LEEDARSON LA02305 Bluetooth Combo Module User Manual

LA02305 Bluetooth Combo Module

Specifications

The LA02305 is a universal Wi-Fi and Bluetooth SMART combo
module developed by Leedarson. It utilizes the Espressif Inc.
ESP32-U4WD System in Package with an embedded 4MB flash.

Key Features

  • Compliant with Bluetooth LE specifications
  • Wi-Fi 802.11 b/g/n
  • BLE interface
  • Vertical Mount (Plug-In) and Horizontal (SMD) options
  • 6 PWMs (GPIOs)
  • 1 Available UART
  • 1 ADC
  • 1 Dedicated Triac Dimmer Detection Pin

Block Diagram

The LA02305 is a highly-integrated system supporting 2.4GHz
wireless connectivity with built-in hardware components for Wi-Fi
and BLE protocols.

Power Supply

The module requires a single nominal supply level of 3.3V with
included decoupling and filtering components. Supply voltage noise
tolerance should be less than 100mVpp.

Module Certification Information

Module Certification Type Certification Information
LA02305 FCC 2AB2Q-LA02305
IC 10256A-LA02305

Product Usage Instructions

1. Module Installation

Ensure that the power supply meets the required specifications
of 3.3V. Connect the module as per the provided pinout diagram.

2. Connectivity Setup

Follow the documentation to establish Wi-Fi and Bluetooth
connections. Use the provided UART interface for communication.

3. Programming

Utilize the available GPIOs and ADC for programming custom
functionalities as needed for your IoT product.

FAQ

Q: What is the operating temperature range of the LA02305
module?

A: The general operating temperature range is from -40°C to
105°C.

Q: What is the required power supply voltage for the LA02305
module?

A: The module operates on a supply voltage of 3.3V.

“`

LA02305 Module User Manual
1. Introduction
1.1 Overview
The LA02305 is a Leedarson-developed universal Wi-Fi and Bluetooth SMART (BLE) combo module. It uses the Espressif Inc. ESP32-U4WD System in Package that integrates an embedded 4MB flash.

Figure 1.1.LA02305 Module
The LA02305 module is designed for a variety of IOT products such as Power Drivers, Sensors, Plugs, Lighting, Switches, etc.

Plug Switch

Sensor

Down light

Power Drive

Figure 1.2.Product Application

1.2 Key features
Embedded Xtensa® 32-bit LX6 microprocessor, with clock up to 160MHz Data Memory: 520KB internal SRAM and 448KB internal ROM,4MB Flash Power supply voltage: 3.0V3.6V Operating temperature: -40105Deg-C Frequency of crystal oscillator: 40MHz32.768KHz Operating frequency: 24022480MHz(Bluetooth), 2412-2462MHz(WIFI) Support WIFI 802.11b/g/n up to 150Mbps
Compliant with Bluetooth LE specifications
Wi-Fi 802.11 b/g/n and BLE can’t transmission simultaneous Interface:
Vertical Mount (Plug-In) 6 PWMs (GPIOs) 1 Available UART 1 ADC 1 Dedicated Triac Dimmer Detection Pin
Horizontal (SMD) 6 PWMs (GPIOs)

3 GPIOs 1 Available UART 2 ADC 1 Dedicated Triac Dimmer Detection Pin
1.3 Block Diagram
The LA02305module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4GHz wireless connectivity and support Wi-Fi and BLE protocols.
Built around the ESP32-U4WD Wireless SoC, the LA02305 includes a built-in PCB trace antenna, supply decoupling and filtering components, a 40MHz reference crystal, a 32.768KHz crystal, and an RF shield.

1.4 Power Supply
The LA02305 requires a single nominal supply level of 3.3V. All the necessary decoupling and filtering components are included in the module. The supply voltage noise tolerance of the module should be less than 100mVpp and the supply current should be more than 500mA.

