ESP32-C3-MINI-1 and ESP32-C3-MINI-1U Datasheet
Module Overview
This document provides detailed specifications for the ESP32-C3-MINI-1 and ESP32-C3-MINI-1U modules. It is recommended to check the latest version of this document via the provided URL or QR code.
https://espressif.com/sites/default/files/documentation/esp32-c3-mini-1_datasheet_en.pdf
Features
CPU and On-Chip Memory
- ESP32-C3FH4 or ESP32-C3FN4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz
- 384 KB ROM
- 400 KB SRAM (16 KB for cache)
- 8 KB SRAM in RTC
- 4 MB embedded flash
Wi-Fi
- IEEE 802.11 b/g/n-compliant
- Center frequency range of operating channel: 2412~2484 MHz
- Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band
- 1T1R mode with data rate up to 150 Mbps
- Wi-Fi Multimedia (WMM)
- TX/RX A-MPDU, TX/RX A-MSDU
- Immediate Block ACK
- Fragmentation and defragmentation
- Transmit opportunity (TXOP)
- Automatic Beacon monitoring (hardware TSF)
- 4 x virtual Wi-Fi interfaces
- Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode. Note: When ESP32-C3 series scans in Station mode, the SoftAP channel will change along with the Station channel.
- Antenna diversity
- 802.11mc FTM
Bluetooth
- Bluetooth LE: Bluetooth 5, Bluetooth mesh
- Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
- Advertising extensions
- Multiple advertisement sets
- Channel selection algorithm #2
Peripherals
- GPIO, SPI, UART, I2C, I2S, remote control peripheral, LED PWM controller, general DMA controller, TWAI® controller (compatible with ISO 11898-1), USB Serial/JTAG controller, temperature sensor, SAR ADC
Integrated Components on Module
- 40 MHz crystal oscillator
Antenna Options
- On-board PCB antenna (ESP32-C3-MINI-1)
- External antenna via a connector (ESP32-C3-MINI-1U)
Operating Conditions
- Operating voltage/Power supply: 3.0 ~ 3.6 V
- Operating ambient temperature: 85 °C version module: -40 ~ 85 °C; 105 °C version module: -40 ~ 105 °C
Certification
- RF certification: FCC/CE/SRRC
- Green certification: RoHS/REACH
Test
- HTOL/HTSL/uHAST/TCT/ESD/Latch-up
Description
The ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are versatile Wi-Fi and Bluetooth LE modules designed for smart homes, industrial automation, health care, and consumer electronics. Their rich peripheral set and compact size make them ideal for various applications.
| Module | Ordering code | Chip embedded | Module dimensions (mm) |
| ESP32-C3-MINI-1 (85 °C version) | ESP32-C3-MINI-1-N4 | ESP32-C3FN4 | 13.2 x 16.6 x 2.4 |
| ESP32-C3-MINI-1 (105 °C version) | ESP32-C3-MINI-1-H4 | ESP32-C3FH4 | 13.2 x 12.5 x 2.4 |
| ESP32-C3-MINI-1U (85 °C version) | ESP32-C3-MINI-1U-N4 | ESP32-C3FN4 | |
| ESP32-C3-MINI-1U (105 °C version) | ESP32-C3-MINI-1U-H4 | ESP32-C3FH4 |
The ESP32-C3-MINI-1 features an on-board PCB antenna, while the ESP32-C3-MINI-1U includes a connector for an external antenna. Both modules come in 85 °C (ESP32-C3FN4 chip) and 105 °C (ESP32-C3FH4 chip) variants, differing primarily in their operating temperature ranges.
The ESP32-C3 chip series, including the ESP32-C3FN4 and ESP32-C3FH4, are equipped with a 32-bit RISC-V single-core processor and a comprehensive set of peripherals such as UART, I2C, SPI, and more. For detailed chip-level specifications, refer to the ESP32-C3 Series Datasheet.
