RENESAS DA14535MOD SmartBond TINY Bluetooth LE Module User Manual

User Manual for RENESAS models including: DA14535MOD SmartBond TINY Bluetooth LE Module, DA14535MOD, SmartBond TINY Bluetooth LE Module, TINY Bluetooth LE Module, Bluetooth LE Module, LE Module

SmartBond TINY Bluetooth LE Module

28-Sept-2023

DA14535MOD

Renesas Electronics Corporation

User Manual

Renesas Design Netherlands BV DA14535MOD Y82-DA14535MOD Y82DA14535MOD da14535mod

File Info : application/pdf, 38 Pages, 2.17MB

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DA14535MOD
SmartBond TINY Bluetooth® LE Module
General Description
confidential
Key Features

Target

Datasheet
CFR0011-120-00

Standards Conformance Europe (CE/RED) UK (UKCA) US (FCC) Canada (IC) Japan (MIC) South Korea (KCC) Taiwan (NCC)

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Brazil (Anatel) South Africa (ICASA) China (SRRC) Thailand (NBTC) India (WPC) Australia/ New Zealand (ACMA)

Datasheet
CFR0011-120-00

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SmartBond TINY Bluetooth® LE Module
Applications
Beacons Remote Controls Proximity tags Low Power Sensors Commissioning/Provisioning RF pipe Toys Industrial applications Data acquisition Wellness Infotainment IoT Robotics Gaming

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Datasheet
CFR0011-120-00

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Contents
General Description ............................................................................................................................ 1
Key Features ........................................................................................................................................ 1
Applications ......................................................................................................................................... 3
Contents ............................................................................................................................................... 4
Figures.................................................................................................................................................. 5
Tables ................................................................................................................................................... 5
1 References ..................................................................................................................................... 7
2 Block Diagram ............................................................................................................................... 8
3 Pinout ............................................................................................................................................. 9
4 Characteristics ............................................................................................................................ 12 4.1 Absolute Maximum Ratings ................................................................................................ 12 4.2 Recommended Operating Conditions ................................................................................. 12 4.3 Device Characteristics ........................................................................................................ 12
5 Mechanical Specifications.......................................................................................................... 16 5.1 Dimensions ......................................................................................................................... 16 5.2 PCB Footprint...................................................................................................................... 17 5.3 Marking................................................................................................................................ 17
6 Packaging Information................................................................................................................ 18 6.1 Tape and Reel..................................................................................................................... 18 6.2 Labeling............................................................................................................................... 19
7 Application Information .............................................................................................................. 19
8 Design Guidelines ....................................................................................................................... 21 8.1 Installation Location ............................................................................................................ 21 8.2 Antenna Graphs .................................................................................................................. 23 8.3 Radiation Pattern ................................................................................................................ 24
9 Soldering ...................................................................................................................................... 26
10 Ordering Information .................................................................................................................. 27
11 Regulatory Information ............................................................................................................... 28 11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) (Europe)........................................ 29 11.2 FCC (U.S.A.) .................................................................................................................... 29 11.2.1 List of Applicable FCC Rules ............................................................................... 29 11.2.2 Summarize the Specific Operational Use Conditions.......................................... 29 11.2.3 Limited Module Procedures ................................................................................. 29 11.2.4 Trace Antenna Designs ....................................................................................... 30 11.2.5 RF Exposure Considerations............................................................................... 30 11.2.6 Antennas.............................................................................................................. 30 11.2.7 Label and Compliance Information ...................................................................... 30 11.2.8 Information on test modes and additional testing requirements: ......................... 31 11.2.9 Additional testing, Part 15 Subpart B disclaimer: ................................................ 31 11.3 IC (Canada)......................................................................................................................... 31 11.4 UKCA (UK) .......................................................................................................................... 32 11.5 NCC (Taiwan) ..................................................................................................................... 32

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11.6 MSIP (South Korea) ............................................................................................................ 33 11.7 ICASA (South Africa) .......................................................................................................... 33 11.8 ANATEL (Brazil) .................................................................................................................. 33 11.9 SRRC (China) ..................................................................................................................... 34 11.10 MIC (Japan) ........................................................................................................................ 34 11.11 NBTC (Thailand) ................................................................................................................. 35 11.12 WPC (India)......................................................................................................................... 35 11.13 Australia/ New Zealand ....................................................................................................... 35
Revision History ................................................................................................................................ 36