1.5 Module Certification Information
Table 1.1. Module Certification Information

Module LA02305

Certification Type FCC IC

Certification Information 2AB2Q-LA02305 10256A-LA02305

2. Electrical characteristics
2.1 Absolute maximum ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any conditions above those indicated in the operation listing of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Table 2.1. Absolute maximum ratings

Symbol VCC GND VIO
Storage temperature MSL
ESD HBM
ESD CDM

Parameter Power Supply Ground of Module Voltage of Module IO
Moisture Sensitivity Level Human Body Mode Charge Device Mode

Min. -0.3
-0.3 -40

Max. +3.6
0 +3.6 +125

3 1.5

500

Units V V V
Deg-C
KV V

2.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies, the minimum and maximum values of all other tables are specified over this operating range, unless otherwise noted.
Table 2.2. General Operating Conditions

Symbol

Parameter

Min.

Typ.

Max.

Units

VCC

Supply voltage, normal

3.0

3.3

3.6

V

TA

Operation temperature1

-40

25

105

Deg-C

ICC peak

Supply Current Peak2

400

450

mA

ICC average

Supply Current average2

150

mA

Note: 1. It refers in particular to the surface temperature on 40MHz reference crystal of the LA02305 when it is
working, if the surface temperature of 40MHz reference crystal is above 105 Deg-C, the RF parameters will be worse. 2. It is measured when the module runs the RF test Firmware @ 10% duty cycle and 25 Deg-C ambient temperature.

2.3 DC Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V.TA=25Deg-C Table 2.3. DC Specifications

Symbol

Parameter(condition)

Min.

Typ.

Max.

Units

VIH

Input high voltage

0.75xVCC –

VCC

V

VIL

Input low voltage

GND

– 0.25xVCC V

VOH

Output high voltage

0.8xVCC –

V

VOL

Output low voltage

0.1xVCC

V

IOH

Output high current

40

mA

IOL

Output low current

28

mA

RPU

Pull-up resistance

45

k

RPD

Pull-down resistance

45

k

ITX 802.11b peak Transmit 11b DSSS 1Mbps Pout=+21.53dBm

382

mA

ITX 802.11b average Transmit 11b DSSS 1Mbps Pout=+18.12dB

– 148

mA

ITX 802.11b peak Transmit 11b DSSS 11Mbps Pout=+21.03dBm

378

mA

ITX 802.11b average Transmit 11b DSSS 11Mbps Pout=+17.95dBm

146

mA

ITX 802.11g peak Transmit 11g OFDM 6Mbps Pout=+20.99dBm

332

mA

ITX 802.11g average Transmit 11g OFDM 6Mbps Pout=+16.30dBm

139

mA

ITX 802.11g peak Transmit 11g OFDM 54Mbps Pout=+20.89dBm

272

mA

ITX 802.11g average Transmit 11g OFDM 54Mbps Pout=+16.11dBm

130

mA

ITX 802.11n peak Transmit 11n OFDM MCS0 Pout=+23.59dBm

328

mA

ITX 802.11n average Transmit 11n OFDM MCS0 Pout=+16.61dBm

140

mA

ITX 802.11n peak Transmit 11n OFDM MCS7 Pout=+23.44dBm

256

mA

ITX 802.11n average Transmit 11n OFDM MCS7 Pout=+16.35dBm

128

mA

IRX 802.11b/g/n Rx average current

108

mA

ITX BLE

Pout=9.41dBm

236

mA

ITX BLE average Pout=9.35dBm

184

mA

IRXBLE

Rx average current

115

mA

Note: The current is measured with the module runningthe RF test Firmware @ 10% duty cycle

2.4 RF Specifications
Unless otherwise indicated, typical conditions are: VCC=3.3V TA=25Deg-C Table 2.4. Wi-Fi Specifications

Symbol Fop
PRF11b PRF11g
PRF11n

Description
Operating frequencies 11b DSSS 1Mbps output power 11b DSSS 11Mbps output power 11g OFDM 6Mbps output power 11g OFDM 54Mbps output power 11n OFDM HT20 MCS0 output power 11n OFDM HT20 MCS7 output power 11n OFDM HT40 MCS0 output power

