FANSTEL LR62C Lora Transceiver Module User Guide

User Guide for FANSTEL models including: LR62C Lora Transceiver Module, LR62C, Lora Transceiver Module, Transceiver Module, Module

2

Users Manual

Fanstel Corporation, Taipei LR62E1 LoRa transceiver Module X8WLR62E1 X8WLR62E1 lr62e1

File Info : application/pdf, 28 Pages, 1.67MB

GetApplicationAttachment.html?id=7074719

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

LoRa Sensor, Beacon Applications
LR62E1 and LR62C LoRa transceiver module uses a Semtech SX1262 sub-GHz radio transceiver. A chip antenna or an u.FL connector is on-board for external antenna. In this document, LR62E1 or LR62C is referred as LR62C. It is paired with Fanstel BT840F, a Nordic nRF52840 BLE 5.3 module. The Cortex M4F MCU in BT840F manages LR62C through SPI interface. BT840F GPIOs can be used for sensor data input or control output. Android OS app is available for field set up through Bluetooth interface.

BT840F + LR62C pair can be used in LoRaWANTM application. LoRaWan stacks are not available from Fanstel.

Cloud Connection, LoRa Gateway

BT840F Specifications:

The 2nd application example is in a gateway for connecting to a cloud server(AWS, Microsoft, Google, Fanstel development server, etc.) through Ethernet, WiFi, or LTE network.

· Nordic nRF52 with ARM Cortex M4F at 64 MHz. · Over-the-Air (OTA) firmware update · Flash/RAM: 1024KB/256KB

BLE 5.3 module manages LR62C through SPI

· 34 GPIOs

interface.
LR62E1 Specifications:

· 12 bit/200KSPS ADC, 8 configurable channels with programmable gain.

· Semtech SX1262 transceiver.

· 3X SPI Master/Slave (8Mbps)

· Size:10.2x15mm

· 3X 4-channel pulse width modulator (PWM)

· Uses a TCXO instead of the crystal in LR62E for better frequency stability.
LR62C Specifications:
· Semtech SX1262 transceiver with a chip antenna.
· Uses a TCXO resonator.
· Size: 10 x ?? mm.
M262E840F/M262C840F Combo:

· 2X 2-wire Master/Slave (I2C compatible) · UART (with CTS/RTS and DMA) · 128-bit AES HW encryption · 5 x 32 bits, 3 x 24 bits Real Time Counters (RTC) · Available NFC-A tag interface for OOB pairing · Size: 30x42 mm for M.2 connector, B-key

· Combo modules for M.2 connector, B key. · M262E840F: LR62E1, BT840F combo. · M262C840F: LR62C, BT840F combo.

· Operation temperature: - 4 0 ° C t o + 8 5 ° C
Evaluation Board
· EV-LN60G for LR62E1 or LR62C combo with BT840F( M.2 module not included).

Model Summaries
module
BLE module/Flash/RAM
Size
GPIO Antenna LoRa/BLE
LoRa max. TX power, conducted/radiated
BLE max. TX power, conducted/radiated Certifications
Availability

LR62E1
10.2x15.0mm
u.FL

LR62C Chip

M262E840F
BT840F/1MB/512KB 30x42mm, M.2, B key
34 u.FL/PCB
+8.5 dBm/+8.8 dBm

M262C840F
BT840F/1MB/512KB 30x42mm, M.2, B key
34 Chip/PCB
+8.5 dBm/+8.8 dBm

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

Table Of Contents
1. Introduction .......................................................................................................................................................3 2. Product Overview .............................................................................................................................................4
Semtech SX1262 ..............................................................................................................................................4 LR62E1 .............................................................................................................................................................5 LR62C ............................................................................................................................................................... 5 M262C840F ......................................................................................................................................................6 M262E840F ......................................................................................................................................................6 Mechanical Drawings ........................................................................................................................................ 7 LR62E1 and LR62C Pin Functions ................................................................................................................... 8 M262840F/M262X840XE Pin Functions ......................................................................................................... 10 3. Transmission Power Settings .........................................................................................................................13 4. Evaluation Boards...........................................................................................................................................14 Evaluation Board EV-LN60G .......................................................................................................................... 14 Loading Firmware into Evaluation Board Through a Nordic DK ..................................................................... 15 Nordic Development Environment .................................................................................................................. 15
Download and set up Basic Software tools for EV-LN60G..........................................................................16
Evaluation Board EV-LN60G Schematics.......................................................................................................17 Battery Power Application ............................................................................................................................... 19 5. Miscellaneous .................................................................................................................................................20 Soldering Temperature-Time Profile for Re-Flow Soldering ........................................................................... 20 Cautions, Design Notes, and Installation Notes..............................................................................................20 Packaging .......................................................................................................................................................23 FCC Label.......................................................................................................................................................23 6. Revision History..............................................................................................................................................24 7. Contact Us ......................................................................................................................................................25

