User Manual for Shanghai Chipfresh Internet Of Things Technology models including: X-C13SG, XC13SG, 2A3M5-X-C13SG, 2A3M5XC13SG, X-C13SG, Wi-Fi 802.11b g n and BLE5.0 Wireless Standards, BLE5.0 Wireless Standards
Shanghai ChipFresh Internet of Things Technology Co. , Ltd. X-C13SG 2A3M5-X-C13SG 2A3M5XC13SG x c13sg
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DocumentDocumentX-C13SG 802.11bgn and BLE SoC X-C13SG User manual Based on RISCV SOC Support Wi-Fi (802.11b/g/n) and BLE5.0 Wireless Standards Shanghai ChipFresh Internet of Things Technology Co., Ltd www.chipfresh.com 1 1 Module Overview 1.1 Features MCU · TG7100C embedded,32-bit RISC-V single-core processor · 160 MHz CPU · 276 KB RAM · 128 KB ROM · 1 Kb eFuse Wi-Fi · IEEE 802.11 b/g/n-compliant · Operation Frequency 2412-2462MHz802.11b/g/n ht20 · Supports 20 MHz bandwidth in 2.4 GHz band · Transmit PowerMax 22dBm · Modulation methodDSSSOFDM · Security MechanismsWEP/WPA-PSK/WPA2- PSK/WPA3-SAE · EncryptionWEP64/WEP128/TKIP/AES · Support Wi-Fi STA/AP Mode · Support UART Data Communication with Wi-Fi or BLE · Support APLink and BLELINK Config · Support Wireless and Remote Firmware Upgrade Function · Support Software SDK for Develop · Support PCB X-C13SG 802.11bgn and BLE SoC · Support PCB /IPEX Antenna Option BLE · Operation Frequency 2402-2480MHz · Transmit Power10.30 dBm(BLE) · Receiver Sensitivity-97 dBm · Advertising extensions Hardware · Peripherals: GPIOSPIUARTADC DACIRLED PWM · Support XTAL 24/32/38.4/40MHz · 2MB SPI flash · Operating voltage/Power supply2.7 ~ 3.6 V · Operating ambient temperature: Operating Temp: -40 ~ 85°C Storage Temp: -40 ~ 105 °C Humidity/MSL: <85% / Level 3 · Operating Current: Peak (1ms for every 100ms): <350mA Average (STA, No data): 45mA Average (STA, Continuous TX): 60mA Average (AP): 70mA Standby: 310uA(Reset Pin set to low) · SizeFigure 3 Shanghai ChipFresh Internet of Things Technology Co., Ltd 2 1.2 Description X-C13SG 802.11bgn and BLE SoC X-C13SG is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi and BLE baseband/MAC designs, which provide a wireless interface to any equipment with a serial or other interface for data transfer. X-C13SG integrate MAC, base band processor, RF transceiver in hardware and all Wi-Fi protocol and configuration functionality and networking stack, embedded firmware to make a fully self-contained solution for a variety of applications. 1.3 Applications Light control Smart plug Industrial control Industrial sensors and controls Health Care Consumer Electronics Smart Agriculture Retail and Catering Shanghai ChipFresh Internet of Things Technology Co., Ltd 3 CONTENTS X-C13SG 802.11bgn and BLE SoC 1 MODULE OVERVIEW....................................................................................................................................... 2 1.1 FEATURES..................................................................................................................................................... 2 1.2 DESCRIPTION................................................................................................................................................3 1.3 APPLICATIONS.............................................................................................................................................. 3 CONTENTS.......................................................................................................................................................... 4 LIST OF FIGURES................................................................................................................................................. 5 LIST OF TABLES................................................................................................................................................... 5 HISTORY..............................................................................................................................................................7 2 HARDWARE INTRODUCTION.......................................................................................................................... 7 2.1 PIN LAYOUT..................................................................................................................................................7 2.2 PIN DESCRIPTION......................................................................................................................................... 7 2.3 PHYSICAL DIMENSIONS..............................................................................................................................8 2.4 ON-BOARD CHIP ANTENNA....................................................................................................................... 9 2.5 ORDERING INFORMATION.........................................................................................................................9 3 ELECTRICAL CHARACTERISTICS..................................................................................................................... 