HP Elite x2 G8 QuickSpecs

Overview

Left Side View

1. Ambient Light Sensor
2. FHD Camera LED
3. FHD and IR Cameras
4. IR Camera LED
5. Speakers
6. Magnetic Pen Attach Area

Right Side View

7. Optional Premium Keyboard
8. Glass Clickpad
9. Nano Security Lock Slot (Lock Sold Separately.)
10. Volume Up/Volume Down
11. Audio Combo Jack

Right Side View (Continued)

1. World-facing Microphone
2. Rear-Facing 8 MP Camera
3. Privacy Camera Shutter
4. Power Button
5. HP Fingerprint Sensor (select models)
6. Kickstand
7. Nano SIM Card Slot (Available with WWAN configurations only)
8. Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
9. Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
10. SuperSpeed USB Type-C® 10Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
11. Charging LED

Note: SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

At a Glance

Windows 11 Pro, other Windows OS or FreeDOS preinstalled
Designed for professionals who desire freedom to work anywhere without compromising on productivity, security, or privacy
HP Elite x2 G8 delivers PC productivity and enterprise-friendly features in a stunningly crafted and versatile detachable design
Clean with select household cleaning wipes
Post-consumer recycled content used in display bezel, speaker enclosure, and battery frame
Powered with 11th Gen Intel® Core™ i3, i5, i7 U-Series processors with optional vPro®, Thunderbolt™ 4, Intel® Iris® Xe Graphics
Up to 2 TB PCIe NVMe SSD and up to 16 GB LPDDR4 dual channel memory
Choice of displays (all touch-enabled with Corning® Gorilla® Glass 5):
- 13" diagonal 3Kx2K (3000 x 2000), IPS, 450 nits, 72% NTSC
- 13" diagonal, WUXGA+ (1920 x 1280), IPS, 400 nits, 72% NTSC
- 13" diagonal, WUXGA+ (1920 x 1280), IPS, 1000 nits, 72% NTSC with HP Sure View Integrated Privacy Screen Gen3
Software applications that enhance productivity and take care of you including HP Quick Drop, HP Programmable Key, HP Easy Clean, and HP WorkWell
Immersive collaboration experience with dual premium stereo speakers, DNN Noise Suppression, HP Dynamic Audio, HP Sound Calibration, Front-facing 2MP + IR and rear-facing 8 MP cameras
Enterprise grade security and manageability features including TPM2.0, HP Sure Start self-healing BIOS, HP Client Security, Self-Encrypting storage drives, Dual HP Privacy Camera, optional HP Sure View Gen3, optional Fingerprint reader, HP Manageability Integration Kit and HP Image Assistant.
Connectivity anywhere with Wi-Fi® 6, optional 4G LTE, built-in Tile, and USB-C® docking (dock sold separately)
Undergoes MIL-STD 810H testing
Premium spill resistant, backlit keyboard with HP Programmable Key, Clickpad, and HP Durakey (optional).
Battery life up to 11 hours

Technical Specifications

Product Name

HP Elite x2 G8

Operating System

Preinstalled

Windows 11 Pro
Windows 11 Pro Education
Windows 11 Home (HP recommends Windows 11 Pro for business)
Windows 11 Home Single Language (HP recommends Windows 11 Pro for business)
Windows 11 Pro (Windows 11 Enterprise or Windows 10 Enterprise available with a Volume Licensing Agreement)
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade)
FreeDOS

Processors

Intel® Core™ i7-1165G7 processor (2.8 GHz base frequency, up to 4.7 GHz frequency with Intel® Turbo Boost Technology, 12 MB L3 cache, 4 cores)
Intel® Core™ i7-1185G7 (3.0 GHz base frequency, up to 4.8 GHz with Intel® Turbo Boost Technology, 12 MB L3 cache, 4 cores), supports Intel® vPro® Technology
Intel® Core™ i5-1135G7 processor (2.4 GHz base frequency, up to 4.2 GHz frequency with Intel® Turbo Boost Technology, 8 MB L3 cache, 4 cores)
Intel® Core™ i5-1145G7 (2.6 GHz base frequency, up to 4.4 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache, 4 cores), supports Intel® vPro® Technology
Intel® Core™ i3-1125G4 with Intel® UHD Graphics (2.0 GHz base frequency, up to 3.7 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache, 4 cores)

