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User Guide for MULTITECH models including: MTUDK2-ST-CELL.R1 Universal Developer Kit 2.0, MTUDK2-ST-CELL.R1, Universal Developer Kit 2.0, Developer Kit 2.0, Kit 2.0
MultiTech MTUDK2-ST-CELL.R1 | WDL Systems
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DocumentDocumentUniversal Developer Kit 2.0
MTUDK2-ST-CELL.R1 Developer Guide
UNIVERSAL DEVELOPER KIT DEVELOPER GUIDE
Universal Developer Kit Developer Guide Models: MTUDK2-ST-CELL.R1
Part Number: S000779, Version 1.0
Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2022 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.
Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.
Trademarks and Registered Trademarks
MultiTech, MultiConnect, SocketModem, and the MultiTech logo are registered trademarks of Multi-Tech Systems, Inc. All other brand and product names are trademarks or registered trademarks of their respective companies.
Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications ("Restricted Applications"). Use of the products in such Restricted Applications is at the user's sole risk and liability.
MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS.
The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever.
Contacting MultiTech
Country
Sales
Europe, Middle East, sales@multitech.co.uk Africa:
U.S., Canada, all others: sales@multitech.com
+(44) 118 959 7774
(800) 328-9717 or (763) 785-3500
Support support@multitech.co.uk
support@multitech.com
+(44) 118 959 7774
(800) 972-2439 or (763) 717-5863
Website www.multitech.com
Knowledge Base For immediate access to support information and resolutions for MultiTech products, visit http://www.multitech.com/kb.go.
Support Portal To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com. Warranty To read the warranty statement for your product, visit https://www.multitech.com/legal/warranty. World Headquarters
Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
CONTENTS
Contents
Chapter 1 Developer Kit Introduction.................................................................................................................... 5 Overview ....................................................................................................................................................................... 5 Features ...................................................................................................................................................................... 5 Related Documentation .............................................................................................................................................. 5 MTUDK2-ST-CELL Developer Kit Contents ................................................................................................................... 6
Chapter 2 Board Components ............................................................................................................................... 7 Developer Board .......................................................................................................................................................... 7 Developer Board Dimensions........................................................................................................................................ 8 Developer Board Connectors ........................................................................................................................................ 9 Board Components ..................................................................................................................................................... 9 Additional Connector Information............................................................................................................................ 12 LED Indicators ........................................................................................................................................................... 12
Chapter 3 Installation and Operation .................................................................................................................. 13 Installing a SIM Card ................................................................................................................................................... 13 Installing a SIM Card on a SocketModem ................................................................................................................ 13 Installing a SIM Card on a DragonFly ....................................................................................................................... 13 Installing a SIM Card ................................................................................................................................................. 14 Installing a SocketModem on the Developer Board ................................................................................................... 15 Installing a Dragonfly on the Developer Board........................................................................................................... 17 Installing a Dragonfly Nano on the Developer Board ................................................................................................. 19 Arduino Shield............................................................................................................................................................. 20 Installing an Arduino Shield with a Dragonfly........................................................................................................... 20 Dragonfly Arduino Pins ............................................................................................................................................. 22 Attaching Power Supply Blades .................................................................................................................................. 23 Power Supply and Blades.......................................................................................................................................... 23 Attaching the Blades ................................................................................................................................................. 24 SMA to U.FL Cables ..................................................................................................................................................... 25 Connecting an Antenna through the Developer Board Connectors........................................................................... 25
Chapter 4 Diagrams and Schematics.................................................................................................................... 27 Assembly Diagram....................................................................................................................................................... 27 Block Diagram ............................................................................................................................................................. 28 Schematics - Power..................................................................................................................................................... 29 Schematics - RS-232 .................................................................................................................................................... 30 Schematics - Sockets ................................................................................................................................................... 31 Schematics - ST Link .................................................................................................................................................... 32 Schematics - LEDs........................................................................................................................................................ 33 Schematics - USB......................................................................................................................................................... 34
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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CONTENTS
Chapter 5 Design Considerations......................................................................................................................... 35 Noise Suppression Design ........................................................................................................................................... 35 PC Board Layout Guideline ......................................................................................................................................... 35 Electromagnetic Interference .................................................................................................................................... 35 Electrostatic Discharge Control................................................................................................................................... 36 USB Design ................................................................................................................................................................. 36
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
DEVELOPER KIT INTRODUCTION
Chapter 1 Developer Kit Introduction
Overview
The MTUDK2-ST-CELL.R1 (UDK2.R1) Universal Developer Kit supports development with cellular SocketModem (MTSMC), Dragonfly (MTQ), and Dragonfly Nano (MTQN). Use the developer board to streamline your development efforts and evaluate your products and applications. Easily plug in your communications device and use the developer kit for testing, programming and evaluation.
Note: Unless otherwise specified, features labeled as MTQ on the Developer Board, the feature can be used by the MTQN.
Features
6V-12V power input Selectable 3.3V or 5V on board power supply USB and serial interfaces USB port for mbed development environment RS-232 DB-9 connector for serial interface Arduino shield socket
Related Documentation
This User Guide provides information about the Developer Kit. You will also need: Device Guide for your SocketModem or Dragonfly model for specifications, pin information, mechanical drawings, labeling, regulatory information, and other model specific details. AT Command Reference Guide for the radio on your device USB Driver Installation Guide for USB models, for driver installation steps.
