Broadcom HDSM-541W/543W: 0.56-in. (14.0-mm) Dual-Digit Surface-Mount LED Display
Data Sheet
Description
This Broadcom® 0.56-in. (14.22-mm) height dual-digit display uses a white ChipLED. This device comes with a gray top surface and white segments.
Ordering Information
| White | Description |
|---|---|
| HDSM-541W | Common Anode, Right-Hand Decimal |
| HDSM-543W | Common Cathode, Right-Hand Decimal |
Features
- 0.56-in. digit height
- Low current operation
- Excellent character appearance
- Available in CA and CC
- 500 pieces per reel
- Moisture Sensitivity Level: Level 3
- RoHS compliant
Applications
- Industrial
- Consumer
- Home appliance displays
- Medical
- Office automation
- Avionic instrumentation
Package Dimensions (Unit: mm)
Diagram showing the package dimensions of the LED display. Key dimensions include overall height, width, and depth, as well as pin spacing and placement. The diagram indicates Pin 1 and provides overall measurements for the component.
There are two figures showing the LED display segments, labeled DIG. 1 and DIG. 2, with pin connections indicated.
Pin Connection (Common Anode)
| Pin Number | Connection |
|---|---|
| 1 | CATHODE G |
| 2 | CATHODE DP |
| 3 | CATHODE A |
| 4 | CATHODE F |
| 5 | COMMON ANODE DIG2 |
| 6 | CATHODE D |
| 7 | CATHODE E |
| 8 | CATHODE C |
| 9 | CATHODE B |
| 10 | COMMON ANODE DIG1 |
Internal Circuit Diagram (Common Anode)
Diagram illustrating the internal circuitry for the common anode configuration. It shows the connections for DIG 1 and DIG 2, with segments labeled A, B, C, D, E, F, G, and DP, connected to specific pin numbers.
Pin Connection (Common Cathode)
| Pin Number | Connection |
|---|---|
| 1 | ANODE G |
| 2 | ANODE DP |
| 3 | ANODE A |
| 4 | ANODE F |
| 5 | COMMON CATHODE DIG2 |
| 6 | ANODE D |
| 7 | ANODE E |
| 8 | ANODE C |
| 9 | ANODE B |
| 10 | COMMON CATHODE DIG1 |
Internal Circuit Diagram (Common Cathode)
Diagram illustrating the internal circuitry for the common cathode configuration. It shows the connections for DIG 1 and DIG 2, with segments labeled A, B, C, D, E, F, G, and DP, connected to specific pin numbers.
Absolute Maximum Ratings at TA = 25°C
| Parameter | White | Units |
|---|---|---|
| Power Dissipation per Segment | 39 | mW |
| Peak Forward Current per Segment (1/10 duty cycle, 0.1-ms pulse width) | 80 | mA |
| Continuous Forward Current per Segment | 10 | mA |
| Derating Linearly from 25°C per Segment | 0.083 | mA/°C |
| Reverse Voltage per Segment | Not designated for reverse bias | V |
| Operating Temperature Range | -40°C to +85°C | |
| Storage Temperature Range | -40°C to +85°C |
Electrical/Optical Characteristics at TA = 25°C
White
| Parameter | Symbol | Min. | Typ. | Max. | Units | Test Condition |
|---|---|---|---|---|---|---|
| Average Luminous Intensity | Iv | 28 | 44 | mcd | IF = 5 mA | |
| Chromaticity Coordinates | (x,y) | See Figure 1 | IF = 5 mA | |||
| Forward Voltage, per Segment | VF | 2.95 | 3.8 | V | IF = 5 mA | |
| Reverse Current, per Segmenta | IR | 100 | μΑ | VR = 5V | ||
| Luminous Intensity Matching Ratio | Iv-m | 2:1 | IF = 5 mA |
a Indicates the production final test condition only. Long-term reverse biasing is not recommended.
Typical Electrical/Optical Characteristic Curves at TA = 25°C
White
Figure 1: Color Bin Limit (CIE 1931 Chromaticity Diagram) [Tolerance: ± 0.02]
A diagram showing the SMT White Color Bin Structure with x and y coordinates. A table provides specific Chromaticity Coordinates (x, y) for different points.
