Schindler XFIPMB PMB High Performance Multimedia Board User Guide

User Guide for Schindler models including: XFIPMB, XFIPMB PMB High Performance Multimedia Board, PMB High Performance Multimedia Board, High Performance Multimedia Board, Performance Multimedia Board, Multimedia Board, Board

PCB Specification and Technical description template

andreas schneiter Tecpoint Electronic Engineering SA

Integration Manual

Schindler elevators Ltd PMB Mediaboard with 60GHz short range radar XFIPMB XFIPMB pmb

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INDEX
1 INTRODUCTION............................................................................................................................. 2 1.1 Scope ....................................................................................................................................... 2 1.2 PCBA........................................................................................................................................3 1.2.1 PMB .................................................................................................................................... 3 1.2.2 PMBL .................................................................................................................................. 3 1.3 Definitions, Acronyms and Abbreviations .................................................................................. 4 1.4 References ............................................................................................................................... 4
2 GENERAL BOARD IMPLEMENTATION ......................................................................................... 5 2.1 Power supply ............................................................................................................................ 5 2.2 Reset ........................................................................................................................................ 5 2.3 Optical Camera.........................................................................................................................6 2.4 I2C Switch ................................................................................................................................ 6 2.5 Ambient Light Sensor ............................................................................................................... 7 2.6 Audio ........................................................................................................................................ 8 2.7 Radar........................................................................................................................................9 2.8 EEPROM ................................................................................................................................ 10 2.9 User Interface ......................................................................................................................... 10 2.10 uC ....................................................................................................................................... 11
3 CONNECTORS ............................................................................................................................ 12 3.1 Multimedia 28pin..................................................................................................................... 12 3.2 Speaker .................................................................................................................................. 12 3.3 Microphone.............................................................................................................................13 3.4 Optical Camera....................................................................................................................... 13
4 MECHANICS ................................................................................................................................ 14
5 CERTIFICATIONS ........................................................................................................................ 15 5.1 Compliance Procedure of Host device .................................................................................... 15 5.2 Certification label .................................................................................................................... 16 5.2.1 PMB label.......................................................................................................................... 16 5.2.2 End device label ................................................................................................................ 17
6 VARIANTS .................................................................................................................................... 18
7 SALE.............................................................................................................................................18

Modification KA No. KA Date

Ae 0 -

Ae 1

Ae 2

Ae 3

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil
Form EBI 82-008E02B (WinWord)

Ae 4 Ae 5 Ae 6

Classification 11220

Lead Office
GSW

Remark

Prepared 24-11-20 buettial

Reviewed

- -

Norms chkd - -

Released

- -

Replaces / Mod.

Basis Drawing

Q 50100040

No Format
Pg. A4 18

Page Langua

Cet ouvrage est notre propriété intellectuelle. Sans notre autorisation écrite, il ne peut être ni copié d'une manière quelconque, ni être utilisé pour la fabrication, ni non plus être communiqué à des tiers.

1 Introduction
The MB1.Q PCB (Media Board 1st Generation) is a high-performance multimedia board mainly used in PX products.
This document holds the technical description concerning the MB1.Q PCB.
2 different assembly variants of the MB1 board are available: 1. Fully assembled 2. Only the radar part is assembled (for more details see the chapter 6 Variants)
1.1 Scope
The MB1 board implements the following main parts and functions:
· Multimedia 28pin o Main board power supply o MIPI CSI 2x data channels + 1x clock channel o I2C o I2S o GPIOs
· Power Supply o 1x LDO o 1x DC/DC
· Optical Camera o Power supply (specific power-ON sequence) o MIPI CSI 2x data channels + 1x clock channel o I2C
· I2C Switch · Ambient Light Sensor · Audio
o 2x Speakers o 1x Digital microphone · Radar · 128 Kbit EEPROM · User Interface o 1x Green LED · uC · SWD (programming interface for the uC)

Diese Darstellung ist unser geistiges Eigentum. Sie darf ohne unsere schriftliche Zustimmung weder irgendwie kopiert noch zur Anfertigung des Werkes gebraucht oder Drittpersonen bekanntgegeben werden.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
2 A4 . E