Figures
Figure 1: DA14535 SmartBond TINYTM Module Block Diagram ........................................................... 8 Figure 2: Pinout Diagram Top View ...................................................................................................... 9 Figure 3: Mechanical Drawing ............................................................................................................. 16 Figure 4: Module Footprint Top View .................................................................................................. 17 Figure 5: Module Shield Marking......................................................................................................... 17 Figure 6: Tape and Reel ...................................................................................................................... 18 Figure 7: Reel Labeling ....................................................................................................................... 19 Figure 8: Reel Directives Conformity Label ......................................................................................... 19 Figure 9: Example of Connecting a Sensor to the SPI Bus and an MCU to RST and UART ............. 20 Figure 10: Installation Locations for Optimum Antenna Performance ................................................ 21 Figure 11: Antenna Performance in Proximity of Copper (Left), Laminate (Middle), and Laminate under Antenna (Right) ......................................................................................................................... 22 Figure 12: DA14535 TINYTM Module Evaluation Board ...................................................................... 22 Figure 13: VSWR Installed in the Upper Left Corner (Position #1) of Evaluation Board .................... 23 Figure 14: VSWR with Module Installed in Center (Position #2) of the Evaluation Board .................. 23 Figure 15: VSWR with Module Installed in the Upper Right Corner (Position #3) of the Evaluation Board ................................................................................................................................................... 23 Figure 16: Measurement Plane Definition ........................................................................................... 24 Figure 17: Radiation Pattern for XY-Plane, Horizontal Polarization.................................................... 25 Figure 18: Radiation Pattern for XY-Plane, Vertical Polarization ........................................................ 25 Figure 19: Radiation Pattern for XZ-Plane, Horizontal Polarization .................................................... 25 Figure 20: Radiation Pattern for XZ-Plane, Vertical Polarization ........................................................ 25 Figure 21: Radiation Pattern for YZ-Plane, Horizontal Polarization .................................................... 25 Figure 22: Radiation Pattern for YZ-Plane, Vertical Polarization ........................................................ 25 Figure 23: Recommended Reflow Profile for Lead Free Solder ......................................................... 26

Tables
Table 1: Pin Description ........................................................................................................................ 9 Table 2: Absolute Maximum Ratings................................................................................................... 12 Table 3: Recommended Operating Conditions ................................................................................... 12 Table 4: DC Characteristics................................................................................................................. 12 Table 5: XTAL32M - Recommended Operating Conditions ................................................................ 14 Table 6: Digital I/O - Recommended Operating Conditions ................................................................ 14 Table 7: Digital I/O - DC Characteristics ............................................................................................. 14 Table 8: Radio - AC Characteristics .................................................................................................... 14 Table 9: Reel Specifications ................................................................................................................ 18 Table 10: Antenna Efficiency vs TINYTM Module Positions ................................................................. 21 Table 11: Reflow Profile Specification ................................................................................................. 26 Table 12: MSL Level vs Floor Lifetime ................................................................................................ 27 Table 13: Ordering Information (Samples) .......................................................................................... 27 Table 14: Ordering Information (Production)....................................................................................... 27

Datasheet
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Table 15: Standards Conformance ..................................................................................................... 28

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1 References
[1] DA14535, Datasheet. [2] DA14585/DA14531 SW Platform Reference Manual

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Datasheet
CFR0011-120-00

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2 Block Diagram
confidential

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Datasheet
CFR0011-120-00

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3 Pinout
ANTENNA AREA

Target

n.c.

J16 P0_8

GND

J15 P0_9

GND

MARKING AREA

J14 P0_5/RxTx

GND

J13 P0_7

P0_6

J12 P0_0/RST

J6 J7 J8 J9 J10 J11

GND VBAT P0_11 P0_10/SWDIO P0_2/SWCLK GND

Figure 2: Pinout Diagram Top View

Note that J1 has no internal connection. J1 should be connected to ground.