Processor Family

11th Generation Intel® Core™ i7 processor (i7-1185G7, i7-1165G7)
11th Generation Intel® Core™ i5 processor (i5-1145G7, i5-1135G7)
11th Generation Intel® Core™ i3 processor (i3-1125G4)

Graphics

Integrated

Intel® Iris® Xe Graphics
Intel® UHD Graphics

Supports

Support HD decode, DirectX12

Display

Touch

Specification	13" WUXGA+ (1920 x 1280), 400 nits	13" 3Kx2K (3000 x 2000), 450 nits	13" WUXGA+ (1920 x 1280), 1000 nits, HP Sure View
Diagonal Size	13.0 in	13.0 in	13.0 in
Outline Dimensions (W x H x D)	277.748 x 193.2 max. (w/ P-cover)	279.3 x 193.0 mm (max.)	277.748 x 193.2 mm (max)
Active Area	272.448 x 181.632	274.5 x 183 mm (max.)	272.448 x 181.632 mm
Weight	200 g (max)	160 g (max.)	190 g (max)
Thickness	2.0 (panel) /3.9 (panel + PCB) max.	1.8(panel side)/3.9(PCBA side) mm(max.)	3.9 mm (max)
Interface	eDP 1.4	eDP 1.4a + PSR (4 lane) (MBO support)	eDP 1.4 + PSR (4 lane)
Surface Treatment	BrightView	BrightView	BrightView
Touch Enabled	Yes	Yes	Yes
Contrast Ratio	1500:1	1800:1	2000:1
Refresh Rate	60 Hz	60Hz	60 Hz
Brightness	400 nits	450 nits	1000 nits
Pixel Resolution	1920 x 1280	3000 x 2000	1920 x 1280
Format of LCD Pixel Arrangement	RGB	RGB	RGB
Backlight	LED	LED	LED
Color Gamut Coverage	100% sRGB	8bits	100% sRGB
Color Depth	8 bits	UWVA 85/85/85/85	8 bits
Viewing Angle	85/85/85/85		UWVA 85/85/85/85

Storage and Drives

Primary M.2 Storage

2 TB PCIe® NVMe™ TLC SSD
1 TB PCIe® NVMe™ TLC SSD
512 GB PCIe® NVMe™ TLC SSD
256 GB PCIe® NVMe™ TLC SSD
128 GB PCIe® NVMe™ TLC SSD
512 GB PCIe® NVMe™ Value SSD
256 GB PCIe® NVMe™ Value SSD
512 GB PCIe® NVMe™ SED TLC SS
256 GB PCIe® NVMe™ SED TLC SS
512 GB Intel® PCIe® NVMe™ QLC SSD with 32 GB Intel® Optane™ memory H10

128 GB PCIe® NVMe™ TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	128 GB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X2	1300 ~ 2047 MB/s	630 ~ 800 MB/s	250,069,680	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security; DIPM; TRIM; DEVSLP

1 TB PCIe® NVMe™ TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	1 TB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X4	3100 ~ 3500 MB/s	2700 ~ 3200 MB/s	2,000,409,264	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security; TRIM; L1.2

256 GB PCIe® NVMe™ TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	256 GB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X4	2800 ~ 3500 MB/s	1400 ~ 2200 MB/s	500,118,192	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security; TRIM; L1.2

256 GB PCIe® NVMe™ Value

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	256 GB	Value	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3	2100 ~ 2200 MB/s	900 ~ 1400 MB/s	500,118,192	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security (optional); TRIM; L1.2

256 GB PCIe® NVMe™ SED TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	256 GB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3x4	2800 ~ 3500 MB/s	1663 ~ 2200 MB/s	500,118,192	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security (option); TCG Opal 2.0; TRIM; L1.2

512 GB PCIe® NVMe™ TLC SSD

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	512 GB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3x4	3100 ~ 3500 MB/s	2400 ~ 2956 MB/s	1,000,215,215	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security; TRIM; L1.2

512 GB PCIe® NVMe™ Value

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	512 GB	Value	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3	1500 ~ 3500 MB/s	1000 ~ 1600 MB/s	1,000,215,215	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security (optional); TRIM; L1.2

512 GB Intel® PCIe® NVMe™ QLC SSD with 32 GB Intel® Optane™ memory H10

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	512 GB	QLC+3D XPoint	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X2X2	Up to 2400 MB/s	Up to 1300 MB/s	1,000,215,215	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security; TRIM; L1.2

