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LG Innotek LTD-BK2000 Mobile Communication Module

LG Innotek-LTD-BK2000-Mobile-Communication-Module-product

Summary
This document describes the technical specification of the module which includes the interface, the mechanical specification, and the electrical characteristics.

Product Introduction

This is a mobile communication module that supports various interfaces like USB and UART. The module is designed for the automotive industry. It also supports carrier aggregation as per 3GPP, which is dependent on carrier and chipset support.

Key Features

Feature Implementation
General
Frequency bands Please refer to the RF Specification
Output power Class 3 (20.3~25.7dBm) for WCDMA & LTE
Power supply

4G/5G DCDC

Operating conditions : 3.9V < VPH_PWR_CH1 < 4.1V (Typ. 4.0V)

Absolute maximum ratings : 0V < VPH_PWR < +5.0V

Powe Supply PMIC Operating conditions : 3.9V < VPH_PWR_PMIC < 4.1V (Typ. 4.0V)

Absolute maximum ratings : 0V < VPH_PWR < +5.0V

Operating temperature Normal operation : -20°C to +70°C (Class A) Extended operation : -40~-20°C, +70~+85°C (Class B)
Physical Dimensions : 50mm x 50mm x 3.5mm Weight : Max 18.0 grams
RoHS All hardware components fully compliant with EU RoHS Directive
Interfaces
Module Interfaces Surface mount device with solderable connection pads

(SMT application interface).

Antenna 50 Ohms. LTE main antenna, LTE Diversity/MIMO antenna
USB USB 3.0 SuperSpeed and high-speed(for backward compatibility)
UIM interface Support two ports. including dual-voltage options
Memory 8Gb NAND Flash / 8Gb LPDDR4x SDRAM

Environmental Specifications
The environmental specifications for both the operating and storage temperature of modules are defined in the below table.
Table 1.0: Environmental Specifications

Parameter Temperature Range Operating Class
Ambient Operating Temperature From -20°C to +70°C Class A
From -40~-20°C, +70~+85°C Class B
Ambient Storage Temperature From -40°C to +85°C  
Ambient Humidity 95% or less  

Note
The customer must design the heat dissipation not to exceed the junction temperature of the main components at 85°C. ( Refer to Design Guide for junction temperature)

Class A is defined as the operating temperature ranges that the device:

  • Shall exhibit normal function during and after environmental exposure.
  • Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

  • Shall remain fully functional during and after environmental exposure
  • Shall exhibit the ability to establish a voice, SMS, or DATA call (emergency call) at all times even when one or more environmental complaints exceed the specified tolerance.
  • Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed.

Mechanical Specifications

This module is a Land Grid Array (LGA) form factor device that does not have any System or RF connectors. All electrical and mechanical connections are made via the 581 pads LGA on the underside of the PCB.

Table 1.: Module Dimensions

Parameter Nominal Tolerance Units
Overall Dimension1) 50.0 x 50.0 ±0.15 mm
Overall Module Height

(Excluding ball thickness)

3.5 ±0.2 mm
Final coplanarity

(including warpage)

230 mm
Weight (Max) 17   g

Note
Overall Dimension refers to the size excluding the routing area. There should be no other components within 500um of the product’s outer edge.

LGA moisture sensitivity level

  • MSL 3 Level (Floor Life Time : 168Hrs. / Condition : ≤30℃, 60% RH)
  • Standard : IPC / JEDEC J-STD-020C

Communication Specification

  • Receiver
  • Bandwidth: 5MHz
  • Frequency : B2(1930~1990 MHz), B5(869~894 MHz)
  • RF to Baseband Direct conversion (Zero IF)
  • Modulation method  QPSK and 16QAM receiving sensitivity : B2, B5 ≤-104.0dBm (BER=<0.1%)
  • 3GPP TS 34.121-1 Table 6.2.2

Transceiver

  • Frequency : B2(1850~1910 MHz), B5(824~849 MHz)
  • Maximum RF Output: Power class 3, 20.3dBm ~ 25.7dBm
  • Modulation method: PSK
  • Baseband to RF Direct conversion (Zero IF) LTE

Receiver

  • Bandwidth : 3GPP TS 36.521-1 Table 5.4.2.1-1
  • Frequency : B2(1930~1990 MHz), B4(2110~2155 MHz)
  • B5(869~894 MHz), B7(2620~2690 MHz), B12(729~746 MHz)
  • B13(746~756 MHz), B17(734~746 MHz), B66(2110~2200 MHz)
  • RF to Baseband Direct conversion (Zero IF)
  • Modulation method: QSK, 16QAM and 64QAM
  • receiving sensitivity : B2, B5, B7 (≤-94.3dBm) / B4 (≤-96.3dBm)
  • B12, B13, B17 (≤-93.3dBm) / B66 (≤-95.8dBm) @QPSK, Channel bandwidth=10MHz 3GPP TS 36.521-1 Table 7.3.5-1

Transceiver

  • Frequency : B2(1850~1910 MHz), B4(1710~1755 MHz)
  • B5(824~849 MHz), B7(2500~2570 MHz) ,B12(699~716 MHz)
  • B13(777~787 MHz),B17(704~716 MHz), B66(1710~1780 MHz)
  • Maximum RF Output: Poer class 3, 20.3dBm ~ 25.7dBm
  • Modulation method: QPS and 16QAM
  • Baseband to RF Direct conversion (Zero IF)

Integration Guide
Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or modification is made.

Note
If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102.

OEM Manual

  • The List of applicable FCC rules
  • FCC: Part 22, Part 24, Part 27

Summarize the specific operational use conditions

  • The module is designed for vehicles only and has to be tested additionally inserted in another host.
  • Limited module procedures N/A
  • Trace antenna designs N/A

RF exposure considerations
RF Exposure evaluation was performed with very specific installation condition at 20 cm. Any other installation conditions may require additional tests and a permissive change procedure.

Antennas
Dipole Antenna is used for testing, with a unique antenna connector. The maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table.

LG Innotek-LTD-BK2000-Mobile-Communication-Module-FIG-1

Label and compliance information
To satisfy the labeling requirements, the following text must appear on the exterior of the end product.

Contains FCC I: YZP-BK2000
Information on test modes and additional testing requirements If the additional module is inserted in the host, test modes should take into consideration different operational conditions for a standalone modular transmitter in a host. Additional testing, Part 15 Subpart B disclaimer According to § 15.103 Exempted devices, (a), this module is exempted due to being utilized exclusively in vehicles.

FCC STATEMENT

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation.

This module complies with FCC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with a maximum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas.

USED
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the device.

This module complies with ISED radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with a minimum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas.

Documents / Resources

LG Innotek LTD-BK2000 Mobile Communication Module [pdf] User Manual
YZP-BK2000, YZPBK2000, bk2000, LTD-BK2000 Mobile Communication Module, LTD-BK2000, Mobile Communication Module, Communication Module, Module

References

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