Applications
- Smart Home
- Light control
- Smart button
- Smart plug
- Indoor positioning
- Industrial Automation
- Industrial robot
- Mesh network
- Human machine interface (HMI)
- Industrial field bus
- Health Care
- Health monitor
- Baby monitor
- Consumer Electronics
- Smart watch and bracelet
- Over-the-top (OTT) devices
- Wi-Fi and Bluetooth speaker
- Logger toys and proximity sensing toys
- Smart Agriculture
- Smart greenhouse
- Smart irrigation
- Agriculture robot
- Retail and Catering
- POS machines
- Service robot
- Audio Device
- Internet music players
- Live streaming devices
- Internet radio players
- Generic Low-power IoT Sensor Hubs
- Generic Low-power IoT Data Loggers
Block Diagram
The block diagrams illustrate the internal structure of the ESP32-C3-MINI-1 and ESP32-C3-MINI-1U modules. They show the ESP32-C3FN4/FH4 chip connected to a 40 MHz crystal oscillator, SPI flash memory, RF matching circuitry, and GPIO pins. The ESP32-C3-MINI-1 utilizes an on-board PCB antenna, while the ESP32-C3-MINI-1U connects to an external antenna.
Pin Definitions
Pin Layout
The pin layout diagram shows the approximate physical arrangement of the 53 pins on the module. A keepout zone is indicated for proper PCB design. For a scaled diagram, refer to the Physical Dimensions section.
Pin Description
The module features 53 pins with various functions, including power supply (3V3, GND), general-purpose input/output (GPIO), and specific peripheral interfaces like SPI, UART, I2C, and more. Key pins include EN (chip enable), TXD0, RXD0, and strapping pins.
| Name | No. | Type¹ | Function |
| GND | 1, 2, 11, 14, 36-53 | P | Ground |
| 3V3 | 3 | P | Power supply |
| NC | 4, 7, 9, 10, 15, 17, 24, 25, 28, 29, 32-35 | NC | |
| IO2 | 5 | I/O/T | GPIO2, ADC1_CH2, FSPIQ |
| IO3 | 6 | I/O/T | GPIO3, ADC1_CH3 |
| EN | 8 | I | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. |
| IO0 | 12 | I/O/T | GPIO0, ADC1_CH0, XTAL_32K_P |
| IO1 | 13 | I/O/T | GPIO1, ADC1_CH1, XTAL_32K_N |
| IO10 | 16 | I/O/T | GPIO10, FSPICS0 |
| IO4 | 18 | I/O/T | GPIO4, ADC1_CH4, FSPIHD, MTMS |
| IO5 | 19 | I/O/T | GPIO5, ADC2_CH0, FSPIWP, MTDI |
| IO6 | 20 | I/O/T | GPIO6, FSPICLK, MTCK |
| IO7 | 21 | I/O/T | GPIO7, FSPID, MTDO |
| IO8 | 22 | I/O/T | GPIO8 |
| IO9 | 23 | I/O/T | GPIO9 |
| IO18 | 26 | I/O/T | GPIO18, USB_D- |
| IO19 | 27 | I/O/T | GPIO19, USB_D+ |
| RXD0 | 30 | I/O/T | GPIO20, U0RXD |
| TXD0 | 31 | I/O/T | GPIO21, U0TXD |
¹ P: power supply; I: input; O: output; T: high impedance.
Strapping Pins
The ESP32-C3 family utilizes three strapping pins: GPIO2, GPIO8, and GPIO9. These pins determine the boot mode and other settings upon system reset. The voltage level on these pins during reset is latched and held until power down. Software can read these values via the GPIO_STRAPPING register. By default, GPIO9 has an internal pull-up resistor.
| Pin | Default | SPI Boot | Download Boot |
| GPIO2 | N/A | 1 | 1 |
| GPIO8 | N/A | Don't care | 1 |
| GPIO9 | Internal pull-up | 1 | 0 |
GPIO8 also controls the enabling/disabling of ROM Code Print During Booting based on the EFUSE_UART_PRINT_CONTROL setting.