512 GB PCIe® NVMe™ Self Encrypting Drive TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	512 GB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X4	3100 ~ 3500 MB/s	2400 ~ 2956 MB/s	1,000,215,215	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security (option); TCG Opal 2.0; TRIM; L1.2

2 TB PCIe® NVMe™ TLC

Form Factor	Capacity	NAND Type	Height	Width	Weight	Interface	Maximum Sequential Read	Maximum Sequential Write	Logical Blocks	Operating Temperature	Features
M.2 2280	2 TB	TLC	0.09 in (2.3 mm)	0.87 in (22 mm)	0.02 lb (10 g)	PCIe NVMe Gen3X2	2900 ~ 3500 MB/s	2100 ~ 2000 MB/s	3,907,029,168	32° to 158°F (0° to 70°C) [ambient temp]	ATA Security. TRIM; L1.2

Networking/Communications

WLAN

Intel® Wi-Fi 6 AX201 (2x2) and Bluetooth® 5.2, vPro® Wireless Card
Intel® Wi-Fi 6 AX201 (2x2) and Bluetooth® 5.2, non-vPro® Wireless Card

WWAN

Intel® XMM™ 7360 LTE-Advanced Cat 9

Miracast

Compatible with Miracast-certified devices.

Intel® Wi-Fi 6 AX201 + Bluetooth® 5.2 Wireless Card (802.11ax 2x2, supporting gigabit data rate5) (vPro®)

	Wireless LAN Standards
	IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11ac, IEEE 802.11ax, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i, IEEE 802.11k, IEEE 802.11r, IEEE 802.11v
Interoperability	Wi-Fi certified
Frequency Band	• 802.11b/g/n/ax 2.402 – 2.482 GHz • 802.11a/n/ac/ax 4.9 – 4.95 GHz (Japan) 5.15 – 5.25 GHz 5.25 – 5.35 GHz 5.47 – 5.725 GHz 5.825 – 5.850 GHz
Data Rates	• 802.11b: 1, 2, 5.5, 11 Mbps • 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps • 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps • 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz) • 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz,,80MHz & 160MHz) • 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz,,80MHz & 160MHz)
Modulation	Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security³	• IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only • AES-CCMP: 128 bit in hardware • 802.1x authentication • WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. • WPA2 certification • WPA3 certification • IEEE 802.11i • WAPI
Network Architecture Models	Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming	IEEE 802.11 compliant roaming between access points
Output Power²	• 802.11b: +18.5dBm minimum • 802.11g: +17.5dBm minimum • 802.11a: +18.5dBm minimum • 802.11n HT20(2.4GHz): +15.5dBm minimum • 802.11n HT40(2.4GHz): +14.5dBm minimum • 802.11n HT20(5GHz): +15.5dBm minimum

Intel® Wi-Fi 6 AX201 + Bluetooth® 5.2 Wireless Card (802.11ax 2x2, supporting gigabit data rate5) (non-vPro®)

	Wireless LAN Standards
	IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11ac, IEEE 802.11ax, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i, IEEE 802.11k, IEEE 802.11r, IEEE 802.11v
Interoperability	Wi-Fi certified
Frequency Band	• 802.11b/g/n/ax 2.402 – 2.482 GHz • 802.11a/n/ac/ax 4.9 – 4.95 GHz (Japan) 5.15 – 5.25 GHz 5.25 – 5.35 GHz 5.47 – 5.725 GHz 5.825 – 5.850 GHz
Data Rates	• 802.11b: 1, 2, 5.5, 11 Mbps • 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps • 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps • 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz) • 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz,,80MHz & 160MHz) • 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz,,80MHz & 160MHz)
Modulation	Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security³	• IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only • AES-CCMP: 128 bit in hardware • 802.1x authentication • WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES. • WPA2 certification • WPA3 certification • IEEE 802.11i • WAPI
Network Architecture Models	Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming	IEEE 802.11 compliant roaming between access points
Output Power²	• 802.11b: +18.5dBm minimum • 802.11g: +17.5dBm minimum • 802.11a: +18.5dBm minimum • 802.11n HT20(2.4GHz): +15.5dBm minimum • 802.11n HT40(2.4GHz): +14.5dBm minimum • 802.11n HT20(5GHz): +15.5dBm minimum • 802.11n HT40(5GHz): +14.5dBm minimum • 802.11ac VHT80(5GHz): +11.5dBm minimum

