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Instruction Manual for FN-LINK models including: FG6223ASRC-01, RTL8723CS-CG, FG6223ASRC Wi-Fi Single Band BLE4.1 SDIO UART Combo Module, FG6223ASRC, Wi-Fi Single Band BLE4.1 SDIO UART Combo Module, Single Band BLE4.1 SDIO UART Combo Module, BLE4.1 SDIO UART Combo Module, SDIO UART Combo Module, UART Combo Module, Combo Module, Module
FN-LINK TECHNOLOGY LIMITED FG6223ASRC 2AATL-FG6223ASRC 2AATLFG6223ASRC fg6223asrc
File Info : application/pdf, 24 Pages, 1.66MB
DocumentDocumentPRODUCT SPECIFICATION FG6223ASRC Wi-Fi Single-band 1x1 + BLE 4.1 SDIO/UART Combo Module Version:v1.0 Customer: Customer P/N: Signature: Date: Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 Website:www.fn-link.com FN-LINK TECHNOLOGY LIMITED 1 FG6223ASRC Module Datasheet Ordering Information Part NO. Description FG6223ASRC-01 RTL8723CS-CG, b/g/n, 2.4GWi-Fi+BLE4.1, 1T1R, 12X12mm, SDIO +Uart,dcdc,Unshielded cover Target power: 2.4G: 17/15/15 FN-LINK TECHNOLOGY LIMITED 2 FG6223ASRC CONTENTS 1. General Description .................................................................................................. 5 1.1 Introduction ............................................................................................................ 5 1.2 Description .............................................................................................................5 2. Features ..................................................................................................................... 6 3. General Specification ................................................................................................7 3.1 WI-FI Specification .................................................................................................7 3.2 Bluetooth Specification .......................................................................................... 9 4. ID setting information ............................................................................................... 9 5. Pin Definition ........................................................................................................... 10 5.1 Pin Outline ........................................................................................................... 10 5.2 Pin Definition details .............................................................................................11 6. Electrical Specifications ......................................................................................... 12 6.1 Power Supply DC Characteristics ........................................................................12 6.2 Power Consumption .............................................................................................13 6.3 SDIO Power-on sequence ................................................................................... 13 7. Size reference .......................................................................................................... 14 7.1 Module Picture .....................................................................................................14 7.2 Marking Description ............................................................................................. 15 7.3 Layout Recommendation ..................................................................................... 16 8. The Key Material List ...............................................................................................16 9 . Recommended Reflow Profile ..............................................................................18 10. RoHS compliance .................................................................................................. 18 11. Package .................................................................................................................19 11.1 Reel ................................................................................................................... 19 11.2 Carrier Tape Detail .............................................................................................19 11.3 Packaging Detail ................................................................................................ 20 12. Moisture sensitivity ............................................................................................ 