STP0177C-128160 Series TFT LCD Panel User Manual
Model No.: STP0177C-128160
Manufacturer: SHENZHEN SURENOO TECHNOLOGY CO.,LTD. (深圳市襄诺科技有限公司)
Product Overview
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A 1.77-inch TFT LCD panel with a resolution of 128x160 pixels, featuring the ST7735S driver and a 10-pin SPI interface. The panel displays an image of the Statue of Liberty.
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1. General Description
Item | Details |
---|---|
MODEL NO | STP0177C-128160 |
Display Mode | Transmissive |
Display Format | Graphic 128RGB*160 Dot-matrix (128xRGBx160) |
Input Data | SPI-4wire interface |
Viewing Direction | 12 o'clock |
Drive | ST7735S |
2. Mechanical Specification
Item | Specifications | Unit |
---|---|---|
Dimensional outline | 33.30(W)*42.94(H)*2.30+/-0.1(T) (FPC not include) | mm |
Resolution | 128RGB*160 | dots |
LCD Active area | 28.03 (W)*35.04 (H) | mm |
Pixel size | 0.219(W)*0.219(H) | mm |
3. Mechanical Dimension
A technical drawing illustrating the physical dimensions of the STP0177C-128160 TFT LCD panel. It shows the overall outline, active display area, pixel dimensions, and the location of the FPC connector. The drawing also includes a table detailing the pin assignments for the 10-pin connector: 1. LED-K (Backlight Negative), 2. LED-A (Backlight Positive, 3.3V), 3. VCC (System Voltage, 2.8V), 4. TE (Synchronous Data), 5. CS (Chip Select, active low), 6. RESET (Reset Signal), 7. DC (Data/Command, output), 8. SCL (Serial Clock), 9. SDA (Serial Data, input), 10. GND (Ground).
Display mode: normal white.
Viewing direction: 12 o'clock
Driver IC: ST7735S
Operating temperature: -20 to 70 °C.
Storage temperature: -30 to 80 °C.
RoHS compliance.
Backlight circuit schematic: 15mA*2, 3.2V DC.
4. Electrical Maximum Ratings
Item | Symbol | Min | Max | Unit | Note |
---|---|---|---|---|---|
Supply voltage (IOVCC) | V | 1.65 | 3.3 | V | 1.8 |
Supply voltage (VCC) | V | 2.5 | 3.5 | V | 2.8 |
Operating temperature | TOPR | -20 | 70 | °C | |
Storage temperature | TSTR | -30 | 80 | °C |
5. Backlight Characteristic
Item | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
LED module Forward voltage | VLED | 3.0 | 3.3 | 3.4 | V |
LED module current | ILED | - | 30 | - | mA |
LCD Surface Luminance | Ls | 150 | 200 | - | Cd/m² |
LCM Surface brightness uniform | LD | 80 | - | - | % |
Backlight circuit schematic showing LEDs (LED1, LED2), resistors (R3, R2, R1), and a transistor (Q1, S8050), powered by 3.3V, with a backlight control signal (BL_CTR).
6. Module Function Description
Pin | Symbol | Description |
---|---|---|
1 | LED-K | Backlight Negative |
2 | LED-A | Backlight Positive (3.3V) |
3 | VCC | System Voltage (2.8V) |
4 | TE | Synchronous Data |
5 | CS | Chip Select, active low |
6 | RESET | Reset Signal |
7 | DC | Data/Command Output |
8 | SCL | Serial Clock |
9 | SDA | Serial Data Input |
10 | GND | Ground |
7. TFT-LCD Module Characteristics
Type | Symbol | Condition | Min | Typical | Max | Unit |
---|---|---|---|---|---|---|
TFT-LCD Module Characteristics | VCC | -- | 2.5 | 2.8 | 3.5 | V |
IOVCC | -- | 1.65 | 1.8 | 3.3 | V | |
Logic Level | VIH | IOVCC=1.8-3.3V | 0.8* VIOVCC | -- | IOVCC | V |
VIL | VSSI | -- | 0.2* VIOVCC | V | ||
Operating Current | IDD | VCC=2.8V | -- | TBD | -- | mA |
8. Backlight Characteristics
Type | Symbol | Condition | Min | Typical | Max | Unit |
---|---|---|---|---|---|---|
Current | IF | VF=3.2V | -- | 30 | 40 | mA |
Forward Voltage | VF | -- | 3.0 | -- | 3.4 | V |
Luminance | Lv | IF=15mA | -- | -- | -- | Cd/m² |
Uniformity | ΔΒρ | -- | 80 | -- | -- | % |
9. Response Time & Contrast Ratio
Item | Symbol | Condition | Min | Typical | Max | Unit |
---|---|---|---|---|---|---|
Response time | Tr+Tf | θ=0° | - | 30 | 60 | ms |
Contrast ratio | CR | θ=0° | 200 | 300 | - |
Graph illustrating the signal transition for response time, showing changes between 'White' and 'Black' states, with rise time (Tr) and fall time (Tf) indicated.