Table 1: Pin Description

Pin #

Pin Name

n.c

GND

P0_6

Type
GND GND GND DIO (Type A) Note 1

GND

VBAT

P0_11

GND PWR DIO

Reset State
I-PD
I-PD

Description
Not internally connected. Recommended to be connected to ground externally
Ground
Ground
Ground
INPUT/OUTPUT with selectable pullup/down resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains a state retention mechanism during power down
Ground
POWER. Battery connection. IO supply
INPUT/OUTPUT with selectable pull-

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Pin # J9
J10 J11 J12 J13 J14 J15 J16 Note 1

Pin Name

Type (Type A)

Reset State

Description
up/down resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains a state retention mechanism during power down

P0_10

DIO (Type A)

I-PD

INPUT/OUTPUT with selectable pullup/down resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains a state retention mechanism during power down

SWDIO

INPUT/OUTPUT. SWI Data input/output. Bidirectional data and control communication (by default)

P0_2

DIO (Type B)

I-PD

SWCLK

INPUT SWI clock signal (by default)

GND

Ground

P0_0

DIO (Type B) Note 2

I-PD

RST

RST active high hardware reset (default)

P0_7

DIO (Type A)

I-PD

P0_5

DIO (Type B)

I-PD

P0_9

DIO (Type A)

I-PD

P0_8

DIO (Type A)

I-PD

There are two types of pads, namely Type A and Type B. Type A is a normal IO pad with a Schmitt trigger on input while Type B has an extra RC Filter with a cutoff frequency of 100 kHz.

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Note 2 This pin is also used for the communication to the internal SPI FLASH. · I-PD is Input-Pulled Down · I-PU is Input-Pulled Up · DIO is Digital Input-Output · PWR is power · GND is Ground

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4 Characteristics
All MIN/MAX specification limits are guaranteed by design, production testing, and/or statistical characterization. Typical values are based on characterization results at default measurement conditions and are informative only.
Default measurement conditions (unless otherwise specified): VBAT= 3.0 V, TA = 25 oC. All radio measurements are done with standard RF measurement equipment.

4.1 Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 2: Absolute Maximum Ratings

Parameter Description

Conditions

Min Max Unit

VBAT_LIM

Limiting battery supply voltage

-0.2 3.6

4.2 Recommended Operating Conditions

Table 3: Recommended Operating Conditions

Parameter Description

VBAT

Battery supply voltage enabling FLASH programming

VBAT_NOM

Nominal battery supply voltage

VPIN

Voltage on a pin

Ambient operating temperature

Conditions

Min Typ Max Unit

1.65

3.6

-0.2

3.6

-40

°C

4.3 Device Characteristics

Table 4: DC Characteristics

Parameter Description

Conditions

IBAT_ACTIVE

Battery supply current with CPU running CoreMark from RAM at 16 MHz

IBAT_BLE_ADV_
100ms

Average battery supply current with system in Advertising state (3 channels) every 100 ms and extended sleep with all RAM retained. TX output power at 3 dBm. FLASH is off.

IBAT_BLE_CON

Average battery supply current with system in a

Min Typ Max Unit

tbd

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Parameter Description

Conditions

N_30ms

connection state with 30ms connection interval and extended sleep with all RAM retained. TX output power at 3 dBm. FLASH is off.

IBAT_FLASH

Battery supply current with CPU fetching code from serial FLASH. RF is off.

IBAT_HIBERN

Battery supply current with system shut down (Hibernation or shipping mode). FLASH is off.

IBAT_IDLE

Battery supply current with CPU in Wait for Interrupt Mode. FLASH is off.

IBAT_SLP_32KB

Battery supply current with system in extended sleep mode and 32 kB RAM retained

Battery supply current with IBAT_SLP_64KB system in extended sleep
mode and all RAM retained

IBAT_RF_RX Battery supply current

Continuous RX; FLASH in sleep mode; DCDC converter is on;

IBAT_RF_TX_+3 Battery supply current
dBm

Continuous TX; FLASH in sleep mode; DCDC converter is on; Output power at 3 dBm;

IBAT_RF_TX_0d Battery supply current
Bm

Continuous TX;FLASH in sleep mode; DCDC converter is on; Output power at 0 dBm;

IBAT_RF_TX_-
3dBm

Battery supply current

Continuous TX;FLASH in sleep mode; DCDC converter is on; Output power at -3 dBm;

IBAT_RF_TX_-
7dBm

Battery supply current

Continuous TX;FLASH in sleep mode; DCDC converter is on; Output power at -7 dBm

IBAT_RF_TX_-
19dBm

Battery supply current

Continuous TX;FLASH in sleep mode; DCDC converter is on; Output power at -19.5 dBm

Target Min Typ Max Unit

tbd

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Table 5: XTAL32M - Recommended Operating Conditions

Parameter Description

Conditions

Min Typ Max Unit

fXTAL(32M) Crystal oscillator frequency

MHz

After optional trimming;

including aging and

fXTAL(32M) Crystal frequency tolerance temperature drift

-20

Note 1

ppm

Note 1 Using the internal varicaps a wide range of crystals can be trimmed to the required tolerance.

