4inch e-Paper User Manual

Revision History

Contents

• 1. OVERVIEW
• 2. FEATURES
• 3. MECHANICAL SPECIFICATION
• 4. MECHANICAL DRAWING OF EPD MODULE
• 5. INPUT/OUTPUT INTERFACE
• 5.1 Connector Type: Golden Finger for ZIF Type FH34rj-50s-0.5sh(50)
• 6. ELECTRICAL CHARACTERISTICS
• 6.1 Absolute Maximum Rating
• 6.2 Panel DC Characteristics
• 7. POWER SEQUENCE
• 7.1 Power on Sequence Display
• 7.2 Power off Sequence Display
• 8. OPTICAL CHARACTERISTICS
• 8.1 Specification
• 8.2 Definition of Contrast Ratio
• 8.3 Reflection Ratio
• 8.3 Definition of Color Performance & Saturation Ratio
• 9. REFERENCE CIRCUIT
• 10. HANDLING, SAFETY, AND ENVIRONMENT REQUIREMENTS
• 11. RELIABILITY TEST
• 12. BLOCK DIAGRAM
• 13. BORDER DEFINITION
• 14. PACKAGE

1. OVERVIEW

The 4-inch e-Paper is a reflective electrophoretic E Ink Spectra™ 6 Display module based on glass active matrix TFT substrate. It has 4.0” active area with 400(H) x 600(V) pixels. The panel can display vivid color that include black, white, yellow, red, green and blue depending on the associated lookup table used. The display is capable to display images with full colors driven by the all-in-one display controller and the associated waveform file.

2. FEATURES

• High contrast reflective/electrophoretic technology
• 400(H) x 600(V) display
• Full colours
• Ultra wide viewing angle
• Ultra low power consumption
• Pure reflective mode
• Bi-stable display
• Commercial temperature range
• Portrait type
• Glass substrate
• All in one IC that integrated source driver, gate driver, TCON, PMIC and OTP memory in the module.

3. MECHANICAL SPECIFICATION

4. MECHANICAL DRAWING OF EPD MODULE

The mechanical drawing provides detailed dimensions and pin assignments for the EPD module. Key dimensions include an outline of 66.0(H) x 99.0(V) x 0.85(D) mm and an active area of 56.4(H) x 84.6(V) mm. The connector is a Golden Finger for ZIF Type FH34rj-50s-0.5sh(50). The drawing also includes a comprehensive pin assignment table listing 50 pins with their type, name, and description, detailing functions like TFT_VCOM, GND, VGL, VGH, and interface pins such as SCL and SI0.

5. INPUT/OUTPUT INTERFACE

5.1 CONNECTOR TYPE: GOLDEN FINGER FOR ZIF TYPE FH34RJ-50S-0.5SH(50)

5.1.1 PIN ASSIGNMENT

Note 5-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU communication only when CS# is pulled LOW.

Note 5-2: This pin is (D/C#) Data/Command control pin connecting to the MCU. When the pin is pulled HIGH, the data will be interpreted as data. When the pin is pulled LOW, the data will be interpreted as command.

Note 5-3: This pin (RES#) is reset signal input. The Reset is active low.

Note 5-4: This pin (Busy_N) is Busy state output pin. When Busy is Low, the operation of chip should not be interrupted and any command should not be issued to the module. The driver IC would put Busy pin Low when the driver IC is working such as:

• Outputting display waveform; or
• Programming with OTP
• Communicating with digital temperature sensor

Note 5-5: This pin (BS0) is for 3-line SPI or 4-line SPI selection. When it is “Low”, 4-line SPI is selected. When it is "High”, 3-line SPI (9 bits SPI) is selected. Please refer to below Table:

6. ELECTRICAL CHARACTERISTICS

6.1 ABSOLUTE MAXIMUM RATING

Note 6-1: Maximum ratings are those values beyond which damages to the device may occur.

Note 6-2: Functional operation should be restricted to the limits by Chapter "6. Electrical Characteristics".

6.2 PANEL DC CHARACTERISTICS

The following specifications apply for: VDD = 3.0V, TA = 25℃

Note 6-3: The module operating current data is measured by using oscilloscope, and extract the mean value.

Note 6-4: The typical power consumption is measured using associated 25C waveform with following pattern transition: from full white pattern to color stripe pattern. (Note 6-8)

Note 6-5: The high loading (Max) power consumption is measured using associated 25C waveform with following pattern transition: from full white pattern to noise pattern (including random scattering of 6 colors). (Note 6-9)

Note 6-6: The listed electrical/optical characteristics are only guaranteed under the controller & waveform provided by E Ink.

Note 6-7: Vcom value has been set in the IC on the panel.

Note 6-8: The typical power consumption

Note 6-9: The high loading power consumption

Diagrams on page 14 illustrate power consumption scenarios: one shows a transition from a blank screen to a color screen, and another shows a transition from a blank screen to a noisy screen with colored pixels.

7. POWER SEQUENCE

In order to prevent IC fail in power on resetting, the power sequence must be followed as below:

7.1 POWER ON SEQUENCE DISPLAY

The Power ON Sequence diagram shows the timing relationships between various signals (VDD, RST_N, BUSY_N, SPI, VPH, VGL, VGH, VSHX, VSLX, TFT_VCOM, FPL_VCOM, Source, Gate) during the power-on process. It illustrates the order and duration of signal transitions, such as VDD rising, RST_N assertion, BUSY_N becoming invalid, SPI becoming PON, and the gradual activation of gate and source driving voltages.