The setup and hold times for strapping pins relative to the CHIP_EN signal are critical for correct boot behavior, as detailed in Table 5.
| Parameter | Description | Min (ms) |
| t₀ | Setup time before CHIP_EN goes from low to high | 0 |
| t₁ | Hold time after CHIP_EN goes high | 3 |
Electrical Characteristics
Absolute Maximum Ratings
Exceeding these stress ratings may cause permanent damage. Functional operation is only guaranteed within the recommended operating conditions.
| Symbol | Parameter | Min | Max | Unit |
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| TSTORE | Storage temperature | -40 | 105 | °C |
Recommended Operating Conditions
| Symbol | Parameter | Min | Typ | Max | Unit |
| VDD33 | Power supply voltage | 3.0 | 3.3 | 3.6 | V |
| IDD | Current delivered by external power supply | 0.5 | A | ||
| TA | Operating ambient temperature | -40 | 85 °C version | 85 | °C |
| 105 °C version | 105 | ||||
| Humidity | Humidity condition | 85 | %RH |
DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
| CIN | Pin capacitance | 2 | pF | ||
| VIH | High-level input voltage | 0.75 x VDD¹ | VDD1+ 0.3 | V | |
| VIL | Low-level input voltage | -0.3 | 0.25 x VDD¹ | V | |
| IIH | High-level input current | 50 | nA | ||
| IIL | Low-level input current | 50 | nA | ||
| VOH² | High-level output voltage | 0.8 x VDD¹ | V | ||
| VOL² | Low-level output voltage | 0.1 x VDD¹ | V | ||
| IOH | High-level source current (VDD1= 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) | 40 | mA | ||
| IOL | Low-level sink current (VDD1= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) | 28 | mA | ||
| RPU | Pull-up resistor | 45 | kΩ | ||
| RPD | Pull-down resistor | 45 | kΩ | ||
| VIH_NRST | Chip reset release voltage | 0.75 x VDD¹ | VDD1+ 0.3 | V |
¹ VDD is the I/O voltage for a particular power domain of pins. ² VOH and VOL are measured using high-impedance load.
Current Consumption Characteristics
The module supports advanced power management, allowing it to switch between different power modes. For details, refer to the ESP32-C3 Series Datasheet.
| Work mode | Description | Peak (mA) |
| TX | 802.11b, 1 Mbps, @21 dBm | 350 |
| 802.11g, 54 Mbps, @19 dBm | 295 | |
| 802.11n, HT20, MCS 7, @18.5 dBm | 290 | |
| 802.11n, HT40, MCS 7, @18.5 dBm | 290 | |
| RX | 802.11b/g/n, HT20 | 82 |
| 802.11n, HT40 | 84 |
¹ Measurements taken with a 3.3 V supply at 25 °C ambient RF temperature, 100% duty cycle for transmitters. ² RX mode figures are with peripherals disabled and CPU idle.
| Work mode | Description | Typ | Unit |
| Modem-sleep¹, ² | The CPU is powered on³ | 20 | mA |
| Light-sleep | 80 MHz | 15 | mA |
| Deep-sleep | RTC timer + RTC memory | 130 | µA |
| Power off | CHIP_PU is set to low level, the chip is powered off | 1 | µA |
¹ Modem-sleep figures assume CPU is powered on and cache is idle. ² Wi-Fi activity may cause the chip to switch between Active and Modem-sleep modes. ³ Software can adjust CPU frequency to reduce consumption.
Wi-Fi Radio
Wi-Fi RF Standards
| Name | Description |
| Center frequency range of operating channel¹ | 2412~2484 MHz |
| Wi-Fi wireless standard | IEEE 802.11b/g/n |
| Data rate | 11b: 1, 2, 5.5 and 11 Mbps 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max) 11n: MCS0-7, 150 Mbps (Max) |
| Antenna type | PCB antenna and IPEX antenna |
¹ Device should operate within the center frequency range allocated by regional regulatory authorities. Target center frequency range is software configurable.