Power Consumption

Transmit mode: 2.0 W
Receive mode: 1.6 W
Idle mode (PSP) 180 mW (WLAN Associated)
Idle mode: 50 mW (WLAN unassociated)
Connected Standby/Modern Standby: 10mW
Radio disabled: 8 mW

Power Management

ACPI and PCI Express compliant power management
802.11 compliant power saving mode

Receiver Sensitivity⁴

802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
802.11ax, MCS11(HT40): -59dBm maximum
802.11ax, MCS11(VHT160): -58.5dBm maximum

Antenna type

High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications

Form Factor

PCI-Express M.2 MiniCard with CNVi Interface

Dimensions

Type 1216: 1.67 x 12.0 x 16.0 mm
Type 126: 1.3g

Weight

3.3v +/- 9%

Operating Voltage

Temperature

Operating: 14° to 158° F (-10° to 70° C)
Non-operating: -40° to 176° F (-40° to 80° C)

Humidity

Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)

Altitude

Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)

LED Activity

LED Amber – Radio OFF; LED OFF – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Card

Bluetooth Specification	Frequency Band	Number of Available Channels	Data Rates and Throughput	Transmit Power
4.0/4.1/4.2/5.0/5.1/5.2 Compliant	2402 to 2480 MHz	Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)	Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps BLE: 1 Mbps data rate; throughput up to 0.2 Mbps Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)	The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR.

Power Consumption

Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW

Bluetooth Software Supported Link Topology

Microsoft Windows Bluetooth Software

Power Management

Microsoft Windows ACPI, and USB Bus Support

Certifications

FCC (47 CFR) Part 15C, Section 15.247 & 15.249

Power Management Certifications

ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark

Bluetooth Profiles Supported

BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Security & Manageability

Intel® vPro™ support with appropriate Intel® chipset components

Power

Power Supply

HP Smart 65 W USB Type-C slim adapter
HP Smart 65 W USB Type-C standard adapter

Power Cord

Premium 1m power cord
Conventional 1m power cord

Primary Battery

HP Long Life 2-cell, 47Wh polymer
HP Fast Charging (50% in 30 minutes) with no impact to battery recharge longevity

Battery Life

Up to 11 hours

Battery Weight

0.190kg

HP Smart 65 W USB Type-C slim adapter

Dimensions	Weight	Input	Input Efficiency	Input frequency range	Input AC current	Output	Output power	DC output	Hold-up time	Output current limit	Connector	Environmental Design	Operating temperature	Non-operating (storage) temperature	Altitude	Humidity	Storage Humidity	EMI and Safety Certifications
88x53.5x21mm	unit: 200g +/- 10g		81.5% min at 115 Vac/ 230Vac @ 5V/3A 86.7% min at 115 Vac/ 230Vac @ 9V/3A 88% min at 115 Vac/ 230Vac @ 12V/5A 89% min at 115 Vac/ 230Vac @ 15V/4.33A 89% min at 115 Vac/ 230Vac @ 20V/3.25A	47 ~ 63 Hz	1.7 A at 90 Vac and maximum load		65W	5V/9V/12V/15V/20V	5ms at 115 Vac input	<8.0A	USB Type C®		32°F to 95°F (0° to 35°C)	-4°F to 185°F (-20° to 85°C)	0 to 16,400 ft (0 to 5000m)	5% to 95%	5% to 95%	CE Mark - full compliance with LVD and EMC directives Worldwide safety standards - IEC60950-1 and/or IEC62368, EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR32 Class B, CCC, NOM-1 NYCE. * MTBF - over 200,000 hours at 25°C ambient condition.