21 FN-LINK TECHNOLOGY LIMITED 3 Revision History Version Date Contents of Revision Change V1.0 2024/07/18 New version FG6223ASRC Draft Checked Approved LXP LXY QJP FN-LINK TECHNOLOGY LIMITED 4 FG6223ASRC 1. General Description 1.1 Introduction FG6223ASRC is a highly integrated 802.11b/g/n 1T1R WLAN, integrated Bluetooth 2.1/3.0/4.0/4.1single chip. It combines a WLAN MAC, a 1T1R capable WLAN baseband, BT Protocol Stack (LM, LL,and LE), BT Baseband, modem, and WLAN/BT RF in a single chip. FG6223ASRC provides a complete solution for a high throughput performance integrated wireless LAN,and Bluetooth controller. FG6223ASRC WLAN baseband implements Orthogonal Frequency Division Multiplexing (OFDM) with 1 transmit and 1receive path and is compatible with the 802.11n specification. Features include one spatial stream transmission, short guard interval (GI) of 400ns, spatial spreading, and transmission over 20MHz and 40MHz bandwidth. 1.2 Description Model Name Product Description Dimension Wi-Fi Interface BT Interface OS supported Operating temperature Storage temperature FG6223ASRC Support Wi-Fi/BLE functionalities L x W x H: 12 x 12 x 1.8 mm Support SDIO V2.0 UART / PCM Android /Linux/ Windows 0°C to 70°C -55°C to 125°C FN-LINK TECHNOLOGY LIMITED 5 2. Features General 802.11b/g/n 1T1R WLAN and Bluetooth single chip FG6223ASRC PHY Features 802.11n OFDM One Transmit and one Receive path (1T1R) 20MHz and 40MHz bandwidth transmission Short Guard Interval (400ns) DSSS with DBPSK and DQPSK, CCK modulation with long and short preamble Host Interface Complies with SDIO 1.1/2.0 for WLAN with clock rate up to 50MHz(SDR25) GSPI interface forconfigurable endian for WLAN Complies with HS-UART with configurable baud rate for Bluetooth Bluetooth Features Supports Bluetooth 4.0/4.1 Low Energy(BLE) Supports multiple Low Energy states FN-LINK TECHNOLOGY LIMITED 6 3. General Specification 3.1 WI-FI Specification Feature Description WLAN Standard IEEE 802.11 b/g/n Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHzCh1 ~ Ch13 Test Items Typical Value 802.11b /11Mbps : 17dBm ± 1.5 dB Output Power 802.11g /54Mbps : 15dBm ± 1.5 dB 802.11n /MCS7 : 15dBm ± 1.5 dB Spectrum Mask Meet with IEEE standard Freq. Tolerance ±20ppm SISO Receive Sensitivity - 1Mbps PER @ -91 dBm (11b,20MHz) @8% PER - 2Mbps PER @ -89 dBm FG6223ASRC EVM EVM -10dB EVM -25dB EVM -28dB -83 -80 FN-LINK TECHNOLOGY LIMITED 7 SISO Receive Sensitivity (11g,20MHz) @10% PER SISO Receive Sensitivity (11n,20MHz) @10% PER SISO Receive Sensitivity (11n,40MHz) @10% PER Maximum Input Level - 5.5Mbps PER @ -86 dBm - 11Mbps PER @ -84 dBm - 6Mbps PER @ -87 dBm - 9Mbps PER @ -86 dBm - 12Mbps PER @ -84 dBm - 18Mbps PER @ -82 dBm - 24Mbps PER @ -79 dBm - 36Mbps PER @ -75 dBm - 48Mbps PER @ -71 dBm - 54Mbps PER @ -70 dBm - MCS=0 PER @ -87 dBm - MCS=1 PER @ -84 dBm - MCS=2 PER @ -82 dBm - MCS=3 PER @ -79 dBm - MCS=4 PER @ -75 dBm - MCS=5 PER @ -71 dBm - MCS=6 PER @ -70 dBm - MCS=7 PER @ -69 dBm - MCS=0, PER @ -84 dBm - MCS=1, PER @ -81 dBm - MCS=2, PER @ -79 dBm - MCS=3, PER @ -76 dBm - MCS=4, PER @ -72 dBm - MCS=5, PER @ -68 dBm - MCS=6, PER @ -67 dBm - MCS=7, PER @ -66 dBm 802.11b : -8 dBm 802.11g/n : -20 dBm FG6223ASRC -79 -76 -85 -84 -82 -80 -77 -73 -69 -68 -85 -82 -80 -77 -73 -69 -68 -67 -82 -79 -77 -74 -70 -66 -65 -64 FN-LINK TECHNOLOGY LIMITED 8 3.2 Bluetooth Specification Feature General Specification Bluetooth Standard Host Interface Antenna Reference Frequency Band Number of Channels Modulation RF Specification Output Power (Class 1) Sensitivity @ BLE=30.8% for GFSK (1LE) Maximum Input Level FG6223ASRC Description BLE UART Small antennas with 0~2 dBi peak gain 2400 MHz ~ 2483.5 MHz 39 channels GFSK Min(dBm) 1 Typical(dBm) 5 -89 GFSK (1Mbps):-20dBm Max(dBm) 9 Bluetooth power is determined by customer driver and does not undergo power calibration. 4. ID setting information WI-FI Vendor ID TBD Product ID TBD FN-LINK TECHNOLOGY LIMITED 9 5. Pin Definition 5.1 Pin Outline < TOP VIEW > FG6223ASRC FN-LINK TECHNOLOGY LIMITED 10 5.2 Pin Definition details FG6223ASRC NO. Name 1 GND 2 WL_BT_ANT 3 GND 4 NC 5 NC 6 GPIO_12 7 GPIO_14 8 NC 9 VBAT_IN 10 NC 11 NC 12 GPIO_9 13 GPIO_8 14 SD_D2 15 SD_D3 16 SD_CMD 17 SD_CLK 18 SD_D0 19 SD_D1 20 GND 21 NC 22 VDDIO 23 NC 24 UART_RTS 25 PCM_OUT 26 PCM_CLK Type I/O I O P - I O I/O I/O I/O I I/O I/O P I O I/O Description Voltage Ground connections RF I/O port Ground connections Floating (NC) Floating (NC) Host to wake up device Shared with GPlO14 This pin is shared with either WiFi or BT functions to wake up the host when the remote wake function is enabled. The polaritycan be defined by