Wi-Fi RF Transmitter (TX) Specifications
Target TX power is configurable. Default characteristics are provided below.
| Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
| 802.11b, 1 Mbps | 20.5 | ||
| 802.11b, 11 Mbps | 20.5 | ||
| 802.11g, 6 Mbps | 20.0 | ||
| 802.11g, 54 Mbps | 18.0 | ||
| 802.11n, HT20, MCS 0 | 19.0 | ||
| 802.11n, HT20, MCS 7 | 17.5 | ||
| 802.11n, HT40, MCS 0 | 18.5 | ||
| 802.11n, HT40, MCS 7 | 17.0 |
| Rate | Min (dB) | Typ (dB) | SL¹ (dB) |
| 802.11b, 1 Mbps, @21 dBm | -24.5 | -10 | |
| 802.11b, 11 Mbps, @21 dBm | -25.0 | -10 | |
| 802.11g, 6 Mbps, @21 dBm | -23.0 | -5 | |
| 802.11g, 54 Mbps, @19 dBm | -28.0 | -25 | |
| 802.11n, HT20, MCS 0, @20 dBm | -23.5 | -5 | |
| 802.11n, HT20, MCS 7, @18.5 dBm | -30.5 | -27 | |
| 802.11n, HT40, MCS 0, @20 dBm | -26.5 | -5 | |
| 802.11n, HT40, MCS 7, @18.5 dBm | -30.5 | -27 |
¹ SL stands for standard limit value.
Wi-Fi RF Receiver (RX) Specifications
| Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
| 802.11b, 1 Mbps | -98.0 | ||
| 802.11b, 2 Mbps | -96.0 | ||
| 802.11b, 5.5 Mbps | -93.0 | ||
| 802.11b, 11 Mbps | -88.6 | ||
| 802.11g, 6 Mbps | -92.8 | ||
| 802.11g, 9 Mbps | -91.8 | ||
| 802.11g, 12 Mbps | -90.8 | ||
| 802.11g, 18 Mbps | -88.4 | ||
| 802.11g, 24 Mbps | -85.4 | ||
| 802.11g, 36 Mbps | -82.0 | ||
| 802.11g, 48 Mbps | -77.8 | ||
| 802.11g, 54 Mbps | -76.2 | ||
| 802.11n, HT20, MCS 0 | -92.6 | ||
| 802.11n, HT20, MCS 1 | -90.6 | ||
| 802.11n, HT20, MCS 2 | -88.0 | ||
| 802.11n, HT20, MCS 3 | -84.8 | ||
| 802.11n, HT20, MCS 4 | -81.6 | ||
| 802.11n, HT20, MCS 5 | -77.4 | ||
| 802.11n, HT20, MCS 6 | -75.6 | ||
| 802.11n, HT20, MCS 7 | -74.4 | ||
| 802.11n, HT40, MCS 0 | -90.0 | ||
| 802.11n, HT40, MCS 1 | -87.6 | ||
| 802.11n, HT40, MCS 2 | -84.8 | ||
| 802.11n, HT40, MCS 3 | -81.8 | ||
| 802.11n, HT40, MCS 4 | -78.4 | ||
| 802.11n, HT40, MCS 5 | -74.2 | ||
| 802.11n, HT40, MCS 6 | -72.6 | ||
| 802.11n, HT40, MCS 7 | -71.2 |
| Rate | Min (dBm) | Typ (dBm) | Max (dBm) |
| 802.11b, 1 Mbps | 5 | ||
| 802.11b, 11 Mbps | 5 | ||
| 802.11g, 6 Mbps | 5 | ||
| 802.11g, 54 Mbps | 0 | ||
| 802.11n, HT20, MCS 0 | 5 | ||
| 802.11n, HT20, MCS 7 | 0 | ||
| 802.11n, HT40, MCS 0 | 5 | ||
| 802.11n, HT40, MCS 7 | 0 |
| Rate | Min (dB) | Typ (dB) | Max (dB) |
| 802.11b, 1 Mbps | 35 | ||
| 802.11b, 11 Mbps | 35 | ||
| 802.11g, 6 Mbps | 31 | ||
| 802.11g, 54 Mbps | 14 | ||
