Instruction Manual for Shenzhen Dadoutek Electronics models including: DB809S, 2A6CI-DB809S, 2A6CIDB809S, DB809S BLE 5 Module, DB809S, BLE 5 Module

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User Manual

SHENZHEN DADOUTEK ELECTRONICS CO.,LTD DB809S BLE Module 2A6CI-DB809S 2A6CIDB809S db809s


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BLE 5 MODULE
DB809S Product Manual

Version V1.00 V1.10 V1.11 V1.12 V1.13 V1.14

Update Time 2019-3-15 2019-4-17 2019-4-22 2020-6-16 2020-7-10 2020-8-17
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Editor Alan Jiao Jack Wang Jack Wang Allen.Hu Joe .Zhou Allen Hu

Contents

1. Product Introduction .......................................................................................... - 1 -

1.1

Product Overview .............................................................................................. - 1 -

2. Detail Param ....................................................................................................... - 2 -

2.1

Performance ......................................................................................................... - 2 -

2.2

Mechanical specifications .................................................................................... - 3 -

2.3

PIN Description.................................................................................................... - 4 -

2.4

Soldering Reflow Guidelines ............................................................................... - 5 -

3. Attentions.............................................................................................................. - 6 -

4. Sales And Service Network .................................................................................. - 7 -

4.1

Headquarter .......................................................................................................... - 7 -

4.2

North China.......................................................................................................... - 7 -

4.3

East China ............................................................................................................ - 7 -

4.4

Southwest China .................................................................................................. - 7 -

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1. Product Introduction
1.1 Product Overview
DB809S is made by nRF52805 which is the baseline member of the nRF52 Series SoC family. It is built around an ARM® CortexTM-M4 CPU running at 64 MHz. It meets the challenge of bringing Bluetooth 5 feature sets and protocol concurrency to applications at a price point that makes adding Bluetooth 5 connectivity to an application compelling. It is an ideal candidate for less complex applications and also as a Bluetooth 5 connectivity processor in larger applications.
DB809S is SMD packagethe rapid production of can be realized through the standard SMT equipment. It can give customers high reliability connection, especially suitable for automation, large-scale modern mode of production, low cost, convenient application in all kinds of Internet of things terminal hardware.

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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2. Detail Param

2.1 Performance

Form 1: Performance

Module

DB809S

Soc

nRF52805 WLCSP

FLASH

192KB

RAM

24KB

VDD

1.7V to 3.6V

PIN Num

15

Working FRQ

2402MHz-2480MHz (BLE)/2360MHz-2500MHz(nRF Private mode)

GPIO

10

ADC

12-bit, 200 kbps2 channels

PWM

4 Channels

PDM

1

TIMER/RTC

3 x 32bit(Count mode)/2

SPI/I2C/UART

1 (Master or Slave mode)/ 1 (Master or Slave mode)/1

AES

Hardware

RNG

1

Comparator

64 level* 2 Channels

Watch Dog

1

TX Power

-20 to +4 dbm, 4db steps

RF PHY

1Mbps2Mbps BLE mode/1M, 2Mbps Nordic nRF Private mode

Current (Chip reference)

TX4.6 mA peak current (0 dBm) RX: 4.6 mA peak current 0.3uA 3V VDD in System OFF modeno RAM retention

Working Temperature -40~85

Storage Temperature 22~28

Package Size

10.5*16*3mm

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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2.2 Mechanical specifications
Picture 1 is the PCB mechanical specifications of the module.

Picture 1: PCB Mechanical Specifications dimensions in millimeters

Length 10.5mm

Width 16mm

Form 2 PCB Height PAD SizeBottom

2.33mm

0.7mm*0.8mm

PIN Gap 1.27mm

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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2.3 PIN Description

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Form 3 Module PIN Description

PIN PIN On nRF52

Description

1

GND

GND

2

SWDIO

Serial wire debug I/O for debug and programming

3

SWCLK

Serial wire debug clock input for debug and programming

4 P0.21/NRESET

Digital I/O / Configurable as pin reset

5

P0.20

Digital I/O

6

P0.18

Digital I/O

7

P0.16

Digital I/O

8

P0.12

Digital I/O

9

P0.14

Digital I/O

10 P0.05/AIN3

Analog input /Digital I/O

11 P0.04/AIN2

Analog input /Digital I/O

12 P0.01/XL2 General purpose I/O Connection for 32.768 kHz crystal (LFXO)

13 P0.00/XL1 General purpose I/O Connection for 32.768 kHz crystal (LFXO)

14

VDD

1.7 V ~3.6VRecommended voltage range

15

GND

GND

NoteInput voltage higher then VCC will destroy the module.

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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2.4 Soldering Reflow Guidelines
Form 4 and picture 2 are reflow conditions and profile.

Form4: Reflow conditions

Picture 2: Reflow profile
LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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3. Attentions
1This module contains CMOS devices, need be protected from ESD.
2Module needs to connect GND well, to reduce parasitic inductance. 3If module needs reflow, pay attention to reflow profile. 4Area below the ANT of this module, should not use polygon. 5ANT of this module should be far away from other circuit. 6Module should be placed as far as possible away from the other low frequency circuits or digital circuits. 7Module is plugged into a power supply for recommend the use of magnetic beads in isolation. 8If there are other internal band wireless module in your product, frequency should be reasonable planning, take the shielding measures, such as reduce the influence of harmonic interference and intermodulation interference.

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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4. Sales And Service Network

4.1 Headquarter
Shenzhen Headquarter Add Rm.1502,FIYTA Tech Building,#002 No.1 SouthernRd,Hi-Tech,Nanshan District,Shenzhen 518057,P.R.China Tel 86-755-86018818 Fax 86-755-86018808
4.2 North China
Beijing Office Add Room1006,QuantumPlaza,No.23ZhiChunRoad,HaiDianDistrict,Beijing Tel 86-10-82358601/2/3/4 Fax 86-10-82358605
4.3 East China
Shanghai Office Add :Rm.2005,MingshenCenterBuilding,No.3131,KaixuanRoad,XuhuiDistrict,Shanghai200030,P. R.China Tel 86-21-54071701 Fax 86-21-54071702
4.4 Southwest China
Chengdu Office Add :Room1402,Bldg#2,ShuduCenter,No.138,TianfuNo.2Street,MidSection,TianfuAvenue,HighTechDistrict,ChengduCity Tel 86-28-85355251 Fax 86-28-85350890

LocationRm.1502,East Tower,FIYTA Tech. Bldg.,Southern District of High-tech Industrial Park,Nanshan District,Shenzhen 518057,P.R.China
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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: · Reorient or relocate the receiving antenna. · Increase the separation between the equipment and receiver. · Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. · Consult the dealer or an experienced radio/TV technician for help.
Caution: Any changes or modifications to this device not explicitly approved by manufacturer could void your authority to operate this equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
The device has been evaluated to meet general RF exposure requirement. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.



References

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