Q 50100040 Page Format Lang
3 A4 . E

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

1.2 PCBA
1.2.1 PMB MB1 Top
MB1 Bottom
1.2.2 PMBL MB11 Top
MB11 Bottom

1.3 Definitions, Acronyms and Abbreviations

I2C I2S GPIO SWD LED MMIC VCO PLL RF CSI MIPI CMOS EEPROM LDO uC CPU FPU ART DSP MPU ESD UV IR ~

Description Inter-Integrated Circuit Integrated Interchip Sound General Purpose Input Output Serial Wire Debug Light Emitting Diode Microwave Monolithic Integrated Circuits Voltage Controlled Oscillator Phase Locked Loop Radio Frequency Camera Serial Interface Mobile Industry Processor Interface Complementary Metal-Oxide Semiconductor Electrically Erasable Programmable Read-Only Memory Low Drop Out Microcontroller Central Processing Unit Floating Point Unit Adaptive Real Time Digital Signal Processing Memory Protection Unit Electrostatic Discharge Ultra-Violet Infra-Red Low Active Signal

1.4 References

REF [1] REF [2] REF [3] REF [4] REF [5] REF [6]

S50100040 (Schematics MB1.Q) PORT 1 mini Optical Camera Technical Specifications Q41910733 https://ams.com/ https://www.maximintegrated.com/ https://www.infineon.com/ http://www.st.com/

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
4 A4 . E

2 General board implementation
2.1 Power supply
The MB1 main power supply is +3.3 VDC ± 3% and +5 VDC ± 3% and it comes directly from the Multimedia 28pin connector (see chapter 3.1 Multimedia 28pin).
On board the power supply is structured as follows:

The 1V8 power supply it is enabled with 14 ms delay (it is a request of the Optical Camera). This is implemented with the DCDC regulator MAX17270 (R+C delay on the enable pin of the 1V8).

The board power supplies are generated from the main power supply and are represented in the following table:

Board Power Supplies

PWR In

PWR Out

3V3

1.5 VDC

3.3 VDC

3V3

1.2 VDC

3.3 VDC

1.8 VDC

2.8 VDC

Imax Out 300 mA
1.1 A 1.1 A 0.6 A

Name VDD_RF
1V2 1V8 2V8

Regulator Typ. LDO: NCV8164 Schindler Id. Nr. 561351 DCDC: MAX17270 Schindler Id. Nr. 561286

2.2 Reset
The board reset is controlled/managed directly from the host CPU connected to the Multimedia 28pin connector and the trigger point is the on board uC.

The reset of the following blocks is controlled/managed directly from the on board uC:

Block Radar Audio codec

Signal name uC_RADAR_RESET AUDIO_RESET~

uC GPIO PA1 PC8

Note: The audio codec can be also reset through the I2C I/O Expander with the Output 6.

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
5 A4 . E

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

2.3 Optical Camera
The following Optical Camera is supported by the MB1 board:

Schindler Id. Nr. Type

59910733

See REF [2]

Main features

Note

· Image Sensor: Sony IMX219

REF [2]

· Resolution: 8 MP (3280 x 2464)

· CMOS Size: 1/4 Inch

· Aperture (F): 2.0

· Focal Length: 2.96 mm

· FOV (View Angle): 77.6°

· Distortion: < 1%

· Focusing Range: 20 cm ~ Infinity

· Interface: MIPI + I2C (control

signals)

· Dimensions

o Lens: 6.50 x 6.50 x 4.9 mm

o Module: 80 x 9 mm

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

The MIPI CSI interface is directly connected to the Multimedia 28pin connector. The control signals of the Optical Camera (I2C interface) are connected to the Multimedia 28pin connector through a voltage level translator (from 3.3 VDC to 1.8 VDC).
During the power-up of the Optical Camera the 1V8 power supply must be enabled ONLY when the 1V2 and the 2V8 power supplies are stable. A delay of 10 ms must be considered. This power-up sequence is done by the MAX17270 DC/DC regulator.
For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

2.4 I2C Switch
A digital switch on the I2C lines is present on board. The switch is directly managed by the uC through the following pin:

Block I2C Switch

Signal name I2C_SEL

uC GPIO PE7

The functionality of the I2C switch is represent in the table below:

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
6 A4 . E

I2C_Sel = 1
The I2C Master is the host CPU connected to the Multimedia 28pin connector and the on board uC is an I2C Slave.