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

1. Introduction
LR62C LoRa module with Semtech SX1262 transceiver are ideal for long range wireless applications. It can be paired with BT840F BLE module in LoRa sensor or beacon design. A smart phone can set up sensor or beacon easily through Bluetooth interface.
BT840F is powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic nRF52840 SoCs. With an ARM CortexTM M4F MCU, 1024KB flash, 256KB RAM, embedded 2.4GHz multiprotocol transceiver, and an integrated antenna, it allows faster time to market with reduced development cost.
The second application example is in a gateway for connecting to cloud server. A LoRa sensor or beacon can be connected to a cloud server through Ethernet, WiFi, or LTE network.
It is possible to port LoRaWANTM stacks to Nordic nRF52 BLE SoCs. LoRaWANTM stacks are not available from Fanstel.

LR62E1, LR62C LoRa Modules
2. Product Overview
Semtech SX1262
Semtech SX1262 data sheets can be downloaded from this webpage. https://www.fanstel.com/wirelessdocument

Ver 0.9, Dec. 2023

A block diagram is below.

LR62E1, LR62C LoRa Modules
LR62E1
· A LoRa module with Semtech SX1262, 915 MHz. · Uses a TCXO instead of a crystal for improved frequency stability. · An u.FL connector for external antenna. · 10 castellated pins. · Size: 10.2x15mm.
LR62C
· A LoRa module with Semtech SX1262, 915 MHz. · Uses a TCXO instead of a crystal for improved frequency stability. · A chip antenna is integrated. · 10 castellated pins. · Size: 10.2x ??mm.

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LR62E1, LR62C LoRa Modules
M262C840F
· BT840F with + 8.5dBm TX power, an integrated PCB antenna. · LR62C with a chip antenna. · Size: 30x42mm · For M.2 connector, 67 pins, B key.
M262E840F
· BT840F with + 8.5dBm TX power, an integrated PCB antenna. · LR62E1 with dBm TX power, an u.FL connector for external
antenna. · Size: 30x42mm · For M.2 connector, 67 pins, B key.

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LR62E1, LR62C LoRa Modules
Mechanical Drawings
The followings are mechanical drawings of LR62E1 and LR62C, top view.

Ver 0.9, Dec. 2023

Library components for PADS and EAGLE can be downloaded from http://www.fanstel.com/download-document/

For other PCB layout tools, please download evaluation board Gerber files and extract library component.

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

LR62E1 and LR62C Pin Functions
The followings are LR62C pin assignment. Pin functions are in a table below. Please refer to Semtech SX1262 Product Specifications for detailed descriptions and features supported. It can be downloaded from:
https://www.fanstel.com/wirelessdocument

LR62C pin# pin name
1 ANT-SW 2 SX-NRESET 3 BUSY 4 DIO1 5 VDD 6 SCK 7 MOSI 8 MISO 9 NSS 10 GND 11 5V 12 GND

SX1262 pin# Descriptions
Antenna switch 15 Reset signal, active low 14 Busy indicator 13 Multiple purpose Digital IO
1 DC input voltage, 1.8V to 3.7V 18 SPI clock 17 SPI Slave input 16 SPI Slave Output 19 SPI Slave Select 20 Ground
Power amplifier 5V regulated DC power input Power amplifier ground

LR62E1, LR62C LoRa Modules

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LR62E1, LR62C LoRa Modules

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M262840F/M262X840XE Pin Functions

M.2 nRF52840 BT840F M262X840F

pin#

Name

BLE-VDDH

VDD-3V3

Descriptions
DC input for 3.3V regulator; 3.2V to 15V. 4.35V minimum if connected to USB-VBUS externally.
High voltage input for nRF52840/nRF5340, 2.5V to 5.5V
DC input for 3.3V regulator; 3.2V to 15V. 4.35V minimum if connected to USB-VBUS externally.
Regulated 3.3V DC input, 800 mA minimum

AD2 F6

USB-VBUS

USB power supply, 4.35V to 5.5V.

