Renesas RX Driver Package Ver. 1.02

1. Overview

1.1 Applicability

This User's Manual applies to the RX110, RX111, RX113, RX130, RX231, RX23T Group RX Driver Package, version 1.02.

1.2 Operating Environment

This package runs under the operating environment described below.

2. About RX Driver Package

The RX Driver Package is a software platform (framework) that combines the following modules required for development in a single package. This allows for immediate development without needing to obtain each module separately.

• Board Support Package (BSP) module
• FIT peripheral function modules (free version)
• FIT middleware modules (free version)
• FIT interface modules

The user application layer can be developed easily using the Sample Application Program (RX Driver Package Application) which utilizes the RX Driver Package.

2.1 System Structure

The figure below shows the system structure of the RX Driver Package.

Figure 2-1 System Structure

A diagram illustrating the RX Driver Package system structure. It shows the RX Driver Package Application at the top, interacting with User Application (FIT Module) and e² studio project. Below this, the RX Driver Package is depicted with components like POSIX Wrapper (FIT Module), Middleware (FIT Module), Device Driver (FIT Module), RTOS Wrapper (FIT Module), and Board Support Package (BSP Module). These components interact with the MCU, Interface, Device Driver, Middleware, and BSP. The diagram also indicates connections to Renesas evaluation boards and emulators (E1, E20), and mentions third-party evaluation boards. Items marked with an asterisk are under development.

2.2 RX Driver Package Features

The RX Driver Package has the following features:

1. Select necessary modules and start developing immediately: Build a system by selecting needed modules. Develop the application program afterward.
2. Free to use: All included modules are free of charge, including free versions of middleware modules like TCP/IP and file system.
3. Upgrade to paid versions of modules: Free versions can be replaced with commercial (paid) versions for full functionality and support.
4. Check operation including user application: The RX Driver Package Application is a sample that uses the RX Driver Package, enabling immediate operation checks.

Figure 2-2 An example of system build

A diagram showing an example system build for the RX Driver Package. It lists various modules categorized under System, Communication, Analog, and Other. Modules include TCP/IP, DHCP Client, DNS Client, FTP Server, HTTP Server, FAT File System, Sound playback, I2C, SPI, USB, CAN, AD converter, DAC, Flash API, LCD controller, and more. It also shows Board Support Package and Interface modules. The diagram illustrates how these modules can be integrated into a system build.

3. Structure of the RX110, RX111, RX113, RX130, RX231, RX23T Group RX Driver Package

3.1 Folder Structure

The folder structure used in this package is shown below. When the ZIP file is decompressed, it contains a FITModules folder, a reference_documents folder, and this document. The FITModules folder contains FIT modules (ZIP and XML files), and the reference_documents folder contains documentation for various development scenarios.

Figure 3-1 Folder Structure of the RX110, RX111, RX113, RX130, RX231, RX23T Group RX Driver Package

A diagram illustrating the folder structure of the RX Driver Package ZIP file. It shows the main ZIP file containing folders like FITModules and reference_documents. The FITModules folder contains FIT Module XML and FIT Module ZIP files. The reference_documents folder contains PDF documents for adding FIT modules to projects, including for e² studio and CS+ projects.

3.2 Module Structure

The figure below shows the types and structure of the FIT modules included in this package.

Figure 3-2 RX110, RX111, RX113, RX130, RX231, RX23T Group RX Driver Package FIT Module Structure

A diagram illustrating the FIT module structure within the RX Driver Package. It shows various modules categorized under System, Communication, Analog, and Other, with connections indicating their relationships and dependencies. Modules are grouped and displayed in a hierarchical manner, showing how they integrate within the driver package.

3.3 FIT Modules

The table below lists the FIT modules included in this package.

Note: This package includes the M3S-T4-Tiny (TCP/IP protocol stack library) of evaluation version. For the commercial version, please refer to the below URL: http://www.renesas.com/mw/t4

4. Usage Procedures

The RX Driver Package allows programs to be easily constructed by using the FIT plugin included in e² studio. The remainder of this section presents a simple usage example using e² studio. To use CS+, refer to the document “RX Family Adding Firmware Integration Technology Modules to CS+ Projects (R01AN1826EJ)” included in this package.

4.1 Environment Used

The RX231 is used as the target microcontroller and the Renesas Starter Kit RX231 is used as the target board. If a different environment is used, replace the specifics used in the example with the ones for that environment as you read.

4.2 Install RX Driver Package in e² studio

Install the FIT modules in the RX Driver Package into e² studio.

1. Decompress the downloaded file an_r01an2670ej0101_rx.zip into an arbitrary directory.
2. Open the folder that was decompressed and open the FITModules folder in that folder.
3. Select all the files in the FITModules folder and click Copy in the Edit menu.
4. Open the e² studio install folder (Usually, this will be c:/Renesas/e2_studio.) and open the FITModules folder in that folder.
5. Click Paste on the Edit menu. The e² studio FITModules folder will be copied to the FIT modules.

4.3 Application Creation

In this section, create a simple application that drives an LED.

4.3.1 Create a Workspace and a Project

First, create a new workspace and a new project.

1. Start e² studio.
2. Enter an arbitrary workspace folder in the displayed dialog box and click OK.
3. When the following window is displayed, click Workbench.
4. When the workbench has started, select New from the File menu and click C Project.
5. Enter the project name. For the project type, select Sample Project under Executable (Renesas). For the tool chain, select Renesas RXC Toolchain. After making these settings, click Next.
6. Select the target. Click the “...” button under Target Selection and select R5F52318AxFP. After making these settings, click Next.
7. Set the check box of "Use FIT module" and click Next.
8. Simply click Next.
9. Simply click Next.
10. Simply click Finish.
11. Click OK. The project will be generated.