Table 6: Digital I/O - Recommended Operating Conditions

Parameter Description

Conditions

VIH

HIGH level input voltage

VDD=0.9V

VIL

LOW level input voltage

VDD=0.9V

Min Typ Max Unit

0.7*V DD

0.3*V DD

Table 7: Digital I/O - DC Characteristics

Parameter Description

Conditions

IIH IIL IIH_PD IIL_PU

HIGH level input current LOW level input current HIGH level input current LOW level input current

VI=VBAT_HIGH=3.0V VI=VSS=0V VI=VBAT_HIGH=3.0V VI=VSS=0V, VBAT_HIGH=3.0V

VOH

HIGH level output voltage

IO=3.5mA, VBAT_HIGH=1.7V

VOL

LOW level output voltage

IO=3.5mA, VBAT_HIGH=1.7V

VOH_LOWDRV HIGH level output voltage

IO=0.3mA, VBAT_HIGH=1.7V

VOL_LOWDRV LOW level output voltage

IO=0.3mA, VBAT_HIGH=1.7V

Min Typ Max Unit

-10

180

-180

-60

0.8*VB

AT_HI

0.2*VB AT_HI V
GH

0.8*VB

AT_HI

0.2*VB AT_HI V
GH

Table 8: Radio - AC Characteristics

Parameter Description

Conditions

PSENS_CLEAN sensitivity level

Dirty Transmitter disabled;

Min Typ Max Unit

tbd

dBm

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Parameter Description

Conditions
DC-DC converter disabled; PER = 30.8 %; Note 1

Min Typ Max Unit

PSENS_EPKT sensitivity level

Extended packet size (255 octets)

tbd

dBm

Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/4.0.1, section 6.4.1.

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5 Mechanical Specifications
5.1 Dimensions
The module's dimensions are shown in Figure 3.

Target

DA14535
Figure 3: Mechanical Drawing

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5.2 PCB Footprint
The footprint for the PCB is shown in Figure 4. 12.5mm

Target

14.5mm 10.15mm

9.5mm 0.9mm
1.5mm
1mm

1.75mm

2.0mm

Figure 4: Module Footprint Top View

5.3 Marking

Figure 5: Module Shield Marking

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6 Packaging Information
6.1 Tape and Reel

Target

Figure 6: Tape and Reel

The actual reel specifications are presented in the following table:

Table 9: Reel Specifications
Diameter Reel tape width Tape material Qty/Reel Leader Trailer

13 inch 24 mm Antistatic 100/1000 pcs 400 mm + 10% 160 mm + 10%

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Figure 7: Reel Labeling The directives label shows information regarding directives conformity as in Figure 8.

42mm

67mm
Figure 8: Reel Directives Conformity Label
7 Application Information
There are some special considerations for the use of the TINYTM module, namely:
The RST signal is shared with the MOSI input of the NOR flash. For this reason, RST must not
be driven to GND. When the internal Flash is in use, the reset functionality is not available
The SPI Bus of DA14535 is used for the communication of the SoC with the NOR Flash at boot
time. Three of the four signals are not driven to external module pins. For this reason, a sensor that utilizes the SPI bus must be assigned (by software) to the module pins to communicate with after the boot is completed and when NOR Flash is no longer in use. An example is given in Figure 12.

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VBAT

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J5 SCK

J13

Sensor

J16

/CS

J15 MOSI

J8 MISO

P0_6 P0_7 P0_8 P0_9 P0_11

P0_2
P0_5
P0_10
DA14P5NR3AO5MJEECT
P0_0/RST P0_1 P0_3 P0_4

J10 J14

J9 J12

P25Q11U

MOSI /CS MISO SCK

1Mbit NOR Flash

GND

DA14535 TINY Module J1, J2, J3, J4, J6, J11

UTX URX
MCU
GPIO

Figure 9: Example of Connecting a Sensor to the SPI Bus and an MCU to RST and UART
Note that the P0_0/RST pin (J12) should not be driven while the TINYTM module boots from its internal SPI FLASH.

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8 Design Guidelines
The DA14535 SmartBond TINYTM Module comes with an integrated PCB trace antenna. The antenna area is 12x4 mm. The antenna's Voltage Standing Wave Ratio (VSWR) and efficiency depend on the installation location.
The radiation performance of the PCB trace antenna depends on the host PCB layout. The maximum antenna gain is -0.5 dBi when installed on a 50x50 mm reference board, as shown in Figure 21. The radiation pattern is omnidirectional. The RF front end is optimized to achieve the maximum possible efficiency for various installation positions of the module on a host PCB. To obtain a similar performance, follow the guidelines described in the following sections.

