RECOMMENDED OPERATING CONDITIONS AND DIGITAL I/O CHARACTERISTICS ................................................... 11 4.3. OPERATION MODE CURRENT CONSUMPTION .................................................................................................. 11
5. RF CHARACTERISTICS ........................................................................................................................ 12
5.1. TRANSMITTER (CLASS 2) ............................................................................................................................ 12 5.2. RECEIVER ................................................................................................................................................. 13 5.3. BLE RF SPECIFICATIONS ........................................................................................................................... 13
6. INTERFACE ............................................................................................................................................ 14
6.1. VDD IN..................................................................................................................................................... 14 6.2. UART (PERIPHERAL UART)....................................................................................................................... 14 6.3. GPIO ....................................................................................................................................................... 14 6.4. SPI .......................................................................................................................................................... 14 6.5. PRIMARY UART ........................................................................................................................................ 14
7. HANDLING PRECAUTIONS .................................................................................................................. 15
7.1. GENERAL .................................................................................................................................................. 15 7.2. RF PERFORMANCE .................................................................................................................................... 15
8. ANTENNA ............................................................................................................................................... 16
8.1. GENERAL SPECIFICATION ............................................................................................................................ 16 8.2. MATCHING ................................................................................................................................................ 16 8.3. V.S.W.R................................................................................................................................................... 16 8.4. ANT-VSWR, RETURN LOSS, SMITH CHART.................................................................................................. 17
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Woosim Systems Inc.
1. Overview
WSM-M3W is a compact Bluetooth module satisfies Bluetooth core specification version 5.2. 13.00mm
1.1. General description
 Support Bluetooth core 5.2 BR/EDR/BLE and integrated class 1 PA  Integrated 4Mb serial flash  Support Bluetooth class 2  Support up to 2 UART port  LE data rate up to 1 Mbps  BLUETOOTH SMART READY : Supports BLE and BR/EDR  Supports Adaptive Frequency Hopping(AFH)  Simply replace wired serial cable over Bluetooth device  Integrated antenna(No need external antenna)  User specific command support  After boot, entering SPP Server/BLE Peripheral connecting ready state  Support low power mode. Sniff mode support
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1.2. Specification
Bluetooth core specification version 5.2 Radio frequency : 2,400 ~ 2,483 MHz Support protocol : L2CAP, RFCOMM, SDP, ATT Support profile(BR/EDR) : GAP, SDAP, DIP, SPP Support profile(BLE) : GATT, DIS, BLE-SPP (Proprietary protocol) Output power : Power class 2 RX sensitivity : Normal -93.5dBm Maximum data rate : 3Mbps (BR/EDR. Normally use 1.5Mbps) Operating voltage : 3.3V Temperature range : -30 ~ +105 (storage temperature : -40 to 150) Size : 13.0mm X 19.0mm X 1.9mm PCB Thickness : 0.8 T
1.3. Applications
Portable printer Portable scanner and bar code POS terminal Wireless data collection device Medical devices Industrial equipment, factory automation equipment Mobile phone, Computers, PDA
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1.4. Block diagram

Woosim Systems Inc.

BPF

CYW20706

X-Tal 20MHz Serial F4lMasBh

UART

Vin 3V3

1.5. Module size
Top View
Antenna Aux Holes(Pads) for PCB Mounting
Bluetooth Chip

13.0 max

(Unit : mm)

19.0 max

Connection Pins(Pads)

6

1

1. PIO_5 2. VCC 3. Tx 4. Rx 5. GND 6. PIO_6

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1.6. PIN description

Number 1 2 3 4 5 6

Pin PIO_5 VCC TX RX GND PIO_6

I/O Output Power Output Input Ground Output

Description GPIO (reserved) 3.3V UART TX line UART RX line Ground GPIO (reserved)

Woosim Systems Inc.

1.7. Factory settings Configuration of Bluetooth parameters - Factory setting

No

Parameter

1 Local Device Name

2 BLE Device Name

2 Bluetooth Service Name

3 Bluetooth Device Address

4 PIN Code

5 UART Baud Rate

6 UART Parity

7 UART Stop Bit

8 UART Flow Control

9 Class Of Device

10 Security Mode

11 Operating Mode 12 Page Scan Mode 13 Inquiry Scan Mode 14 Link Timeout

Value "WOOSIM BR/EDR" "WOOSIM BLE(V5.2)" "BT SERIAL" "1C B8 57 08 00 00" ~ "1C B8 57 FF FF FF" "1234" (ASCII) 57,600bps None 1 None Printer (0x040680) BR/EDR : Level-3 (Using PIN Code) BLE : Just Works Active and Sniff Mode Support Transparent Mode When connected : Non-connectable When disconnected : connectable When connected : Non-discoverable When disconnected : discoverable Link Supervision Timeout = 0.625ms X 0x7D00 = 20sec

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2. Usage
2.1. Connect to external hardware
To apply the M3W Bluetooth serial module to an existing product, connect Tx (Pin 3) to the receive data (RD) pin of the microcontroller as shown in the figure below, and connect the transmit data (TD) pin of the microcontroller to Rx (Pin 4) connect to The M3W model is used when directly connected to the host CPU with 3.3V logic level.