Min.
2412 –

Typ.
18.12 17.95 16.30 16.11 16.24 16.13 16.61

Max.
2462 –

Units
MHz dBm dBm dBm dBm dBm dBm dBm

11n OFDM HT40 MCS7 output power

16.35

dBm

Receiver sensitivity @11b DSSS 1Mbps

-95

dBm

Maximum receiving level @11b DSSS 1Mbps PSENS11b
Receiver sensitivity @11b DSSS 11Mbps

5

dBm

-86

dBm

Maximum receiving level @11b DSSS 11Mbps

5

dBm

Receiver sensitivity @11g OFDM 6Mbps

-91

dBm

Maximum receiving level @11g OFDM 6Mbps PSENS11g
Receiver sensitivity @11g OFDM 54Mbps

0

dBm

-73

dBm

Maximum receiving level @11g OFDM 54Mbps

-8

dBm

Receiver sensitivity @11n OFDM HT20 MCS0

-90

dBm

Maximum receiving level @11n OFDM HT20 MCS0

0

dBm

Receiver sensitivity @11n OFDM HT20 MCS7

-71

dBm

Maximum receiving level @11n OFDM HT20 MCS7

PSENS11n

Receiver sensitivity @11n OFDM HT40 MCS0

-8

dBm

-88

dBm

Maximum receiving level @11n OFDM HT40 MCS0

0

dBm

Receiver sensitivity @11n OFDM HT40 MCS7

-68

dBm

Maximum receiving level @11n OFDM HT40 MCS7

-8

dBm

Table 2.5. BLE Specifications

Symbol Fop
PRFLE
PSENSLE

Description
Operating frequencies LE Output Power
LE Out Power Control range LE Out Power Control step
LE Receiver sensitivity LE Maximum receiving level

Min.
2402 –

3. Pin Definition

Typ.

Max. Units

2480 MHz

8

dBm

24

dB

3

dB

-90

dBm

0

dBm

Figure 3.1.Vertical Mount (Plug-In) Table 3.1. Plug-In pin definition

Module No 1 2 3 4 5 6

Pin of IC 17_MTMS
GND 15_GPIO26 40_U0RXD 17_MTMS 41_U0TXD

Pin Definition PWM1/IO0
GND PWM2/IO1
RX0 PWM3/IO2
TX0

Pin Function Description PWM channel 1 output / GPIO 0 Ground of Module PWM channel 2 output / GPIO 1 FACTORY_UART_RX data in (RX) PWM channel 3 output / GPIO 2 FACTORY_UART_TX data out (TX)

Direction I/O -I/O I I/O O

7

21_MTDO

PWM4/IO3

PWM channel 4 output / GPIO 3

I/O

8

9_CHIP_PU

RESET

Reset, Low Active

I

9

24_GPIO4

PWM5/IO4

PWM channel 5 output / GPIO 4

I/O

10

10_VDET_1

FAC

FACTORY MODE enable, low active

I

11

35_GPIO18

PWM6/IO5

PWM channel 6 output / GPIO 5

I/O

12

5_SENSOR_VP

ADC0

Analog-to-Digital Converter

I

13

GND

GND

Ground of Module

14

16_GPIO27

TX1

HOST_UART_RX (data out from ESP32) ,

O

need an external pull up

15

1,3,4,19,26,37,4

VCC

Power Supply

3,46

16

14_GPIO25

RX1

HOST_UART_TX (data in to ESP32) , need

I

an external pull up

Note:

1. AC_TRIAC_DETECT is used to detect if a device is powered through a triac dimmer and to determine the

dimmer settings. The circuit that feeds this signal should give a scaled DC voltage representation of the average AC

voltage integrated over approximately 200ms.If the triac is set to chop the AC waveform 50%, the

AC_TRIAC_DETECT signal should be at 50% of VCC.If the triac dimmer is turned up completely, the AC

waveform will be minimally chopped and the AC_TRIAC_DETECT signal should be at 100% of VCC.