These documents are available through your model's pages at: SocketModem Dragonfly Dragonfly Nano
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DEVELOPER KIT INTRODUCTION
MTUDK2-ST-CELL Developer Kit Contents
The MTUDK2-ST-CELL Developer Kit includes the following:
Developer Board Power Supply
Cables Antennas Customer Notices Additional
1 - MTUDK 2.0 Cell Developer Board 1 - 100-240V 9V-1.7A power supply with removable blades 1 - NAM blade/plug, 1 - EURO blade/plug 1 - UK blade/plug 1 - AU/NZ blade/plug 1 - Micro USB Cable 3 - SMA-U.FL Antenna Cables (attached to developer board) 1 - 3.3V magnetic GPS Antenna 2 - 700-2600 MHz Antennas Quick Start One promotional screwdriver
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Chapter 2 Board Components
Developer Board
BOARD COMPONENTS
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BOARD COMPONENTS
Developer Board Dimensions
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Developer Board Connectors
BOARD COMPONENTS
Board Components
Label J1 J2 J3 J4 J5 J10
JP1
JP4
Description Scope probe ground connection Scope probe ground connection Power Jack RS-232 Connector QuickConnect Socket (for MTQ/MTQN devices). USB connector for mbed, serial, and SocketModem. For the MTQ/MTQN, use the USB connector on the MTQ/MTQN. For information on connecting to and using mbed, refer to the device guide for your MTQ/MTQN model. (Not available for SocketModems.) 3-row connector: USB Connector, MTQ/MTSMC, D-SUB Connector. Refer to JP1 USB Connector for additional information. For the MTSMC, used to disable the USB interface. Default jumper position is 1-2 for USB.
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BOARD COMPONENTS
Label JP5
JP6
JP7 JP8 JP9 S1 S2 X1 X2 X3 X4 X5 X6 X7 X8
Description Selects between the on-board 3.3V or 5V regulator for powering an MTQ or MTQN. Jumper Pins 1-2: Target voltage 3.3V. Jumper pins 2-3: Target voltage 5V. Selects between the on-board 3.3V or 5V regulator for powering an MTSMC. Jumper Pins 1-2: Target voltage 3.3V. Jumper pins 2-3: Target voltage 5V. Used with the Current Monitor (U4) to for monitoring the current for the device. J-link Header 4-pin Header STLINK Reset Button. Use to reset the processor of the device attached to the board. Wake Button. Use to wake the MTSMC/MTQ/MTQN. SocketModem, USB Connector. SocketModem Serial Connector. SocketModem, GPIO (not connected). SocketModem Power Connector. Arduino Shield Connector. Arduino Shield Connector. Arduino Shield Connector. Arduino Shield Connector.
CAUTION: Take care when connecting or disconnecting USB cables to avoid detaching the connector from the board.
Main Regulator
The main regulator supplies 3.3V and 5V to the board from the main barrel jack or from USB if the Host can deliver enough power.
The switching frequency is set to 1.05MHz, but is adjustable from 300 KHz to 2MHz. Any changes to the frequency may require inductor or capacitor changes for proper operation.
The part also supports a spread spectrum mode that sweeps between the set value and 20% higher than set frequency over a 5 KHz rate. This mode could be used to reduce emissions from the power supply.
This supply is not meant to be a reference for general MTQ or Socket Modem designs as generally users pick 3.3 or 5V and don't need to have high current capabilities on both voltages.
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
BOARD COMPONENTS
JP1 USB Connector Use the JP1 USB Connector to route the serial connection from the MTQ/MTSMC to either the USB or the DB9
To select USB for serial communication from the modem: Use the left side of the connector (3-30) with shunts to connect the modem to the USB transceiver.
To select the 9-pin serial connector: Use the right side of the connector (1-28).
Note: There are extra pins for RX and TX so you can swap these signal directions.
Default Jumper Positions By default, USB is selected with the following jumper positions installed:
DCD: 29-30 RI: 26-27 DSR: 23-24 CTS: 20-21 RTS: 17-18 Open RXD: 11-12 Open TXD: 5-6 DTR: 2-3
The 9-pin serial connector is selected with the following jumper positions installed: DCD: 28-29
RI: 25-26
DSR: 22-23
CTS: 19-20
RTS: 16-17
Open
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BOARD COMPONENTS
RXD: 10-11
Open
TXD: 4-5
DTR: 1-2
Configuring Headers Headers can be configured to act like a USB to serial converter for other devices. To do this, use jumper wires.
Connect pin 6 to pin 10 Connect pin 4 to pin 12
Additional Connector Information
Voltage Selection Connectors Three position headers are used to select incoming voltage for the MTQ (JP5) and the Socket Modem (JP6). They allow you to select 5V, 3.3V, or an external voltage (using Pin 2 of JP5 or JP6). These headers can also be used with the current monitor (U4) to measure the current consumed by the device. USB from MTQ On the UDK2.R1, there is one USB connection for all communications to the board. If you are working with an MTQ or MTQN, DO NOT use the USB connection to the device while it is connected to the developer board. Arduino Connectors The Arduino connectors are intended to allow the user to integrate sensors or other I/O to an MTQ or Socket Modem. Current Monitor You can use the current monitor (U4) to monitor current of any device connected to JP7 as long as the voltage and current are within its capabilities of +/-5A and less than 420V. The layout is not designed to have high voltage isolation so there may be issues with voltages over 75V.
To monitor the current used by an MTQ with a 5V input. Connect Pin 3 of JP5 to pin 1 of JP7 and Pin 2 of JP7 to pin 2 of JP5.
To approximate the current in Amps = (Analog Voltage from JP7 pin 3 3.3V / 2 ) / 0.264. For the actual value for your board, measure the voltage on JP7 pin 2 with no current.
LED Indicators
LED indicators are labeled on the board. STAT and COM LEDs are next to JP9. The rest of the LED indicators are next to the Arduino connectors. For more LED information, consult the schematics.
