User Manual for Sunseeker models including: AP6212, 2BFD7-AP6212, 2BFD7AP6212, AP6212 AP6212A 2.4G Wi-Fi and Bluetooth Module, AP6212 AP6212A, 2.4G Wi-Fi and Bluetooth Module, Wi-Fi and Bluetooth Module, Bluetooth Module, Module
Zhejiang Sunseeker Industrial Co., Ltd. AP6212 2BFD7-AP6212 2BFD7AP6212 ap6212
Zhejiang Sunseeker Industrial Co., Ltd. AP6212 2.4G Wi-Fi&Bluetooth; module 2BFD7-AP6212 2BFD7AP6212 ap6212
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DocumentDocumentZhejiang Sunseeker Industrial Co., Ltd. USER MANUAL PRODUCT NAME 2.4G Wi-Fi&Bluetooth module SPEC. NO. REV 2.3 DATE 10.08. 2018 PREPARED REVIEW PM QA APPROVED DCC ISSUE From NO.:C-RD-047B AP6212/AP6212A HVIN:AP6212(HF) WiFi + Bluetooth 4.1 SIP Module Spec Sheet Revision History Date Revision Content Revised Version By 2017/04/28 Refer to the earlier release for detailed revision history. Richard 1.9 - Modify FM spec. 2017/06/14 - Add BT modulation 8DPSK Richard 2.0 2017/09/07 - Modify Recommended Reflow Profile Richard 2.1 2017/09/29 - Add Packing Dimension photo Beth 2.2 2018/10/08 - Modify Operating Temperature. Richard 2.3 1 Contents 1. Introduction .......................................................................................................... 3 2. Features ................................................................................................................ 4 3. Deliverables.......................................................................................................... 5 3.1 Deliverables .................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification .......................................................................................... 6 4.1 General Specification...................................................................................... 6 4.2 Voltages .......................................................................................................... 6 4.2.1 Absolute Maximum Ratings .................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 5. WiFi RF Specification ......................................................................................... 7 5.1 2.4GHz RF Specification................................................................................. 7 6. Bluetooth Specification...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. BLE Specification ............................................................................................... 10 7.1 BLE Specification ........................................................................................... 10 8. Pin Assignments............................................................................................... 11 8.1 Pin Outline .................................................................................................... 11 8.2 Pin Definition ................................................................................................ 11 9. Dimensions ....................................................................................................... 13 9.1 Physical Dimensions .................................................................................... 13 9.2 Layout Recommendation .............................................................................. 14 10. External clock reference .................................................................................. 15 10.1 SDIO Pin Description.................................................................................. 15 11. Host Interface Timing Diagram........................................................................ 16 11.1 Power-up Sequence Timing Diagram ......................................................... 16 11.2 SDIO Default Mode Timing Diagram........................................................... 18 11.3 SDIO High Speed Mode Timing Diagram.................................................... 19 12. Recommended Reflow Profile ......................................................................... 20 13. Package Information........................................................................................ 23 13.1 Label........................................................................................................... 23 13.2 Dimension................................................................................................... 24 13.3 MSL Level / Storage Condition ................................................................... 26 2 1. Introduction Zhejiang Sunseeker Industrial Co., Ltd. would like to announce a low-cost and low-power consumption module which has all of the WiFi, Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors' 802.11b/g/n Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth. This compact module is a total solution for a combination of WiFi + BT technologies. The module is specifically developed for Smart phones and Portable devices. 3 2. Features 802.11b/g/n single-band radio Bluetooth V4.1 with integrated Class 1.5 PA and Low Energy (BLE) support Concurrent Bluetooth and WLAN operation Simultaneous BT/WLAN receive with single antenna WLAN host interface options: - SDIO v2.0 -- up to 50 MHz clock rate BT host digital interface: - UART (up to 4 Mbps) IEEE Co-existence technologies are integrated die solution ECI -- enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives 4 3. Deliverables 3.1 Deliverables The following products and software will be part of the product. Module with packaging Evaluation Kits Software utility for integration, performance test. Product Datasheet. Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform's antennas are required for the certification. 5 4. General Specification 4.1 General Specification Model Name Product Description Dimension WiFi Interface BT Interface Operating temperature a,b Storage temperature Humidity AP6212/AP6212A Support WiFi/Bluetooth functionalities L x W x H: 12 x 12 x 1.5 (typical) mm SDIOV 2.0 UART / PCM -30°C to 85°C -40°C to 85°C Operating Humidity 10% to 95% Non-Condensing a. The operating temperature 65 to 85°C is feasible at conditional environment. Please examine the reliability on final product. b. Functionality is guaranteed across this range of temperature. Optimal RF performance as specified in the data sheet, however, is guaranteed only for 10°C to 55°C. 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol Description VBAT VDDIO Input supply Voltage Digital/Bluetooth/SDIO/ I/O Voltage Min. Max. Unit -0.5 5.5 V -0.5 3.6 V 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Typ. Operating Temperature VBAT VDDIO -30 25 3.0 3.3 1.7 3.3 Max. Unit 85 deg.C 3.8 V 3.6 V 6 5. WiFi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11b/g/n, WiFi compliant Frequency Range 2.4G Wi-Fi:2412~2462 MHz(802.11b/g/n20) Modulation Output Power 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 2.4G Wi-Fi: 802.11b: 18.672 dBm 802.11g: 24.210 dBm 802.11n20: 23.858 dBm - MCS=0 PER @ -85 dBm, +/- 2dB - MCS=1 PER @ -84 dBm, +/- 2dB Receive Sensitivity (11n,20MHz) @10% PER - MCS=2 - MCS=3 - MCS=4 - MCS=5 PER @ -82 dBm, +/- 2dB PER @ -80 dBm, +/- 2dB PER @ -77 dBm, +/- 2dB PER @ -73 dBm, +/- 2dB - MCS=6 PER @ -71 dBm, +/- 2dB - MCS=7 PER @ -68 dBm, +/- 2dB - 6Mbps PER @ -86 dBm, +/- 2dB - 9Mbps PER @ -85 dBm, +/- 2dB - 12Mbps PER @ -85 dBm, +/- 2dB Receive Sensitivity (11g) - 18Mbps PER @ -83 dBm, +/- 2dB @10% PER - 24Mbps PER @ -81 dBm, +/- 2dB - 36Mbps PER @ -78 dBm, +/- 2dB - 48Mbps PER @ -73 dBm, +/- 2dB - 54Mbps PER @ -71 dBm, +/- 2dB - 1Mbps PER @ -90 dBm, +/- 2dB Receive Sensitivity (11b) - 2Mbps PER @ -88 dBm, +/- 2dB @8% PER - 5.5Mbps PER @ -87 dBm, +/- 2dB - 11Mbps PER @ -84 dBm, +/- 2dB Data Rate 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 7 Data Rate (20MHz ,Long GI,800ns) Data Rate (20MHz ,short GI,400ns) Maximum Input Level Maximum Antenna Gain: 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps 802.11b : -10 dBm 802.11g/n : -20 dBm 2.37 dBi 8 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.1 of 1, 2 and 3 Mbps. Host Interface UART Maximum Antenna Gain: Frequency Band 2.37dBi 2402MHz ~ 2480MHz Number of Channels 79 channels Modulation GFSK, /4-DQPSK, 8DPSK RF Specification Min. Typical. BLE(1Mbps): Sensitivity @ BER=0.1% for GFSK (1Mbps) Sensitivity @ BER=0.01% for /4-DQPSK (2Mbps) Sensitivity @ BER=0.01% for 8DPSK (3Mbps) Maximum power 6.09 dBm -86 dBm -86 dBm -80 dBm GFSK (1Mbps):4.52 dBm /4-DQPSK:6.83 dBm 8DPSK:7.16 dBm Max. 9 7. BLE Specification 7.1 BLE Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Frequency Band 2402MHz-2480MHz Host Interface UART Frequency step Number of Channels 2MHz 40CH 10 8. Pin Assignments 8.1 Pin Outline < TOP VIEW > 8.2 Pin Definition NO Name Type 1 GND 2 WL_BT_ANT I/O 3 GND 4 FM_RX I 5 NC 6 BT_WAKE I 7 BT_HOST_WAKE O 8 NC 9 VBAT P 10 XTAL_IN I 11 XTAL_OUT O 12 WL_REG_ON I 13 WL_HOST_WAKE O Description Ground connections RF I/O port Ground connections FM radio RF input antenna port Floating (Don't connected to ground) HOST wake-up Bluetooth device Bluetooth device to wake-up HOST Floating (Don't connected to ground) Main power voltage source input Crystal input Crystal output Internal regulators power enable/disable WLAN to wake-up HOST 11 14 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND Ground connections 21 VIN_LDO_OUT P Internal Buck voltage generation pin 22 VDDIO P I/O Voltage supply input 23 VIN_LDO P Internal Buck voltage generation pin 24 LPO I External Low Power Clock input (32.768KHz) 25 PCM_OUT O PCM Data output 26 PCM_CLK I/O PCM clock 27 PCM_IN I PCM data input 28 PCM_SYNC I/O PCM sync signal 29 NC Floating (Don't connected to ground) 30 NC Floating (Don't connected to ground) 31 GND Ground connections 32 NC Floating (Don't connected to ground) 33 GND Ground connections 34 BT_RST_N I Low asserting reset for Bluetooth core 35 NC Floating (Don't connected to ground) 36 GND Ground connections 37 NC Floating (Don't connected to ground) 38 NC Floating (Don't connected to ground) 39 GPIO2 I/O WiFi Co-existence pin with LTE 40 GPIO1 I/O WiFi Co-existence pin with LTE 41 UART_RTS_N O Bluetooth/FM UART interface 42 UART_TXD O Bluetooth/FM UART interface 43 UART_RXD I Bluetooth/FM UART interface 44 UART_CTS_N I Bluetooth/FM UART interface 45 TP1 O FM Analog AUDIO left output 46 TP2 O FM Analog AUDIO right output 47 TP3 (NC) Floating (Don't connected to ground) 12 9. Dimensions 9.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > < TOP VIEW > 13 9.2 Layout Recommendation (Unit: mm) < TOP VIEW > 14 10. External clock reference External LPO signal characteristics Parameter Nominal input frequency Frequency accuracy Duty cycle Module input Signal Level Signal type Input impedance Clock jitter (integrated over 300Hz 15KHz) Specification 32.768 30 30 - 70 400~3300 Square-wave >100k <5 <1 External Ref_CLK signal characteristics Units kHz ppm % mV, p-p pF Hz 10.1 SDIO Pin Description The module supports SDIO version 2.0 for 4-bit modes (100 Mbps), and high speed 4-bit (50 MHz clocks 200 Mbps). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This `out-of-band' interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided. Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B) 15 Function 1 Backplane Function to access the internal System On Chip (SOC) address space (Max BlockSize / ByteCount = 64B) Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max BlockSize/ByteCount=512B) SDIO Pin Description SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 11. Host Interface Timing Diagram 11.1 Power-up Sequence Timing Diagram The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable. WL_REG_ON: Used by the PMU to power up the WLAN section. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset. BT_RST_N: Low asserting reset for Bluetooth and FM only. This pin has no effect on WLAN and does not control any PMU functions. This pin must be driven high or low (not left floating). 16 WLAN=ON, Bluetooth=ON WLAN=OFF, Bluetooth=OFF WLAN=ON, Bluetooth=OFF 17 WLAN=OFF, Bluetooth=ON 11.2 SDIO Default Mode Timing Diagram 18 11.3 SDIO High Speed Mode Timing Diagram 19 12. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : 2 times The notification of WiFi module before mounting: The aperture of stencil should be larger than foot print of module, and the stencil thickness should be not less than 0.12mm. It must use N2 for reflow and suggest the concentration of oxygen less than 5000 ppm . 20 Solder Paste definition Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB pad. We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between 0.6~0.65mm and the L between L1.5~1.6mm. If the thickness of the stencil is thinner, we suggest to adding more solder, to increase the wetting ability. Depends on different production situation, if the stencil thickness is 0.08~0.1mm, and the module nearby area is no more space for expending soldering area, we will suggest to increase the stencil thickness to increase the wetting ability. The major consideration parts of stencil design is to increase the solder paste wetting ability. 21 Module Specifications L 0.7mm The design for PCB Pad : L:0.8mm We recommend the apertures for stencil L:0.5mm~0.6mm In order to avoid highness impact caused solder paste thickness, the stencil open size can be appropriately retracted 13. Package Information 13.1 Label Label A Anti-static and humidity notice Label B MSL caution / Storage Condition Label C Inner box label . Label D Carton box label . 23 13.2 Dimension 24 B Humidity indicator A Desiccant C C D 25 13.3 MSL Level / Storage Condition 26 FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Note : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates,uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. ISED statement This device complies with Innovation, Science and Economic Development Canada (ISED) licenceexempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet appareil est conforme à la ou aux normes RSS exemptées de licence pour Innovation, Science et développement économique Canada. Le fonctionnement est soumis aux deux conditions suivantes: (1) ce dispositif ne peut pas causer d'interférence nocive, et (2) ce dispositif doit accepter toute interférence reçue, y compris les interférences pouvant causer un fonctionnement indésirable. Cet équipement respecte les limites d'exposition aux rayonnements ionisants fixées pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec une distance minimale de 20cm entre le radiateur et votre corps. Cet émetteur ne doit pas être localisé ou fonctionner en conjonction avec une autre antenne ou un autre émetteur. OEM instructions (Reference KDB 996369 D03 OEM Manual v01, 996369 D04 Module Integration Guide v02) 1. Applicable FCC rules This device complies with part 15.247 of the FCC Rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 3.0~3.8VDC. The operational ambient temperature of the module is -30 °C ~ +85 °C. The external antenna is NOT allowed. 3. Limited module procedures N/A 4. Trace antenna design N/A 5. RF exposure considerations The equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. 6. Antenna Antenna type: Dipole Antenna ; Peak antenna gain:2.37 dBi 7. Label and compliance information An exterior label on OEM's end product can use wording such as the following: "Contains FCC ID: 2BFD7-AP6212 " 8. Information on test modes and additional testing requirements 1) The modular transmitter has been fully tested by the module grantee on the required number of channels, modulation types, and modes, it should not be necessary for the host installer to retest all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter, perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions). 2) The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. 3) If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected . 4) Additional testing, Part 15 Sub part B disclaimer: The device is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the higher frequency range of investigation When testing the host product, all the transmitters must be operating. The transmitters can be enabled by using publicly-available drivers and turned on, so the transmitters are active. When testing for emissions from the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive mode only is not possible then, the radio shall be passive (preferred) and/or active scanning. In these cases, this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4, ANSI C63.10 for further general testing details. The product under test is set into a link/association with a partnering device, as per the normal intended use of the product. To ease testing, the product under test is set to transmit at a high duty cycle, such as by sending a file or streaming some media content.Microsoft Office Word 2007