Figure 3.2. Horizontal (SMD) Table 3.2. SMD pin definition

Module No 1
2 3 4 5 6 7 8

Pin of IC
17_MTMS GND
15_GPIO26 40_U0RXD 17_MTMS 41_U0TXD 21_MTDO 9_CHIP_PU

9

24_GPIO4

10

10_VDET_1

11

35_GPIO18

12

5_SENSOR_VP

13

GND

14

16_GPIO27

15

1,3,4,19,26,37,43,

46

16

14_GPIO25

17

10_VDET_1

18

14_GPIO25

19

9_CHIP_PU

Pin Definition PWM1/IO0
GND PWM2/IO1
RX0 PWM3/IO2
TX0 PWM4/IO3
RESET
PWM5/IO4 FAC
PWM6/IO5 ADC0 GND TX1
VCC
RX1
FAC RX1
RESET

Pin Function Description
PWM channel 1 output / GPIO 0 Ground of Module PWM channel 2 output / GPIO 1 FACTORY_UART_RX data in (RX) PWM channel 3 output / GPIO 2 FACTORY_UART_TX data out (TX) PWM channel 4 output / GPIO 3 Reset, Low Active
PWM channel 5 output / GPIO 4 FACTORY MODE enable, low active
PWM channel 6 output / GPIO 5 Analog-to-Digital Converter Ground of Module HOST_UART_RX (data out from ESP32) , need an external pull up Power Supply

Direction
I/O -I/O I I/O O I/O I
I/O I
I/O I -O

HOST_UART_TX (data in to ESP32) , need

I

an external pull up

FACTORY MODE enable, low active

I

HOST_UART_TX (data in to ESP32) , need

I

an external pull up

Reset, Low Active

I

20

16_GPIO27

TX1

HOST_UART_RX (data out from ESP32) ,

O

need an external pull up

21

41_U0TXD

TX0

FACTORY_UART_TX data out (TX)

O

22

42_GPIO21

IO8

GPIO8

I/O

23

40_U0RXD

RX0

FACTORY_UART_RX data in (RX)

I

24

GND

GND

Ground of Module

25

NC

26

5_SENSOR_VP

ADC0

Analog-to-Digital Converter

I

27

NC

28

39_GPIO22

IO9

GPIO9

I/O

29

23_GPIO0

IO7

GPIO7

I/O

30

11_VDET_2

ADC2

Analog-to-Digital Converter

I

31

GND

GND

Ground of Module

32

GND

GND

Ground of Module

Note:

1. AC_TRIAC_DETECT is used to detect if a device is powered through a triac dimmer and to determine the

dimmer settings. The circuit that feeds this signal should give a scaled DC voltage representation of the average AC

voltage integrated over approximately 200ms.If the triac is set to chop the AC waveform 50%, the

AC_TRIAC_DETECT signal should be at 50% of VCC.If the triac dimmer is turned up completely, the AC

waveform will be minimally chopped and the AC_TRIAC_DETECT signal should be at 100% of VCC.

4. Package Specifications 4.1 Dimension

Figure 4.1.Module Dimensions (Unit: mm)

4.2 PCB Pads Information

Perspective view

Note:

Figure 4.2.Pad Size (Unit: mm)

1. Shaded part is Antenna Trace. 2. The sizes of pads on the component side are the same to the opposite side.

4.3 Plug-in Land pattern example

Note: Please see below lay-out:

Figure 4.3.Plug-in PCB Land Pattern (Unit: mm)

Figure 4.4.Plug-in PCB Land Pattern (Unit: mm)
4.4 SMD Land pattern example
Figure 4.5.SMD PCB Land Pattern (Unit: mm) Note: Shaded part is Antenna Trace.

