ASRock X600D5-P1/DASH Motherboard Specifications

1.1 BIOS Features

The motherboard supports the following core components:

1.2 System Specifications

Dimensions

Form Factor: 6.7 x 6.8 inches (17.0 cm x 17.2 cm)

CPU Support

Processor Socket: AMD Socket AM5
Compatible CPUs: AMD Ryzen™ 8000 Series, AMD Ryzen™ 7000 Series
CPU Power Design: Supports up to 65W TDP CPUs, features a 4+1+1 power phase design.

Chipset

AMD X600 Chipset

Memory

Technology: DDR5 SO-DIMM
Slots: 2 x DDR5 SO-DIMM slots
Speed: DDR5 ECC 6400+(OC)*
Maximum Capacity: Up to 96GB
Memory Support List: Available at http://www.asrock.com/

M.2 Slot (Key E)

1 x M.2 Socket (Key E) 2230 for WiFi/Bluetooth modules.

Graphics

Integrated Graphics: AMD RDNA™ graphics (CPU dependent).
Display Outputs: Supports up to 4 displays.
- 1 x HDMI 2.1 port (TMDS 8G, HDR, HDCP 2.3, supports 4K @ 120Hz).
- 2 x DisplayPort 1.4 ports (DSC, HDCP 2.3, supports 4K @ 120Hz).
- 1 x USB Type-C port supporting USB4 (40 Gb/s) with DisplayPort Alternate Mode (for Ryzen™ 8000G series) or DP Alt Mode (for Ryzen™ 7000 series).

Audio

Realtek ALC269 audio codec.

LAN

Controller: PCIE x1 Gigabit LAN 10/100/1000 Mb/s
PHY Chip: Realtek RTL8111FP
Features: Wake-On-LAN, ESD protection for LAN, 802.3az Ethernet, UEFI PXE boot, DASH support.

1.4 I/O Ports and Connectors

Rear Panel I/O

Internal Connectors

Storage Connectors

1.5 RAID and BIOS Features

RAID Support

Supports RAID 0 and RAID 1 for M.2 NVMe SSDs.

BIOS

1.6 CMOS Clear

To clear CMOS settings, follow these steps:

  1. Power off the system and unplug the power cord.
  2. Locate the CLRCMOS1 jumper on the motherboard.
  3. Move the jumper from pins 1-2 (default) to pins 2-3 to clear CMOS.
  4. Plug in the power cord and power on the system briefly.
  5. Power off the system and unplug the power cord again.
  6. Return the jumper to its original position (pins 1-2).
Clearing CMOS resets all BIOS settings to their default values.

1.7 Onboard Headers

SATA3 Connector

SATA1 connector supporting SATA3 6.0 Gb/s.

Fan Connectors

COM1 Header

Serial communication header with the following pinout: DDCD#1, RRXD#1, TTXD#1, DDTR#1, GND, DDSR#1, RRTS#1, CCTS#1, RRI#1.

2.5 Speaker Connector

MONO1 (4-pin) connector for audio output. Pinout: GND, Signal, MONO_OUT+, MONO_OUT-. Supports 2.5W output.

CASE OPEN Header

This header is used to detect if the computer case has been opened, providing a security alert.

1.5 M.2 WiFi/BT Module Installation

This section describes the M.2 Socket (Key E) 2230, designed for installing WiFi and Bluetooth modules. The slot accommodates modules with a PCB length of 3cm (Type2230). Diagrams illustrate the location and correct orientation for installing the M.2 WiFi/BT module on the motherboard.

1.6 M.2 SSD Module Installation

This section details the installation of M.2 SSDs into the M.2 Socket (M Key) M2_1 and M2_2. These slots support M.2 SSDs in the 2280 form factor and utilize the PCIe Gen4x4 interface, offering up to 64 Gb/s bandwidth for NVMe SSDs. Diagrams show the placement and orientation for installing M.2 SSD modules.

M.2 SSD Compatibility List

Brand Interface Model Number / Description
ADATAPCIeASX7000NPC-512GT-C (XPG SX7000) (NVMe)
ADATAPCIeASX8000NPC-512GM-C (XPG ASX8000) (NVMe)
ApacerPCIeZ280 AP240GZ280-240G (NVMe)
IntelPCIeOptane Memory 32GB (MEMPEK1W032GA)(NVMe)
IntelPCIeOptane Memory 16GB (MEMPEK1W016GA)(NVMe)
INTELPCIe600P-SSDPEKKW256G7-256GB (NVMe)
INTELPCIe600P-SSDPEKKW128G7-128GB (NVMe)
INTELPCIe6000P-SSDPEKKF256G7-256GB (NVMe)
INTELPCIe6000P-SSDPEKKF512G7-512GB (NVMe)
KingstonPCIeSHPM2280P2/240G
PATRIOTPCIeHellfire M2 (240G) (NVMe)
PLEXTORPCIePX-256M8PeG (NVMe)
PLEXTORPCIePX-256M8SeGN (NVMe)
SamsungPCIeXP941-512G (MZHPU512HCGL)
SamsungPCIe950Pro-512G (NVMe)
SamsungPCIe950Pro-256G (NVMe)
SamsungPCIeMZ-VLW1280 (PM961) (NVMe)
SamsungPCIeMZ-VPW1280 (SM961) (NVMe)
TOSHIBAPCIeXG3-128G (NVMe)
TOSHIBAPCIeOCZ RD400-256G (NVMe)
WDPCIeWDS512G1X0C-00ENX0 (NVMe)
WDPCIeWDS256G1X0C-00ENX0 (NVMe)

Environmental Compliance

China RoHS Compliance (SJ/T 11364-2006)

This table indicates the presence of hazardous substances within the product according to China RoHS standards.

Substance Concentration Limit Compliance Status
Lead (Pb)< 0.1%O
Cadmium (Cd)< 0.01%O
Mercury (Hg)< 0.1%O
Hexavalent Chromium (Cr(VI))< 0.1%O
Polybrominated Biphenyls (PBB)< 0.1%O
Polybrominated Diphenyl Ethers (PBDE)< 0.1%O

Legend:
'O' indicates that the concentration of the substance is below the limit specified in SJ/T 11363-2006 and EU Directive 2002/95/EC.
'X' indicates that the concentration of the substance is above the limit specified in SJ/T 11363-2006 and EU Directive 2002/95/EC.

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