M3W Bluetooth Serial Module
VCC
Tx

+3.3V 2 3

4 Rx
5 GND

Host Controller Micro-Controller
RD TD

2.2. Operation for BR/EDR
M3W Bluetooth serial module operates as follows.  Standby mode: When power is applied, the internal initialization procedure is carried out and then it enters standby mode and waits for a Bluetooth pairing request from the outside.  Bluetooth connection: If there is a Bluetooth pairing request from the outside in standby mode, the pairing operation is performed. The pairing process includes checking whether a legitimate device requests a connection using a 4-digit PIN code. When pairing is established, it enters a mode in which other devices do not accept pairing request (If the connected device supports BT2.1 or higher, SSP is supported. In this case, SSP mode is based on Just Works mode).  Data reception: When data is received from the connected Bluetooth device, it is output to the host controller through the Tx (Pin 3) port.  Data transmission: When data is input from the Host Controller to the Rx (Pin 4) port, it is transmitted to the connected Bluetooth device.
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2.3. Operation for Low Energy
The M3W Bluetooth serial module operates as follows.  Standby mode: Enter into BLE ADVERTISING MODE and execute advertising in low power mode.  BLE connection: CENTRAL device detects this and connects BLE LINK. Profiles supported by BLE are as follows.  DEVICE INFORMATION PROFILE  SERIAL SERVICE  Since it supports dual mode operation, 2.2 and 2.3 are supported at the same time. Only one connection is allowed at a time.

3. BLE Operation descript

3.1. BLE setup

In BLE and BR/EDR operation, BR/EDR mode operation takes precedence over BLE operation. In other words, it is possible to operate only in BR/EDR mode by turning off the BLE operation if necessary. The method of stopping the operation of BLE can be written by changing the setting of the internal memory (PS KEY) value, and it can also be changed through the UART command when the Bluetooth link is not connected.

3.2. BLE and BR/EDR operation

In the state in which BLE operation is enabled, it is discovered as two devices from the outside. (DUAL MODE operation). If a link is connected with priority among BLE or BR/EDR, the other cannot be used. That is, when the BLE link is connected, the BR/EDR link cannot be used, and when the BR/EDR linker is connected, the BLE link cannot be connected.

3.3. BLE service and UUID

The services that can be used by connecting BLE are as follows.

 Device Information Service : This profile is supported by the Bluetooth SIG. In general,

general information related to the device can be read.

 Serial Profile Service : This is an internal profile that is not supported by Bluetooth. According

to the recommendation of the Bluetooth SIG, 128 bits UUID is used, and it is divided into two

characteristics: transmission and reception.

Description

Primary Service

Characteristic

Device Information Service

180A

 SYSTEM ID

2A23

 MODEL NUMBER

2A24

 SERIAL NUMBER

2A25

 FIRMWARE REVISION

2A26

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 HARDWARE REVISION  SOFTWARE REVISION  MANUFACTURER NAME  PNP ID SERIAL SERVICE
 TX characteristic  RX characteristic

2A27 2A28 2A29 2A50
A9FE5E12DE714020B2CF8BF76 4FB0A8D A9FE5E12DE714020B2CF8BF765FB0A8D A9FE5E12DE714020B2CF8BF766FB0A8D
<Table 3-1 : BLE UUID>

Description

VALUE

Device Information Service

 SYSTEM ID

N/A

 MODEL NUMBER

"M3W"

 SERIAL NUMBER

N/A

 FIRMWARE REVISION

"FW-0407"

 HARDWARE REVISION N/A

 SOFTWARE REVISION

0401

 MANUFACTURER NAME "WOOSIM"

 PNP ID

N/A

 Certification Data

N/A

<Table 3-2 : BLE DEVICE INFORMATION>

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4. Electrical specification
4.1. Absolute maximum ratings

Ratings Supply voltage Operating Temperature
Storage Temperature
ESD tolerance HBM1 ESD tolerance MM2 ESD tolerance CDM3
1. Human Body Model 2. Machine Model 3. Charged Device Model