8.1 Installation Location
For optimum performance, install the module at the edge of a host PCB with the antenna edge facing out. The module can be located on either of the outer corners or the middle of the host PCB with equivalent performance.
The antenna should have 4 mm free space in all directions. Copper or laminate in the proximity of the PCB trace antenna will affect the efficiency of the antenna. Laminate or copper under the antenna should be avoided as it severely affects the performance of the antenna. The antenna keep-out area can be seen in Figure 11.
Metals close to the antenna will degrade the antenna's performance. The amount of degradation depends on the host system's characteristics.
Table 10 summarizes the antenna efficiency at different installation locations on a host PCB as shown in Figure 10.

Table 10: Antenna Efficiency vs TINYTM Module Positions

Freq [MHz]
2405 2440 2480

Position # 1 (Left)

Antenna efficiency

[%]

[dB]

-2,8

-3,4

-3,0

Position # 2 (Middle)

Antenna efficiency

[%]

[dB]

-4,0

-4,7

-4,0

Position # 3 (Right)

Antenna efficiency

[%] [dB]

-4,0

-3,9

-2,8

Figure 10: Installation Locations for Optimum Antenna Performance

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Figure 11: Antenna Performance in Proximity of Copper (Left), Laminate (Middle), and Laminate under Antenna (Right)
The actual TINYTM module evaluation board layout that has been used to conduct measurements is shown in Figure 12.

Figure 12: DA14535 TINYTM Module Evaluation Board

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8.2 Antenna Graphs
The antenna VSWR measurements for the three installation positions are shown in the following figures.

Figure 13: VSWR Installed in the Upper Left Corner (Position #1) of Evaluation Board Figure 14: VSWR with Module Installed in Center (Position #2) of the Evaluation Board

Figure 15: VSWR with Module Installed in the Upper Right Corner (Position #3) of the Evaluation Board

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8.3 Radiation Pattern
The antenna radiation pattern measurements are carried out in an anechoic chamber. Radiation patterns are presented for three measurement planes: XY-, XZ-, and YZ- planes with horizontal and vertical polarization of the receiving antenna.

Figure 16: Measurement Plane Definition

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Measurements are carried out for the module installed in the upper right corner on the reference board with no laminate below the antenna trace.

Radiation Pattern for Antenna Trace

Horizontal polarization

Vertical polarization

Figure 17: Radiation Pattern for XY-Plane, Horizontal Polarization

Figure 18: Radiation Pattern for XY-Plane, Vertical Polarization

Figure 19: Radiation Pattern for XZ-Plane, Horizontal Polarization

Figure 20: Radiation Pattern for XZ-Plane, Vertical Polarization

Figure 21: Radiation Pattern for YZ-Plane, Horizontal Polarization

Figure 22: Radiation Pattern for YZ-Plane, Vertical Polarization

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9 Soldering
The successful reflow soldering of the DA14535 TINYTM Module on a PCB depends on several parameters such as the thickness of the stencil, the pads solder paste aperture, the solder paste characteristics, the reflow soldering profile, size of the PCB, and so on.
The volume of solder paste applied to the board is mainly determined by the aperture size and stencil thickness. An initial solder paste aperture for the pads is provided on the solder paste layer of the PCB footprint. This aperture is modified by the assembly process experts according to stencil thickness, solder paste, and available assembly equipment.
The solder profile depends on the solder paste type used. For example, the soldering profile of a lead-free solder paste, Sn3Ag0.5Cu with no clean Flux (ROL0) and Solder Powder Type 4, is presented below.
No clean flux is recommended because washing must not be applied after assembly to avoid moisture being trapped under the shield.

Figure 23: Recommended Reflow Profile for Lead Free Solder

Table 11: Reflow Profile Specification

Statistic Name
Slope1 (Target=2.0) Between 30.0 and 70.0
Slope2 (Target=2.0) Between 70.0 and 150.0
Slope3 (Target=-2.8) Between 220.0 and 150.0
Preheat time 110-190C
Time above reflow @220C
Peak temperature
Total time above @235C

Low Limit 1
1
-5
60 30 235 10

High Limit 3
3
-0.5
120 65 250 30

Units Degrees/Second
Degrees/Second
Degrees/Second
Seconds Seconds Degrees Celsius Second

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Solderability reflow check of five cycles was performed, applying the procedures mentioned in the JESD-A113E standard.
The MSL is an indicator for the maximum allowable time period (floor lifetime) in which a moisturesensitive plastic device, once removed from the dry bag, can be exposed to an environment with a maximum temperature of 30 °C and a maximum relative humidity of 60 % RH before the solder reflow process.
DA14535 TINY Module is qualified for MSL 3.