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
Chapter 3 Installation and Operation
Installing a SIM Card
Installing a SIM Card on a SocketModem
Note: When using the SocketModem with a developer board, mount the SocketModem on the developer board before installing the SIM card. To install the SIM Card:
With the contact side facing down, align the notched edge as outlined on the SocketModem and slide the SIM card completely into the SIM holder.
Installing a SIM Card on a DragonFly
Note: When using the Dragonfly with a developer board, install the SIM card before mounting the Dragonfly on the developer board. To install the SIM card:
With the contact side facing down, align the notched edge as shown on the Dragonfly's SIM holder and slide the SIM card completely into the SIM holder.
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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INSTALLATION AND OPERATION
Installing a SIM Card
Note: When using the DragonflyTM Nano with a developer board, install the SIM card before mounting the DragonflyTM Nano on the developer board. Note: All DragonflyTM Nano models require the use of a Micro SIM (3FF) card. To install the SIM card:
Refer to the image below on how to install the SIM card. Slide the SIM card completely into the SIM holder.
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
Installing a SocketModem on the Developer Board
To install a SocketModem: 1. Remove the screws from the developer board. 2. Align the SocketModem on the developer board as shown.
3. Secure the SocketModem with the screws you removed in Step 1.
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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INSTALLATION AND OPERATION
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Installing a Dragonfly on the Developer Board
To install a Dragonfly: 1. Remove the screws from the developer board. 2. Align the Dragonfly on the developer board as shown.
INSTALLATION AND OPERATION
3. Secure the Dragonfly with the screws you removed in Step 1.
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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INSTALLATION AND OPERATION
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
Installing a Dragonfly Nano on the Developer Board
To install a Dragonfly Nano: 1. Remove the screws from the developer board. 2. Align the Dragonfly Nano on the developer board as shown.
3. Secure the Dragonfly Nano with the screws you removed in Step 1.
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INSTALLATION AND OPERATION
Arduino Shield
Installing an Arduino Shield with a Dragonfly
Note: When using an Arduino Shield with a Dragonfly, install the SIM card in the Dragonfly and then install the Dragonfly on the developer board before installing the Arduino shield. To use an Arduino Shield with a Dragonfly
1. Disable the developer card's serial port. 2. Align the Arduino Shield on the developer board as shown. It will overlap the Dragonfly
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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INSTALLATION AND OPERATION
Dragonfly Arduino Pins
Signals (B01 & B02)
NC nReset, from pushbutton NC 5.0V Ground Ground NC
A0 (PC2) A1 (PC0) A2 (PC4) A3 (PB0) A4 (PC1) A5 (PC9)
Arduino Shield
NC VREF nRST 3.3V X9 5.0V GND GND VIN
A0 A1 A2 X7 A3 A4 A5
D15 D14 AVDD GND D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
Signals (STM32F411RE processor- B01 only) D15 (PB8) D14 (PB9) NC Ground D13 (PA5) X6 D12(PA6) D11 (PB5) D10 (PC8) D9 (PB13) D8 (PB1)
D7 (PA8) D6 (PA1) D5 (PA9) D4 (PA7) X8 D3 (PA0) D2 (PB15) D1 (PA2) D0 (PA3)
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
Dragonfly Nano Arduino Pins Signals (B01 & B02)
NC nReset, from pushbutton NC 5.0V Ground Ground NC
A0 (PC2) A1 (PC13) A2 (PC4) A3 (PE6) A4 (PA6) A5 (PG8)
Arduino Shield
NC VREF nRST 3.3V X9 5.0V GND GND VIN
A0 A1 A2 X7 A3 A4 A5
D15 D14 AVDD GND D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
Signals (STM32L471QG processor- B01 only)
D15 (PB8) D14 (PB9) NC Ground D13 (PG2) X6 D12(PG3) D11 (PB5) D10 (PC8) D9 (PB10) D8 (PB0)
D7 (PG7) D6 (PA1) D5 (PA9) D4 (PA7) X8 D3 (PA0) D2 (PB15) D1 (PA2) D0 (PA3)
Attaching Power Supply Blades
Power Supply and Blades
If your device shipped with a power supply, attach the blades for your region.
Power Supply no
blades
Power Supply with
EU blade
Power Supply with NAM blade
Power Supply with
UK blade
Power Supply with AU-NZ blade
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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INSTALLATION AND OPERATION
Attaching the Blades
To attach a power supply blade: 1. Remove the power supply cover (not shown). To do this, slide the lock down and hold it while you lift off the cover. 2. Insert the latch on the blade into the notch on the power supply. 3. Slide the lock down and hold it while you press the blade in place. Then, release it.
1 - Latch 2 - Notch 3 - Sliding lock
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
INSTALLATION AND OPERATION
SMA to U.FL Cables
The developer kit includes three 4.5" SMA to U.FL cables which are preinstalled on the developer board. Consult the mechanical drawings for your device to determine which antenna to connect to which U.FL connector on the device.
Connecting an Antenna through the Developer Board Connectors
To connect an antenna to the device through the developer board: 1. Determine which SMA connector you want to use for the antenna. 2. Finger tighten the antenna to the SMA connector. 3. Attach the U.FL connector from the cable to the connector on the device.
G = GPS (may not apply to your device) M = Main D = Diversity
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INSTALLATION AND OPERATION
26
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
DIAGRAMS AND SCHEMATICS
Chapter 4 Diagrams and Schematics
Assembly Diagram
J4
On JP1 for serial mode place 2 pin shunts (01058002L) across: DTR (2,3) TXD (5,6) RXD (11,12) RTS (17,18) CTS (20,21) DSR (23,24) RI (26,27) DCD (29,30)
On JP5,6 place 2 pin shunts (01058002L) across pins 2,3 for 5V For the MTQ and MTSMC
R61
R60
R56
R57
R62
R63
View from Top side (Scale 2:1)
JP8
JP4
R104 R102 R100 R99 C86 C92 R97 C87
MT3
TH3
TH4
C27
FB1
C28
R101
C88 R105
R94 R96 R103 C89
U9
C85
Y2
C91 C90 R98
J10 FID2
CR2
R88
R95
H4
R65
R66
LED2 LED1
CR1 R64 C70 C77 R67 R59 R55 R54
R73 R72
C71 C78
R92
JP9
U5
R50 R51 C73 C76 R71 C63 C64
R70 R68 C62 C75
Y1
Q3
R93 R91
C68 C66
C69
H1
U6
C74 C67 C65
R52 R53 R58 R69 R18 R19 R20 R21 C72
R15
U3 R16 R17
JP1
C21
FID1
TH5
TH2
MT2
S1
C22
R22
R14
R12
R13
U2
C17 C18 C19 C20
C26 C24 C25 J5
C32 C31
X4 C30 C29
R25
S2
JP7
H3 E1
U8
U7
C83
R82 C79
C84
C81
R26
C82
C80
R41
U4
C44 C45 C43
X1 C23
PCB1
R85 R84 R83 R79 R81 R86 R76 R75 R80 R78 R74 R77
LED6 LED3 LED7 LED9 LED4 LED5 LED14 LED10 LED8 LED11 LED12 LED13
J2
X5
X7
C60
C50
C61
C51
FB5 FB3
FB4
R27
C37
R28
C38
R29
C39
R30
C40
R31
C41
H2
R32
C42
X2
X3
X8
X6
R24 R23
FB2
R40 C49 R39 C48
C7
JP6
C11
JP5
C10
L2 L3
R9 R8 C6
R38 C47
C16
Q1
C12 R6
R11
R37 C46
R87
C8 R4 C15 C13
U1
R3 R2
R36 C36
Q2
R5 C9 C14 R7
R35 C35 R34
R89
R10 C5 C4
R90
C34
R33
C33
FID3 C1 C3
L1
R49
C52
R48
C53 R47
R1 C2
C54
R46
C55
R45
C56
R44
C57
R43
C58
R42
C59
J1
J3
TH1
MT1
TH6
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY, CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS, INC. THIS DRAWING SHALL NOT BE REPRODUCED, PUBLISHED, DISPLAYED, USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN CONSENT OF MULTI-TECH SYSTEMS, INC.
©2020 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
27
DIAGRAMS AND SCHEMATICS
Block Diagram
1 A
B
C
D 1
2
3
4
Socket Modem Dragonfly
SHUNTS
UART TRANSCEIVER EXAR USB TO UART External Header
LEDs
Arduino Header
USB HUB
mBed ST-Link JLink Header
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
2
3
4
5
6
J25 J26 ARE SCOPE PROBE GROUND
CONNECTIONS
J1
1
J2
1
GND GND
A
SMC/MTQ MOUNTING HOLES
GND GND GND GND
H1 01200207L H2 01200207L H3 01200207L H4 01200207L
DB9 CONNECTOR
USB CONNECTOR
GND
TH1 MT1 116PT-151 116NP-136
ANTENNA HOLDER MOUNTING HOLES
B
TH2
GND
MT2
116PT-151 116NP-136
ANTENNA HOLDER MOUNTING HOLES
GND
TH3 MT3 116PT-151 116NP-136
ANTENNA HOLDER MOUNTING HOLES
GenRad
C
TH4
TH5
TH6
128NP
128NP
128NP
FIDUCIAL FIDUCIAL FIDUCIAL E1 COMPANY_LOGO
PCB1 10000636LF
Build Level [No Variations]
D
Change No. 0
Size:
Document Number
Rev
B
387
F
Date: 2/11/2021
Sheet 1 of
8
5
6
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Schematics - Power
DIAGRAMS AND SCHEMATICS
1 A B C D
2
3
4
5
6
External Power
6 to 12V Input
PWR
PWR
VIN
Net Class
Net Class VIN_FILT
J3
i
i
A
50 V
33pF
3
2
1
4 L1 1
25 V
ZDX-POWER-CON
3
2
ZJYS-2
C1 .01uF
C2 .01uF 50 V
C3
i
Net Class R1 PWR 0
i
Net Class PWR
GND
GND
Regulator is good to 42VIN, caps are 25V or
B
better.