7.2 POWER OFF SEQUENCE DISPLAY

The Power OFF Sequence diagram illustrates the timing for shutting down the module. Key signals like BUSY_N, SPI, Source/VBD, Gate, TFT_VCOM, FPL_VCOM, VSHX, VSLX, VGH, and VGL are shown with their state changes during power-off. This includes transitions like SPI going to POF, Source/VBD going to HIZ, Gate following VGL, and VGH/VGL returning to their initial states.

8. OPTICAL CHARACTERISTICS

8.1 SPECIFICATION

Measurements are under illumination 45/0, the detector is perpendicular to surface unless otherwise specified.

Note 8-1: Luminance meter: Eye-One Pro plus Spectrophotometer.

WS: White state, DS: Dark state, RS: Red state, YS: Yellow state, BS: Blue state, GS: Green state

8.2 DEFINITION OF CONTRAST RATIO

The contrast ratio (CR) is the ratio between the reflectance in a full white area (Rl) and the reflectance in a dark area (Rd): CR=RI/Rd.

The diagram illustrates the measurement setup for contrast ratio, showing a detector positioned above an EPD sample, with light sources arranged in a ring around the detector at 45° angles.

8.3 REFLECTION RATIO

The reflection ratio is expressed as: R = Reflectance Factor_{white board} × (L_center / L_{white board}). L_center is the luminance measured at center in a white area (a* ~ b* ~ 0). L_{white board} is the luminance of a standard white board. Both are measured with equivalent illumination source. The viewing angle shall be no more than 2 degrees.

8.3 DEFINITION OF COLOR PERFORMANCE & SATURATION RATIO

The diagram shows a color space representation with axes L* (Lightness), a* (green-red), and b* (blue-yellow). The Spectroradiometer One Pro3 plus was used to measure color image to obtain L*, a*, b* values, which are then used to determine the color space.

9. REFERENCE CIRCUIT

The reference circuit diagram shows the typical connections for driving the e-Paper display. It includes power supply components, gate and source drivers, and interface connections. A table details the SPI mode selection based on BS0 and BS1 pins:

10. HANDLING, SAFETY, AND ENVIRONMENT REQUIREMENTS

WARNING

The display glass may break when it is dropped or bumped on a hard surface. Handle with care. Should the display break, do not touch the electrophoretic material. In case of contact with electrophoretic material, wash with water and soap.

CAUTION

The display module should not be exposed to harmful gases, such as acid and alkali gases, which corrode electronic components. Disassembling the display module can cause permanent damage and invalidates the warranty agreements. IPA solvent can only be applied on active area and the back of a glass. For the rest part, it is not allowed. The module storage environment must under reliability test storage item's criteria.

Mounting Precautions

• (1) It`s recommended that you consider the mounting structure so that uneven force (ex. Twisted stress) is not applied to the module.
• (2) It`s recommended that you attach a transparent protective plate to the surface in order to protect the EPD. Transparent protective plate should have sufficient strength in order to resist external force.
• (3) You should adopt radiation structure to satisfy the temperature specification.
• (4) Acetic acid type and chlorine type materials for the cover case are not desirable because the former generates corrosive gas of attacking the PS at high temperature and the latter causes circuit break by electro-chemical reaction.
• (5) Do not touch, push or rub the exposed PS with glass, tweezers or anything harder than HB pencil lead. And please do not rub with dust clothes with chemical treatment. Do not touch the surface of PS for bare hand or greasy cloth. (Some cosmetics deteriorate the PS)
• (6) When the surface becomes dusty, please wipe gently with absorbent cotton or other soft materials like chamois soaks with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach the PS. Do not use acetone, toluene and alcohol because they cause chemical damage to the PS.
• (7) Wipe off saliva or water drops as soon as possible. Their long time contact with PS causes deformations and color fading.

Data sheet status

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

REMARK

All The specifications listed in this document are guaranteed for module only. Post-assembled operation or component(s) may impact module performance or cause unexpected effect or damage and therefore listed specifications is not warranted after any Post-assembled operation.

11. RELIABILITY TEST

[Criteria] In the standard conditions, there is not display function NG issue occurred. (including: line defect, no image). All the cosmetic specification is judged before the reliability stress.

12. BLOCK DIAGRAM

The block diagram illustrates the system architecture. It shows the EL040EF1 Panel connected via an FPC (Flexible Printed Circuit) to a Micro Controller. The Micro Controller interfaces with various components, including L-R-C Diode & MOS components, SPI Interface, I2C Interface, and an optional Temperature Sensor.

13. BORDER DEFINITION

The diagram shows the e-Paper display module, highlighting the "Border" area surrounding the "Active Area" where the display content is shown.

14. PACKAGE

The package diagram illustrates the assembly and contents of the product packaging. It shows an empty tray, followed by layers of e-Paper panels (8pcs per layer) interleaved with EPE cushion sheets and trays. The carton dimensions are 455*375*190mm, and each carton contains 128 panels. The notes advise on stacking trays with 180° rotation and checking alignment via tray half-circles. The table details the package contents: 6 x 30g thickened paperboard (73+95mm), 5 x CARTON INTERNAL, 4 x Bag (450*380*580mm), 3 x EL040EF1 panels, 2 x TRAY, 1 x EPE FOAM, with quantities and remarks for each item.