5. Soldering Recommendations
Refer to below information for SMT temperature settings. Note that the number of times of reflow should not above 2 times.
Table 5.1. SMT temperature setting

Set points(C)

Zone

1

2

3

4

5

6

7

8

9

10

Top

140

180 190 180 180 190 245 260

265

210

Bottom

140

180 190 180 180 190 245 260

265

210

Conveyor Speed(cm/min):130.0

6. Declaration

Figure 5.1.SMT temperature setting curve

FCC Statement 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.

15.21 Note: The grantee is not responsible for any changes or modifications not expressly approved by the party responsible for compliance. Such modifications could void the user’s authority to operate the equipment.

15.105(b)

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help
RF exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body.
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.
ISED RF exposure statement: This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Le rayonnement de la classe b repecte ISED fixaient un environnement non contrôlés.Installation et mise en
oeuvre de ce matériel devrait avec échangeur distance minimale entre 20 cm ton corps.Lanceurs ou ne peuvent
pas coexister cette antenne ou capteurs avec d’autres.

Regulatory Module Integration Instructions
1.1 List of applicable FCC rules This device complies with part 15.247 of the FCC Rules. 1.2 Summarize the specific operational use conditions This module can be applied in HID, sports and fitness sensors , health sensors, mobile accessories as well as smart home. The input voltage to the module should be nominally 3.0-3.6V DC ,typical value 3V DC and the ambient temperature of the module should not exceed 105 .
This module using one kind of PCB antenna with maximum gain is 4.0dBi, If the antenna needs to be changed,the certification should be re-applied.
1.3 Limited module procedures
Not applicable
1.4 Trace antenna designs
Not applicable
1.5 RF exposure considerations This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator your body. If the device built into a host as a portable usage, the additional RF exposure evaluation may be required as specified by 2.1093.
1.6 Antennas Module contains one PCB antenna. 1.7 Label and compliance information The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: 2AB2Q-LA02305 ” ,or “Contains FCC ID: 2AB2Q-LA02305 “,Any similar wording that expresses the same meaning may be used. 1.8 Information on test modes and additional testing requirements a)The modular transmitter has been fully tested by the module grantee on the required number of channels, modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter, perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions

limits or band edge limits (e.g.,where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product (enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance.
C)If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference has been corrected
The LA02035 module is based on ESP32-U4WD chip .support standard Bluetooth HCI UART commands. For the testing module on your product, user can refer to specification of the Bluetooth/WIFI system on how to configure and evaluate the module.This specification can also be found on the official Bluetooth website: https://www.bluetooth.org/en- us/specification/adopted- specifications. 1.9 Additional testing , Part 15 subpart B disclaimer
The final host I module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device .
The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369.
Frequency spectrum to be investigated
For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the higher frequency range of investigation.
Operating the host product
When testing the host product, all the transmitters must be operating.The transmitters can be enabled by using publicly-available drivers and turned on, so the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory devices or drivers are not available.

When testing for emissions from the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive mode only is not possible then, the radio shall be passive (preferred) andIor active scanning. In these cases , this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4 ANSI C63.10 and ANSI C63.26 for further general testing details.
The product under test is placed into a normal ‘paired’ mode with another BLE device, as per the normal intended use of the product (for example, transferring data).
IC Label Instructions: The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module IC: 10256A-LA02305 “or “Contains IC: 10256A-LA02305″ Any similar wording that expresses the same meaning may be used Instructions d’etiquetage IC: L’exterieur des produits finis contenant ce module doit afficher une etiquette faisant reference au module inclus. Cette etiquette exterieure peut utiliser des libelles tels que: contient le module emetteur IC: ” 10256A-LA02305 “ou” contient IC:10256A-LA02305 ” tout libelle similaire exprimant le meme sens peut etre utilise

Documents / Resources

LEEDARSON LA02305 Bluetooth Combo Module [pdf] User Manual
LA02305, 2AB2Q-LA02305, 2AB2QLA02305, LA02305 Bluetooth Combo Module, LA02305, Bluetooth Combo Module, Combo Module, Module

References

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