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Instruction Manual for Shenzhen Neewer Technology Co Ltd models including: IB725L-30B1 Bluetooth Module Dual-Mode BT5 Module, IB725L-30B1, Bluetooth Module Dual-Mode BT5 Module, Module Dual-Mode BT5 Module, Dual-Mode BT5 Module, BT5 Module, Module
Shenzhen Neewer Technology Co., Ltd IB725L-30B1 Bluetooth module 2ANIV-IB725L-30B1 2ANIVIB725L30B1 ib725l 30b1
IB725L-30B1 Bluetooth Module by Shenzhen Neewer
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DocumentDocumentwww.sziton.com IB725L-30B1 V1.3 - Dec., 2023 Bluetooth module IB725L-30B1 Dual-Mode BT5 Module DISCLAIMER AND COPYRIGHT NOTICE Information in this document, including URL references, is subject to change without notice. This document is provided "As if" with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any purpose, or any warranty otherwise arising out of any proposal, specification or samples. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Bluetooth logo and symbol belong to the Bluetooth SIG Inc. The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright ITON Technology Corp. All rights reserved. www.sziton.com Table of Contents IB725L-30B1 V1.3 Dec., 2023 1. Device Overview .............................................................................................................................3 1.1 Features .....................................................................................................................................................3 1.2 Applications ............................................................................................................................................. 3 1.3 Descriptions ............................................................................................................................................. 4 1.4 Functional Block Diagram ....................................................................................................................5 2. Pin Configuration and Functions ...............................................................................................5 2.1 Module Pin Diagram ............................................................................................................................. 5 2.2 Pin Functions ........................................................................................................................................... 6 3. Specifications .................................................................................................................................. 8 3.1 Absolute Maximum Ratings ................................................................................................................ 8 3.2 RF Characteristics ................................................................................................................................... 8 3.2.1 Transmitter RF Parameters ....................................................................................................................... 8 3.2.2 Receiver RF Parameters ............................................................................................................................. 9 3.2.3 Antenna Requirements............................................................................................................................10 3.3 Power Consumption ............................................................................................................................10 3.3.1 SPP (Under Dual-mode) ......................................................................................................................... 10 3.3.2Low Energy (Under Dual-mode) ........................................................................................................... 11 3.3.3 Low Power Mode Current ConsumptionUnder UART ......................................11 4. Application, Implementation, and Layout ............................................................................ 11 4.1 Application .............................................................................................................................................11 4.2 Typical Application Schematic Diagram ........................................................................................12 4.3 Layout Guideline .................................................................................................................................. 12 5. Mechanical and Package ........................................................................................................... 13 5.1 Recommended PCB Footprint ..........................................................................................................13 5.2 Packaging Information .......................................................................................................................14 6. Thermal Reflow ............................................................................................................................ 