VIN_FILT
5V 4A out VDD5
PWR Net Class
i
C4 10uF 25V
R2
GND L2
100K 1uH
U1
4 5 11
VIN1 VIN1
EN1
24 BST1
14 22
23
PG1
SW1 SW1
VIN2 VIN2
EN2
7 8 12
BST2 18
BIAS PG2 SW2 SW2
26 15 19 20
R3 L3
VIN_FILT
100K 1uH
C5 10uF 25V
GND
3.3V 4A out PWR Net Class VDD3_3
i
C6 C7
R4 C8
LT8650S
C9
R5
C10 C11
47uF 47uF 1M 4.7pF
4.7pF
1M
47uF 47uF
10V 10V
50 V
50 V
10V 10V
R8
R6
15K
28
27 29
FB1 VC1
SS1
FB2 VC2
SS2
31
32 30
R7
15K
C15 .01uF 25 V
GND GND
191k
C12
C13 C14 R9 GND GND
5V RESISTORS: R4: 1M R8: 191K
220pF 50 V
17 13
CLKOUT TEMP
RT VCC
SYNC
1 25 16
C16 R10
25 V .01uF
220pF 324K
50 V
3.3V RESISTORS:
R5: 1M
R9: 324K
C
GND GND GND GND GND GND GND GND
VOUT = 0.8(1+R1/R2)
0
1uF 34.0K
VOUT = 0.8(1+R1/R2)
Vout = 4.988V nominal GND
6.3 V
Vout = 3.269V nominal
2 10 33 34 35 36 37 38
GND
GND
GND GND GND
R11
FSW = 1.05MHz
GND
GND GND GND
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
Build Level [No Variations]
D
Change No. 0
Size: B
Date:
Document Number 387
2/11/2021
Sheet 2
Rev F
of
8
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
29
DIAGRAMS AND SCHEMATICS
Schematics - RS-232
1
2
3
4
5
6
U2
J4
A
SERIAL_DTR SERIAL_TXD SERIAL_RTS
21 20
18
R10UT R1IN
R2OUT R2IN R3OUT R3IN
8 9
11
DTR TXD RTS
DCD
1
DSR
6
RXD RTS
2 7
11 GND
A
SERIAL_RXD SERIAL_CTS SERIAL_DSR SERIAL_DCD SERIAL_RI
24 23 22 19 17
T1IN T2IN T3IN T4IN T5IN
T1OUT T2OUT T3OUT T4OUT T5OUT
5 6 7 10 12
RXD CTS DSR DCD RI
TXD
3
CTS
8
DTR
4
RI
9
GND
5
10 GND
GND
C17 C19
.1uF 10 V .1uF 10 V
27 4
V+ V-
C1+ C1-
28 25
C18 .1uF 10 V
9-POS/D-SUB-F
VDD3_3 R12
10K
16 15
R1OUTB C2+ MBAUD C2-
1 3
C20 .1uF 10 V
(Default) USB Jumper
(Optional) DB9 Jumper
VDD3_3
26 2
VCC SHDN
GND
EN
14 13
R13 R14
10K 10K
VDD3_3
placement for JP1 DTR: 2-3
placement for JP1 DTR: 1-2
ICL3237E
GND
TXD: 5-6
TXD: 4-5
GND
Open
Open
RXD: 11-12
RXD: 10-11
Open
Open
RTS: 17-18
RTS: 16-17
CTS: 20-21
CTS: 19-20
USB UART
DSR: 23-24
DSR: 22-23
B
RI: 26-27
RI: 25-26
VDD3_3
VDD3_3
C21 .01uF 25 V
GND
B
DCD: 29-30
DCD: 28-29
U3
Please add this text in layout next to pins on JP1 DB9 USB
DTR TXD TXD RXD RXD RTS CTS DSR RI DCD
4, 6 D7 4, 6 D0
4, 6 D1
3, 4, 6 D3 4, 6 D6 4, 6 D5 4, 6 D8 4, 6 D4
SERIAL_DTR DTR
SERIAL_TXD TXD
SERIAL_TXD
SERIAL_RXD RXD
SERIAL_RXD
SERIAL_RTS RTS
SERIAL_CTS CTS
SERIAL_DSR DSR
SERIAL_RI RI
SERIAL_DCD DCD
JP1 1 2 4 5 7 8 10 11 13 14 16 17 19 20 22 23 25 26 28 29
3
EXAR_DTR
6
EXAR_TXD
9
12
EXAR_RXD
15
18
EXAR_RTS
21
EXAR_CTS
24
EXAR_DSR
27
EXAR_RI
30
EXAR_DCD
R15 R16
10K 10K
12 11
SCL SDA
USBD+ USBD-
15 14
USB_EXAR_D_P 7 USB_EXAR_D_N 7
2 LOWPOWER
R17 R18
EXAR_RI
8
EXAR_DSR
6
EXAR_DCD
7
EXAR_RTS
3
EXAR_CTS
4
EXAR_DTR
5
EXAR_TXD
9
EXAR_RXD 10
100K 100K
VDD3_3 VDD3_3
GPIO0/RI GPIO2/DSR GPIO1/CD GPIO5/RTS GPIO4/CTS GPIO3/DTR TX RX
VCC GND1 GND2 E_PAD
XR21V1410
VDD3_3
16 1 13 17
R19
100K VDD3_3
GND
R20
100K VDD3_3
R21
100K VDD3_3
C
30 PIN HDR
C
Reset Button
Wake Button
VDD3_3
4, 5, 6 NRST
R22 10K
S1
1
3
2
4
SW-SPST
GND
4 A1 3, 4, 6 D3
R23
33
VDD3_3
S2
R24
33
1
3
2
4
SW-SPST
R25
10K
USB Connector MTQ / MTSMC D-SUB Connector C22 .01uF 25 V
D 1
GND
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
2
3
4
GND
Build Level [No Variations]
D
Change No. 0
Size:
Document Number
Rev
B
387
F
Date: 2/11/2021
Sheet 3 of
8
5
6
30
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Schematics - Sockets
DIAGRAMS AND SCHEMATICS
1
2
3
4
5
6
MTQ connector
PWR Net Class
PWR Net Class
VDD3_3PCB Label JP4
Socket modem universal interface
X1
+ +
+ +
A
5 MBED_RX 5 JTAG_TMS
5 JTAG_TDO
3, 4, 5, 6 6
3, 6 3, 6 3, 6 3, 6
NRST LS
D0 D7 D5 D3
MBED_RX JTAG_TMS JTAG_TDO
NRST LS
D0 D7 D5 D3
GND
VCC_MTQ
GND D10 D12 D14 A5 D9 A2 A4
MTQ Socket
J5
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
40 1 39 2 38 3 37 4 36 5 35 6 34 7 33 8 32 9 31 10 30 11 29 12 28 13 27 14 26 15 25 16 24 17 23 18 22 19 21 20
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 PIN CON
MBED_TX JTAG_TCK
USB_MTQ_D_P USB_MTQ_D_N
i VCC_MTQ
330uF 6.3 V
10V
22uF
10 V
.1uF
33pF
MBED_TX 5 JTAG_TCK 5
C27
C26
C25
C24
GND
USB_MTQ_D_P 7 USB_MTQ_D_N 7
D1 D4
D1 D4
D8
D8
D6
D6
GND D11
D13
D15
D2 A0
D2
A3
A1
A1
GND 3, 6 3, 6 3, 6 3, 6
6
3
C28
330uF 6.3 V
FB1
i
120-OHM VDD5
1 3.3 2 3 5
3 PIN HDR JP5
1 2 3
3 PIN HDR
VDD_USB GND
Use JP198 to disable the SMC USB interface. Default jumper position is 1-2.
