Contents hide
1 SAMSUNG DDR4 PC4 25600 Server Memory
2 FAQs
3 PRODUCT INFORMATION
4 DDR4 SDRAM MEMORY ORDERING INFORMATION
5 Component Product Guide
6 Module Ordering Information
7 RDIMM LRDIMM Memory Buffer Information
8 PACKAGE DIMENSION
9 Documents / Resources
9.1 References
10 Related Posts

SAMSUNG-LOGO

SAMSUNG DDR4 PC4 25600 Server Memory

SAMSUNG-DDR4-PC4-25600-Server-Memory-PRODUCT

FAQs

  • Q: How do I determine the appropriate DDR4 SDRAM configuration for my system?
    • A: Refer to the product guide and tables provided to match your system requirements with the available options based on density, banks, and package type.
  • Q: What is the voltage requirement for DDR4 SDRAM Memory?
    • A: The DDR4 SDRAM Memory operates at a voltage of 1.2V for efficient performance.

PRODUCT INFORMATION

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE

The products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an “AS IS” basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark, or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel, or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks, and registered trademarks belong to their respective owners.

DDR4 SDRAM MEMORY ORDERING INFORMATION

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (1)

  1. SAMSUNG Memory: K
  2. DRAM: 4
  3. DRAM Type
    • A: DDR4 SDRAM (1.2V VDD)
  4. Density
    • 4G: 4Gb
    • 8G: 8Gb
    • AG: 16Gb
    • BG: 32Gb
  5. Bit Organization
    • 04: x 4
    • 08: x 8
    • 16: x16
  6. # of Internal Banks
    • 5: 16 Banks
  7. Interface (VDD, VDDQ)
    • W: POD (1.2V, 1.2V)
  8. Revision
    • M: 1st Gen.
    • A: 2nd Gen.
    • B: 3rd Gen.
    • C: 4th Gen.
    • D: 5th Gen.
    • E: 6th Gen.
    • F: 7th Gen.
    • G: 8th Gen.
  9. Package Type
    • B: FBGA (Halogen-free & Lead-free, Flip Chip)
    • M: FBGA (Halogen-free & Lead-free, DDP)
    • 2: FBGA (Halogen-free & Lead-free, 2H TSV)
    • 3: FBGA (Halogen-free & Lead-free, 2H 3DS)
    • 4: FBGA (Halogen-free & Lead-free, 4H TSV)
    • 5: FBGA (Halogen-free & Lead-free, 4H 3DS)
  10. Temp & Power
    • C: Commercial Temp.( 0°C ~ 85°C) & Normal Power
    • I: Industrial Temp.(-40°C ~ 95°C) & Normal Power
  11. Speed
    • PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
    • RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
    • TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
    • RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
    • TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
    • WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
    • VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21)
    • WE : DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22)
    • YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21)
    • AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22)

Component Product Guide

[Table 1] DDR4 SDRAM Component Product Guide for PC/SVR

Density Banks Part Number Package & Power,

Temp. & Speed

 Org. VDD

Voltage

 PKG Avail. Note
 

 

8Gb B-die

 16Banks (4Bank Groups) K4A8G045WB1) BCPB/RC/TD 2G x4  

1.2V

  

78 ball FBGA

  

’19 2Q EOL

  
K4A8G085WB BCPB/RC/TD 1G x8
8Banks (2Bank Groups) K4A8G165WB BCPB/RC/TD 512M x16 1.2V 96 ball FBGA
 

 

8Gb C-die

 16Banks (4Bank Groups) K4A8G045WC1) BCTD/VF/WE 2G x4  

1.2V

  

78 ball FBGA

  

 

MP

  
K4A8G085WC BCTD/*VF/*WE 1G x8
8Banks (2Bank Groups) K4A8G165WC BCTD/*VF/*WE 512M x16 1.2V 96 ball FBGA
 

8Gb D-die

 16Banks (4Bank Groups) K4A8G045WD1) BC/TD/VF/WE 2G x4  

1.2V

  

78 ball FBGA

 ’18 4Q CS  
K4A8G085WD BC/TD/*VF/*WE 1G x8
 

 