14 7. Ordering Information .................................................................................................................15 8. Revision History ........................................................................................................................... 15 ITON Technology Corp. Page 2 of 15 www.sziton.com 1. Device Overview 1.1 Features V5.0+BR+EDR+BLE specification Provides +8dbm transmitting power Profiles supported: GAP\SMP\ATT\GATT\SPP\HID-over-GATT profile Receiver with -92dBm sensitivity UART or OTA firmware upgrade Serial port command for applications One IIC interface supports host and device mode 2M internal-flash 1.2 Applications Bluetooth SPP or BLE to RS232 (RS485) serial data conversion Bluetooth wireless data transmission Medical and industrial telemetry Portable printers Barcode scanning devices Mobile POS devices Smart appliances Industrial automation Custom Bluetooth audio devices IB725L-30B1 V1.3 Dec., 2023 ITON Technology Corp. Page 3 of 15 www.sziton.com IB725L-30B1 V1.3 - Dec., 2023 1.3 Descriptions The Module IB725L has a notable merit that its firmware supports concurrent Bluetooth SPP and GATT connections. It establishes a Bluetooth bidirectional communication channel which is between the application MCU and the mobile phone through the UART interface. The application MCU can send a corresponding command to enable the Bluetooth module and to set it into different modes, then to send and receive communication data at the SPP or GATT level.The MCU can also read the mode status of the module through serial commands. This module is designed with ITON@IN725L dual mode Bluetooth 5.0 SoC. IB725L features 96 MHz 32-Bit ARM-core, excellent receiving sensitivity down to -92 dBm (BLE GFSK), integrated PA to support Class 1 Tx power up to 8 dBm. These two RF parameters contribute to its best in class link budget to enable long Bluetooth communication distance around 100 meters or even farther. As a dual mode Bluetooth module, it can realize both GATT and SPP connections concurrently, which provide the best interoperability for various iOS and Android mobile devices. It supports both BR (2 Mbps) and EDR (3 Mbps) when running SPP. These high Classic Bluetooth data rate provides high throughput, enabling applications which require higher through than what BLE can provide. Its raw data through running SPP can reach up to 1 Mbps. This module also supports Bluetooth audio profiles including but not limited to A2DP, HFP, and AVRCP. An external audio codec can be flexibly connected via PCM interface to drive a speaker and a microphone. This module can also support iAP2 and HomeKit for MFi licensed developers. The module comes with a set of AT commands via UART interface for setting up a bidirectional Bluetooth data link easily between an application MCU and mobile phones. DISCLAIMER AND COPYRIGHT NOTICE Information in this document, including URL references, is subject to change without notice. This document is provided "As if" with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any purpose, or any warranty otherwise arising out of any proposal, specification or samples. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Bluetooth logo and symbol belong to the Bluetooth SIG Inc. The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright ITON Technology Corp. All rights reserved. www.sziton.com 1.4 Functional Block Diagram IB725L-30B1 V1.3 Dec., 2023 Figure 1.IB725L-30B1 Functional Block Diagram 2. Pin Configuration and Functions 2.1 Module Pin Diagram ITON Technology Corp. Page 5 of 15 www.sziton.com IB725L-30B1 V1.3 Dec., 2023 2.2 Pin Functions Pin Name 1 GND 2 VDD 3 VDDIO 4 LDOIN 5 NC 6 NC ITON Technology Corp. Figure 2.IB725L-30B1 Pin Diagram Description Ground Power Power Power NC NC Ground Typical Power Supply: DC 2.4 V~4.5 V InputDC1.8V-3.6VVDD=2.4V-3.6VShort it with VDD InputDC5Vused to chargerecommend NC / / Page 6 of 15 www.sziton.com 7 Wake up I/O 8 NC NC 9 PA4 I/O 10 PA3 I/O 11 SCL I/O 12 SDA I/O 13 UART1_CTS I/O 14 PA0 I/O 15 UART1_RTS I/O 16 USB0DM I/O 17 USB0DP I/O 18 PB7 I/O 19 RST I 20 UART1_RXD I 21 UART1_TXD O 22 PB6 I/O 23 SPI_DI I/O ITON Technology Corp. GPIO Wake up from sleep mode / GPIO PWM1: Timer1 PWM Output GPIO PWMCH0L ADC1: ADC Channel 1 GPIO I2C_SCL GPIO I2C_SDA GPIO UART1_CTS GPIO PWMCH0H GPIO UART1_RTS GPIO USB0DM for Download GPIO USB0DP for Download GPIO External reset signal input, active low GPIO UART1_RX GPIO UART1_TX GPIO ADC12: ADC Channel 12 TMR3CK GPIO SPI_DI IB725L-30B1 V1.3 Dec., 2023 Page 7 of 15 www.sziton.com IB725L-30B1 V1.3 Dec., 2023 24 SPI_CLK 25 SPI_DO 26 PB3 27 PB2 28 PB1 29 GND 30 BT_RF I/O I/O I/O I/O I/O Ground O GPIO SPI_CLK GPIO SPI_DO GPIO PWMCH2L GPIO PWMCH2H GPIO PWM2: Timer2 PWM Output ADC7: ADC Channel 