VDD-3V3

Regulated 3.3V DC input, 800 mA minimum

AD6 E4

USB DP

USB data pin

BLE-SWDCLK

Serial Wire Debug clock input for BLE

AD4 E5

USB DN

USB data pin

AC24 16

BLE-SWDIO

Serial Wire Debug data for BLE

GND

Ground

GND

Ground

P011

BLE GPIO

GND

Ground

AD22 12

P100

BLE GPIO

AD8 13

P013

BLE GPIO

P012

BLE GPIO

Y23

P101

BLE_UART RXD

P109

BLE GPIO

AC13 14

P018/RESET

Reset for BT40F, Reset or P018 for BT840F

AC17 E2

P021

BLE GPIO

AC9 D4

P014

BLE GPIO

AC19 D1

P023

BLE GPIO

AC11 D3

P016

BLE-OTA

AD20 C1

P024

BLE GPIO

AC15 D2

P019

BLE GPIO

W24 C5

P102

BLE_UART-TXD

LR62E1, LR62C LoRa Modules

AD10 C4

AD18 C2

AD12 C3

AD16 E1

AC21 B1

A10

B11

J24

L24

B13

A12

P015 P022 P017 P008 P020 P006 P031 P108 P030 P007 P025 P005
P004
P029
P028
P026
P027
P010
P009
P003
P002

BLE GPIO BLE GPIO BLE GPIO BLE GPIO BLE GPIO BLE GPIO BLE GPIO, analog input BLE GPIO BLE GPIO, analog input BLE GPIO BLE GPIO BLE GPIO, analog input No Connect BLE GPIO, analog input No Connect BLE GPIO, analog input No Connect BLE GPIO, analog input No Connect BLE_I2C, SDA No Connect BLE_I2C, SCL No Connect BLE_GPIO, NFC2 No Connect BLE_GPIO, NFC1 No Connect BLE_GPIO, AIN1 No Connect BLE_GPIO, AIN 0 No Connect No Connect No Connect No Connect No Connect No Connect No Connect No Connect No Connect
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LR62E1, LR62C LoRa Modules

No Connect

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LR62E1, LR62C LoRa Modules
3. Transmission Power Settings
The conditions for LR62E to transmit at +20.3 dBm: · Regulated 5V, 1.5 Amp DC power to the 5V pin. · Regulated 3.3V DC power to the VDD pin. · Set SX1262 TX power to +22 dBm.

Ver 0.9, Dec. 2023

LR62E1, LR62C LoRa Modules 4. Evaluation Boards

Ver 0.9, Dec. 2023

Evaluation Board EV-LN60G
EV-LN60G can be used to evaluate LR62E1 or LR62C with a Nordic nRF52840 module, BT840F. An EVLN60G includes the following:

· An EV board without an M.2 module. · A 10-pins flat cable. · An USB cable Additional hardware required but not included in EV-LN60G. · M262E840F (LR62E1 + BT840F) module and a LoRa antenna ANT025 or ANT025P (IP67). Or, · M262C840F (LR62C + BT840F) module and a LoRa antenna ANT025 or ANT025P (IP67).

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

Loading Firmware into Evaluation Board Through a Nordic DK
To program BT840F BLE module.
· Connect Nordic nRF52840DK debug out to Fanstel evaluation board debug in using the 10-pin flat cable as

shown below. · Connect Nordic nRF52DK to PC. · Connect a DC power source to micro or mini USB port of evaluation board.
Nordic Development Environment
Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52 Series devices. nRF52DK or nRF52840DK board is recommended for firmware development. Document and Software development tools can be downloaded by the following links.
Get started with Nordic chip and all online documents. http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/development/nrf52 _dev_kit.html&cp=1_1
Nordic SDK with many example projects. https://developer.nordicsemi.com/nRF5_SDK/
Nordic development zone. https://devzone.nordicsemi.com/tutorials/b/getting-started/posts/development-with-gcc-and-eclipse
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LR62E1, LR62C LoRa Modules

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Download and set up Basic Software tools for EV-LN60G
nRF command line tool 10.2.1 or newer. https://www.nordicsemi.com/Software-and-Tools/Development-Tools/nRF-Command-Line-Tools/Download
nRF Connect desktop 3.2.0 or newer. https://www.nordicsemi.com/Software-and-Tools/Development-Tools/nRF-Connect-for-desktop

LR62E1, LR62C LoRa Modules
Evaluation LN60G

Ver 0.9, Dec. 2023
Board EVSchematics

LR62E1, LR62C LoRa Modules

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LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

Battery Power Application
Two inductors required for DCDC converter are inside BT840F module. You can enable DCDC to lower power consumption.
The 32.768 kHz sleep crystal and load capacitors are on the M.2 module.

LR62E1, LR62C LoRa Modules

Ver 0.9, Dec. 2023

5. Miscellaneous
Soldering Temperature-Time Profile for Re-Flow Soldering
Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight.