the customer. This Wakeup pin can be configured as shared wake up pin by both WL and BT when any of WL and BT function issue the wake signal to the host. Floating (NC) VDDIO VDDIO 3.3±10% V Main power voltage source input 3.3V Floating (NC) Floating (NC) Pull high: ON , Pull low: OFF External pull low can disable WL When BT DISn is also deasserted,will enter the 3.3V whole chip reset state. General Purpose Input/Output Pin VDDIO SDIO data line 2 SDIO data line 3 SDIO command line SDIO clock line SDIO data line 0 SDIO data line 1 Ground connections Floating(NC) I/O Voltage supply input VDDIO Floating (NC) UART RTS, module side is Ground connections PCM Output during power up don't pull high this pin VDDIO PCM Clock VDDIO FN-LINK TECHNOLOGY LIMITED 11 FG6223ASRC 27 PCM_IN I PCM Input 28 PCM_SYNC O PCM Sync 29 NC Floating (NC) 30 MAIN_XTAL_IN O Floating (NC) 31 GND - Ground connections 32 NC - Floating (NC) 33 GND - Ground connections Pull high: ON , Pull low: OFF 34 GPIO_11 External pull low can disable BT I When WL DISn is also deasserted,will enter the whole chip reset state. 35 CHIP_EN Chip Enable default pull high. 36 GND - Ground connections 37 NC - Floating (NC) 38 NC - Floating (NC) 39 NC - Floating (NC) 40 NC - Floating (NC) 41 GND GND 42 UART_OUT O UART Output 43 UART_IN I UART Input 44 UART_CTS I UART CTS 45 NC - Floating (NC) 46 NC - Floating (NC) 47 NC - Floating (NC) P:POWER I:INPUT O:OUTPUT VDDIO:3.3V VDDIO VDDIO 3.3V VDDIO VDDIO VDDIO 6. Electrical Specifications 6.1 Power Supply DC Characteristics The digital IO supports VDD33 or VDD18 application. MIN Operating Temperature 0 VCC33 3.0 VDDIO 1.62 TYP 25 3.3 1.8 or 3.3 MAX 70 3.6 3.6 Unit deg.C V V FN-LINK TECHNOLOGY LIMITED 12 FG6223ASRC 6.2 Power Consumption Power Consumption (Typical by using SWR) Wi-Fi only: TX b mode 20MHz: 335 mA (max) RX b mode 20MHz: 80 mA (max) TX n mode 40MHz: 133 mA (max) RX n mode 40MHz: 53 mA (max) TX n mode 20MHz: 137 mA (max) RX n mode 20MHz: 47 mA (max) BT: TX: 101.8 mA (max) RX: 75.8 mA (max) IDEL: 50.5 mA (max) 6.3 SDIO Power-on sequence After power-on, the SDIO interface is selected by the RTL8723DS automatically when a valid SDIO command is received. To attain better SDIO host compatibility, the following power-on sequence is recommended. After main 3.3V ramp up and 1.8V ramp up, the power management unit is enabled by the power ready detection circuit. The power management unit enables the SDIO block. eFUSE is then autoloaded to SDIO circuits during the Tnon_rdy duration. After CMD5/5/3/7 procedures, card detection is executed. When the driver has loaded, normal CMD52 and CMD53 are used. FN-LINK TECHNOLOGY LIMITED 13 7. Size reference 7.1 Module Picture L x W : 12 x 12 (±0.2) mm FG6223ASRC H: 1.8mm Weight 0.42g FN-LINK TECHNOLOGY LIMITED 14 7.2 Marking Description < TOP VIEW > FG6223ASRC FN-LINK TECHNOLOGY LIMITED 15 7.3 Layout Recommendation FG6223ASRC 8. The Key Material List Item 1 2 3 Part Name Chipset PCB Crystal Description RTL8723CS-CG QFN40 5X5mm FG6223ASRC 12X12mm 4L 2016 24MHz 12pF 10ppm 4 Inductor 2016 2.2uH ,±20% Manufacturer Realtek ZLSLXY TST,HOSONIC,TKD,ECEC,JWT Microgate,sunlord,cenke,ceaiya,INP AQ,Scientic FN-LINK TECHNOLOGY LIMITED 16 9. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <260°C Number of Times : 2 times FG6223ASRC 10. RoHS compliance All hardware components are fully compliant with EU RoHS directive FN-LINK TECHNOLOGY LIMITED 18 11. Package 11.1 Reel A roll of 1500pcs FG6223ASRC 11.2 Carrier Tape Detail FN-LINK TECHNOLOGY LIMITED 19 11.3 Packaging Detail the take-up package FG6223ASRC Using self-adhesive tape Size of black tape: 24mm*32.6m Color of plastic disc: blue the cover tape :21.3mm*32.6m NY bag size:450mm*415mm size 350*350*35mm The packing case size:360*210*370mm FN-LINK TECHNOLOGY LIMITED 20 FG6223ASRC 12. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH) b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5 c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition d) "IPC/JEDEC J-STD-033A paragraph 5.2" is respected e) Baking is required if conditions b) or c) are not respected f) Baking is required if the humidity indicator inside the bag indicates 10% RH or more FN-LINK TECHNOLOGY LIMITED 21 FG6223ASRC Caution: Use the Product in the environment with the temperature Between 0 and 70; Otherwise, it may damage your product. Products can only be used below 2000m altitude For the following equipment: Product Name: Combo Module Brand Name: / Model No.: FG6223ASRC FN-LINK TECHNOLOGY LIMITED E-mail: jim@fn-link.com hereby declares that this [Name: Combo Module, Model: FG6223ASRC] is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the internet address: www.xxx.com This product is intended for sale and application in a business environment. RED Article 10 2 -This product can be used across EU member states RED Article 10 10 -The product is class 1 product, No restrictions The RF distance between body and product is 20cm Frequency Range: Technical Characteristics Bluetooth Bluetooth Version: Bluetooth V4.1(BLE Mode) Frequency Range: 2402MHz-2480MHz Max.RF Output Power: 7.32dBm (EIRP) Wi-Fi(2.4GHz) Support Standards: 802.11b, 802.11g, 802.11n-HT20/40 Frequency Range: 2412-2472MHz for 802.11b/g/n(HT20) 2422-2462MHz for 802.11n(HT40) Max.RF Output Power: 17.24dBm (EIRP) FN-LINK TECHNOLOGY LIMITED 22 2.2 List of applicable FCC rules FCC Part 15.247 FG6223ASRC 2.3 Specific operational use conditions This product is a Single-modular transmitter policy independent of any host. Not applicable. 2.4 Limited module procedures This product is a Single-modular transmitter. It is not a limited module. Not applicable. 2.5 Trace antenna designs This product has a external antennas. Not applicable. 2.6 RF exposure considerations This equipment complies with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and any part of your body. 2.7 Antennas This product has two external antennas. The antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. No. Antenna Type Frequency Range Gain Impedance 1 FPC Antenna 2402-2480MHz 2412-2462MHz 3.39dBi 50ohm 2.8 Label and compliance information FCC ID label on the final system must be labeled with "Contains FCC ID: 2AATL-FG6223ASRC" or "Contains transmitter module FCC ID: 2AATL-FG6223ASRC". 2.9 Information on test modes and additional testing requirements Contact FN-LINK TECHNOLOGY LIMITED will provide stand-alone modular transmitter test mode. Additional testing and certification may be necessary when multiple modules are used in a host. 2.10 Additional testing, Part 15 Subpart B disclaimer To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For FN-LINK TECHNOLOGY LIMITED 23 FG6223ASRC example, if a host was previously authorized as an unintentional radiator under the Supplier's Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details of how the module is integrated with the host, FN-LINK TECHNOLOGY LIMITED shall provide guidance to the host manufacturer for compliance with the Part 15B requirements. FCC Warning This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE 1: Any changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. Note 1: This module certified that complies with RF exposure requirement under mobile or fixed condition, this module is to be installed only in mobile or fixed applications. A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily re-located, such as wireless devices associated with a personal computer, are considered to be mobile devices if they meet the 20 centimeter separation requirement. A fixed device is defined as a device is physically secured at one location and is not able to be easily moved to another location. FN-LINK TECHNOLOGY LIMITED 24 FG6223ASRC Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited to OEM installation only and must not be sold to end-users, end-user has no manual instructions to remove or install the device, only software or operating procedure shall be placed in the end-user operating manual of final products. Note 3: The module may be operated only with the antenna with which it is authorized. Any antenna that is of the same type and of equal or less directional gain as an antenna that is authorized with the intentional radiator may be marketed with, and used with, that intentional radiator. Note 4: For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. Note 5: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro vide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a pa rticular installation. If this equipment does cause harmful interference to radio or televisi on reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -- Reorient or relocate the receiving antenna. -- Increase the separation between the equipment and receiver. -- Connect the equipment into an outlet on a circuit different from that to which the rec eiver is connected. -- Consult the dealer or an experienced radio/TV technician for help. FN-LINK TECHNOLOGY LIMITED 25