7 Ground RF pin connecting to an antenna 3. Specifications 3.1 Absolute Maximum Ratings Caution! The absolute maximum ratings in the following table indicates voltages levels where permanent physical damage to the device can occur, even if these limits were exceeded for only a brief duration. Parameter Min. VDD_3V3 -0.3 Ambient Temperature -20 Storage Temperature -65 3.2 RF Characteristics 3.2.1 Transmitter RF Parameters Basic Data Rate Parameter RF Transmit Power RF Power Control Range ITON Technology Corp. Specifications Unit Typ. Max. 3.3 4.5 V 25 +65 - +150 Min. Typ. Max. Unit Test Conditions 0 8 dBm 20 dB Page 8 of 15 www.sziton.com 20dB Bandwidth Adjacent Channel Transmit Power +2MHz -2MHz +3MHz -3MHz IB725L-30B1 V1.3 Dec., 2023 950 KHz 25 -40 dBm Power Supply -38 dBm VBAT=5V -44 10 dBm 2441MHz -35 20 dBm Enhanced Data Rate Parameter Relative Power DEVM RMS /4 DQPSK Modulation Accuracy DEVM RMS DEVM 99% DEVM Peak Adjacent Channel Transmit Power +2MHz -2MHz +3MHz -3MHz Min Typ -1 7 12 17 -40 -38 -44 -35 Max Unit Test Conditions dB % % 25, Power Supply % VBAT=5V dBm 2441MHz dBm dBm dBm Note: All specifications are for industrial temperature. All specifications are single-ended. Unused input are left open, Maximum value is the value required for Bluetooth qualification. Meets this spec using a front-end bandpass filter. 3.2.2 Receiver RF Parameters Basic Data Rate Parameter Sensitivity Co-channel Interference Rejection Adjacent Channel Interference +1MHz -1MHz Min Typ -92 -9 +5 +2 Max Unit dBm dB dB dB Test Conditions 25, Power Supply VBAT=5V 2441MHz ITON Technology Corp. Page 9 of 15 www.sziton.com Rejection +2MHz +37 dB -2MHz +36 dB +3MHz +40 dB -3MHz +35 dB IB725L-30B1 V1.3 Dec., 2023 Enhanced Data Rate Parameter Sensitivity Co-channel Interference Rejection +1MHz Adjacent Channel Interference Rejection -1MHz +2MHz -2MHz +3MHz -3MHz Min Typ -92 -9 +5 +2 +37 +36 +40 +35 Max Unit dBm dB dB dB dB dB dB dB Test Conditions 25, Power Supply VBAT=5V 2441MHz Note: All specifications are single ended. Unused inputs are left open. All specifications, except typical, are for industrial temperature. 3.2.3 Antenna Requirements The module requires to configure with external 2.4G Antenna. 3.3 Power Consumption 3.3.1 SPP (Under Dual-mode) Operation Mode Starting current Operating current Broadcast power consumption Not-connect current AVG Current 15.5mA 5.2mA 1.1mA 0.9mA Note 500 ms broadcast interval ITON Technology Corp. Page 10 of 15 www.sziton.com 3.3.2Low Energy (Under Dual-mode) Operation Mode Standby current AVG Current 150uA Minimum Standby current 60uA Soft-Shutdown 2.5uA IB725L-30B1 V1.3 Dec., 2023 Note Connect modesniff Connect mode 2s broadcast intervalDifferent mobile phones have different power consumptionRange50-105uA 3.3.3 Low Power Mode Current ConsumptionUnder UART Parameter Pairing current Connecting current RX current TX current AVG Current 780uA 720uA 3mA 3.8mA Note Continuously sending broadcasts Stay connected 10 ms broadcast interval 10 ms broadcast interval 4. Application, Implementation, and Layout 4.1 Application IB725L Figure 3 .Transparent Transmission Block Diagram ITON Technology Corp. Page 11 of 15 www.sziton.com 4.2 Typical Application Schematic Diagram IB725L-30B1 V1.3 Dec., 2023 Figure 4.Typical Application Schematic Diagram of IB725L-30B1 4.3 Layout Guideline 1. Keep RF traces with 50 Ohm impedance. 2. The antenna requires enough clearance area. 3. The filter capacitor should be as close as possible to the module. 4. Do not place strong interference lines under the module. ITON Technology Corp. Page 12 of 15 www.sziton.com 5. Mechanical and Package 5.1 Recommended PCB Footprint IB725L-30B1 V1.3 Dec., 2023 Figure 5.Recommended PCB Footprint of IB725L-30B1 Note: 1. The RF trace on the product board connecting to the RF pin needs to be controlled at 50 Ohm impedance. Normally an L/C matching network is needed in between. 2. The decoupling capacitor for VDD_3V3 input should be as close to the module as possible. 3. Strong interference line at the bottom of the module should be forbidden. 4. The whole Thickness is 2.8mm2.17mm refers to the thickness of components height and pcb thickness. ITON Technology Corp. Page 13 of 15 www.sziton.com 5.2 Packaging Information IB725L-30B1 V1.3 Dec., 2023 Figure 6.Brief Packaging Process of IB725L-30B1 Modules 6. Thermal Reflow Referred to IPC/JEDEC standard. Peak temperature: <250°C Number of times: 2 Figure 7.Recommended Reflow for Lead Free Solder Note: The module is recommended not to go through reflow oven twice; ITON Technology Corp. Page 14 of 15 www.sziton.com 7. Ordering Information Part NO. IB725L-30B1 Working Voltage 2.4V~4.5V IB725L-30B1 V1.3 Dec., 2023 ANT Not included Shielding Cover Remark Not included 8. Revision History Version Change Content V1.0 Initial Version V1.1 Update power consumption parameters V1.2 Add module appearance diagram V1.3 Add