10 3.1 ABSOLUTE MAXIMUM RATINGS................................................................................................................10 3.2 RECOMMENDED OPERATING CONDITIONS.............................................................................................. 10 3.3 ESD..............................................................................................................................................................10 3.4 WIFI/BLE RF STANDARDS...........................................................................................................................10 4 PRODUCT HANDLING.................................................................................................................................... 12 4.1 REFLOW PROFILE....................................................................................................................................... 12 4.2 STORAGE CONDITIONS.............................................................................................................................. 12 4.3 DEVICE HANDLING INSTRUCTION (MODULE IC SMT PREPARATION).......................................................12 5 CONTACT INFORMATION..............................................................................................................................13 Shanghai ChipFresh Internet of Things Technology Co., Ltd 4 LIST OF FIGURES X-C13SG 802.11bgn and BLE SoC FIGURE 1. X-C13SG PIN LAYOUT (TOP VIEW).................................................................................................7 FIGURE 2. X-C13SG PHYSICAL DIMENSIONS.................................................................................................8 FIGURE 3. SUGGESTED MODULE PLACEMENT REGION.................................................................................. 9 FIGURE 4. ORDERING INFORMATION..............................................................................................................9 FIGURE 5. REFLOW PROFILE............................................................................................................................. 11 Shanghai ChipFresh Internet of Things Technology Co., Ltd 5 LIST OF TABLES X-C13SG 802.11bgn and BLE SoC TABLE1. PINS DEFINITION..................................................................................................................................7 TABLE2. ABSOLUTE MAXIMUM RATINGS........................................................................................................10 TABLE3. RECOMMENDED OPERATING CONDITIONS......................................................................................10 TABLE4. ESD..................................................................................................................................................... 10 TABLE5. RF STANDARDS...................................................................................................................................11 Shanghai ChipFresh Internet of Things Technology Co., Ltd 6 2 Hardware Introduction X-C13SG 802.11bgn and BLE SoC 2.1 Pin Layout X-C13SG comes with a on-board PCB antenna, please refer to Figure 2. Figure 2. 2.2 Pin Description X-C13SG Pin Layout (Top View) The module has 23 pins. See pin definitions in Table 1. Pin Describtion Type 1,8,14,16,23 Ground P 2 GPIO8 IPD 3 RESET I,PU UART1_RX 4 GPIO11 I Function GND Internal 10K pull-down resistor, Boot select: Low: boot from module flash. High: boot from external UART. This is used for factory firmware program, leave it unconnected for user application "Low" effective reset input. 3.3V TTL UART1 Debug Input SPI, PWM 5 GPIO14 IPU/O SPI, DAC, ADC 6 UART0_RX I GPIO7 3.3V TTL UART0 Communication Input 7 UART0_TX O,PU 3.3V TTL UART0 Communication Output GPIO16 9 GPIO12 I/O SPI, PWM. ADC 10 GPIO1 IPU/O SPI,PWM Shanghai ChipFresh Internet of Things Technology Co., Ltd 7 X-C13SG 802.11bgn and BLE SoC 11 GPIO3 IPU press this button ( "Low" > 4s ) and loose to make Factory the module recover to factory setting. 12 GPIO4 O "0" Boot-up OK; Ready "1" Boot-up Fail; GPIO5 "0" Wi-Fi connect to router 13 Link IPU/O "1" Wi-Fi unconncted; 15 +3.3V P The maximum output current of the external power supply is recommended to be above 500mA. 17 GPIO22 IPU/O SPI,PWM 18 GPIO0 IPU/O SPI,PWM 19 GPIO2 I/O SPI,PWM 20 GPIO21 IPU/O SPI,PWM 21 GPIO20 IPU/O SPI,PWM 22 UART1_TX O GPIO17 3.3V TTL UART1 Debug Output Table1. Pins Definition 2.3 Physical Dimensions X-C13SG Physical Dimensions (Unit: mm),please refer to Figure 4: Figure 3. X-C13SG Physical Dimensions Shanghai ChipFresh Internet of Things Technology Co., Ltd 8 X-C13SG 802.11bgn and BLE SoC 2.4 PCB Antenna X-C13SG support internal PCB antenna option. When customer select internal antenna, you shall comply with