4.3.2 Install the FIT Modules with the FIT Plugin

Install the required modules with the FIT plugin into the created project. Here, install the BSP module (r_bsp) and the compare match timer driver (r_cmt_rx).

1. In the Renesas Views menu, select e² solution toolkit and click FIT Configurator.
2. In the FIT Configurator tab, select the created project with Project to Add FIT Module to. Next, select RX231 under Group and select RSKRX231 from Target Board. Next, click r_cmt_rx in the module list and click Add Module >>.
3. In the Console tab, a warning may appear regarding the r_bsp version dependency. This warning can be ignored as it does not impact module addition.
4. Check r_bsp and r_cmt_rx are added in Selected Modules. The mark on r_cmt_rx indicates occurrence of the warning explained in the above 3. Then, click Generate Code.
5. Click OK with changing anything. The following modules will be installed: r_bsp, r_cmt_rx. The following include paths will be added to project settings: /${ProjName}/r_bsp, /${ProjName}/r_config, /${ProjName}/r_cmt_rx, /${ProjName}/r_cmt_rx/src.

4.3.3 Create an LED Driving Program

Create a program that toggles the LED0 on/off state every 0.5 seconds using the compare match timer. Open the file src/(the project name).c and modify it as shown below.

#include "platform.h"
#include "r_cmt_rx_if.h"

/* LED Currently status */
uint32_t ledstatus = LED_OFF;

void call_back(void *pdata)
{
    if (ledstatus == LED_OFF)
    {
        /* Turn ON the LED0 If the status is LED OFF */
        LED0 = LED_ON;
        ledstatus = LED_ON;
    }
    else
    {
        /* Turn OFF the LED0 If the status is LED ON */
        LED0 = LED_OFF;
        ledstatus = LED_OFF;
    }
}

void main(void)
{
    uint32_t cmt_ch;

    /* LED0 off */
    LED0 = LED_OFF;

    /* Create of 0.5 second(2Hz) cyclic timer. */
    R_CMT_CreatePeriodic(2, &call_back, &cmt_ch);

    while(1);
}

4.3.4 Build and Try Running the Program

Build the program just created and verify that it runs.

1. Click Build Project on the Project menu.
2. When the build completes, the following will be displayed in Console view: 'Build complete.'
3. Click Debug Build on the Run menu.
4. Click under the Renesas GDB Hardware Debugging and click led_sample HardwareDebug. Click the Debugger tab and click Connection Setting. Modify EXTAL Frequency to be 8.0000 and change Provide Power from Emulator to No. When these changes have been made, click Debug.
5. When the following message is displayed, click Yes.
6. When the load module download completes, a Debug perspective opens.
7. Click Restart on the toolbar. The program will be executed and a break will occur at the start of the main function.
8. After the break at the start of the main function, click Restart on the tool bar again. The project will be run and the program will iterate toggling LED0 with a period of 0.5 seconds.

4.3.5 For location of the API information of each FIT module

For the API information of FIT module embedded in the project, refer to the doc folder of each FIT module folder.

5. RX Driver Package Application

5.1 RX Driver Package Application Structure

The RX Driver Package Application is a sample application program provided so that users can use the RX Driver Package easily. The RX Driver Package Application consists of an application program that operates using device drivers and middleware included in the RX Driver Package and a project file for building that application. This allows users to start evaluation quickly.

Figure 5-1 RX Driver Package Application Structure

A diagram showing the structure of the RX Driver Package Application, with boxes for "Sample application program" and "Project file" pointing to "RX Driver Package Application".

Renesas plans to release a variety of types of this RX Driver Package Application in the future, such as system programs that operate using a combination of multiple drivers and middleware and evaluation programs for independent modules from the RX Driver Package.

For information of the latest RX Driver Package Application, refer to the “Products Supporting RX Driver Package Application” shown in the following URL: http://www.renesas.com/products/mpumcu/rx/child/fit.jsp

Figure 5-2 Types of RX Driver Package Application

A diagram illustrating various types of RX Driver Package Applications. It shows a central "RX Driver Package" box connected to various application types such as "Network server and client", "Camera control program", "Audio player (ADPCM)", "Device driver evaluation program", "Boot loader", and "Image and video middleware control program". The "RX Driver Package Application" is also shown connected.

6. Supplement

6.1 Commercial Version of Middleware and Drivers Supporting FIT

A list of the commercial version (paid) Middleware and Drivers for RX family is shown below.

For the information of the latest commercial version (paid) Middleware and Drivers, refer to the page of the Middleware and Drivers shown in the following URL: http://www.renesas.com/mw/

Website and Support

Renesas Electronics Website: http://www.renesas.com/

Inquiries: http://www.renesas.com/contact/

All trademarks and registered trademarks are the property of their respective owners.

Revision History

General Precautions in the Handling of MPU/MCU Products

The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Handling of Unused Pins

Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual.

2. Processing at Power-on

The state of the product is undefined at the moment when power is supplied.

• The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the moment when power is supplied.
• In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed.
• In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified.

3. Prohibition of Access to Reserved Addresses

Access to reserved addresses is prohibited. The reserved addresses are provided for the possible future expansion of functions. Do not access these addresses; the correct operation of LSI is not guaranteed if they are accessed.

4. Clock Signals

After applying a reset, only release the reset line after the operating clock signal has become stable. When switching the clock signal during program execution, wait until the target clock signal has stabilized. When the clock signal is generated with an external resonator (or from an external oscillator) during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable.

5. Differences between Products

Before changing from one product to another, i.e. to a product with a different type number, confirm that the change will not lead to problems. The characteristics of an MPU or MCU in the same group but having a different part number may differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-evaluation test for the given product.