Low Power Mode Current Reviser Chris Chris Leron Leron Date 2022.11.14 2023.04.07 2023.09.13 2023.12.06 ITON Technology Corp. Page 15 of 15 FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursua nt to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful inte rference in a residential installation. This equipment generates uses and can radiate radio frequency energy a nd, if not installed and used in accordance with the instructions, may cause harmful interference to radio com munications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turn ing the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help important announcement Important Note: Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/Canada. This device is intended only for OEM integrators under the following conditions: 1.The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2.The transmitter module may not be co-located with any other transmitter or antenna, Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The final end product must be labeled in a visible area with the following" Contains FCC ID: 2ANIV-IB725L-30B1 " Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. s manual Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01 2.2List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3Specific operational use conditions This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. 2.4Limited module procedures Not applicable 2.5Trace antenna designs Not applicable 2.6RF exposure considerations This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 2.7Antennas This radio transmitter FCC ID:2ANIV-IB725L-30B1 has been approved by Federal Communications Commission to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. 2.8Label and compliance information The final end product must be labeled in a visible area with the following" Contains FCC ID:2ANIV-IB725L-30B1". 2.9Information on test modes and additional testing requirements Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when the module is installed in the host. 2.10Additional testing, Part 15 Subpart B disclaimer Host manufacturer is responsible for compliance of the host system with module installed with all other applicable requirements for the system such as Part 15 B. 2.11Note EMI Considerations Host manufacture is recommended to use D04 Module Integration Guide recommending as "best practice" RF design engineering testing and evaluation in case non-linear interactions generate additional non-compliant limits due to module placement to host components or properties. 2.12How to make changes This module is stand-alone modular. If the end product will involve the Multiple simultaneously transmitting condition or different operational conditions for a stand-alone modular transmitter in a host, host manufacturer have to consult with module manufacturer for the installation method in end system. According to the KDB 996369 D02 Q&A Q12, that a host manufacture only needs to do an evaluation (i.e., no C2PC required when no emission exceeds the limit of any individual device (including unintentional radiators) as a composite. The host manufacturer must fix any failure. ISED Statement English: This device complies with Industry Canada license exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, a nd (2) This device must accept any interference, including interference that may cause undesired operation of the device. The digital apparatus complies with Canadian CAN ICES 3 (B)/NMB 3(B). French: Le présentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationestautorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareildoit accepter tout brouillageradi oélectriquesubi, mêmesi le brouillageest susceptible d'encompromettre le fonctionnement. l'appareil numérique du ciem conforme canadien peut 3 (b) / nmb 3 (b). This device meets the exemption from the routine evaluation limits in section 2.5 of RSS 102 and compliance with RSS 102 RF exposure, users can obtain Canadian information on RF exposure and compliance. cet appareil est conforme à l'exemption des limites d'évaluation courante dans la section 2.5 du cnr - 102 et conformité avec rss 102 de l'exposition aux rf, les utilisateurs peuvent obtenir des données canadiennes sur l'exposition aux champs rf et la conformité. This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Cet équipementdoit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre corps. ISED Modular Usage Statement NOTE 1: When the ISED certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use the wording Contains transmitter module IC: 22889-IB725L30B1 or Contains IC: 22889-IB725L30B1 . NOTE 1: Lorsque le numéro de certification ISED n'est pas visible lorsque le module est installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Cette étiquetteextérieure peut être libellée Contient le module émetteur IC: 22889-IB725L30B1 ou Contient IC: 22889-IB725L30B1.