Table 12: MSL Level vs Floor Lifetime
MSL Level MSL 4 MSL 3 MSL 2A MSL 2 MSL 1

Floor Lifetime 72 hours 168 hours 4 weeks 1 year Unlimited at 30 °C/85 %RH

10 Ordering Information
The ordering number consists of the part number followed by a suffix that indicates the packing method. For details and availability, consult your Renesas local sales representative.

Table 13: Ordering Information (Samples)

Part Number

Size (mm)

DA14535MOD00F0100C

12.5 x 14.5 x 2.8

Shipment Form Reel

Pack Quantity 100

MOQ 3

Table 14: Ordering Information (Production)

Part Number
DA14535MOD00F01002

Size (mm)
12.5 x 14.5 x 2.8

Shipment Form Reel

Pack Quantity 1000

MOQ 1

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11 Regulatory Information
This section outlines the regulatory information for the DA14535 SmartBond TINYTM Module. The module is certified for the global market. This facilitates the market entry of the end product. Note that the end product would need to apply for the end product certification, however, the module certification listed below will facilitate that procedure.
When the user sends the end product to those markets, the end product may need to follow additional requirements according to the specific market regulation.
For example, some markets have additional testing and/or certification like Korea EMC, South Africa SABS EMC and some have the requirement to put on the end product label a modular approval ID or mark that consists of an approved Bluetooth® Low Energy modular ID on host label directly, like Japan, Taiwan, Brazil.
A list of the Conformance Standards that the DA14535 SmartBond TINYTM Module meets is shown in Table 15.

Table 15: Standards Conformance

Area

Item

Service

Standard

Global

Safety for module

IEC 62368-1:2018

Europe
UK
US/CA Japan Taiwan

Wireless Safety for module

RED CE

EN 300 328 v2.2.2 EN 62479:2010
EN IEC 62368-1: 2020+A11: 2020

EMC

RED

EN 301 489-1 v2.2.3
EN 301 489-17 v3.2.4

Wireless

EN 300 328 v2.2.2 UKCA-RED
EN 62479:2010

Safety for module EMC

UKCA-LVD UKCA-RED

BS EN IEC 623681: 2020+A11: 2020
EN 301 489-1 V2.2.3
EN 301 489-17 V3.2.4

FCC ID

47 CFR PART 15 Subpart C: 2021 section 15.247

Wireless

IC ID

RSS-247 Issue 2: February 2017
RSS-Gen Issue 5: April 2018+A1: March 2019+A2: February 2021

Wireless

MIC

JRL

Wireless

NCC

LP0002

Certificate ID CERTIFICATION IN PROGRESS
Note 1
CERTIFICATION IN PROGRESS
CERTIFICATION IN PROGRESS
Y82-DA14535MOD 9576A-DA14535MOD
012-230026
CERTIFICATION IN PROGRESS

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Area

Item

Service

Standard

Certificate ID

South Korea

Wireless

South Africa

Wireless

MSIP ICASA

KS X 3123 "
" KN 301 489
Based on RED

R-R-8DL-DA14535MOD
CERTIFICATION IN PROGRESS

Brazil

Wireless

Anatel

ATO No.14448/2017
Resolution No.680

CERTIFICATION IN PROGRESS

China

Wireless

SRRC 2002353 CERTIFICATION IN PROGRESS

Thailand
India Australia/ New Zealand

Wireless Wireless Wireless

NBTC WPC ACMA

NBTC TS 10352562
Based on RED
Based on RED

CERTIFICATION IN PROGRESS
CERTIFICATION IN PROGRESS CERTIFICATION IN PROGRESS

Note 1 Include national differences of the US/Canada/Japan/China/Korea/Europe/Australia/South Africa/Taiwan/Brazil/Thailand.