16Gb A-die

 16Banks (4Bank Groups) K4AAG085WA BCTD/*VF/*WE 2G x8 1.2V 78 ball FBGA  

’19 1Q CS

  
8Banks (2Bank Groups) K4AAG165WA BCTD/*VF/*WE 1G x16 1.2V 96 ball FBGA
 

 

32Gb A-die

 16Banks (4Bank Groups) K4AAG085WA BCTD/*VF/*WE 2G x8 1.2V 78 ball FBGA  

’19 1Q CS

  
8Banks

(2Bank Groups)

 K4AAG165WA BCTD/*VF/*WE 1G x16 1.2V 96 ball FBGA

NOTE: 1) Please contact Samsung for sample availability.

[Table 2] DDR4 SDRAM Component Product Guide for Consumer

Density Banks Part Number Package & Power,

Temp. & Speed

 Org. VDD

Voltage

 PKG Avail. Note
 

 

4Gb D-die

 16Banks (4Bank Groups) K4A4G085WD BCPB/RC BIPB/RC 512M x8 1.2V 78 ball FBGA  

’18 4Q EOL

  
8Banks (2Bank Groups) K4A4G165WD BCPB/RC BIPB/RC 256M x16 1.2V 96 ball FBGA  
 

 

4Gb E-die

 16Banks (4Bank Groups) K4A4G085WE BCRC/TD/WE BIRC/TD/WE 512M x8 1.2V 78 ball FBGA  

 

MP

  
8Banks (2Bank Groups) K4A4G165WE BCRC/TD/WE BIRC/TD/WE 256M x16 1.2V 96 ball FBGA  
 

 

4Gb F-die

 16Banks (4Bank Groups) K4A4G085WF BCTD/*WE 512M x8 1.2V 78 ball FBGA  

’18 4Q CS

  
8Banks (2Bank Groups) K4A4G165WF BCTD/*WE 256M x16 1.2V 96 ball FBGA  
 

 

8Gb B-die

 16Banks (4Bank Groups) K4A8G085WB BCRC/TD/WE BIRC/TD/WE 1G x8 1.2V 78 ball FBGA  

 

MP

  
8Banks (2Bank Groups) K4A8G165WB BCRC/TD/WE BIRC/TD/WE 512M x16 1.2V 96 ball FBGA  
 

 

8Gb C-die

 16Banks (4Bank Groups) K4A8G085WC BCRC/TD/*WE 1G x8 1.2V 78 ball FBGA  

 

MP

  
8Banks (2Bank Groups) K4A8G165WC BCRC/TD/*WE 512M x16 1.2V 96 ball FBGA  
 

 

16Gb B-die

 16Banks (4Bank Groups) K4AAG085WB MCRC/TD 1G x8 1.2V 78 ball FBGA  

 

MP

  
8Banks (2Bank Groups) K4AAG165WB MCRC/TD 512M x16 1.2V 96 ball FBGA  
 

 

16Gb A-die

 16Banks (4Bank Groups) K4AAG085WA BCTD/*WE 2G x8 1.2V 78 ball FBGA  

’19 1Q CS

  
8Banks

(2Bank Groups)

 K4AAG165WA BCTD/*WE 1G x16 1.2V 96 ball FBGA  

Module Ordering Information

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (2)