HP Smart 65 W USB Type-C standard adapter

Dimensions	Weight	Input	Input Efficiency	Input frequency range	Input AC current	Output	Output power	DC output	Hold-up time	Output current limit	Connector	Operating temperature	Non-operating (storage) temperature	Altitude	Humidity	Storage Humidity	EMI and Safety Certifications
90.0x51x28.5mm	unit: 250g +/- 10g		81.5% min at 115 Vac/ 230Vac @ 5V/3A 86.7% min at 115 Vac/ 230Vac @ 9V/3A 88% min at 115 Vac/ 230Vac @ 12V/5A 89% min at 115 Vac/ 230Vac @ 15V/4.33A 89% min at 115 Vac/ 230Vac @ 20V/3.25A	47~63Hz	1.6 A at 90 VAC and maximum load		65W	5V/9V/12V/15V/20V	5ms at 115 Vac input	8.0A Max.	USB Type-C®	32°F to 95°F (0°to 35°C)	-4°F to 185°F (-20° to 85°C)	0 to 16,400 ft (0 to 5000m)	20% to 95%	10% to 95%	CE Mark - full compliance with LVD and EMC directives Worldwide safety standards - IEC60950-1 and/or IEC62368, EN60950-1 and/or EN62368-1, UL60950-1 and/or UL62368-1, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR32 Class B, CCC, NOM-1 NYCE. * MTBF - over 200,000 hours at 25°C ambient condition.

HP Long Life 2-cell, 47 Wh¹ polymer

Dimensions	Weight	Cells/Type	Energy	Voltage	Amp-hour capacity	Watt-hour capacity	Temperature	Operating (Charging)	Operating (Discharging)	Fuel Gauge LED	Warranty	Optional Travel Battery Available
5.11 X 84.00 X 238.14 mm	0.190 kg	2 cell Lithium-Ion Polymer cell / 4473A9	ED700 platform	7.7V	6.15Ah	47 Wh	5° to 40° C	32° to 113°F (0° to 45° C)	14° to 122°F (-10° to 60° C)	N/A	3-year	No

Weights & Dimensions

Product Weight

Tablet only: Starting at 1.83 lbs
Tablet + KB: Starting at 2.58 lbs
Tablet only: Starting at 0.82 kg
Tablet + KB: Starting at 1.17 kg

Product Dimensions (w x d x h)

Tablet only: 11.39 x 8.5 x 0.35 in
Tablet + KB: 11.39 x 8.74 x 0.56 in
Tablet only: 28.93 x 21.58 x 0.88 cm
Tablet + KB: 28.93 x 22.19 x 1.42 cm

Ports

2 Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
1 SuperSpeed USB Type-C® 10Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)
1 Headphone/microphone combo jack

Service and Support

1-year and 3-year limited warranties and 90-day software limited warranty options depending on country.
Batteries have a default one-year limited warranty except for HP Long Life batteries which will follow the one or three year warranty of the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information.
On-site service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc.

System Unit

Regulatory Model Number: HSN-C11C
Stand-Alone Power Requirements (AC Power)
Nominal Operating Voltage: 19 V
Discrete Graphics: N/A
Max Operating Power: UMA<65W

Temperature

Operating: 32° to 95° F (0° to 35° C)
Non-operating: 41° to 95° F (5° to 35° C)

Relative Humidity

Operating: 10% to 90%, non-condensing
Non-operating: 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature

Shock

Operating: 40 G, 2 ms, half-sine
Non-operating: 200 G, 2 ms, half-sine

Random Vibration

Operating: 0.75 grms
Non-operating: 1.50 grms

Altitude (unpressurized)

Operating: -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating: -50 to 40,000 ft (-15.24 to 12,192 m)

Planned Industry Standard Certifications

UL: Yes
CSA: Yes
FCC Compliance: Yes
ENERGY STAR®: ENERGY STAR® 8.0
EPEAT®: EPEAT® Gold in United States
ICES: Yes
Australia / NZ A-Tick Compliance: Yes
CCC: Yes
Japan VCCI Compliance: Yes
KC: Yes
BSMI: Yes
CE Marking Compliance: Yes
BNCI or BELUS: Yes
CIT: Yes
GOST: Yes
Saudi Arabian Compliance (ICCP): Yes
SABS: Yes

Environmental Data

Eco-Label Certifications & declarations

IT ECO declaration
US ENERGY STAR®
US Federal Energy Management Program (FEMP)
EPEAT® Gold registered in the United States. See http://www.epeat.net for registration status in your country.
TCO 8.0
China Energy Conservation Program (CECP)
China State Environmental Protection Administration (SEPA)
Taiwan Green Mark
Korea Eco-label
Japan PC Green label*

Sustainable Specifications

Impact: Ocean-bound plastic in (part(s))
30% post-consumer recycled plastic
External Power Supply 90% Efficiency
Low halogen
Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
Bulk packaging available

System Configuration

The configuration used for the Energy Consumption and Declared Noise Emissions data for the Notebook model is based on a "Typically Configured Notebook".

