RUILON ELECTRONICS

Description

Positive Thermal Coefficient (PTC) devices provide over-current protection for electrical and electronic devices. They function using conducting strips of metal embedded inside polymers. Under normal conditions, the device's resistance is near zero. However, during over-current conditions, the PTC heats up, causing the polymer to expand and increasing the impedance. When the current returns to normal, the component cools down, returning to its original shape and very low resistance levels.

Image: Two yellow, disc-shaped PTC devices with radial leads are shown.

Features

• Hold Current (Ihold): 0.2~5.0A
• 72V Operating voltage
• Radial leaded devices
• Over-current protection
• Very high voltage surge capabilities
• Available in lead-free version
• Fast time-to-trip
• RoHS compliant, Lead-Free and Halogen-Free

Applications

• Over-current and over-temperature protection of automotive electronics
• Hard disk drives
• PC motherboards
• Point-of-sale (POS) equipment
• PCMCIA cards
• USB port protection - USB 2.0, 3.0 & OTG
• HDMI 1.4 Source protection
• Computers & peripherals
• Industrial control
• Security systems

Part Number Code

The part number is structured as follows:

R L [Voltage Rating] [Hold Current] [LOGO] [Other Options] - [Other Options] [Other Options] [Other Options]

Example placeholders: R, L, X, X, X, -, X, X, X. With labels: LOGO, Voltage rating(VDC), Hold current.

Environmental Specifications

Electrical Characteristics

Definitions:

• I_hold=Hold current: maximum current at which the device will not trip at 25°C still air.
• I_T=Trip current: minimum current at which the device will always trip at 25°C still air.
• V_max=Maximum voltage device can withstand without damage at rated current.
• I_max=Maximum fault current device can withstand without damage at rated voltage.
• T_trip=Maximum time to trip(s) at assigned current.
• P_{d typ}=Typical power dissipation: typical amount of power dissipated by the device when in still air environment.
• R_imin=Minimum device resistance at 25°C prior to tripping.
• R1_max=Maximum device resistance is measured one hour post reflow.

Solder Reflow Conditions

Wave Soldering

Soldering Temperature: 260°C~270°C

Soldering Time: ≤3sec.

Soldering Position: Resettable fuse wire and the bottom ≥ 6mm.

Manual Soldering

Soldering Temperature: 250°C~280°C

Soldering Time: ≤3sec.

Soldering Position: Resettable fuse wire and the bottom ≥ 6mm.

Graph: A temperature-time graph illustrating the soldering profile for wave soldering. It shows stages of Pre-heating (100°C-130°C), Soldering (245°C-260°C for max 5s), and Cooling. The X-axis represents Time(s) from 0 to 250, and the Y-axis represents Temperature (°C) from 0 to 300.

Environmental Temperature and IH, IT

Graph: A line graph depicting the relationship between environmental temperature (X-axis, from -30°C to 85°C) and current (Y-axis, from 0 to 300). Two lines are shown, labeled IH (Hold Current) and IT (Trip Current), illustrating how these currents vary with temperature.

Product Dimensions

Diagram fig.1: A radial leaded PTC device is shown with labels A, B, C, and D indicating different dimensions.

Diagram fig.2: A similar radial leaded PTC device is shown, also with labels A, B, C, and D, and includes a "Marking" area.

Dimensions (mm)

Dimensions (in)

Packaging

Cautions for R-line PTC Use

1. Operation beyond the maximum voltage or current may result in device damage, including PTC arcing, resistance increasing, or burning.
2. The Hold current specified at different temperatures is the conventional performance after wave-soldering or manual soldering. PTC can hold this current for 1 hour at the specified temperature. This current is not suitable for long-term charging or discharging applications.
3. All resistance and electronic characteristics are based on tests conducted at Ruilongyuan Lab. Applicability needs to be verified by the customer, as parameters may be affected by other processes like twice soldering or injection. Customers must independently evaluate and test to select appropriate products for their applications.
4. PTC is a thermal-sensitive device and is affected by ambient temperature. It is recommended to avoid placing heat sources near the PTC to minimize external heat impact.
5. Wave Soldering or Hand Soldering are recommended for R-line PTC. Refer to the Ruilongyuan recommended soldering curve. Exceeding the recommended soldering temperature may damage the PTC.
6. During assembly and application, verify the material specifications and application parameters (Temperature, Time, etc.) of all injection or plastic materials, adhesives, silica gels, etc., to ensure compatibility and prevent adverse effects on PTC performance.
7. It is not recommended to use board washing water or other cleaning agents for PTC assembly or use. If necessary, verify the applicability of cleaners, washer water, and solvents to ensure they do not affect PTC performance. Chemicals known to affect PTC include highly soluble and destructive organic compounds like ethers, benzenes, ketones, and lipids. After cleaning, place the product in an open environment for at least 24 hours to allow residual solvents to volatilize.
8. During assembly, avoid applying excessive force such as smashing, clamping, pulling, denting, or twisting the PTC body to prevent performance degradation.
9. PTC is a secondary protection device, intended only for sporadic, accidental over-current or over-temperature events. It is not suitable for continuous or repeated failure conditions.
10. PTC is not recommended for installation in space-constrained environments, as this can inhibit its performance.
11. When the product is finally discarded, it can be treated as general electronic waste. Refer to the MSDS for specific raw material compositions of PPTC.