Figure 2: Relative Luminous Intensity vs. Forward Current
A graph plotting Relative Luminous Intensity (Normalized at 5 mA) against DC Forward Current (mA). The curve shows an increasing trend.
Figure 3: Forward Current vs. Forward Voltage
A graph plotting Forward Current (mA) against Forward Voltage (V). The curve shows a typical LED forward voltage characteristic.
Figure 4: Allowable DC Current vs. Ambient Temperature
A graph plotting Max. Allowable DC Current (mA) against Ambient Temperature (°C). The curve shows a decrease in allowable current as temperature increases.
ISMT Soldering Profile
Pb-Free Reflow Soldering Profile
A temperature-time graph illustrating the Pb-Free Reflow Soldering Profile. It shows key temperature points (150°C, 200°C, 217°C, 245°C) and time durations for different stages of the reflow process, including ramp-up rates and soak times, according to J-STD-020C.
Notes:
- The peak temperature refers to the peak package body temperature.
- The number of reflow processes is limited to a maximum of two times only. A cooling process to normal temperature is required between the first and second soldering processes.
Recommended Soldering Pattern (Unit: mm)
Diagrams showing the recommended soldering pattern for the LED display, including dimensions for the pad layout and stencil window opening. The recommended stencil window opening is 80%.
Tape Specification (Unit: mm)
Diagrams illustrating the tape specification for the surface-mount LED display, showing the carrier tape with sprocket holes and component placement. Dimensions for tape width, pitch, and component cavity are provided. The user direction of unreeling is indicated.
Precautionary Notes
Soldering
- Do not perform reflow soldering more than twice. Allow the product to cool to normal room temperature before the second reflow. Observe the necessary precautions of handling moisture-sensitive devices as stated in the following section.
- Do not apply any pressure or force on the LED display during reflow and after reflow when it is still hot.
- Use reflow soldering to solder the LED display. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to the following conditions: Soldering iron tip temperature = 315°C maximum, Soldering duration = 2 seconds maximum, Number of cycles = 1 only, Power of soldering iron = 50W maximum.
- Do not touch the LED display with the soldering iron except for the soldering terminals, as it can cause damage.
- Confirm beforehand whether the functionality and performance of the LED display are affected by soldering with hand soldering.
- Use solder paste with no-clean flux for soldering.
- To remove foreign particles on the surface of the package, use a wet cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure. Do not wash or soak the LED display in any solution.
Handling Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note 5305, Handling Moisture-Sensitive Surface-Mount LEDs, for additional details and a review of proper handling procedures.
Before use:
- An unopened moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LED displays per the original MSL rating.
- Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, the MBB must be properly resealed with fresh desiccant and an HIC. The exposed duration must be taken in as floor life.
Control after opening the MBB:
- Read the HIC immediately upon opening the MBB. Keep the LEDs at <30°C/60% RH at all times, and complete all high-temperature-related processes, including soldering, curing, or rework, within 168 hours.
Control for unfinished reels:
- Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5% RH.
Control of assembled boards:
- If the PCB soldered with the LED displays is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or a desiccator at <5% RH to ensure that all LED displays have not exceeded their floor life of 168 hours.
Baking is required if one of the following conditions exist:
- The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC.
- The LED displays are exposed to conditions of >30°C/60% RH at any time.
- The LED's floor life exceeded 168 hours.
The recommended baking condition is 60°C ± 5°C for 20 hours. Baking can be done only once.
Application Precautions
- The drive current of the LED display must not exceed the maximum allowable limit across temperature as stated in this data sheet. Constant current driving is recommended to ensure consistent performance.
- Circuit design must cater to the whole range of forward voltage (VF) of the LED display to ensure that the intended drive current can always be achieved.
- The LED display exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (such as intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.
- The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED.
- Avoid rapid changes in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED display.
- If the LED display is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain, water, dust, oil, corrosive gases, external mechanical stresses, and so on.
CAUTION!
LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Observe appropriate precautions during handling and processing.