11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) (Europe)
The DA14535 SmartBond TINYTM Module is a Radio Equipment Directive (RED) assessed radio that is CE marked. The module has been manufactured and tested with the intention of being a subassembly to a final product. The module has been tested to RED 2014/53/EU Essential Requirements for Health, Safety, and Radio. The applicable standards are:
Radio: EN 300 328 V2.2.2 (2019-07) Health: (SAR) EN 62479:2010 Safety: EN 62368-1 EMC: EN 301 489-1 v2.2.3, EN 301 489-17 v3.2.4
End product will need to perform the radio EMC tests according to EN 301 489. The conducted tests can be inherited from the module test report. It is recommended to repeat the EN 300 328 radiated testing with the end product assembly.

11.2 FCC (U.S.A.)
Model no. DA14535MOD-00F0100 FCC ID: Y82-DA14535MOD

11.2.1 List of Applicable FCC Rules
The module complies with FCC Part 15.247.
11.2.2 Summarize the Specific Operational Use Conditions
The module has been certified for Portable applications. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
11.2.3 Limited Module Procedures
Not applicable.

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11.2.4 Trace Antenna Designs
Not applicable.

11.2.5 RF Exposure Considerations
This equipment complies with FCC's RF radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be collocated or operating in conjunction with any other antenna or transmitter.

11.2.6 Antennas

Type PCB Antenna

Gain -0.5 dBi

Impedance 50

The antenna is permanently attached, can't be replaced.

Application Fixed

11.2.7 Label and Compliance Information
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference Note 2 This device must accept any interference received, including interference that may cause
undesired operation.

Note
The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user's authority to operate the equipment.

Warning
Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

Note
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
The system integrator must place an exterior label on the outside of the final product housing the DA14535MOD-00F0100 Module. Below are the contents that must be included on this label.

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OEM Labeling Requirements:
Notice The OEM must make sure that FCC labeling requirements are met. This includes a clearly visible exterior label on the outside of the final product housing that displays the contents shown in below:

Model: DA14535MOD-00F0100 Contains FCC ID: Y82-DA14535MOD
11.2.8 Information on test modes and additional testing requirements:
When testing host product, the host manufacture should follow FCC KDB Publication 996369 D04 Module Integration Guide for testing the host products. The host manufacturer may operate their product during the measurements. In setting up the configurations, if the pairing and call box options for testing does not work, then the host product manufacturer should coordinate with the module manufacturer for access to test mode software.
11.2.9 Additional testing, Part 15 Subpart B disclaimer:
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) list on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.
11.3 IC (Canada)
Model no. DA14535MOD-00F0100 IC ID: 9576A-DA14535MOD The DA14535 SmartBond TINYTM Module is certified for the IC as a single-modular transmitter. The module meets IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. The module has been tested according to the following standards:
Radio: RSS-247 Issue 2: February 2017, RSS-Gen Issue 5: April 2018+A1: March 2019+A2:
February 2021
Health: RSS-102 Issue 5:2015
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.
L'émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d'Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : 1) L'appareil ne doit pas produire de brouillage; 2) L'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

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RF Exposure Statement
This device complies with IC radiation exposure limits set forth for an uncontrolled environment and meets RSS-102 of the IC radio frequency (RF) Exposure rules. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter.
Le présent appareil est conforme à l'exposition aux radiations IC définies pour un environnement non contrôlé et répond aux RSS-102 de la fréquence radio (RF) IC règles d'exposition. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
OEM Responsibilities to comply with IC Regulations
OEM integrator is responsible for testing their end product for any additional compliance requirements needed for the module installation like IC ES003 (EMC). This can be combined with the FCC Part 15B test.
End product labeling
The DA14535 SmartBond TINYTM Module is labeled with its own IC ID: 9576A-DA14535MOD. If the IC ID is not visible when the module is installed inside another device, then the host product must be labelled to display the ISED certification number for the module, preceded by the word "contains" or similar wording expressing the same meaning, as follows: Contains IC: 9576A-DA14535MOD."

11.4 UKCA (UK)

UKCA ID: CERTIFICATION PENDING

The module has been tested and found to comply with the standards harmonized with the regulations listed below according to UKCA-Radio Equipment Regulations 2017-CHAPTER 1 6(1)(a) Health, 6(1)(b) & 6(2).

The applicable standards are:

Radio: EN 300 328 V2.2.2 (2019-07)

Health: (SAR) EN 62479:2010

Safety: EN 62368-1:2018, BS EN IEC 62368-1: 2020+A11: 2020

EMC: EN 301 489-1 v2.2.3, EN 301 489-17 v3.2.4

product assembly.