Energy Consumption (in accordance with US ENERGY STAR® test method)

Condition	115VAC, 60Hz	230VAC, 50Hz	100VAC, 50Hz
Normal Operation (Sort idle)	4.40 W	4.39 W	4.29 W
Normal Operation (Long idle)	0.58 W	0.63 W	0.59 W
Sleep	0.58 W	0.63 W	0.59 W
Off	0.36 W	0.38 W	0.35 W

Heat Dissipation

Condition	115VAC, 60Hz	230VAC, 50Hz	100VAC, 50Hz
Normal Operation (Short idle)	15 BTU/hr	15 BTU/hr	15 BTU/hr
Normal Operation (Long idle)	2 BTU/hr	2 BTU/hr	2 BTU/hr
Sleep	2 BTU/hr	2 BTU/hr	2 BTU/hr
Off	1 BTU/hr	1 BTU/hr	1 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)

Configuration	Sound Power (LwAd, bels)	Sound Pressure (LpAm, decibels)
Typically Configured – Idle	2.7	16.3
Fixed Disk – Random writes	2.7	16.2
Optical Drive – Sequential reads	2.7	16.2

Longevity and Upgrading

This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the spare parts are available throughout the warranty period and or for up to “5” years after the end of production.

Additional Information

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2011/65/EC.
This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).
This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see http://www.epeat.net
Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
This product is 94.0% recycle-able when properly disposed of at end of life.

Packaging Materials

External: PAPER/Corrugated (398 g)
Internal: PLASTIC/polyester (9 g)
PAPER/Molded pulp (205 g)
The plastic packaging material contains at least 0% recycled content.
The corrugated paper packaging materials contains at least 99% recycled content.

RoHS Compliance

HP Inc. complies fully with materials regulations. We were among the first companies to extend the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive to our products worldwide through the HP GSE. HP has contributed to the development of related legislation in Europe, as well as China, India, and Vietnam.

We believe the RoHS directive and similar laws play an important role in promoting industry-wide elimination of substances of concern. We have supported the inclusion of additional substances—including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical and electronics products.

We met our voluntary objective to achieve worldwide compliance with the new EU RoHS requirements for virtually all relevant products by July 2013, and we will continue to extend the scope of the commitment to include further restricted substances as regulations continue to evolve.

To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Bis(2-Ethylhexyl) phthalate (DEHP)
Benzyl butyl phthalate (BBP)
Dibutyl phthalate (DBP)
Diisobutyl phthalate (DIBP)
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface designed to be frequently handled or carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
Use readily recyclable packaging materials such as paper and corrugated materials.
Reduce size and weight of packages to improve transportation fuel efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management and Recycling

HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

HP, Inc. Corporate Environmental Information

For more information about HP's commitment to the environment:

Global Citizenship Report: http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications: http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

Footnotes

Percentage of ocean-bound plastic contained in each component varies by product
Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
External power supplies, WWAN modules, power cords, cables and peripherals excluded.
100% outer box packaging and corrugated cushions made from sustainably sourced certified and recycled fibers.
Fiber cushions made from 100% recycled wood fiber and organic materials.
Plastic cushions are made from >90% recycled plastic.

Fingerprint Reader

Model: Synaptics FS7605 area touch fingerprint sensor
Mobile Voltage Operation: 2.7V to 3.3V
Operating Temperature: 0-60°C
Current Consumption Image: 100mA
Low Latency Wait For Finger: 30uA
Capture Rate: 30 cm/sec
ESD Resistance: IEC 61000-4-2 4B (±15KV)
Detection Matrix: 200*1 (Plus another secondary line) / 508 dpi / 10mm sensor area
FRR (False Reject Rate) / FAR (False Acceptance Rate): FRR ~ 1% @ 1:50K FAR

Country of Origin

China

Options and Accessories (sold separately and availability may vary by country)

