Cdtech CDI-W30721DM Dual Band WiFi4+BLE5.0 Module Specification

Software

CHINA DRAGON TECHNOLOGY LIMITED

Address: Building B4, First Industrial Park, Linpo Keng, Shajing Street, Bao'an District, Shenzhen, China

Tel: (86 755) 81449957

Fax: (86 755) 81449967

E-mail: Info@cdtech.cn

Website: Http://www.cdtech.cn

Reversion History

1. Overview

The CDI-W30721DM is based on the RTL8721DM-VA1 designed module. It is a highly integrated, single-chip, low-power dual-band (2.4GHz and 5GHz) Wireless LAN (WLAN) and Bluetooth Low Energy (BLE 5.0) communication controller.

It also integrates an audio codec, Key-Scan, and touch keys. Additionally, high-speed connectivity interfaces and flexible design configure GPIO for different functions according to applications.

2. Features

• Wi-Fi 802.11 a/b/g/n 1x1, 2.4GHz & 5GHz
• Supports 20MHz/40MHz up to MCS7
• Internal PTA interface for arbitrating data transmission between Wi-Fi and internal Bluetooth or external 2.4G devices
• Both central and peripheral modes
• BLE 5.0
• Low power beacon listen mode

3. General Specification

RF Specification

2.4GHz RF Specification

5GHz RF Specification

BLE RF Specification

4. Electrical Characteristics

4.1 Power-on or Resuming from Deepsleep Sequence

A diagram shows the sequence of power-on or resuming from deepsleep. Key signals like VDDx, VDD_IO, CHIP_EN, and HS core power are illustrated with their voltage levels and timing relationships (T_RDY, T_CORE, T_BOOT).

Shutdown Sequence

A diagram illustrates the shutdown sequence. Key signals like VDDx, VDD_IO, CHIP_EN, and HS core power are shown with their timing relationships (T_RST, V_RST, T_CORE, T_BOOT) leading to CPU availability.

5. Pin Description & Dimensions (unit: mm)

Diagrams show the top, side, and bottom views of the module, indicating dimensions and pin locations. The antenna area and shield cover are also indicated.

Download Instructions: UART_LOG_RX, UART_LOG_TX (TX ground before power-on). When downloading software, run it first and then power on the module.

6. Supplier

7. Physical photo

Diagrams show the top and bottom views of the module with various pins labeled (PIN1, PIN10, PIN11, PIN23, PIN24, PIN33).

8. Warpage

Warpage (Clearance) Inspection Standard:

Place the module on a horizontal marble surface and use a 0.1mm-thick feeler gauge to measure the clearance between the bottom of the module and the marble. The requirement is that the gap ≤ 0.1mm.

9. Baking & storage temperature & Recommended Reflow Profile

9.1 Baking & storage temperature

A. Storage life: 12 months. Storage conditions: <40°C, Relative humidity: <90%R.H.

B. After this bag is opened: Devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be handled with care.

• Check the humidity card: Display value should be less than 30% (blue). If it is 30%~40% (pink) or greater than 40% (red), the module has absorbed moisture.
• Mounted within 168 hours under factory conditions of: ≤30°C, ≤60%R.H.
• Once opened, the workshop preservation of life is 168 hours.

C. Module apart packing after 168 hours: If baking is required, devices may be baked for.

• Modules must be re-baked to remove moisture issues.
• Baking temperature: 40°C ± 5°C, 120 hours.
• After baking, place an appropriate amount of desiccant to seal packages.

D. Module reel packaging items:

• Storage life: 12 months. Storage conditions: <40°C, Relative humidity: <90%R.H.
• Module apart packing after 168 hours: To launch patch, re-baking is needed to remove hygroscopic moisture. Baking temperature conditions: 125°C, 8 hours.
• The actual number of module reel packing is based on customer requirements.

E. Module pallet packaging items:

• Storage life: 3 months. Storage conditions: <40°C, Relative humidity: <90%R.H.
• Module if not used within 48 hours, needs baking at 125°C for 8 hours before launch.
• Pallet packaging each plate is 100 PCS. The actual number of module pallet packing is based on customer requirements.

Note: Packaging methods are determined by customer requirements and actual shipments.

9.2 Recommended Reflow Profile

Referred to IPC/JEDEC standard.

Peak Temperature: <250°C

Number of Times: ≤2 times

A diagram illustrates the recommended reflow profile with temperature and time parameters, including Preheat (150~200°C), Ramp up rate (1~2°C/sec max.), Peak temperature (245+5°C), and Ramp down rate (Max. 2.5°C/sec).

10. Packing information

Diagrams illustrate the packing process: module direction, plastic disc color (blue), reel of 600pcs, inner box (K3K: 33.5cm*34.7cm*7cm, 600 PCS), and carton (K=A: 36.4*35.7*37.5cm, 3000 PCS). Anti-static bags are used.

The CDI-W30721DM is an ESD (electrostatic discharge) sensitive device. Handle with care to avoid permanent malfunction or performance degradation, even though it has built-in ESD protection circuitry.

11. Appendix

Module integration Description

Integration instructions for host product manufacturers according to 996369 D03 OEM Manual v01r01 Manual v01.

11.1 List of applicable FCC rules

CFR 47 FCC PART 15 SUBPART C&E has been investigated and is applicable to the modular.

11.2 Specific operational use conditions

This module is a stand-alone modular. If the end product involves multiple simultaneous transmitting conditions or different operational conditions for a stand-alone modular transmitter in a host, the host manufacturer must consult with the module manufacturer for the installation method in the end system.

11.3 Limited module procedures

Not applicable

11.4 Trace antenna designs

Not applicable

11.5 RF exposure considerations

To maintain compliance with FCC's RF Exposure guidelines, this equipment should be installed and operated with a minimum distance of 20cm from your body.

11.6 Antennas

This radio transmitter (FCC_ID:2BFLD-W30721DM) has been approved by the Federal Communications Commission to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.

11.7 Label and compliance information

The final end product must be labeled in a visible area with the following: Contains FCC ID:2BFLD-W30721DM.

11.8 Information on test modes and additional testing requirements

Host manufacturer is strongly recommended to confirm compliance with FCC requirements for the transmitter when the module is installed in the host.

11.9 Additional testing, Part 15 Subpart B disclaimer

Host manufacturer is responsible for compliance of the host system with the module installed, including all other applicable requirements for the system such as Part 15 B.

This device is intended only for OEM integrators under the following condition: The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

ISED Statement

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada's licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.

ISEDC Radiation Exposure Statement:

This equipment complies with ISEDC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

The device for operation in the band 5150–5350MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems.

FCC Statement

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.