RAM Audio DSP_PowerPack™ SUB Series

Product Overview

The RAM Audio DSP_PowerPack™ SUB Series offers high-performance audio amplification modules designed for integration into acoustic enclosures. These modules provide robust power output and advanced digital signal processing capabilities.

Module Assembly and Installation

For the installation of the SUB module, an internal chamber within the acoustic enclosure is required, separate from the speaker chamber. Optionally, the SUB module can be supplied with a rear metal case to simplify installation and avoid the need to make the primary chamber airtight.

The module is secured to the enclosure using M5 screws. A foam gasket should be placed between the module and the enclosure to prevent vibrations. It is not recommended to use foam between the module and the optional rear metal case.

Cabinet Mechanization and Dimensions

Detailed diagrams illustrate the required cabinet cut-outs and module dimensions:

SB 3K Cabinet Mechanization

This section describes the recommended machining for the acoustic enclosure to accommodate the SB 3K module. The required external dimensions for the cut-out are approximately 492mm in width and 176mm in height. The internal depth required for the module is approximately 90mm.

SB 6K Cabinet Mechanization

This section describes the recommended machining for the acoustic enclosure to accommodate the SB 6K module. The required external dimensions for the cut-out are approximately 502mm in width and 222mm in height. The internal depth required for the module is approximately 90mm.

SB 3K Optional Aluminium Case Dimensions

The optional rear metal case for the SB 3K module has external dimensions of approximately 510mm in width, 178mm in height, and 106mm in depth.

SB 3K Module Front/Profile Dimensions

The front and profile dimensions of the SB 3K module itself are approximately 490mm in width, 165mm in height, and 90mm in depth.

SB 6K Module Front/Profile Dimensions

The front and profile dimensions of the SB 6K module itself are approximately 500mm in width, 125mm in height, and 90mm in depth.

Connections and Front Panel Description

The connection of speakers to the module is facilitated by Faston connectors. The PCB features duplicated male Faston connectors to allow for the connection of two speakers in parallel.

Speaker Connection Diagram

The diagram shows how to connect two speakers in parallel to the module using the Faston connectors. The positive terminal of the module connects to the positive terminals of both speakers, and the negative terminal of the module connects to the negative terminals of both speakers.

Front Panel Description

The front panel of the DSP_PowerPack™ SUB Series modules includes the following controls and indicators:

• 1. Signal Input: Female XLR connector for receiving the audio signal.
• 2. Signal Link: Male XLR connector for passing the signal to another device.
• 3. Ethernet Connectors: Two RJ45 ports, functioning as an Ethernet switch for daisy-chain connections.
• 4. USB Connector: A Type B USB connection for potential firmware updates or control.
• 5. LED Indicators:
  • ON: Indicates that the power supply is active.
  • SIGNAL: Shows the presence of an input signal.
  • LIMIT: Illuminates when the DSP limiters are engaged.
  • CLIP: Lights up when the maximum input or output level has been reached.
• 6. Quick Preset: A button that, when pressed for 3 seconds, cycles through the desired output presets.
• 7. LEVEL Controls: Pressing the 'SET' buttons 3 and 4 simultaneously enters LEVEL mode (both LEDs light up). Use buttons 3 and 4 to adjust the audio level.
• 8. Mains Connection: Features a powerCON True1 inlet and outlet. This connector also serves as the main switch due to its breaking capacity.

Technical Specifications

The following tables detail the technical specifications for the DSP_PowerPack™ SUB Series amplifiers.

DSP Specifications

• Overall: High performance 96kHz 120dB 32-bit AD/DA converters, 64-bit double-precision 96kHz DSP, 0.6ms minimum process latency, up to 2700 taps custom FIR process.
• Input Section: Gain, Mute, and Phase inversion controls. Input Delay from 0 to 130 meters. Input EQ with 10 PEQ (Parametric, Shelving, LP, HP, BP, SB, AP) filters.
• Output Section: Crossover Filters include FIR and IIR (up to 48dB/oct, Butterworth, Linkwitz-Riley, Bessel). Output Delay from 0 to 18 meters (52ms) per channel. Output IIR EQ with 12 filters per channel. Output FIR EQ with 20 filters per channel, or custom up to 2700 taps. RMS and Peak limiter per channel.

RAM_OCS Control

• Control & Monitor: Monitors Signal, Limiter, Clip, Temperature, and Protection status. Includes Input, Output, and Temperature meters.
• Communications: Two Ethernet ports for daisy-chain connection. USB 2.0 Type B connector.
• Overall Features: 20 Manufacturer preset memories, 5 User preset memories, 4 Quick Preset selections. Supports Manufacturer/Installer/User passwords. Independent selectable output power per channel (Z dependent). User control groups for virtual Equalization, Gain, and Delay. Zone management for library, stand-by, and alerts. Integration with Smaart® analysis software.

Amplifier Specifications