following antenna design rules and module location suggestions: For customer PCB, module antenna area can't put componet or paste GND net;(See the following red arrow area) Antenna must away from metal or high components at least 20mm; Antenna can't be shieldedby any meal enclosure; All cover, include plastic, shall away from antenna at least 20mm; suggest module better locate in following region at customer board, which to reduce the effect to antenna and wireless signal, and better consult ChipFresh technical people when you structure your module placement and PCB layout. Figure 4. Suggested Module Placement Region 2.5 Ordering Information Figure 5. Ordering Information Shanghai ChipFresh Internet of Things Technology Co., Ltd 9 3 Electrical Characteristics X-C13SG 802.11bgn and BLE SoC 3.1 Absolute Maximum Ratings Parameter Power supply voltage I/O PIN Storage temperature Symbol Min VDD -0.3 - -0.3 - -40 Max Unit 3.6 V VDD+0.3 V 125 Table2. Absolute Maximum Ratings 3.2 Recommended Operating Conditions Parameter Symbol Min Type Max Unit Power supply voltage VDD 2.1 3.3 3.6 V Operating ambient temperature - -40 - 85 Table3. Recommended Operating Conditions 3.3 ESD Name ESD-HBM ESD-MM ESD-CDM Description Human body model class 2 Moisture sensitivity level Charge device model Table4. ESD 3.4 WiFi/BLE RF Standards Typ Unit +/- 2000 V 2 - +/-500 V Class Wi-Fi BLE Item Wireless standard Frequency range Maximum Peak Output Power (Conducted): Wireless standard Frequency range Maximum Peak Output Power (Conducted): Parameters 802.11 b/g/n 2412MHz-2462MHz 802.11b/g/n Bluetooth 5 2402MHz-2480MHz - Typ - 21.51 dBm 10.30 dBm Shanghai ChipFresh Internet of Things Technology Co., Ltd 10 4 Product Handling 4.1 Reflow Profile Solder the module in a single reflow. X-C13SG 802.11bgn and BLE SoC 250 217 200 Preheating zone 150 ~ 200 60 ~ 120 s Ramp-up zone 1 ~ 3 /s 100 Peak Temp. 235 ~ 250 Reflow zone >217 60 ~ 90s Cooling zone 1 ~ 5 /s Soldering time > 30 s 50 25 0 0 50 100 150 200 Time (sec.) 250 Ramp-up zone -- Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s Preheating zone -- Temp.: 150 ~ 200 Time: 60 ~ 120 s Reflow zone -- Temp.: >217 7LPH: 60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s Cooling zone -- Peak Temp. ~ 180 Ramp-down rate: 1 ~ 5 /s Solder -- Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 7. Reflow Profile Shanghai ChipFresh Internet of Things Technology Co., Ltd 11 X-C13SG 802.11bgn and BLE SoC 5.2 Storage Conditions Shelf life in sealed bag: 12 months, at <30 and <60% relative humidity (RH). Recommend to store at 10% RH with vacuum packing. The module is rated at the moisture sensitivity level (MSL) of 3. 5.3 Device Handling Instruction (Module IC SMT Preparation) Baked required with 24 hours at 125+-5 before rework process. After bag is opened, devices that will be re-baked required after last baked with window time 168 hours. Recommend to oven bake with N2 supplied Recommend end to reflow oven with N2 supplied If SMT process needs twice reflow: (1) Top side SMT and reflow (2) Bottom side SMT and reflow Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168 hours window time, no need to bake within 168 hours Case 2: Wifi module mounted on bottom side, follow normal bake rule before process Note: Window time means from last bake end to next reflow start that has 168 hours space. Shanghai ChipFresh Internet of Things Technology Co., Ltd 12 7 Contact Information X-C13SG 802.11bgn and BLE SoC Address: Room 1315, #2 Building, No.268 Zhouzhu Road, Pudong District, Shanghai,China Web: www.chipfresh.com Sales Contact: sales@chipfresh.com <END> This document contains information that is proprietary to Shanghai ChipFresh Inc. Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. Shanghai ChipFresh Internet of Things Technology Co., Ltd 13 FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation. OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 2.7 ~ 3.6 V DC. The operational ambient temperature of the module is -40 to 85 degree C. Only the embedded PCB antenna is allowed. Any other external antenna is prohibited. 3.Limited module procedures N/A 4.Trace antenna design N/A 5.RF exposure considerations The equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment can operated with minimum distance 20cm between the radiator and your body. 6. Antenna Antenna type :PCB Antenna; Antenna Max. Peak Gain 2 dBi 7. Label and compliance information An exterior label on OEM's end product can use wording such as the following: "Contains FCC ID:2A3M5-X-C13SG " 8. Information on test modes and additional testing requirements a)The modular transmitter has been fully tested by the module grantee on the required number of channels,modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter,perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. c)If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected .