tuya CB2S Embedded Low Power Wi-Fi Module

FAQs

Q: What are the main features of the CB2S Module?

A: The CB2S Module is a low-power Wi-Fi module with integrated RF chip BK7231N, supporting Wi-Fi AP, STA modes, and Bluetooth LE. It features a 32-bit MCU, flash memory, and rich peripherals for IoT cloud connection.

Q: How many PWM channels does the CB2S Module have?

A: The CB2S Module has 5 channels of 32-bit PWM output, suitable for high-quality LED control.

PRODUCT INFORMATION

CB2S is an embedded low-power Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB2S not only supports the Wi-Fi AP and STA modes, but also supports Bluetooth LE.

Product Overview

CB2S is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and 256-KB RAM, so as to support the Tuya IoT cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are 5 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control.

Features

• Built-in with the low-power 32-bit CPU, which can also function as an application processor
• The clock rate: 120 MHz
• Working voltage: 3.0 to 3.6V
• Peripherals: 5 PWMs and 1 UART
• Wi-Fi connectivity
• 802.11 b/g/n
• Channels 1 to 11@2.4 GHz
• Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes
• Up to +13 dBm output power in 802.11b mode
• support STA/AP/STA+AP working mode
• Support SmartConfig and AP network configuration manners for Android and iOS devices
• Onboard PCB antenna with a gain of 0.13 dBi
• Working temperature: −40°C to 85°C
• Bluetooth connectivity
• Support the Bluetooth LE V5.2
• Support the transmit power of 6 dBm in the Bluetooth mode
• Complete Bluetooth coexistence interface
• Onboard PCB antenna with a gain of 0.13 dB

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network Camera
• Intelligent bus

Module interfaces

Dimensions and package

The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×2.8±0.15 mm (H). The dimensions of CB2S are as follows:

Pin definition

Note:

• P indicates a power supply pin and I/O indicates an input/output pin.
• For the MCU solution, see CBx Module.

Electrical parameters

Absolute electrical parameters

Normal working conditions

RF power consumption

Working current

RF parameters

Basic RF features

Wi-Fi transmission performance

Wi-Fi receiving performance

Bluetooth transmission performance

Bluetooth receiving performance

Antenna information

Antenna type

CB2S uses the PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×0.8±0.1 mm (H)

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container).
   • Time: 168 hours for the reel package and 12 hours for the tray package.
   • Alarm temperature: 50°C for reel package and 135°C for tray package.
   • Production-ready temperature after natural cooling: < 36°C.
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective
   measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.

MOQ and packaging information

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01

Conditions on using Shenzhen Linktop IOT Co., Ltd regulatory approvals:

• A. Customer must ensure that its product (The ” WIFI/Bluetooth MODULE”) is electrically identical to Shenzhen Linktop IOT Co., Ltd reference designs. The customer acknowledges that any modifications to Shenzhen Linktop IOT Co., Ltd reference designs may invalidate regulatory approvals in relation to the CUSTOMER Product, or may necessitate notifications to the relevant regulatory authorities.
• B. Customer is responsible for ensuring that antennas used with the product are of the same type, with same or lower gains as approved, and providing antenna reports to Shenzhen Linktop IOT Co., Ltd.
• C. Customer is responsible for regression testing to accommodate changes to Shenzhen Linktop IOT Co., Ltd reference designs, new antennas, and portable RF exposure safety testing/approvals.
• D. Appropriate labels must be affixed to the CUSTOMER Product that comply with applicable regulations in all respects.
• E. A user’s manual or instruction manual must be included with the customer product that contains the text as required by applicable law. Without limitation of the foregoing, an example (for illustration purposes only) of possible text to include is set forth below:

FCC

List of applicable FCC rules

• FCC Part 15 Subpart C 15.247

Specific operational use conditions

• Radio Technology: Bluetooth BLE
• Operation frequency: 2402-2480MHz
• Channel No.: 40 channels
• Data rate: 1Mbps
• Channel Separation: 2MHz
• Modulation: GFSK
• Antenna Type: PCB antenna, max gain 0.13dBi.
• Radio Technology: 2.4G WIFI
• Operation frequency: 2412MHz-2462MHz for IEEE 802.11 b, g. n/HT20
• Channel No.: 802.11b/802.11g /802.11n (HT20): 11
• Modulation type: IEEE 802.11b: DSSS (CCK, DQPSK, DBPSK)
• IEEE 802.11g: OFDM (64QAM, 16QAM, QPSK, BPSK)
• IEEE 802.11n: OFDM (64QAM, 16QAM, QPSK, BPSK)
• Antenna Type: PCB antenna, max gain 0.13dBi.

The module can be used for mobile or portable applications with a maximum 0.13dBi antenna. The host manufacturer installing this module into their product must ensure that the final composit product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as show in this manual.

Limited module procedures

Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212.

Trace antenna designs

The antenna used is the PCB antenna on the module.

RF exposure considerations

The device can be used in portable exposure conditions without restriction and if RF exposure statement or module layout is changed, then the host product

the manufacturer is required to take responsibility of the module through a change in FCC ID or a new application. The FCC ID of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/ TV technician for help.

The antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be located or operating in conjunction with any other antenna or transmitter.

Antennas

Antenna Specification are as follows: Antenna Type: PCB antenna Antenna Gain(Peak):0.13 dBi (Provided by customer) This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their endproduct for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

Label and compliance information

Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID: 2BCSG-BZBK002” With their finished product.

Information on test modes and additional testing requirements

• Radio Technology: Bluetooth BLE
• Operation frequency: 2402-2480MHz
• Channel No.: 40 channels
• Data rate: 1Mbps
• Channel Separation: 2MHz
• Modulation: GFSK
• Antenna Type: PCB antenna, max gain 0.13dBi.
• Radio Technology: 2.4G WIFI
• Operation frequency: 2412MHz-2462MHz for IEEE 802.11 b, g. n/HT20
• Channel No.: 802.11b/802.11g /802.11n (HT20): 11
• Modulation type: IEEE 802.11b: DS (CCK, DQPSK, DBPSK)
• IEEE 802.11g: OFDM (64QAM, 16QAM, QPSK, BPSK)
• IEEE 802.11n: OFDM (64QAM, 16QAM, QPSK, BPSK)
• Antenna Type: PCB antenna, max gain 0.13dBi.

Host manufacturer must perform test of radiated & conducted emission and spurious emission, etc according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product be sold legally.

Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

Documents / Resources

tuya CB2S Embedded Low Power Wi-Fi Module [pdf] Owner's Manual BZBK002, 2BCSG-BZBK002, 2BCSGBZBK002, CB2S Embedded Low Power Wi-Fi Module, CB2S, Embedded Low Power Wi-Fi Module, Low Power Wi-Fi Module, Wi-Fi Module, Module

References

• User Manual