Symbol VBAT

Min

Max

Unit

3.0

3.6

V

-30

105



-40

150



-2000

2000

V

-100

100

V

-500

500

V

4.2. Recommended operating conditions and digital I/O characteristics

Characteristics

Supply voltage

Digital I/O Input_Low

VDDIO=1.8V VDDIO=3.3V

Digital I/O Input_High
Digital I/O Output_Low Digital I/O Output_High
Input capacitance (VDDMEM domain)

VDDIO=1.8V VDDIO=3.3V
-

Symbol

Min

Max

Unit

VDDIO

3.1

3.5

V

-

0.6

V

VIL

-

0.8

V

1.1

-

V

VIH

2.0

-

V

VOL

-

0.4

V

VOH

VDDIO-0.4V

-

V

CIN

0.4

pF

4.3. Operation mode current consumption

4.3.1 Bluetooth, BLE, BR and EDR Current Consumption, Class1

Mode 3DH5/3DH5 BLE BLE BLE ADV

Remarks -
Connected 600 ms interval Unconnectable 1.00 sec

Typ

Unit

38.2

mA

211

uA

176

uA

BLE Scan

No devices present. A 1.28-sec interval with 11.25 ms scan window.

355

uA

DMx/DHx

DM1/DH1

-

32.15

mA

DM3/DH3

-

38.14

mA

DM5/DH5

-

38.46

mA

HID OFF Page scan

Deep sleep Periodic scan rate is 1.28 sec

3

uA

486

uA

Receive

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1Mbps

Peak current level during reception of a basic-rate packet.

26.4

mA

EDR

Peak current level during the reception of a 2 or 3 Mbps rate packet

26.4

mA

Sniff slave

11.25ms

-

4.95

mA

22.5ms

-

2.6

mA

495ms

Based on one attempt and no timeout.

254

uA

Transmit

1Mbps

Peak current level during the transmission of a basic-rate packet:

57

mA

EDR

GFSK output power = 10 dBm. Peak current level during the transmission of a 2 or 3 Mbps rate

50

mA

packet. EDR output power = 8 dBm.

4.3.2 Bluetooth and BLE Current Consumption, Class 2 (0 dBm)

Mode 3DH5/3DH5 BLE BLE ADV

Unconnectable 1.00 sec

Remarks

Typ

Unit

33

mA

174

uA

BLE Scan

No devices present. A 1.28-sec interval with 11.25 ms scan window.

368

uA

DMx/DHx

DM1/DH1

-

27.5

mA

DM3/DH3

-

31.4

mA

DM5/DH5

-

32.4

mA

5. RF Characteristics
5.1. Transmitter (Class 2)
Specification Frequency Range Output transmit power Transmit power density Transmit power control 20dB bandwidth for modulated carrier
Adjacent channel transmit power

Condition

Maximum Modulation Initial carrier frequency tolerance Carrier frequency Drift
TX Spurious Emissions

One slot packet(DH1) Three slot Packet(DH3)
Five slot packet(DH5) 30MHz ~ 1GHz 1GHz ~12.75GHz
12

Min

Typ

Max

Unit

2402

2480

MHz

-6

4

dBm

4

dBm

2

8

dBm

1

MHz

-20

dBm

-40

dBm

-40

dBm

140

163

175

kHz

115

kHz

80

%

-75

75

kHz

-20

-40

kHz

-40

-36

-30

dBm

1.8GHz ~1.9GHz 5.15GHz ~5.3GHz

Woosim Systems Inc.
-47 -47

5.2. Receiver
Specification Sensitivity at 0.1% BER for all packet Maximum input level
C/I performance
Out-of-Band, Blocking Performance
Intermodulation Performance RX Spurious Emissions

Condition Single slot packets GFSK, 1 Mbps co-channel
1MHz (Adjacent channel)
2MHz (2nd Adjacent channel)
3MHz (3rd Adjacent channel)
30MHz ~ 2000MHz
2000MHz ~ 2400MHz
2500MHz ~ 3000MHz
3000MHz ~ 12.75GHz Df = 5 MHz 30MHz ~ 1GHz
1GHz ~12.75GHz

Min Typ Max -83 -20 11
0
-30
-40 -10
-27
-27
-10
-39 -57
-47

Unit dBm dBm
dB
dBm
dBm dBm

5.3. BLE RF Specifications

Specification Frequency Range TX Output power RX Sensitivity
Modulation Characteristic