End-product will need to perform the radio EMC tests according to EN 301 489. The conducted tests can be inherited from the module test report. It is recommended to repeat the EN 300 328 radiated testing with the end-

11.5 NCC (Taiwan)
NCC ID: CERTIFICATION PENDING

The DA14535 SmartBond TINYTM Module has received compliance approval in accordance with the Telecommunications Act. The module has been tested according to the following standard:
Radio: Low Power Radio Frequency Devices Technical Regulations (LP0002)
End product may need to follow additional requirements according to the regulation EMC.

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End product labeling The NCC ID can be applied directly to the end product's label.

11.6 MSIP (South Korea)
Model no. DA14535MOD-00F0100
MSIP ID: R-R-8DL-DA14535MOD
DA14535 SmartBond TINYTM Module has received certification of conformity in accordance with Radio Waves Act. The module has been tested according to the following standard:
Radio: Ministry of Science and ICT Notice No. 2019-105
For the end product wireless test, you can refer to Renesas' own certification report so that the lab knows the module itself has passed although it still needs to be tested.
Additionally, EMC for wireless (KN301489).
End product labeling
The MSIP ID can be applied directly to the end product's label. The ID should be clearly visible on the final end product. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website.

11.7 ICASA (South Africa)
South Africa certification is based on RED(CE) approval.

Certification Pending APPROVED

Approval is granted to print labels for the products as described below: 1. For use as Label on the product size: 80 mm (W) X 40 mm (H). To be printed on the
product. 2. For use as Label on the package size: 80 mm (W) X 40 mm (H). To be printed on the
package. End product may need to follow additional requirements according to the regulation EMC.
11.8 ANATEL (Brazil)
Model no. DA14535MOD-00F0100 ANATEL ID: CERTIFICATION PENDING

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Certification Pending
The module has been tested and found to be compliant according to the following Category II standards:
ATO (Act) No 14448/2017
End product may need to follow additional requirements according to the regulation EMC. "Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar interferência em sistemas devidamente autorizados. Translation of the text: "This equipment is not entitled to protection against harmful interference and must not cause interference in duly authorized systems."
11.9 SRRC (China)
Model no. DA14535MOD-00F0100 CMIIT ID: CERTIFICATION PENDING The module has been tested and found to be compliant according to the following standards:
2002353
End product may need to follow additional requirements according to the regulation EMC.
11.10 MIC (Japan)
Model no. DA14535MOD-00F0100 MIC ID: 012-230026

The DA14535 SmartBond TINYTM Module has received type certification as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.
The module has been tested according to the following standard:
Radio: JRL "Article 49-20 and the relevant articles of the Ordinance Regulating Radio" Equipment
End product may need to follow additional requirements according to the regulation EMC.
End product labeling
The MIC ID can be applied directly to the end product's label. The end product may bear the GITEKI mark and certification number so that is clear that the end product contains a certified radio module. The following note may be shown next to, below, or above the GITEKI mark and certification number in order to indicate the presence of a certified radio module:

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Translation of the text:
"This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law."

11.11 NBTC (Thailand)
Model no. DA14535MOD-00F0100 NBTC SDoC ID: CERTIFICATION PENDING The DA14535 SmartBond TINYTM Module is compliant with NBTC requirements in Thailand. End product may need to follow additional requirements according to the regulation EMC. End product labeling End products will have their own ID and labeling requirements.

11.12 WPC (India)
Model no. DA14535MOD-00F0100 Registration No: CERTIFICATION PENDING India certification is based on RED(CE) approval/reports. There are no marking/labeling requirements. End product may need to follow additional requirements according to the regulation EMC.

11.13 Australia/ New Zealand
Model no. DA14535MOD-00F0100 Registration No: CERTIFICATION PENDING

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Revision History

Revision 1.0 1.1 1.2 1.3 1.4 1.5

Date 22-Jun-2023 09-Aug-2023 09-Sept-2023 22-Sept-2023 26-Sept-2023 28-Sept-2023

Description First release. Updated Key Features with maximum output power. Updated with regulatory information Updated regulatory information Updated regulatory information Updated marking with FCC, IC ID

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Status Definitions

Revision 1.<n>

Datasheet Status Target

2.<n>

Preliminary

3.<n>

Final

4.<n>

Obsolete

Product Status Development Qualification Production
Archived

Definition
This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice.
This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design.
This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications.
This datasheet contains the specifications for discontinued products. The information is provided for reference only.

RoHS Compliance
Renesas Electronic's suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.

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Important Notice and Disclaimer
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These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products.
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(Rev.1.0 Mar 2020)

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References

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