Dell EMC PowerEdge R7515 Technical Specifications

System Dimensions

The PowerEdge R7515 system dimensions are detailed in Figure 1.

Chassis Weight

Processor Specifications

PSU Specifications

The PowerEdge R7515 system supports the following AC or DC power supply units (PSU):

[NOTE] When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.

[NOTE] Heat dissipation is calculated using the PSU wattage rating.

[NOTE] This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 230 V.

[NOTE] If a system with 1600 W AC PSU operates at low line 100-120 V AC, then the power rating per PSU is derated to 800 W.

[NOTE] If a system with 1100 W AC PSU or 1100 W mixed mode PSU operates at low line 100-120 V AC, and then the power rating per PSU is derated to 1050 W.

Supported Operating Systems

The PowerEdge R7515 supports the following operating systems:

• Canonical Ubuntu Server LTS
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi

For more information, see www.dell.com/ossupport.

Cooling Fans Specifications

The PowerEdge R7515 system supports both the Standard fan (STD fan) and High Performance fan (HPR fan) and requires all six fans to be installed.

[NOTE] Mixing of STD and HPR fans is not supported.

[NOTE] The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix.

System Battery Specifications

The PowerEdge R7515 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion Card Riser Specifications

The PowerEdge R7515 system supports PCI Express (PCIe) Gen3/Gen4 expansion cards. This system supports low profile, full height, and 1U/2U expansion card risers.

[NOTE] The expansion-card slots are not hot-swappable.

Memory Specifications

The PowerEdge R7515 system supports the following memory specifications for optimized operation.

Storage Controller Specifications

The PowerEdge R7515 system supports the following controller cards:

Drive Specifications

Drives

The PowerEdge R7515 system supports:

• Up to 8 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 7
• Up to 12 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11
• Up to 12 x 3.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11 + up to 2 x 3.5 inch (SAS, SATA or SSD) rear accessible drives in slots 12 to 13
• Up to 24 x 2.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 23
• Up to 12 x 2.5 inch (SAS, SATA or SSD) front accessible drives in slots 0 to 11 and up to 12 x 2.5 inch NVMe drives in 12 universal slots 12 to 23
• Up to 24 x 2.5 inch front accessible NVMe drives in bay 0 (slot 0 to 11) and bay 1 (slots 0 to 11)
• Up to 8 x 2.5 inch (SAS, SATA or SSD) front accessible drives in Universal slots 0 to 7 (Bay 0) and up to 16 x 2.5 inch NVMe drives in bay 0 (slots 8 to 11) and bay 1 (slots 0 to 11)

[NOTE] The front-accessible NVMe drives currently utilize PCIe Gen3.

[NOTE] For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell.com/support > Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents.

Backplane:

• 8 x 3.5-inch SAS, SATA drives
• 24 x 2.5-inch SAS, SATA drives
• 24 x 2.5-inch NVMe drives
• 12 x 3.5-inch SAS, SATA drives and 2 x 3.5-inch SAS, SATA drives
• 12 x 2.5-inch SAS, SATA drives and 12 x 2.5-inch NVMe drives
• 8 x 2.5-inch SAS, SATA drives and 16 x 2.5-inch NVMe drives

Optical Drives

The PowerEdge R7515 system supports the following optical drives:

Ports and Connectors Specifications

USB Ports Specifications

[NOTE] The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

LOM Riser Card Specifications

The PowerEdge R7515 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports that are located on the back panel. The system also supports LAN on Motherboard (LOM) on an optional riser card. You can install one LOM riser card. The supported LOM riser options are:

• 2 x 1 Gb Base-T
• 2 x 10 Gb Base-T
• 2 x 10 Gb SFP+
• 2 x 25 Gb SFP+

[NOTE] You can install up to four PCIe add-on NIC cards.

[NOTE] For information about Linux network performance settings, see the Linux Network Tuning Guide for AMD EPYC Processor Based Servers white paper at AMD.com

Serial Connector Specifications

The serial connector connects a serial device to the system. The PowerEdge R7515 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.

VGA Ports Specifications

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R7515 system supports two 15-pin VGA ports one each on the front and back panels.

IDSDM Module

The PowerEdge R7515 system supports optional Internal Dual SD module (IDSDM) module. The module supports two microSD cards. The supported microSD card storage capacities are mentioned below:

• 16 GB
• 32 GB
• 64 GB

[NOTE] There are two dip switches on the IDSDM for write-protection.