| 802.11n, HT20, MCS 0 | 31 | ||
| 802.11n, HT20, MCS 7 | 13 | ||
| 802.11n, HT40, MCS 0 | 19 | ||
| 802.11n, HT40, MCS 7 | 8 |
Bluetooth LE Radio
Bluetooth LE RF Transmitter (TX) Specifications
| Parameter | Min | Typ | Max | Unit |
| RF transmit power | 0 | dBm | ||
| Gain control step | 3 | dB | ||
| RF power control range | -27 | 18 | dBm |
| Parameter | Description | Min | Typ | Max | Unit |
| In-band emissions | F = F0 ± 2 MHz | -37.62 | dBm | ||
| F = F0 ± 3 MHz | -41.95 | dBm | |||
| F = F0 + > 3 MHz | -44.48 | dBm | |||
| Modulation characteristics | Δf₁avg | 245.00 | kHz | ||
| Δf₂max | 208.00 | kHz | |||
| Δf₂avg / Δf₁avg | 0.93 | ||||
| Carrier frequency offset | -9.00 | kHz | |||
| Carrier frequency drift | |f₀ - f<0xE2><0x82><0x99>|n=2, 3, 4, ..k | 1.17 | kHz | ||
| |f₁ - f₀| | 0.30 | kHz | |||
| |f<0xE2><0x82><0x99> - f<0xE2><0x82><0x99>₋₅|n=6, 7, 8, ..k | 4.90 | kHz |
| Parameter | Description | Min | Typ | Max | Unit |
| In-band emissions | F = F0 ± 4 MHz | -43.55 | dBm | ||
| F = F0 ± 5 MHz | -45.26 | dBm | |||
| F = F0 + > 5 MHz | -47.00 | dBm | |||
| Modulation characteristics | Δf₁avg | 497.00 | kHz | ||
| Δf₂max | 398.00 | kHz | |||
| Δf₂avg / Δf₁avg | 0.95 | ||||
| Carrier frequency offset | -9.00 | kHz | |||
| Carrier frequency drift | |f₀ - f<0xE2><0x82><0x99>|n=2, 3, 4, ..k | 0.46 | kHz | ||
| |f₁ - f₀| | 0.70 | kHz | |||
| |f<0xE2><0x82><0x99> - f<0xE2><0x82><0x99>₋₅|n=6, 7, 8, ..k | 6.80 | kHz |
| Parameter | Description | Min | Typ | Max | Unit |
| In-band emissions | F = F0 ± 2 MHz | -37.90 | dBm | ||
| F = F0 ± 3 MHz | -41.00 | dBm | |||
| F = F0 + > 3 MHz | -42.50 | dBm | |||
| Modulation characteristics | Δf₁avg | 252.00 | kHz | ||
| Δf₁max | 200.00 | kHz | |||
| Carrier frequency offset | -13.70 | kHz | |||
| Carrier frequency drift | |f₀ - f<0xE2><0x82><0x99>|n=1, 2, 3, ..k | 1.52 | kHz | ||
| |f₀ - f₃| | 0.65 | kHz | |||
| |f<0xE2><0x82><0x99> - f<0xE2><0x82><0x99>₋₃|n=7, 8, 9, ..k | 0.70 | kHz |
Module Schematics
The schematics provide reference designs for the ESP32-C3-MINI-1 and ESP32-C3-MINI-1U modules, detailing component connections and layout considerations.
Peripheral Schematics
This section illustrates a typical application circuit, showing how the module connects with external components such as power supply, antenna, reset button, JTAG interface, and UART interface.