C23
.1uF 10 V
3, 4, 5, 6 NRST
7 USB_SOCKM_D_P 7 USB_SOCKM_D_N
NRST SMC_VUSB_DET
USB_SOCKM_D_P USB_SOCKM_D_N
1 2 3 4 5 6
SOC6
X3
D3
GND
1
D1
2 3
D0 D8
4
D5
5
D6
6
D4
D7
SOC6
GND
GND
X2
1 2 3 4 5 6 7 8 9
SOC9
X4
PWR
LS
Net Class
1 2
i FB2
120-OHM
3 4
5
SOCKET MODEM PINS X2 PIN 1 GOES TO PIN 24 X2 PIN 2 GOES TO PIN 25 X2 PIN 3 GOES TO PIN 26 X2 PIN 4 GOES TO PIN 27 X2 PIN 5 GOES TO PIN 28 X3 PIN 1 GOES TO PIN 48 X3 PIN 2 GOES TO PIN 49 X3 PIN 3 GOES TO PIN 50 X3 PIN 4 GOES TO PIN 51 X4 PIN 1 GOES TO PIN 33 X4 PIN 2 GOES TO PIN 34 X4 PIN 3 GOES TO PIN 35 X4 PIN 4 GOES TO PIN 36 X4 PIN 5 GOES TO PIN 37 X4 PIN 6 GOES TO PIN 38 X4 PIN 7 GOES TO PIN 39 X4 PIN 8 GOES TO PIN 40 X4 PIN 9 GOES TO PIN 41 X5 PIN 1 GOES TO PIN 58 X5 PIN 4 GOES TO PIN 61 X5 PIN 6 GOES TO PIN 63
A
33pF .1uF 10 V
6.3 V 6.3 V
R26
33 CUR_MON
PCB Label
PWR
GND
6
B
Arduino headers
D8
R33
33
D9
R34
33
D10
R35
33
D11
R36
33
D12
R37
33
D13
R38
33
C33 33pF C34 33pF C35 33pF C36 33pF
GND
X6
FUNCTION
1
D8/RI
2
D9
3
D10/SS
4
D11/MOSI
5
D12/MISO
6
D13/SCK
A0
R27
33
A1
R28
33
A2
R29
33
A3
R30
33
A4
R31
33
A5
R32
33
X5
FUNCTION
1
A0
2
A1
3
A2
4
A3
5
A4
6
A5
SOC6-SOCKET
3.3 5
JP6
1 2 3
3 PIN HDR
Net Class VDD3_3 i
VDD5
Place at X5 pin
JP5 & JP6 usage:
Jumper pins 1-2: Target voltage 3.3V
Jumper pins 2-3: Target voltage 5V
GND
C31 C32
C29 330uF
C30 330uF
SOC6
B
C43 1uF 10 V
C44 33pF C45 .1uF
10 V C37 33pF C38 33pF C39 33pF C40 33pF C41 33pF C42 33pF
GND
7
GND
GND
D14 D15
R39 R40
33
VDD3_3
33
8
AVDD
9
D14/SDA/SRDY
10
D15/SCL
SOC10-SOCKET
VDD3_3
X7
FUNCTION
1
NC
VDD3_3
C46 33pF C47 33pF C48 33pF C49 33pF
C
D0
R42
33
D1
R43
33
D2
R44
33
D3
R45
33
D4
R46
33
D5
R47
33
D6
R48
33
D7
R49
33
GND
X8
1 2 3 4 5 6 7 8
FUNCTION D0/RXD D1/TXD D2 D3/RTS D4/DCD D5/DSR D6/CTS D7/DTR
GND VDD5
3, 4, 5, 6 NRST
FB3 120-OHM
NRST
2
Vref
3
nRST
4
VDD3V3
5
VDD5V0
6
GND
7
GND
8
VIN
SOC8-SOCKET
GND
C50 33pF C51 .1uF
10 V
Bypass for Arduino supply
Isolated to 420V
PCB Label
+ JP7
-
1 2
OUT
3
+/-5A capable 264mV/A
CUR_MON
PWR Net Class
i
i
U4 1 IP+
VCC 8
2 IP+0
VIOUT 7
3 IP- BEL_SEL 6
1.5K
R41 CUR_MON
C
3 PIN HDR
Net Class PWR
4 IP-0
GND 5
ACS722LLCTR-05AB
GND
SOC8-SOCKET
DNP
FB4
GND GND
FB5
VIN
120-OHM
120-OHM
VDD5
VIN is determined by barrel Jack
Always 5V
C60 33pF C61 .1uF
10 V
C52 33pF C53 33pF C54 33pF C55 33pF C56 33pF C57 33pF C58 33pF C59 33pF
GND
D 1
GND GND
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
2
3
4
Build Level [No Variations]
D
Change No. 0
Size:
Document Number
Rev
B
387
F
Date: 2/11/2021
Sheet 4 of
8
5
6
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
31
DIAGRAMS AND SCHEMATICS
Schematics - ST Link
1
2
3
4
5
6
mBed programming interface controller
VDD3_3
JP8
R50
A
4.7K
VDD3_3
1
2
3
4
A
AIN_1
VDD5 VDD_STLNK
5
6
8
9
10
R51
9 PIN HDR
4.7K
JLink Header
R52
Pin 7 is used for Keying
U5
2.7K
R53
GND
B
4 MBED_RX 4 MBED_TX
R54 R55
0 0
GND MBED_TCK
JP9
1 2 3 4
4 PIN HDR
VDD_STLNK SWDIO 4
VDD_STLNK
5
SWCLK 6
GND
JP92 is used to program U6
HSP061-2 3
2
1 CR1
LED_STLINK MBED_TDO
7 USB_STLINK_D_N 7 USB_STLINK_D_P
GND
7 USB_RENUMn
GND
R69
100K
VDD_STLNK
10 11 12 13 14 15 16 17 29 30 31 32 33 34 37 38