I2C_Sel = o
The I2C Master is the on board uC. With this configuration the on board uC can configure/parametrize the audio codec.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

2.5 Ambient Light Sensor
The following Ambient Light Sensor is present on board:

Schindler Id. Nr. Type

561349

AMS

TSL2540

Main features
· very-high sensitivity light-todigital converter
· Single device integrated optical solution o 2.0mm x 2.0mm x 0.5mm o Power management features o I2C fast mode interface compatible
· Accurate ambient light sensing o Photopic ambient light sense (ALS) o UV / IR blocking filter o Programmable gain and integration time
· Power supply: 1.8 V · Case: 10-QFN, 2 x 2 mm

Note REF [3]

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
7 A4 . E

2.6 Audio
The audio block is composed as follow and is managed directly from the codec represented in the table below:
· 2x Speaker · 1x Digital microphone

Schindler Id. Nr. Type

561387

MAXIM

MAX98090

Main features
· 102 dB DR Stereo DAC to HP (8 kHz < FS < 96 kHz)
· 3.6 mW Stereo Playback Power Consumption
· 99 dB DR Stereo ADC (8 kHz < FS < 96 kHz)
· 4.2 mW Stereo Record Power Consumption
· Stereo PDM Digital Microphone Input
· Master Clock Frequencies from 256 x FS to 60 MHz
· I2S/LJ/RJ/TDM Digital Audio Interface
· FlexSound Technology Signal Processing
· Stereo Low EMI Class D Speaker Amplifiers o 3.2 W/Channel (RL = 4 , SPKR_VDD = 5 V) o 1.8 W/Channel (RL = 8 , SPKL_VDD = 5 V)
· Stereo DirectDrive Class H Headphone Amplifier Jack Detection and Identification
· Differential Receiver Amplifier/Stereo Line Output
· Extensive Click-and-Pop Reduction Circuitry
· RF Immune Analog Inputs and Outputs
· Programmable Microphone Bias · I2C Control Interface with Two
Address Options · Case: 40-TQFN, 5 x 5 mm

Note REF [4]

The audio codec can be controlled through the on board uC or through the host CPU connected to the Multimedia 28pin connector. An additional interrupt line of the chip is connected to the on board uC as follow:

Block Audio codec

Signal name AUDIO _IRQ~

uC GPIO PD1

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
8 A4 . E

The audio codec can be reset is 2 different ways (more details in the chapter 2.3 Reset): · Through the I2C I/O Expander · Through the on board uC
For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

2.7 Radar
The following Radar is present on board:

Schindler Id. Nr. Type

561350

Infineon

BGT60LTR11AIP

Main features
· 60 GHz transceiver MMIC with one transmitter and one receiver unit
· Antennas in package (AIP) 6.7 × 3.3 × 0.56 mm3
· Pulsed Doppler mode of operation for low power consumption
· Autonomous mode o Integrated detector for motion and direction of movement o Direct output of motion detection signal o 15 configurable thresholds for target detection range o 16 configurations for detection status hold time o 4 configurable operating frequencies o 4 configurable pulse repetition rates
· High performance enabled from Infineon's BiCMOS technology o Fully integrated low phase noise VCO and PLL o Medium power amplifier with configurable output power and integrated power detector o Low noise variable gain baseband amplifiers o Fully ESD protected device
· Power supply: 1.5 V · Case: PG-UF2BGA-42
6.7 x 3.3 mm

Note REF [5]

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
9 A4 . E

2.8 EEPROM
The following EEPROM is present on board:

Schindler Id. Nr. 561260

Type ST Microelectronics M24128-DFMC6TG

Main features
· Compatible with all I2C bus modes: o 1 MHz o 400 kHz o 100 kHz
· Memory array: o 128 Kbit (16 Kbyte) of EEPROM o Page size: 64 bytes o Additional Write lockable page (M24128-D order code)
· Single supply voltage and high speed: o 1 MHz clock from 1.7 V to 5.5 V
· Write: o Byte Write within 5 ms o Page Write within 5 ms
· Operating temperature range: o From -40 °C up to +85 °C
· Random and sequential Read modes
· Write protect of the whole memory array
· Enhanced ESD/Latch-Up protection
· More than 4 million Write cycles · More than 200-years data
retention · Case: 8-UFDFPN, 2 x 3 mm

Note REF [6]

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

2.9 User Interface
The user interface is composed from a single green LED connected directly to the I2C I/O Expander like the following table:

LED Color Green

Signal name STS_LED

I2C I/O Expander GPIO Output 7

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
10 A4 . E

2.10 uC
The following uC is present on board:

Schindler Id. Nr. 561348

Type ST Microelectronics STM32F446

Main features · Core: Arm® 32-bit Cortex®-M4
CPU with FPU, ART accelerator, full set of DSP instructions and MPU · Op. Freq. up to 180 MHz · Internal memories o 512 Kbytes of Flash memory o 128 Kbytes of SRAM · Power supply: 3.3 V · Case: 81-WLCSP, 3.7 x 3.8 mm

Note REF [6]

Here below more in detail the uC characteristics:

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

For more details regarding the connections and the signals see the REF [1] document and the chapter 3 Connectors.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
11 A4 . E

3 Connectors

3.1 Multimedia 28pin

Connector Type: SMD FFC/FPC conn., 28 poles, 0.5 mm, Top Contact, Id. Nr. 561082

Silkscreen:

Pin
1 2 3, 4, 14, 19, 22, 25, 28 5 6, 7 8 9 10 11 12, 17 13, 18 15 16 20 21 23 24 26 27

Sig. Name
EXT_RESET_uC ALS_INT~
GND
MOTION_DET_uC N. C. I2S_BCLK I2S_DIN I2S_DOUT I2S_LRCLK 5V 3V3 I2C_SDA I2C_SCL MIPI_CSI_CLK_P MIPI_CSI_CLK_N MIPI_CSI_D1_P MIPI_CSI_D1_N MIPI_CSI_D0_P MIPI_CSI_D0_N

Max U
3.3 VDC 3.3 VDC
0 VDC
3.3 VDC -
3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 5 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC

Tol.
±3% ±3%
-
±3% -
±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3%

Max I
5 mA 5 mA

Typ.
I O

Description
uC Reset ALS Interrupt

PWR Ground

5 mA -
5 mA 5 mA 5 mA 5 mA 200 mA 200 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA

O I I O I PWR PWR I/O O O O O O O O

uC Motion Detection Not connected I2S Bit Clock I2S Data Input I2S Data Output I2S Left Right Clock Main power supply Main power supply I2C Data I2C Clock MIPI CSI CLK+ MIPI CSI CLKMIPI CSI D1+ MIPI CSI D1MIPI CSI D0+ MIPI CSI D0-

3.2 Speaker

Connector Type: SMD 4 poles crimp conn., right angle, 1.20 mm, Id. Nr. 561354

Silkscreen:

Pin Sig. Name
1 SPKR+ 2 SPKR3 SPKL+ 4 SPKL-

Max U
±5 VDC
±5 VDC

Tol.
±5%
±5%

Max I
200 mA
200 mA

Typ.
-

Description
Speaker Non Inverting Output Right channel Speaker Inverting Output Right channel Speaker Non Inverting Output Left channel Speaker Inverting Output Left channel

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
12 A4 . E

3.3 Microphone

Connector Type: SMD FFC/FPC conn., 4 poles, 0.5 mm, Bottom Contact, Id. Nr. 561352

Silkscreen:

Pin Sig. Name
1 1V8 2 GND 3 DIG_MIC_CLK 4 DIG_MIC_DATA

Max U
1.8 VDC 0 VDC 1.8 VDC 1.8 VDC

Tol.
±3% -
±3% ±3%

Max I
10 mA -
5 mA 5 mA

Typ.
PWR PWR
O I

Description
Power supply Ground Digital microphone Clock Digital microphone Data

3.4 Optical Camera

Connector Type: SMD 2x15 poles HRS board conn., 0.4 mm, Id. Nr. 561287

Silkscreen:

Pin
1, 2, 11, 13, 14, 17,
18 3, 5
4 6, 8, 9, 12, 15, 16, 19, 22, 25,
28 7 10 20
21 23 24 26 27 29 30

Sig. Name
N. C.
1V8 1V2
GND
24M_CLK 2V8 MIPI_CSI_D1_N MIPI_CSI_D1_P MIPI_CSI_D0_N MIPI_CSI_D0_P MIPI_CSI_CLK_N MIPI_CSI_CLK_P I2C_SCL I2C_SDA

Max U
-
1.8 VDC 1.2 VDC
0 VDC
3.3 VDC 2.8 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 3.3 VDC 1.8 VDC 1.8 VDC

Tol.
-
±3% ±3%
-
±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3%

Max I Typ. Description

- Not connected

20 mA 20 mA

PWR Power supply Optical Camera PWR Power supply Optical Camera

PWR Ground

5 mA 20 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA

O PWR
I I I I I I O I/O

24 MHz Clock Power supply Optical Camera MIPI CSI D1MIPI CSI D1+ MIPI CSI D0MIPI CSI D0+ MIPI CSI CLKMIPI CSI CLK+ I2C Clock. Voltage level 1.8 VDC I2C Data. Voltage level 1.8 VDC