  • Memory Module: M
  • DIMM Type
    • 3: DIMM
    • 4: SODIMM
  • Data Bits
    • 71: x64 260pin Unbuffered SODIMM
    • 74: x72 260pin ECC Unbuffered SODIMM
    • 78: x64 288pin Unbuffered DIMM
    • 86: x72 288pin Load-Reduced DIMM
    • 91: x72 288pin ECC Unbuffered DIMM
    • 92: x72 288pin VLP Registered DIMM
    • 93: x72 288pin Registered DIMM
  • DRAM Component Type
    • A: DDR4 SDRAM (1.2V VDD)
  • Depth
    • 56: 256M
    • 51: 512M
    • 1G: 1G
    • 2G: 2G
    • 4G: 4G
    • 8G: 8G
      • AG: 16G
      • 1K: 1G (for 8Gb)
      • 2K: 2G (for 8Gb)
      • 4K: 4G (for 8Gb)
      • 8K: 8G (for 8Gb)
      • AK: 16G
  • # of Banks in comp. & Interface
    • 4 : 16Banks & POD-1.2V
  • Bit Organization
    • 0 : x 4
    • 3 : x 8
    • 4 : x 16
  • Component Revision
    • M: 1st Gen.
    • B: 3rd Gen.
    • D: 5th Gen.
    • F: 7th Gen.
    • A: 2nd Gen.
    • C: 4th Gen.
    • E: 6th Gen.
    • G: 8th Gen.
  • Package
    • B: FBGA (Halogen-free & Lead-free, Flip Chip)
    • M: FBGA (Halogen-free & Lead-free, DDP)
    • 2: FBGA (Halogen-free & Lead-free, 2H TSV)
    • 3: FBGA (Halogen-free & Lead-free, 2H 3DS)
    • 4: FBGA (Halogen-free & Lead-free, 4H TSV)
    • 5: FBGA (Halogen-free & Lead-free, 4H 3DS)
  • PCB Revision
    • 0: None
    • 1: 1st Rev.
    • 2: 2nd Rev.
    • 3: 3rd Rev.
    • 4: 4th Rev.
  • Temp & Power
    • C: Commercial Temp.(0°C ~ 85°C) & Normal Power
  • Speed
    • PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
    • RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
    • TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
    • RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
    • TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
    • WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
    • VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21)
    • WE: DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22)
    • YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21)
    • AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22)

DDR4 SDRAM MODULE PRODUCT GUIDE

288Pin DDR4 Registered DIMM

[Table 3] 288Pin DDR4 Registered DIMM

 

Org.

  

Density

  

Part Number

 Temp & Power & Speed Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
1G x72 8GB M393A1G40EB1 CPB C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1G40EB1 CRC C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1G40EB2 CTD C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1G43EB1 CPB E (2Rx8) 512G x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1G43EB1 CRC E (2Rx8) 512G x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1G43EB1 CTD E (2Rx8) 512G x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M393A1K43BB0 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
1G x72 8GB M393A1K43BB0 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
1G x72 8GB M393A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M393A2G40EB1 CPB A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
2G x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
2G x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
2G x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
2G x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
2G x72 16GB M393A2K40BB0 CPB C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K40BB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K40BB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
4G x72 32GB M393A4K40BB0 CPB A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
4G x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP

[Table 3] 288Pin DDR4 Registered DIMM

 

Org.

  

Density

  

Part Number

 Temp &

Power & Speed

 Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
4G x72 32GB M393A4K40BB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
8G x72 64GB M393A8K40B21 CRB A (4Rx4) 3DS 2H

8G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M393A8K40B21 CTC A (4Rx4) 3DS 2H

8G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M393A8K40B2B CTC A (4Rx4) 3DS 2H

8G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M393A8K40B22 CWD B (4Rx4) 3DS 2H

8G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
16G x72 128GB M393AAK40B41 CTC A (8Rx4) 3DS 4H

8G x4 * 36pcs

 8Gb B-die 16 8 78ball FBGA 31.25mm MP
16G x72 128GB M393AAK40B42 CWD B (8Rx4) 3DS 4H

8G x4 * 36pcs

 8Gb B-die 16 8 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43CB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43CB2 CTD E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K43CB2 CVF E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball FBGA 31.25mm CS 3Q’18
2G x72 16GB M393A2K40CB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball 31.25mm MP
2G x72 16GB M393A2K43CB2 CVF E (2Rx8) 1G x8 * 18pcs 8Gb C-die 16 2 78ball
FBGA		 31.25mm CS 3Q’18
2G x72 16GB M393A2K40CB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M393A2K40CB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball
FBGA		 31.25mm MP
2G x72 16GB M393A2K40CB2 CVF C (1Rx4) 2G x4 * 18pcs 8Gb C-die 16 1 78ball

FBGA

 31.25mm CS

3Q’18
4G x72 32GB M393A4K40CB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP
4G x72 32GB M393A4K40CB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm MP
4G x72 32GB M393A4K40CB2 CVF B (2Rx4) 2G x4 * 36pcs 8Gb C-die 16 2 78ball FBGA 31.25mm CS 3Q’18

288Pin DDR4 Load-Reduced DIMM

[Table 4] 288Pin DDR4 Load-Reduced DIMM

 

Org.