Category	Description	Part Number
Cases	HP Executive 14.1 Slim Top load	6KD04AA
	HP Executive 15.6 Top Load	6KD06AA
	HP Executive 15.6 Backpack	6KD07AA
Docking	HP USB-C Mini Dock	1PM64AA, 1PM64UT, 1PM64ET
	HP USB-C Travel Dock G2	7PJ38AA,7PJ38UT,7PJ38ET
Input/Output	HP Bluetooth Travel Bluetooth Mouse	6SP30AA,6SP30UT,6SP30ET
	HP Comfort Grip USB Wireless Mouse	H2L63AA, H2L63UT
	HP Presenter Bluetooth 4.2 Bluetooth Mouse	2CE30AA,2CE30UT,2CE30ET
	HP USB 320M Wired Mouse	9VA80AA,9VA80UT,9VA80ET
	HP USB Premium USB Mouse	1JR32AA#ABA,1JR32UT
	HP USB Premium Wireless Mouse	1JR31AA,1JR31UT
	HP USB Travel USB Mouse	G1K28AA, G1K28ET
	HP Wireless 2.4GHz X4000	H3T50AA, H3T50UT
	HP Multi-Device 635 Black Wireless Mouse	1D0K2AA
	HP Creator 935 Black Wireless Mouse	1D0K8AA
	HP WL USB Keyboard	T6U20AA, T6U20UT
	HP Slim Wireless Keyboard and Mouse	T6L04AA, T6L04UT
	HP Wireless USB Premium Keyboard	Z9N41AA, Z9N41AT
	HP 225 Wired Mouse and Keyboard Combo	286J4AA
	HP Wireless Rechargeable 950MK Mouse and Keyboard	3M165AA, 3M165UT
	HP 235 WL Mouse and Keyboard Combo	1Y4D0AA, 1Y4D0UT
	HP Wired Desktop 320MK Mouse and Keyboard	9SR36AA, 9SR36UT, 9SR36ET
	HP Wired Desktop 320K Keyboard	9SR37AA, 9SR37UT, 9SR37ET
	HP Wired Desktop 320M Mouse	9VA80AA, 9VA80UT, 9VA80ET
	HP 125 Wired Keyboard	266C9AA, 266C9UT, 266C9ET
	HP 225 Wired Mouse and Keyboard Combo	286J4AA, 286J4UT, 286J4ET
	HP Wired Mouse	265A9AA, 265A9UT, 265A9ET
	HP LSR Wired Mouse	265D9AA, 265D9UT, 265D9UT
	HP USB-C to HDMI 2.0 Adapter	2PC54AA,1WC36UT,1WC36AA
	HP USB-C to RJ45 Adapter	V8Y76AA, V7W66AA, V7W66UT
	HP USB-C to USB-A Adapter	N2Z63AA, N2Z63UT
	HP USB-C to VGA Adapter	P7Z54AA, N9K76AA, N9K76AA, N9K76UT
Power	HP 45W USB-C G2 AC Power Adapter	1HE07AA,1HE07UT
	HP 45W USB-C LC AC Power Adapter	1MZ01AA
	HP 65W USB-C AC Power Adapter	X7W50AA, 1HE08AA, 1HE08UT
	HP 65W USB-C Travel Slim AC Power Adapter	3PN48AA, 3PN48UT
	HP USB-C Essential Power Bank	3TB55AA, 3TB55UT
Security	HP Nano Cable Lock	1AJ39AA, 1AJ39UT
	HP SureKey Standard/Nano/Wedge Cable Lock	6UW42AA,6UW42UT

Summary of Changes

Date of change	Version History	Update	Description of change:
April 15, 2021	V1 to V2	Update	Battery Life
April 20, 2021	V2 to V3	Add	Environmental Data
May 6, 2021	V3 to V4	Add	HP S
May 24, 2021	V4 to V5	Update	Product Dimensions/System Unit
May 27, 2021	V5 to V6	Update	HP Pro Security Edition to HP Wolf Pro Security Edition
September 7, 2021	V6 to V7	Update	Networking and Power specs
November 11, 2021	V7 to V8	Update	Windows 10 with Free upgrade to Windows 11 when available in OS section and footnote.
December 13, 2021	V8 to V9	Update	OS footnotes and Wi-Fi 6 footnotes
February 28, 2022	V9 to v10	Add	Processors base frequency
September 7, 2022	V10 to V11	Removed	Tile App
December 7, 2022	V11 to V12	Updated	Windows OS
March 6, 2023	V12 to V13	Updated	Networking and communications section
	V13 to V14

Copyright © 2022 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Intel, Core, Iris, Xe, Thunderbolt and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the United States and other countries. Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

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