Recommendations are provided for optimizing thermal performance by soldering the EPAD to the ground plane and for ensuring stable power supply during power-up using an RC delay circuit on the EN pin.
Physical Dimensions and PCB Land Pattern
Physical Dimensions
Detailed physical dimensions are provided for both the ESP32-C3-MINI-1 and ESP32-C3-MINI-1U modules, including top, side, and bottom views with critical measurements in millimeters. Information on tape, reel, and product marking can be found in the Espressif Module Package Information.
Recommended PCB Land Pattern
PCB land pattern recommendations are given for both the ESP32-C3-MINI-1 and ESP32-C3-MINI-1U modules, showing pad layouts and antenna areas to ensure proper integration.
Dimensions of External Antenna Connector
The ESP32-C3-MINI-1U utilizes a third-generation external antenna connector compatible with W.FL Series (Hirose), MHF III (I-PEX), and AMMC (Amphenol) connectors. Dimensions and material specifications for the connector are provided.
Product Handling
Storage Conditions
Products sealed in moisture barrier bags (MBB) should be stored in a dry environment (< 40 °C and ≤ 90% RH). The module has a moisture sensitivity level (MSL) of 3. After unpacking, soldering should occur within 168 hours under factory conditions (25±5 °C and ≤ 60% RH). Baking may be required if these conditions are not met.
Electrostatic Discharge (ESD)
The modules are rated for electrostatic discharge sensitivity:
- Human body model (HBM): 2000 V
- Charged-device model (CDM): 500 V
- Air discharge: 6000 V
- Contact discharge: 4000 V
Reflow Profile
The reflow profile specifies the temperature and time parameters for soldering the module in a single reflow process. It includes ramp-up, preheating, reflow, and cooling zones with recommended temperature ranges and durations. Sn-Ag-Cu (SAC305) lead-free solder alloy is used.
Related Documentation and Resources
Espressif Systems provides extensive resources for developers:
- Related Documentation
- ESP32-C3 Technical Reference Manual: For detailed information on memory and peripherals.
- ESP32-C3 Series Datasheet: Specifications of the ESP32-C3 hardware.
- Certificates: http://espressif.com/en/support/documents/certificates
- Documentation Updates and Subscription: http://espressif.com/en/support/download/documents
- Developer Zone
- ESP-IDF Programming Guide for ESP32-C3: Extensive documentation for the ESP-IDF development framework.
- ESP-IDF and other development frameworks on GitHub: http://github.com/espressif
- ESP32 BBS Forum: Community for questions, knowledge sharing, and problem-solving. http://esp32.com/
- The ESP Journal: Best Practices, Articles, and Notes. http://medium.com/the-esp-journal
- SDKs and Demos, Apps, Tools, AT Firmware: http://espressif.com/en/support/download/sdks-demos
- Products
- ESP32-C3 Series SoCs: http://espressif.com/en/products/socs?id=ESP32-C3
- ESP32-C3 Series Modules: http://espressif.com/en/products/modules?id=ESP32-C3
- ESP32-C3 Series DevKits: http://espressif.com/en/products/devkits?id=ESP32-C3
- ESP Product Selector: http://products.espressif.com/#/product-selector?language=en
- Contact Us
- Sales Questions, Technical Enquiries, etc.: http://espressif.com/en/contact-us/sales-questions
Revision History
| Date | Version | Release notes |
| 2021-06-21 | V1.0 |
|
| 2021-04-16 | V0.7 | Added information about ESP32-C3-MINI-1U module |
| 2021-02-22 | V0.6 | Updated the value of C7 to 0.1 µF in Chapter 5 Module Schematics |
| 2021-02-05 | V0.5 | Preliminary release |
Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice. All third-party information is provided as is. Espressif Systems disclaims all warranties. Liability for infringement of proprietary rights is disclaimed. No licenses are granted. Wi-Fi Alliance and Bluetooth logos are trademarks. All other trademarks are property of their respective owners. Copyright © 2021 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