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PA8 PA9 PA10 PA11 PA12 PA13 PA14 PA15
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PB8 PB9 PB10 PB11 PB12 PB13 PB14 PB15
18 19 20 39 40 41 42 43 45 46 21 22 25 26 27 28
44 7
BOOT0 NRST
PC13
PC14-OSC32_IN PC15-OSC32_OUT
2 3
4
PD0-OSC_IN PD1-OSC_OUT
5 6
MBED_RST
GND
0 DNP
VDD_STLNK
R58 4.7K
R59 1.5K
DNP
GND
MBED_TMS R64
100
MBED_TCK T_SWDIO_IN
R67 0
DNP
R68 R70
10K 10K
GND
GND
C62 15pF
GND GND
MBED_TMS MBED_TCK MBED_TDO
mbed is default
R56
0
R60
0
R62
0
MBED_RST
R65
0
Not Placed
R57
0 JL_SWDIO_TMS
R61
0 JL_SWCLK_TCK
R63
0 JL_SWO_TDO
R66
0 JL_NRST
B
JTAG_TMS 4 JTAG_TCK 4 JTAG_TDO 4
4
3
R71 100K
C64 .1uF 10 V
8 23 35 47
VSSA VSS_1 VSS_2 VSS_3
STM32F103CBT6
GND
VDD_STLNK
VBAT 1
VDDA VDD_1 VDD_2 VDD_3
9 24 36 48
VDD_STLNK GND
VDD_STLNK
C63 15pF
1
2
Y1 8MHz
GND
NRST
3, 4, 6
Power supply for U6 VDD5
U6
1
VIN OUT GND
2 3
PWR Net Class
i
VDD_STLNK
1uF 6.3 V 33pF
C65 33pF
1uF 10 V .1uF 10 V
GND
AP7313-3.3V
C
LED_STLINK
R72
100
LED1
RED
COM
GND
3.3V Fixed output
C
150mA capacity
C69 .1uF 10 V
C68 C66
C67 C74
C70 33pF C71 33pF C72 33pF C73 33pF C75 .1uF
10 V C76 .1uF
10 V C77 .1uF
10 V C78 .1uF
10 V
R73
100
LED2
GRN
STAT
VDD_STLNK
GND
GND
GND
D 1
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
2
3
4
Build Level [No Variations]
D
Change No. 0
Size:
Document Number
Rev
B
387
F
Date: 2/11/2021
Sheet 5 of
8
5
6
32
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
Schematics - LEDs
DIAGRAMS AND SCHEMATICS
1 A
B
C
D 1
2
3
4
3, 4 D7 3, 4 D4 3, 4 D3 3, 4 D8 3, 4 D6 3, 4 D0 3, 4 D5 3, 4 D1
4 LS 3, 4, 5 NRST
4 D2
VDD3_3 14 1
U7A 2 R74
GND
7
100
74LCX14MTC
U7B
3
4 R75
100
74LCX14MTC
U7F
13
12 R76
100
74LCX14MTC
U7E
11
10 R77
100
74LCX14MTC
U7D
9
8 R78
100
74LCX14MTC
VDD3_3 14
U8A
1
2 R79
GND
7
100
74LCX14MTC
U7C
5
6 R80
100
74LCX14MTC
U8C
5
6 R81
100
R82 47K
VDD3_3 74LCX14MTC U8B
3
4 R83
100
74LCX14MTC
U8D
9
8 R84
100
VDD3_3
74LCX14MTC
U8E
11
10 R85
100
74LCX14MTC
U8F
13
12 R86
100
74LCX14MTC
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
CONSENT OF MULTI-TECH SYSTEMS,INC. ©2021 MULTI-TECH SYSTEMS, INC. ALL RIGHTS RESERVED
Title
UDK2.0
2
3
4
5
VDD3_3
GRN LED3
GND
GRN LED4
GND GND
GRN LED5
GND
C79 33pF C80 10uF
6.3 V C81 .01uF
25 V
6 A
GRN LED6
GND
GRN LED7
GND
VDD3_3
B
GRN LED8
GND
C82 10uF 6.3 V
C83 .01uF 25 V
C84 33pF
GRN LED9
GND
GND
GRN LED10
GND
GRN LED11
GND
C
GRN LED12
GND
GRN
LED13 VDD3_3
GRN LED14
GND
Build Level [No Variations]
D
Change No. 0
Size:
Document Number
Rev
B
387
F
Date: 2/11/2021
Sheet 6 of
8
5
6
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
33
DIAGRAMS AND SCHEMATICS
Schematics - USB
1
2
3
4
5
6
USB connector
VDD_USB
J10
A
VCC DATA-
DATA+
ID GND
1 2 3 4 5
SHIELD1 SHIELD2
SHIELD3 SHIELD4
6 7 8 9
5-PIN-USB
USB_CON_D_N
USB_CON_D_P
R88
100K
DIFF90 4
VDD_USB
5
DIFF90 6
HSP061-2 3
2
1 CR2
USB_D_N
GND USB_D_P
GND
DIFF90 DIFF90
VDD_USB
PWR Net Class
i
R87
0
VDD5
A
S G
D D G S
VIN_FILT
Q1 NTR410P
R89
100
This circuit prevents power supply contention
and gives priority to the barrel input power jack because it is able to supply more current. Add R117 to bypass.
