Texas Instruments bq24133EVM User's Guide

Document Number: SLUU476-December 2010

Product: bq24133EVM Stand-Alone Synchronous, Switch-Mode, Battery-Charge Controller With Integrated N-MOSFETs and Power Path Selector

1 Introduction

1.1 EVM Features

1.2 General Description

The bq24133 is a highly integrated stand-alone Li-ion and Li-polymer switch-mode battery charge controller with two integrated N-channel power MOSFETs and a power path selector gate driver. It offers a constant-frequency synchronous PWM controller with high accuracy regulation of input current, charge current, and voltage. It also provides battery detection, pre-conditioning, charge termination, and charge status monitoring.

The bq24133 automatically enters a low-quiescent current sleep mode when the input voltage falls below the battery voltage. The bq24133 charges one, two, or three cells (selected by CELL pin), supporting up to a 2.5-A charge current. The bq24133 is available in a 24-pin, 3.5 x 5.5 mm², thin QFN package.

For details, see the bq24133 data sheet (SLUSAF7).

1.3 I/O Description

Table 1. I/O Description
Jack Description
J1-VIN Positive input
J1-PGND Negative input
J2-VSYS Connected to system
J2-VBAT Connected to charger output
J2-PGND Ground
J2-TS_EXT Temperature qualification voltage Input

1.4 Control and Key Parameters Settings

Table 2. Control and Key Parameters Settings
Jack Description Factory Setting
JP1 Select external TS input or internal valid TS setting
1-2: External TS input
2-3: Internal valid TS setting
Jumper ON 1-2 (external TS)
JP2 The pullup power source supplies the LEDs when JP2 is ON. LED has no power source when JP2 is OFF. Jumper ON (LED power available)
JP3 TTC setting
2-3: Connect TTC to VREF to enable termination and disable timer
1-2: Connect TTC to GND to disable termination and disable timer
OPEN: Enable timer and termination
Jumper OPEN (enable timer and termination)
JP4 Charger enable/disable setting. ISET is pulled to GND and the charger is disabled when JP4 OPEN; charger is enabled when JP4 is ON. Jumper OPEN (disable charger)
JP5 CELL selection
1-2: CELL-GND, 1CELL
2-3: CELL-VREF, 3CELL
OPEN: CELL- FLOAT, 2CELL
Jumper ON 1-2 (1 CELL) -001
Jumper ON 2-3 (3 CELL) -002

1.5 Recommended Operating Conditions

Table 3. Recommended Operating Conditions
Symbol Description Min Typ Max Unit Notes
VBUS Input voltage 4.5 8 V 001
VBUS Input voltage 6 18 V 002
VBAT Voltage applied at VBAT terminal of J2 2.1 4.2 V 001
VBAT Voltage applied at VBAT terminal of J2 2.1 12.6 V 002
Supply current Maximum input current 0 5 A
ICHRG Battery charge current 0 2 2.5 A
TJ Operating junction temperature range 0 125 °C

The bq2410 EVM board requires a regulated supply approximately 1 V minimum above the regulated voltage of the battery pack to a maximum input voltage of 16 Vdc. The bq24133 uses the CELL pin to select the number of cells with a fixed 4.2 V/cell. Connecting CELL to AGND gives a 1-cell configuration, a floating CELL pin gives a 2-cell configuration, and connecting to VREF gives a 3-cell configuration. The CELL pin adjusts the internal resistor voltage divider from the BAT pin to AGND pin for voltage feedback and regulate to internal 2.1-V voltage reference.

CELL Pin Voltage Regulation
CELL Pin Voltage Regulation
AGND 4.2V
Floating 8.4V
VREF 12.6V

For Note 001, the BAT voltage is set to 4.2 V and for Note 002, the BAT voltage is set to 12.6 V.