[NOTE] One IDSDM card slot is dedicated for redundancy.

[NOTE] Use Dell EMC branded microSD cards that are associated with the IDSDM configured systems.

Video Specifications

The PowerEdge R7515 system system supports Matrox G200eR2 graphics card with 16 MB capacity.

[NOTE] 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.

Supported Front Video Resolution Options

Supported Rear Video Resolution Options

Environmental Specifications

The following sections contain information about the environmental specifications of the system.

[NOTE] For additional information about environmental certifications, please refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/poweredgemanuals

Operational Climatic Range Category A2

Operational Climatic Range Category A3

Thermal Restriction for ASHRAE A3/Fresh Air Environment (UI)

• Two PSUs are required in redundant mode. Single PSU failure is not supported
• LRDIMM is not supported
• Processor TDP equal or greater than 180 W are not supported
• 128 GB or greater capacity DIMMs are not supported
• Non-Dell qualified peripheral cards greater than 25 W are not supported
• Both SW and DW GPGPU are not supported
• PCIe SSD is not supported
• Rear drive configuration is not supported

Thermal Restriction for ASHRAE A4/Fresh Air Environment (UI)

• Two PSUs are required in redundant mode. Single PSU failure is not supported
• LRDIMM is not supported.
• Processor TDP equal or greater than 155 W are not supported.
• 128 GB or greater capacity DIMMs are not supported.
• Both SW and DW GPGPU are not supported.
• PCIe card without EOT (max 65°C inlet temperature) and cooling tier 5 and above are not supported (UI).
• PCIe SSD is not supported.
• BOSS and OCP are not supported (UI).
• PCIe card TDP greater than 25 W is not supported.
• Rear drive configuration is not supported.

Shared Requirements Across All Categories

*: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.

Thermal Restriction Matrix

[NOTE] To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the memory sockets that are not populated.

[NOTE] *For 12 x 3.5-inch drive (Rear 2 x 3.5-inch drives SAS)/24 x 2.5-inch drive configuration support 280 W CPU up to 30°C ambient temperature.

Thermal Restriction Matrix for T4 GPU Card

[NOTE] The table shows ambient restriction according to T4 in specific PCIe slots of Jalpa PCIex4 rear end configuration. Jalpa rear drive x2 + PCIe x2 does not support T4 and is not considered in this table.

[NOTE] GPU temperature has lower sensitivity to processor power. Can support T4 GPU up to 30°C ambient temperature.

Thermal Restriction Matrix for V100S GPU Card

[NOTE] 8 x 3.5-inch drives chassis do not support AUX power cable, and therefore do not support V100S GPU card .

Processor Support Matrix

[NOTE] HPR fan is required for T4 GPU, V100S GPU, NVMe, and Double wide FPGA supporting.

[NOTE] NVMe configuration with drive install/Nvidia T4/ Double Width FPGA

[NOTE] Except for 8 x 3.5-inch/24 x 2.5-inch(without NVMe), all other configurations have only high-performance fan type.

[NOTE] 12 x 3.5-inch does not support 280 W processor.

[NOTE] Need DIMM blank support for Evans HDD (RJT6H, 7KT9W, PY7WD, CNXPV, WGXDC, V308G, 3JTD3, 39XRY) in 12 x 3.5-inch drive configuration.

Other Thermal Restrictions

• Mellanox CX5 with QSFP28 is restricted to slot 4 and slot 5 in no rear drive configuration. Non-Dell qualified cables are not supported.
• Mellanox CX6 with QSFP56 (Mellanox MFS1S00) is restricted to slot 4 and slot 5 in no rear drive configuration. Non-Dell qualified cables are not supported.
• Solarflare XtremeScale X2522-25G adapter is restricted to slot 4 and slot 5 in no rear drive configuration.
• 750 GB PCIe SSD Adapter (P4800) by Intel is restricted to slot 4 and slot 5 in no rear drive configuration.
• 25 G LOM riser is not supported with 128 G LRDIMM or higher on 12 x 3.5-inch drives configuration.
• DIMM blank is required at 12 x 3.5-inch and 12 x 3.5-inch + 2 x 3.5-inch (rear) storage configuration.

Particulate and Gaseous Contamination Specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

[NOTE] This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.

[NOTE] Air entering the data center must have MERV11 or MERV13 filtration.

[NOTE] Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127

[NOTE] Maximum corrosive contaminant levels measured at 50% relative humidity.