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
13 A4 . E

Q 50100040 Page Format Lang
14 A4 . E

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

See mechanical drawing 1.6 mm Top side = 2 mm Bottom side = 2 mm 10 g

4 Mechanics
PCB Size PCB thickness Component height
Weight

5 Certifications
a) User Information acc. to FCC15.21: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
b) Part 15 Statement acc. to FCC 15.19: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation.
c) Statement acc. to RSS GEN Issue 5: This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Cet appareil contient des émetteurs / récepteurs exemptés de licence conformes aux RSS (RSS) d'Innovation, Sciences et Développement économique Canada. Le fonctionnement est soumis aux deux conditions suivantes:
(1) Cet appareil ne doit pas causer d'interférences. (2) Cet appareil doit accepter toutes les interférences, y compris celles susceptibles de
provoquer un fonctionnement indésirable de l'appareil.
The end device is compliant with the following Standards: · ICES-003 Issue 7 (2020) · FCC CFR 47 Part 15 Subpart B
5.1 Compliance Procedure of Host device
The final host device, into which this modular approved transmitter is finally integrated has to comply itself to the appropriate technical requirements (typically §15.107 AC Powerline Conducted Limits when connected to the public AC Power lines and §15.109 Radiated Emission Limits for an Unintentional Radiator) and apply applicable FCC Equipment Authorization Procedures (SDoC or Certification). Host devices marketed to Canada are typically subject to ICES-003 Information Technology Equipment (including Digital Apparatus) and the SDoC procedure.
This modular approved transmitter is tested and certified as stand-alone device under FCC §15.255 "Operation within the band 57-71 GHz" and ISED RSS-210 Annex J: Devices operating in the band 57-71 GHz. When the module is integrated into a final host device, the integrator must repeat the Fundamental (EIRP) and Out-of-Band Emission measurements of one operating channel to assure compliance with the FCC/ISED requirements of the radar module when operating inside the host device.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
15 A4 . E

If the host device contains any additional transmitter, then simultaneous transmission compliance measurements are required to assure that the device complies with the FCC / ISED requirements having all transmitters operational (FCC Multi-transmitter Policy). This also applies when multiple certified RF Modules are integrated and operational in addition to this radar module. RF Exposure to be addressed for the entire device. Restrictions as defined in FCC §15.255 (a) & (b) and RSS-210 Annex J (J.2) apply.
5.2 Certification label
5.2.1 PMB label
Note: A QR/bar code with data related to the production (production date, production batch, Schindler ID number, ...) could be added on the label.
HVIN: PMB PMN: PMB or PMBL (see chapter 6 Variants) Remarks: Product label on the board: The label will be applied on the PMB after the assembly and the tests of it. The PMB will never be supplied standalone, but always in an end device. The end device will be assembled and tested in the Schindler factory. The end device will be then shipped to the end customer that does not open it anymore. PMB/PMBL identification: On the blank board of the PMB there will be 2 different Id. Nr. (PMB and PMBL) that can be crossed (2 empty squares will be present) during the production. In addition, you clearly see the 2 different assembly. See example below of another Schindler board.
PMB Schindler Ident Number: 551261 PMBL Schindler Ident Number: 551260

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
16 A4 . E

Q 50100040 Page Format Lang
17 A4 . E

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

When in production a PMB is produced the empty square related to it will be crossed.
When in production a PMBL is produced the empty square related to it will be crossed.
5.2.2 End device label Here below an example of the end device label.

6 Variants
2 different assembly variants of the MB1 board are available: 3. Fully assembled · PMN: PMB 4. Only the radar part is assembled · PMN: PMBL
For more details regarding the MB1 parts see the REF [1] document.
7 Sale
The PMB will never be sold standalone to a customer, but always in an end device. The end device will be assembled and tested in the Schindler factory. The end device will be then shipped to the end customer that does not open it anymore.
All the technical documents (including the integration instruction of the PMB) are internal confidential manufacturing documents.

This presentation is our intellectual property. Without our written consent, it shall neither be copied in any manner, nor used for manufacturing, nor communicated to third parties.

PCB MB1.Q
Technical description
INVENTIO AG CH-6052 Hergiswil

KA No. KA Date Ae

Q 50100040 Page Format Lang
18 A4 . E

References

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