Q2 NTR410P
R90 10K
Note that USB will not power the 3.3V items
and therefore can only run the socket modem or MTQ at 5V.
GND
B
USB hub
VDD_USB
B
VDD3_3
C85 .1uF 10 V
GND
VDD_STLNK R91
C86 .1uF
10K
VDD_USB
10 V
C87 .1uF 10 V
Q3 2N3904
R92
100 USB_RENUMn 5
C88 .1uF
R93
R94
10 V
33K
47K
C89 .1uF
10 V
R95
U9
MTQ
1.5K
30 31
FLEX_USB_DM FLEX_USB_DP
SWAP_USBDN1_DM/PRT_DIS_M1 SWAP_USBDN1_DP/PRT_DIS_P1
1 2
DIFF90 DIFF90
USB_MTQ_D_N 4 USB_MTQ_D_P 4
GND
R96 100K
27 VBUS_DET
PRTPWR1/PRTCTL1/BC_EN1 OSC1_N
12 13
R97
10K VDD3_3
SOCKET MODEM
GND
GND
VDD3_3
R98
12K
26 11
35
RESET_N
LED0 RBIAS
USBDN2_DM/PRT_DIS_M2 USBDN2_DP/PRT_DIS_P2
3 4
PRTPWR2/PRTCTL2/BC_EN2 OSC2_N
16 17
R99
10K VDD3_3
DIFF90 DIFF90
USB_SOCKM_D_N 4 USB_SOCKM_D_P 4
C
GND
C90 18pF
33 32
XTAL1/REFCLK XTAL2
USBDN3_DM/PRT_DIS_M3/NC2 USBDN3_DP/PRT_DIS_P3/NC3
6 7
DIFF90 DIFF90
EXAR USB UART
USB_EXAR_D_N 3 USB_EXAR_D_P 3
C
GND
Y2 24MHz
2
1
5 34
NC0 NC1
PRTPWR3/PRTCTL3/BC_EN3/NC4 UART_RX/OSC3_N
18 19
R100
10K VDD3_3
STLINK
GND
GND
C91
18pF
GND
4
3
VDD3_3
VDD3_3 C92 1uF
10 V
10 29 36
VDD33A0 VDD33A1
VDD33A2
15 23
VDD33_0 VDD33_1
14 37
VDDCR12 GND_PAD
USBDN4_DM/PRT_DIS_M4/NC5 USBDN4_DP/PRT_DIS_P4/NC6
8 9
PRTPWR4/PRTCTL4/BC_EN4/NC7 UART_TX/OSC4_N
20 21
SDA/SMBDATA/NON_REM1 SUSP_INDLOCAL_PWR/NON_REM0
SCL/SMBCLK/CFG_SEL0 HS_IND/CFG_SEL1
22 28
24 25
R101
R102 R103 R104 R105
10K
100K 100K 100K 100K
VDD3_3 GND
DIFF90 DIFF90
USB_STLINK_D_N 5 USB_STLINK_D_P 5
USB2534i-1080EN
D 1
-NOTICETHIS DRAWING REPRESENTS PROPRIETARY,CONFIDENTIAL AND TRADE SECRET INFORMATION OF AND IS OWNED EXCLUSIVELY BY MULTI-TECH SYSTEMS,INC. THIS DRAWING SHALL NOT BE REPRODUCEDED,PUBLISHED, DISPLAYED,USED DISTRIBUTED OR MODIFIED WITHOUT THE PRIOR WRITTEN
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Title
UDK2.0
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Build Level [No Variations]
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Change No. 0
Size:
Document Number
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B
387
F
Date: 2/11/2021
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
DESIGN CONSIDERATIONS
Chapter 5 Design Considerations
Noise Suppression Design
Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment.
Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes.
PC Board Layout Guideline
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.
The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device vertically in place during the wave solder process.
Electromagnetic Interference
The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels.
Keep traces carrying high frequency signals as short as possible. Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. Decouple power from ground with decoupling capacitors as close to the device's power pins as possible. Eliminate ground loops, which are unexpected current return paths to the power source and ground. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification. Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines.
Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide
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DESIGN CONSIDERATIONS
Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. Locate cables and connectors to avoid coupling from high frequency circuits. Lay out the highest frequency signal traces next to the ground grid. If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. Minimize the number of through-hole connections on traces carrying high frequency signals. Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point.
Electrostatic Discharge Control
Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.
See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) a document "for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment." This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing.
MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling.
MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers.
USB Design
MultiTech recommends that you review Intel's High Speed USB Platform Design Guidelines for information about USB signal routing, impedance, and layer stacking. Also:
Shield USB cables with twisted pairs (especially those containing D+/D-). Use a single 5V power supply for USB devices. See Power Draw for current (ampere) requirements. Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance for the USB pair and to maintain a 20 mil space from the USB pair and all other signals. If power is provided externally, use a common ground between the carrier board and the device.
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Universal Developer Kit 2.0 MTUDK2-ST-CELL.R1 Developer Guide