Contrast ratio (CR) formula: CR = Brightness on the "white" state / Brightness on the "black" state
10. Viewing Angle
Item | Symbol | Condition | Min | Typical | Max | Unit |
---|---|---|---|---|---|---|
Viewing angle | Top (12 o'clock direction) | CR≥10 | 20 | 30 | - | Deg. |
Bottom (6 o'clock direction) | CR≥10 | 40 | 45 | - | ||
Left (9 o'clock direction) | CR≥10 | 40 | 45 | - | ||
Right (3 o'clock direction) | CR≥10 | 40 | 45 | - |
Diagram showing the LCD panel with viewing directions (12, 3, 6, 9 o'clock) and an eye symbol representing the viewer's perspective. Angle θ illustrates deviation from the perpendicular line of sight.
NOTE: The viewing angle directions (3, 6, 9, 12 o'clock) refer to the angle between the line of sight and the perpendicular to the screen surface.
11. Reliability Trial
NO. | ITEM | CONDITION | CRITERION |
---|---|---|---|
1 | High Temperature Non-Operating Test (高温存储实验) | 80°C*120Hrs | No Defect Of Operational Function In Room Temperature Are Allowable (室温运行功能无缺陷) |
2 | Low Temperature Non-Operating Test (低温存储实验) | -30°C*120Hrs | Allowable |
3 | High Temperature/Humidity Non Operating Test (高温高湿实验) | 60°C*90%RH*120Hrs | Allowable |
4 | High Temperature Operating Test (高温工作实验) | 70°C *72Hrs | Allowable |
5 | Low Temperature Operating Test (低温工作实验) | -20°C *72Hrs | Allowable |
6 | Thermal Shock Test (热冲实验) | -20 °C (30Min) ↔ 70 ℃ (30Min) *10CYCLES | Allowable |
12. Inspection Standards
12.1 Glass Defect
NO. | Defect item | Criteria | Remark |
---|---|---|---|
1 | Dimension Unconformity (Major defect) | By Engineering Drawing | |
2 | Cracks (Major defect) | 1. Linear cracks panel 2. Nonlinear crack contrast by limited sample |
【Reject】 |
3 | Glass extrude the conductive area (minor defect) | a: disregards and no influence assemblage. 1) b≤1/3Pin width(non bonding area) 2)bonding area≤0.5mm |
a: Length, b: Width 【Accept】 |
4 | Pin-side,conductive area damaged (minor defect) | (a c: disregards) b≤1/3of effective length for bonding electrode |
a: length, b: Width, c: Thickness 【Accept】 |
5 | Pin-side,non-conductive area damaged (minor defect) | 1)Damage area don't touch the ITO (Including contraposition mark, except scribing mark) | a: Length, b: Width c: Thickness 【Accept】 |
6 | Non-pin-side damage (minor defect) | 1)b exceeds 1/3Bm c b not touch the seal glue |
c: Thickness b: width of damage 【Reject】 【Reject】 |
Diagrams illustrating glass defects: Cracks (major), Glass extrude conductive area (minor), Pin-side conductive area damaged (minor), Pin-side non-conductive area damaged (minor), and Non-pin-side damage (minor), with specific criteria for acceptance or rejection based on dimensions and location.
12.2 LCD Appearance Defect (View Area)
NO. | Defect item | Specification | Allowable | Remark |
---|---|---|---|---|
1 | Fiber, glass scratch/folded (minor defect) | W≤0.03mm 0.03mm<W≤0.05mm; L≤3.0mm 0.05mm<W≤0.1mm; L≤3.0mm W>0.1mm;L>3.0mm |
disregard 2 1 0 |
note1: L: Length, W: Width note2: disregard if out of AA |
2 | Polarizer bubble, concave and convex (minor defect) | ≤0.2mm 0.2mm< ≤0.3mm 0.3mm< ≤0.5mm 0.5mm< Φ |
disregard 2 1 0 |
note1: Φ = (L+W)/2, L:Length, W: Width note2:disregard if out of AA |
3 | Black dots, dirty dots, impurities, eye winker (minor defect) | ≤0.15mm 0.15mm<≤0.25mm 0.25mm<≤0.3mm 0.3mm< Φ |
disregard 2 1 0 |
note2:disregard if out of AA |
4 | Polarizer prick (minor defect) | Φ≤0.1mm 0.1mm<¢ ≤0.25mm Φ >0.25mm |
disregard 3 0 |
note1: Φ = (L+W)/2, L=Length, W=Width note2:the distance between two dots>5mm |
Diagrams illustrating LCD appearance defects: Fiber/glass scratch/folded (minor), Polarizer bubble/concave/convex (minor), Black dots/dirty dots/impurities/eye winker (minor), and Polarizer prick (minor), with specifications and allowable limits.
13. Package Method
An illustration showing the packaging process for the LCD modules. It depicts steps involving an empty tray, BPE (Biaxially-oriented Polyethylene Terephthalate) material, EPE (Expanded Polyethylene) foam, placing modules into trays, putting trays into a carton, and sealing the carton with tape.