The ISET input sets the maximum charging current. Battery current is sensed by current sensing resistor RSR connected between SRP and SRN. The full-scale differential voltage between SRP and SRN is 40 mV maximum. The equation for charge current is:

ICHARGE = VISET / (20 × R15) (1)

For bq24133, the precharge current is set as 1/10 of the fast-charge rate set by ISET voltage, according to the formula:

IPRECHARGE = VISET / (200 × R15) (2)

The default setting is 2 Adc for fast-charge current and 0.2 Adc for precharge current.

In the bq24133, once the voltage on OVPSET is above the 1.6-V ACOV threshold or below the 0.5-V ACUV threshold, the charge is disabled, and the battery is switched to the system instead of the adapter.

VACUV = 0.5 V × (1 + R6 / R9) (3)

For Note 001, ACUV = 2.51 V; for Note 002, ACUV = 5.87 V.

VACOV = 1.6 V × (1 + R6 / R9) (4)

For Note 001, ACOV = 8.03 V; for Note 002, ACOV = 18.80 V.

Similar to setting battery regulation current, the adapter current is set by the voltage on ACSET pin using the following equation:

IDPM = VACSET / (20 × R2) (5)

The default setting on the EVM is 3 Adc for adapter current regulation.

2 Test Summary

2.1 Definitions

This procedure details how to configure the HPA715A evaluation board. The following naming conventions are followed in the test procedure:

Assembly drawings have locations for jumpers, test points, and individual components.

2.2 Safety

  1. Safety Glasses are to be worn.
  2. This test must be performed by qualified personnel who are trained in electronics theory and understand the risks and hazards of the assembly to be tested.
  3. ESD precautions must be followed while handling electronic assemblies and performing this test.
  4. Precautions must be observed to avoid touching areas of the assembly that may get hot or present a shock hazard during testing.

2.3 Quality

  1. Test data can be made available on request from Texas Instruments.

2.4 Safety Apparel

  1. Electrostatic smock
  2. Electrostatic gloves or finger cots
  3. Safety glasses
  4. Ground ESD wrist strap.

2.5 Equipment

2.5.1 Power Supplies

Power Supply #1 (PS#1): a power supply capable of supplying 30 V at 5 A is required.

2.5.2 Loads

2.5.3 Meters

Seven Fluke 75 multimeters (equivalent or better) or four equivalent voltage meters and three equivalent current meters. The current meters must be capable of measuring 5-A+ current.

2.6 Equipment Setup

  1. Set the Power Supply #1 (PS#1) for 6-V ±200-mVdc (001), or 16-V ±0.200-mV (002), 4.5-A ±0.1-A current limit, and then turn off supply.
  2. Connect the output of PS#1 in series with a current meter (multimeter) to J1 (VIN, PGND).
  3. Connect a voltage meter across J1 (VIN, PGND).
  4. Connect Load#1 in series with a current meter to J2 (VBAT, PGND). Turn off Load#1.
  5. Connect Load#2 in series with a current meter to J2 (VSYS, PGND). Turn off Load#2.
  6. Connect a voltage meter across J2 (VBAT, PGND).
  7. Connect a voltage meter across J2 (VSYS, PGND).
  8. Check all jumper shunts. JP1: connect 2-3 (External TS); JP2: ON; JP3: OPEN; JP4: OPEN. JP5: connect 1-2 for 001 and connect 2-3 for 002.
Figure 1. Original Test Setup for HPA715A (bq24133EVM)

This diagram illustrates a typical test setup for the bq24133EVM. It shows a power supply (#1) connected to the J1 connector (VIN, PGND) through a current meter. A voltage meter is also connected across J1. Two electronic loads, Load #1 and Load #2, are connected to J2 (VBAT, PGND and VSYS, PGND respectively), each with its own current meter. Voltage meters are connected across J2 (VBAT, PGND) and J2 (VSYS, PGND). The bq24133EVM board itself is shown with connectors J1 and J2, jumpers JP1-JP5, test points, and the main IC (U1).

2.7 Procedure

Disconnect the load and power supply. Use diode-function of multimeter to check the resistance between J1-VIN and J2-VSYS. Pass only if both OPEN for bi-direction (positive J1-VIN and negative on J2-VSYS; negative J1-VIN and positive on J2-VSYS).

2.7.1 Power Supply and VREF

Make sure that Section 2.6 steps are followed. Disconnect LOAD#1#2. Turn on PS#1 (6 V for 001 and 16 V for 002).

2.7.2 Charger Enable and Battery Detection

Connect 2-3 of JP1 (Internal TS); short JP4 (Charger Enable)

2.7.3 Charge Current/Voltage Regulation and Battery Temperature Qualification

Reconnect LOAD#2, and turn on. Use the constant voltage mode. Set the output voltage to 2.5 V for 001 and 8 V for 002.

Increase the voltage of LOAD#2 to 3.5 V for 001 and 10.5 V for 002.

Open 2-3 of JP1 (External TS)

Connect 2-3 of JP1 (Internal TS)

2.7.4 Charger Termination and Recharge

Increase the voltage of LOAD#2 slowly to approximately 4.2 V for Note 001 and 12.6 V for Note 002.

Decrease the voltage of LOAD#2 slowly to approximately 3.5 V for Note 001 and 10.5 V for Note 002.

2.7.5 OVP - Input Overvoltage Protection

Increase the voltage of PS#1 to 9 V for Note 001 or 20 V for Note 002.

2.7.6 DPM - Input Current Regulation

Connect the output of the Load#1 in series with a current meter (multimeter) to J2 (SYS, PGND). Ensure that a voltage meter is connected across J2 (SYS, PGND). Resume other status as in Section 2.7.3. Turn on the power of Load#1. Set the load current to 0.5 A. Increase the load current until I(J1(VIN)) = 3 A.

2.7.7 Test Complete

Turn off the power supply, and remove all connections from the unit under test (UUT).

3 PCB Layout Guideline

  1. It is critical that the exposed thermal pad on the backside of the bq24133 package be soldered to the PCB ground. Ensure that sufficient thermal vias are right underneath the IC, connecting to the ground plane on the other layers.
  2. The control stage and the power stage must be routed separately. At each layer, the signal ground and the power ground are connected only at the thermal pad.
  3. Charge current sense resistor must be connected to SRP and SRN with a Kelvin contact. The area of this loop must be minimized. The decoupling capacitors for these pins must be placed as close to the IC as possible.
  4. Input current sense resistor must be connected to ACP, ACN with a Kelvin contact. The area of this loop must be minimized. The decoupling capacitors for these pins should be placed as close to the IC as possible.
  5. Decoupling capacitors for VREF, AVCC, and REGN must make the interconnections to the IC as short as possible.
  6. Decoupling capacitors for BAT must be placed close to the corresponding IC pins, and make the interconnections to the IC as short as possible.
  7. Decoupling capacitor(s) for the charger input must be placed close to SW and PGND.
  8. Take the EVM layout for design reference.

4 Bill of Materials, Board Layout, and Schematic

4.1 Bill of Materials

Table 4. Bill of Materials
Count
(-001/-002)
RefDes Value Description Size Part Number MFR
4/4 C1, C7, C14, C15 10 μF Capacitor, Ceramic, 25V, X7R, 10% 1206 STD STD
0/0 C2 Open
1/1 C3 2.2 µF Capacitor, Ceramic, 25V, X7R, 10% 0805 STD STD
1/1 C4 330 pF Capacitor, Ceramic, 50V, X7R, 10% 0603 STD STD
2/2 C5, C18 0.1 µF Capacitor, Ceramic, 16V, X7R, 10% 0603 STD STD
1/1 C6, C13 0.047 μF Capacitor, Ceramic, 50V, X7R, 10% 0603 STD STD
3/3 C8, C16, C17 1.0 µF Capacitor, Ceramic, 25V, X7R, 10% 0805 STD STD
1/1 C9 4700 pF Capacitor, Ceramic, 25V, X7R, 10% 0603 STD STD
3/3 C10, C20, C24 0.1 µF Capacitor, Ceramic, 50V, X7R, 10% 0603 STD STD
0/0 C11, C12, C21, C23 Open
2/2 C22, C19 1.0 µF Capacitor, Ceramic, 16V, X7R, 20% 0805 STD STD
1/1 D1 LTST-C190GKT Diode, LED, Green, 2.1V, 20mA, 6mcd 0603 LTST-C190GKT Lite On
0/1 D2 BAT54C Diode, Dual Schottky, 200-mA, 30-V SOT23 BAT54C-V-G Vishay
1/1 J1 ED120/2DS Terminal Block, 2 pin, 15A, 5.1mm 0.40 x 0.35 inch ED120/2DS OST
1/1 J2 ED120/4DS Terminal Block, 4 pin, 15A, 5.1mm 0.80 x 0.35 inch ED120/4DS OST
3/3 JP1, JP3, JP5 PEC03SAAN Header, 3 pin, 100mil spacing 0.100 inch x 3 PEC03SAAN Sullins
2/2 JP2, JP4 PEC02SAAN Header, 2 pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins
1/1 L1 3.3 μH Inductor, SMT, 5A, 55milliohm 0.204 x 0.216 inch IHLP2020CZER3R3M01 Vishay
1/1 Q1 BSS138W MOSFET, Nch, 30V, 0.5A, 700 milliohms SOT323 BSS138W-7-F Diodes Inc
2/2 Q2, Q3 CSD17313Q2 Trans, Nch, 30V, 5A, 26milliohm SON-6 CSD17313Q2 TI
1/1 Q4 CSD25302Q2 Trans, Pch NexFET, 20V, 5 A, 56 milliohm SON-6 CSD25302Q2 TI
1/1 Q5 2N7002 MOSFET, N-ch, 60V, 115mA, 1.2Ohms SOT23 2N7002-7-F Diodes Inc
1/1 R1 1.00M Resistor, Chip, 1/16W, 5% 0603 STD STD
1/1 R2 0.02 Ω Resistor, Chip, 1/2 watt, 1% 1206 STD STD
4/4 R3, R16, R20, R29 0 Resistor, Chip, 1/16W 0603 STD STD
2/2 R4, R5 3.9 Resistor, Chip, 1/4W, 5% 1206 STD STD
1/1 R6 402k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R7 499k Resistor, Chip, 1/8W, 1% 0603 STD STD
1/0 R8 100k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/0 R9 100k Resistor, Chip, 1/16W, 1% 0603 STD STD
0/1 37.4k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/0 R10 10k Resistor, Chip, 1/16W, 5% 0603 STD STD
0/1 1.00M Resistor, Chip, 1/16W, 5% 0603 STD STD
1/1 R11 1.00k Resistor, Chip, 1/16W, 1% 0603 STD STD
0/0 R12 Open Resistor, Chip 0805 STD STD
2/2 R13, R14 4.02k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R15 0.01 Resistor, Metal Film, 1/2 watt, 1% 1206 STD STD
1/1 R17 10 Resistor, Chip, 1/16W, 5% 0805 STD STD
1/0 R19 10 Resistor, Chip, 1/16W, 5% 0805 STD STD
1/1 R21 5.23k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/0 R22 0 Resistor, Chip, 1/16W 0603 STD STD
1/1 R23 100 Resistor, Chip, 1/16W, 5% 0603 STD STD
1/1 R24 30.1k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R25 3.01M Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R26 10k Resistor, Chip, 1/16W, 5% 0603 STD STD
1/1 R27 4.99k Resistor, Chip, 1/16W, 1% 0603 STD STD
2/2 R28, R31 100k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R30 100k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R18 57.6k Resistor, Chip, 1/16W, 1% 0603 STD STD
1/1 R32 13.7k Resistor, Chip, 1/16W, 1% 0603 STD STD
0/0 TP1, TP3-TP6 TP-SMALL Test Point, 0.020 Hole 0.100 x 0.100 inch N/A N/A
1/1 TP2 131-5031-00 Adaptor, 3.5-mm probe clip 0.200 inch 131-4244-00 or 131-5031-00 Tektronix
13/13 TP7 - TP19 5002 Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone
1/1 TP20 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone
1/1 U1 BQ24133RHL IC, Power Path Selector Stand-alone Charger VQFN BQ24133RHL TI
1/1 PCB, 2.65 In x 3.00 In x 0.062 In HPA715 Any
4/4 Bumper foot (install after final wash) 0.440 x 0.2 SJ-5303 3M
4/4 Shunt, 100-mil, Black 0.100 929950-00 3M
1/1 Label (See Note 5) 1.25 x 0.25 inch THT-13-457-10 Brady

Notes:

  1. These assemblies are ESD sensitive, ESD precautions shall be observed.
  2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
  3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
  4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
  5. Install label after final wash. Text shall be 8 pt font. Text shall be per Table 1.
Table 1. Assembly Number vs Text
Assembly Number Text
HPA715-001 BQ24133EVM-715-5V
HPA715-002 BQ24133EVM-715-15V

4.2 Board Layout

Figure 2. Top Assembly

This diagram shows the physical layout of the top side of the bq24133EVM PCB. Key connectors like J1 (VIN, PGND) and J2 (VSYS, VBAT, PGND, TS_EXT) are visible. Jumpers JP1 through JP5 are labeled, along with various test points (TP1-TP20) and LED indicators. The main integrated circuit (U1, bq24133RHL) is centrally located, surrounded by other surface-mount components such as resistors, capacitors, and MOSFETs (Q1-Q5). The 'Settings' and 'Test Points' sections are clearly demarcated.

Figure 3. Top Layer

This diagram represents the copper traces and component pads on the top layer of the bq24133EVM PCB. It illustrates the routing of electrical connections for power and signals across the board's surface, connecting the various electronic components.

Figure 4. Second Layer

This diagram shows the copper traces on the second layer of the bq24133EVM PCB. This layer is typically used for routing signals or implementing power planes to manage electrical connections beneath the top layer.

Figure 5. Third Layer

This diagram illustrates the copper traces on the third layer of the bq24133EVM PCB, providing additional routing capacity for electrical connections.

Figure 6. Bottom Layer

This diagram represents the copper traces and component pads on the bottom layer of the bq24133EVM PCB. It shows the electrical connections on the underside of the board.

Figure 7. Bottom Assembly

This diagram shows the physical layout of the bottom side of the bq24133EVM PCB, indicating the placement of components and solder points on the underside of the board.

4.3 Schematic

Figure 8. bq24133EVM Schematic

This is the circuit schematic for the bq24133EVM. It details the interconnection of the bq24133 IC (U1) with its supporting components. The schematic shows power input terminals (VIN, PGND), battery connections (VBAT, PGND), system output terminals (VSYS, PGND), and temperature sensor input (TS_EXT). It illustrates how external components like resistors (R1-R32), capacitors (C1-C24), inductors (L1), diodes (D1-D2), and MOSFETs (Q1-Q5) are connected to the IC's pins (e.g., ISET, ACSET, CELL, VREF, REGN, STAT, TTC, OVPSET). Jumpers (JP1-JP5) are depicted, allowing configuration of settings like external/internal temperature sensing, LED power, termination timer, charger enable, and cell count selection. Various test points (TP1-TP20) are included for monitoring signals. The schematic also shows the LED indicator (D1) and the application circuit area.

Important Notices

Evaluation Board/Kit Important Notice

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.

Should this evaluation board/kit not meet the specifications indicated in the User's Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used.

FCC Warning

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

EVM Warnings and Restrictions

It is important to operate this EVM within the input voltage range of 0 V to 20 V and the output voltage range of 0 V to 12.6 V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 85° C. The EVM is designed to operate properly with certain components above 85° C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2010, Texas Instruments Incorporated

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