Condition GFSK, 1 Mbps, 0.1%BER

Min

Typ

Max

2402

2480

10

-95

225

255

275

99

0.8

Unit MHz dBm dBm kHz
%
%

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6. Interface
6.1. VDD in
Input voltage. Power supply should be support 3.3V. MIN : 1.62V TYP : 3.3V MAX : 3.6V (Max 3.795V)
6.2. UART (Peripheral UART)
Peripheral UART connecting to host MCU.  HW FIFO : TX/RX 256 bytes  Min Baud Rate : 2400 bps  Max Baud Rate : 3 Mbps  Default Baud Rate : 57600 bps
MAX : 3.6V (Max 3.795V)
6.3. GPIO
Up to 2 GPIO. Set HIGH when Bluetooth link has been connected. Otherwise set to LOW.
6.4. SPI
Up to two SPI support. SPI connection is not allows in M3W. SPI is dedicated to communicate to Serial Flash.
6.5. Primary UART
Dedicated for firmware download. Enable HW flow control. Only used factory production.
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7. Handling Precautions
7.1. General
The points to be noted when handling the M3W Bluetooth serial module are as follows. When handling the module, provide anti-static measures to avoid damage by static electricity. Use a large enough current source to ensure sufficient current is supplied to the power input stage. Be careful not to input more than the rated power voltage or RF signal.
7.2. RF Performance
In order to maximize the RF performance of the product equipped with the M3W Bluetooth serial module, the PCB design should be done with the following considerations in mind. Stable RF performance can be expected only when sufficient ground area is secured on the main PCB. Having objects (conductors or non-conductors) close to the antenna is not good as it interferes with the antenna radiation and distorts the pattern. In the case of conductors, it should be at least 10mm apart from the antenna, and in the case of non-conductors such as plastic fixtures, it should be separated by at least 5mm. The main PCB should be designed so that the ground plane of the main PCB does not invade the antenna beyond the boundary between the module ground plane and the antenna as shown in the figure below.
Location of module on the main PCB

remove ground on PCB

Main PCB board

remove ground on PCB

Main PCB ground
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8. Antenna
8.1. General specification
8.2. Matching
6.8nH matching circuit.

Woosim Systems Inc.

8.3. V.S.W.R
Free Space environment.
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8.4. ANT-VSWR, Return loss, Smith chart

Woosim Systems Inc.

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FCC Regulation · Part 15.19 Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
· Part 15.105 Statement(Class B) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. · Part 15.21 Statement Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device must not be co-located or operating in conjunction with any other antenna or transmitter.
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Regulatory notice to host manufacturer according to KDB 996369 D03 OEM Manual v01 · List of applicable FCC rules This module has been granted modular approval as below listed FCC rule parts. - FCC Rule parts 15.247 · Summarize the specific operational use conditions The OEM integrator should use equivalent antennas which is the same type and equal or less gain then an antenna listed in this instruction manual. · RF exposure considerations The module has been certified for integration into products only by OEM integrators under the following condition: 1)The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator(antenna) and all persons at all times. 2)The transmitter module must not be co-located or operating in conjunctionwith any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. OEM integrators should provide the minimum separation distance to end-users in their end-product manuals. · Antennas List This module is certified with the following antenna. 1) Type: Chip Antenna 2) Max. peak Antenna gain : -1.07 dBi (2400 ­ 2485 MHz) Any new antenna type, higher gain than listed antenna should be met the requirements of FCC rule 15.203 and 2.1043 as permissive change procedure.
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Label and compliance information · End Product Labeling The module is labeled with it sown FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: - Contains FCC ID: QDDWSM-M3W - Contains IC: 28847-WSMM3W · Information on test modes and additional testing requirements OEM integrator is still responsible for testing their end-product for any additional Compliance requirements required with this module installed(for example, digital device emissions, PC peripheral requirements, additional transmitter in the host, etc.). · Additional testing, Part 15 Subpart B disclaimer The final host product also requires Part 15 subpart B compliance testing with the modular transmitter installed to be properly authorized for operation as a Part 15 digital device.
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ISED Regulation · RSS-GEN, Sec. 7.1.3­(licence-exempt radio apparatus) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This devicemay not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doitpas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
· RF Exposure The antenna (or antennas) must be installed so as to maintain at all times a distance minimum of at least 20 cm between the radiation source (antenna) and any individual. This device may not be installed or used in conjunction with any other antenna or transmitter. L'antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance minimum de au moins 20 cm entre la source de radiation (l'antenne) et toute personne physique.
· É tiquetage du produit final (IC) Le module LAIWB3 est é tiqueté avec sa propre identification FCC et son propre numé ro de certification IC. Si l'identification FCC et le numé ro de certification IC ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre dispositif, la partie externe du dispositif dans lequel le module est installé devra é galement pré senter une é tiquette faisant ré fé rence au module inclus. Dans ce cas, le produit final devra être étiqueté sur une zone visible avec les informations suivantes : - Contient module émetteur identification FCC ID: QDDWSM-M3W - Contient module émetteur IC : 28847-WSMM3W
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