TI Designs: CC256x Bluetooth® Reference Design
Authors: Miguel Sanchez, Dana Myers
Document ID: TIDR111
Reference Design ID: CC256XEM-RD
Company: Texas Instruments
Introduction
This document details the TI Designs CC256x Bluetooth® Reference Design, providing schematics and configuration notes for implementing Bluetooth connectivity using Texas Instruments' CC256x devices.
Revision History
- Added C32, C36
- R33 0 ohm resistor was deleted
- R33 when installed connected MLDO OUT to VBAT_CC
- Delete net SLOW_CLK_DBG, connect net SLOW-CLK-EDGE to P2 pin 10.
Board Interface
Schematic details for the board interface, including connectors and pin assignments.
RF1 Connector Pin Assignments
| Pin | EM Adapter Pin Assignment |
|---|---|
| 1 | GND |
| 2 | HCI_CTS_3V3 |
| 3 | MODULE_UART_CTS |
| 4 | SLOW_CLK_EXT_3V3 |
| 5 | SLOW_CLK |
| 6 | HCI_RX_3V3 |
| 7 | MODULE_UART_RX |
| 8 | HCI_TX_3V3 |
| 9 | MODULE_UART_TX |
| 10 | AUD_FSYNC_3V3 |
| 11 | I2C_SDA |
| 12 | RF_GPIO2 |
| 13 | I2C_SCL |
| 14 | CC_RSTN |
| 15 | SDIO_CMD |
| 16 | WCS_NSHUTD |
| 17 | SDIO_CMD |
| 18 | MODULE_UART_RTS |
| 19 | GND |
| 20 | RF_GPIO3 |
| 46 | VBAT_EDGE |
| 48 | AUD_CLK_1V8 |
| 50 | AUD_FSYNC_1V8 |
| 52 | AUD_IN_1V8 |
| 54 | AUD_OUT_1V8 |
| 56 | nSHUTDOWN_1V8 |
| 58 | HCI_TX_1V8 |
| 60 | HCI_RX_1V8 |
| 62 | HCI_CTS_1V8 |
| 64 | HCI_RTS_1V8 |
| 66 | TX_DEBUG_1V8 |
| 68 | VDD_1V8 |
| 70 | |
| 72 | |
| 74 | |
| 76 | |
| 78 | |
| 80 | |
| 82 | |
| 84 | |
| 86 | |
| 88 | |
| 90 | |
| 92 | |
| 94 | |
| 96 | |
| 98 | |
| 100 |
RF2 Connector Pin Assignments
| Pin | EM Adapter Pin Assignment |
|---|---|
| 1 | +1.8V (Optional) |
| 3 | +1.8V (Optional) |
| 5 | +1.8V (Optional) |
| 7 | +3.3V |
| 9 | +3.3V |
| 11 | MODULE_AUDIO_FSYNC |
| 13 | RF_GPIO2 |
| 15 | CC_RSTN |
| 17 | MODULE_AUDIO_CLK |
| 19 | WCS_NSHUTD |
| 2 | VIO_HOST |
| 4 | +3.3V |
| 6 | +3.3V |
| 8 | AUD_OUT_3V3 |
| 10 | AUD_IN_3V3 |
| 12 | MODULE_AUDIO_DATA_OUT |
| 14 | MODULE_AUDIO_DATA_IN |
| 16 | USBM |
| 18 | USBP |
| 20 | NC |
| 46 | VIO_HOST |
| 48 | VBAT_MCU |
| 50 | RF2 |
| 52 | +3.3V |
| 54 | +3.3V |
| 56 | MODULE_AUDIO_FSYNC |
| 58 | MODULE_AUDIO_CLK |
| 60 | GND |
| 62 | WCS_NSHUTD |
| 64 | MODULE_AUDIO_DATA_LEFT |
| 66 | ANALOG_AUDIO_DATA_LEFT |
| 68 | ANALOG_AUDIO_DATA_RIGHT |
| 70 | MODULE_AUDIO_DATA_RIGHT |
| 72 | USBM |
| 74 | USBP |
| 76 | NC |
| 78 | MODULE_UART_RTS |
| 80 | RF_GPIO3 |
| 82 | GND |
| 84 | VIO_HOST |
| 86 | VBAT_MCU |
| 88 | RF2 |
| 90 | +3.3V |
| 92 | +3.3V |
| 94 | MODULE_AUDIO_FSYNC |
| 96 | MODULE_AUDIO_CLK |
| 98 | GND |
| 100 | MODULE_AUDIO_DATA_LEFT |
Configuration Notes
- 01-EM: RF1 Install, RF2 Removed
- 02-COM: RF1 Removed, RF2 Install
Power Supply and Level Shifters
Bluetooth Power Supply
Details the Bluetooth power supply circuit, operating on a 2.2-4.8V rail with a 1.8V IO supply.
Level Shifters
Level shifters are used to interface between different voltage domains (e.g., VIO_HOST and VDD_1V8_LS).
Configuration Notes
- 01-EM: R2 Removed, R3 Install
- 02-COM: R2 Install, R3 Removed
CC256x HCI Device and Clocking
This section describes the CC256x HCI Class 1.5 capable Bluetooth device, its clocking mechanisms, and key interfaces.
Internal Clock
Provides the 32.768KHz and 26MHz clock sources for the device.
CC256x HCI Device
The core Bluetooth device, handling HCI (Host Controller Interface) communication and RF functions. Key interfaces include:
- HCI_TX_1V8 (A33)
- HCI_RX_1V8 (A26)
- HCI_RTS_1V8 (A32)
- HCI_CTS_1V8 (A29)
- AUD_FSYNC_1V8 (A35)
- AUD_CLK_1V8 (B32)
- AUD_IN_1V8 (B34)
- AUD_OUT_1V8 (B33)
- SLOW_CLK_EXT_1V8 (A25)
- SLOW_CLK_EDGE (A6)
- nSHUTDOWN_1V8 (B24)
- TX_DEBUG_1V8 (A14)
- CLK_REQ_OUT_1V8 (A4)
RF Components
Includes components for RF signal path, such as filters (FL1) and antennas (ANT1).
Important Notice
Texas Instruments Incorporated ("TI") reference designs are intended to assist designers in developing systems with TI semiconductor products. Buyers are responsible for their own analysis, evaluation, and judgment. TI reference designs are provided "AS IS" without warranties, and TI disclaims all liability for infringement, damages, or issues arising from their use. TI may update designs and products. Buyers must ensure compliance with all legal, regulatory, and safety requirements for their products. Specific use cases like FDA, military, or automotive applications have additional considerations and responsibilities for the buyer.
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