Cautions, Design Notes, and Installation Notes
Failure to follow the guidelines set forth in this document may result in degrading of the product's functions and damage to the product.
Design Notes
(1) Follow the conditions written in this specification, especially the control signals of this module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
(5) Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
(7) this product away from other high frequency circuits.
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Notes on Antenna and PCB Layout
(1) Don't use a module with internal antenna inside a metal case.
(2) For PCB layout:
· Avoid running any signal line below module whenever possible, · No ground plane below antenna, · If possible, cut-off the portion of main board PCB below antenna.
Installation Notes
(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets. Set up the temperature at the soldering portion of this product according to this reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application note.
Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this product.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.
(7) These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information and communication equipment.
Storage Notes
(1)The module should not be stressed mechanically during storage.

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(2)Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected:
· Storage in salty air or in an environment with a high concentration of corrosive gas.
· Storage in direct sunlight
· Storage in an environment where the temperature may be outside the range specified.
· Storage of the products for more than one year after the date of delivery storage period. (3) Keep this product away from water, poisonous gas and corrosive gas. (4) This product should not be stressed or shocked when transported. (5) Follow the specification when stacking packed crates (max. 10).
Safety Conditions
These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum. (1)Ensure the safety of the whole system by installing a protection circuit and a protection device. (2)Ensure the safety of the whole system by installing a redundant circuit or another system to
prevent a dual fault causing an unsafe status.
Other Cautions (1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if
reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. (2)Do not use the products for other purposes than those listed. (3)Be sure to provide an appropriate failsafe function on your product to prevent an additional damage that may be caused by the abnormal function or the failure of the product. (4)This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. (5)These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner.
· In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash.
· In direct sunlight, outdoors, or in a dusty environment
· In an environment where condensation occurs.
· In an environment with a high concentration of harmful gas.

LR62E1, LR62C LoRa Modules

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(6) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Fanstel.
Packaging
Production modules are delivered in reel, 1000 modules in each reel.
FCC LABEL
The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment
The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized.
This device is intended for OEM integrator only.

LR62E1, LR62C LoRa Modules
6. Revision History
· Dec. 2023, Ver. 0.90: The first draft release.

Ver 0.9, Dec. 2023

LR62E1, LR62C LoRa Modules
7. Contact Us
Fanstel Corp. 7466 E. Monte Cristo Ave. Scottsdale AZ 85260 Tel. 1 480-948-4928 Fax. 1-480-948-5459 Email: info@fanstel.com Website: www.fanstel.com
Taiwan:
Fanstel Corp. 10F-10, 79 Xintai Wu Road Xizhu, New Taipei City, Taiwan 22101 79 10 10, 22101 Tel. 886-2-2698-9328 Fax. 886-2-2698-4813 Email: info@fanstel.com Website: www.fanstel.com
China:
Fanstel Technologies Corp. 11 Jiale Street Ping-Dih, Long-Gang, Shen Zhen, GD 518117 () 11 Tel. 86-755-8409-0928 Fax. 86-755-8409-0973 QQ. 3076221086 Email: info@fanstel.com Website: www.fanstel.com

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LR62E1, LR62C LoRa Modules

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Federal Communications Commission (FCC) Statement
15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user's authority to operate the equipment.

15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation of the device.

FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Note: The end product shall has the words "Contains Transmitter Module FCC ID: X8WLR62E1"

LR62E1, LR62C LoRa Modules
Canada, Industry Canada (IC) This Class B digital apparatus complies with Canadian ICES-003 Cet appareil numérique de classe B est conforme à la norme NMB-003.

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Le present appareil est conforme aux CNR d'Industrie Canada applicables auxappareils radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage adioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition au rayonnement ISED établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre corps.
Cet émetteur ne doit pas être co-localisé ou fonctionner en conjonction avec une autre antenne ou un autre émetteur.

ICES-003 RF Radiation Exposure Statement
This equipment complies with ICES-003 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Note: The end product shall has the words "Contains Transmitter Module IC: 4100A-LR62E1"

(Modular approval) End Product Labeling: The final end product must be labeled in a visible area with the following: "Contains IC: 4100A-LR62E1".
OEMstatement The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment is installed must also display a label referring to the enclosed equipment

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The end product with this module may subject to perform FCC part 15 unintentional emission test requirement and be properly authorized. This device is intended for OEM integrator only This radio transmitter (192170139/AA/00) has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed Below, with the maximum permissible gain indicated. Antenna types not included in this list that Have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. LR62E1: Dipole Antenna, 2.3dBi

References

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