  

Density

  

Part Number

 Temp & Power & Speed Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
4G x72 32GB M386A4G40EM2 CPB D (4Rx4) DDP 2G x4 *

36pcs

 4Gb E-die 16 4 78ball FBGA 31.25mm EOL 2Q’18
4G x72 32GB M386A4G40EM2 CRC D (4Rx4) DDP 2G x4 *

36pcs

 4Gb E-die 16 4 78ball FBGA 31.25mm EOL 2Q’18
4G x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40BM1 CPB D (4Rx4) DDP

4G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40BM1 CRC D (4Rx4) DDP

4G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40BM2 CTD D (4Rx4) DDP

4G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40BMB CPB D (4Rx4) DDP

4G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40BMB CRC D (4Rx4) DDP

4G x4 * 36pcs

 8Gb B-die 16 4 78ball FBGA 31.25mm MP
16G x72 128GB M386AAK40B40 CUC A (8Rx4) 3DS 4H

8G x4 * 36pcs

 8Gb B-die 16 8 78ball FBGA 31.25mm MP
16G x72 128GB M386AAK40B40 CWD A (8Rx4) 3DS 4H

8G x4 * 36pcs

 8Gb B-die 16 8 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40CM2 CRC D (4Rx4) DDP

4G x4 * 36pcs

 8Gb C-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40CM2 CTD D (4Rx4) DDP

4G x4 * 36pcs

 8Gb C-die 16 4 78ball FBGA 31.25mm MP
8G x72 64GB M386A8K40CM2 CVF D (4Rx4) DDP

4G x4 * 36pcs

 8Gb C-die 16 4 78ball FBGA 31.25mm CS 3Q’18

288Pin DDR4 VLP Registered DIMM

[Table 5] 288Pin DDR4 VLP Registered DIMM

 

Org.

  

Density

  

Part Number

 Temp & Power & Speed Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
2G x72 16GB M392A2K43BB0 CPB H (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 18.75mm MP
2G x72 16GB M392A2K43BB0 CRC H (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 18.75mm MP
4G x72 32GB M392A4K40BM0 CPB J (2Rx4) 4G x4 * 18pcs 8Gb B-die 16 2 78ball FBGA 18.75mm MP
4G x72 32GB M392A4K40BM0 CRC J (2Rx4) 4G x4 * 18pcs 8Gb B-die 16 2 78ball FBGA 18.75mm MP

260Pin DDR4 ECC SODIMM

[Table 6] 260Pin DDR4 ECC SODIMM

 

Org.

  

Density

  

Part Number

 Temp &

Power & Speed

 Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
1G x72 8GB M474A1G43EB1 CPB G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL 2Q’18
1G x72 8GB M474A1G43EB1 CRC G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL 2Q’18
1G x72 8GB M474A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 30mm MP
2G x72 16GB M474A2K43BB1 CPB G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 30mm MP
 

2G x72

  

16GB

  

M474A2K43BB1

  

CRC

  

G (2Rx8)

  

1G x8 * 18pcs

  

8Gb

  

B-die

  

16

  

2

 78ball

 

FBGA

  

30mm

  

MP
2G x72 16GB M474A2K43BB1 CTD G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 30mm MP

260Pin DDR4 ECC UDIMM

[Table 7] 260Pin DDR4 ECC UDIMM

 

Org.

  

Density

  

Part Number

 Temp & Power & Speed Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
512M x72 4GB M391A5143EB1 CPB D (1Rx8) 512M x8 * 9pcs 4Gb E-die 16 1 78ball FBGA 31.25mm EOL 2Q’18
512M x72 4GB M391A5143EB1 CRC D (1Rx8) 512M x8 * 9pcs 4Gb E-die 16 1 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M391A1G43EB1 CPB E (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M391A1G43EB1 CRC E (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2 78ball FBGA 31.25mm EOL 2Q’18
1G x72 8GB M391A1K43BB1 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
1G x72 8GB M391A1K43BB1 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
1G x72 8GB M391A1K43BB2 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1 78ball FBGA 31.25mm MP
2G x72 16GB M391A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M391A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP
2G x72 16GB M391A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2 78ball FBGA 31.25mm MP

260Pin DDR4 Non ECC SODIMM

[Table 8] 260Pin DDR4 Non ECC SODIMM

 

Org.

  

Density

  

Part Number

 Temp & Power & Speed Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
256M x64 2GB M471A5644EB0 CRC C (1Rx16) 256M x16 * 4pcs 4Gb E-die 8 1 96ball FBGA 30mm EOL ’18 1Q
512M x64 4GB M471A5244CB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb C-die 8 1 96ball FBGA 30mm MP
512M x64 4GB M471A5244BB0 CRC C (1Rx16) 256M x16 * 4pcs 8Gb B-die 8 1 96ball FBGA 30mm EOL ’19 1Q
512M x64 4GB M471A5244BB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb B-die 8 1 96ball FBGA 30mm EOL ’19 1Q
512M x64 4GB M471A5143EB1 CRC A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1 78ball FBGA 30mm EOL ’18 2Q
1G x64 8GB M471A1K43DB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-die 16 1 78ball FBGA 30mm MP
1G x64 8GB M471A1K43CB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP
1G x64 8GB M471A1K43CB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP
1G x64 8GB M471A1K43BB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL ’19 1Q
1G x64 8GB M471A1K43BB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL ’19 1Q
1G x64 8GB M471A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL ’18 2Q
2G x64 16GB M471A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-die 16 2 78ball FBGA 30mm MP
2G x64 16GB M471A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP
2G x64 16GB M471A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP
2G x64 16GB M471A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL ’19 1Q
2G x64 16GB M471A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL ’19 1Q
4G x64 32GB M471A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-die 16 2 78ball FBGA 30mm MP
4G x64 32GB M471A4G43AB1 CVF E (2Rx8) 2G x8 * 16pcs 16Gb A-die 16 2 78ball FBGA 30mm CS ’18 4Q

260Pin DDR4 Non ECC UDIMM

[Table 9] 260Pin DDR4 Non ECC UDIMM

 

Org.

  

Density

  

Part Number

 Temp &

Power & Speed

 Raw Card  

Composition

  

Comp. Version

  

Internal Banks

  

Rank

  

PKG

  

Height

  

Avail.
256M x64 2GB M378A5644EB0 CRC C (1Rx16) 256M x16 * 4pcs 4Gb E-die 8 1 96ball FBGA 30mm EOL ’18 1Q
512M x64 4GB M378A5244CB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb C-die 8 1 96ball FBGA 30mm MP
512M x64 4GB M378A5244BB0 CRC C (1Rx16) 256M x16 * 4pcs 8Gb B-die 8 1 96ball FBGA 30mm EOL ’19 1Q
512M x64 4GB M378A5244BB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb B-die 8 1 96ball FBGA 30mm EOL ’19 1Q
512M x64 4GB M378A5143EB2 CRC A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1 78ball FBGA 30mm EOL ’18 2Q
1G x64 8GB M378A1K43DB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-die 16 1 78ball FBGA 30mm CS ’18 2Q
1G x64 8GB M378A1K43CB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP
1G x64 8GB M378A1K43CB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-die 16 1 78ball FBGA 30mm MP
1G x64 8GB M378A1K43BB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL ’19 1Q
1G x64 8GB M378A1K43BB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1 78ball FBGA 30mm EOL ’19 1Q
1G x64 8GB M378A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2 78ball FBGA 30mm EOL ’18 2Q
2G x64 16GB M378A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-die 16 2 78ball FBGA 30mm CS ’18 2Q
2G x64 16GB M378A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP
2G x64 16GB M378A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2 78ball FBGA 30mm MP
2G x64 16GB M378A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL ’19 1Q
2G x64 16GB M378A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2 78ball FBGA 30mm EOL ’19 1Q
4G x64 32GB M378A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-die 16 2 78ball FBGA 30mm CS ’18 2Q
4G x64 32GB M378A4G43AB1 CVF E (2Rx8) 2G x8 * 16pcs 16Gb A-die 16 2 78ball FBGA 30mm CS ’19 1Q

RDIMM LRDIMM Memory Buffer Information

Label Example

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (3)

JEDEC Description Information

  1. Module total capacity, in gigabytes, for primary bus (ECC not counted)
  2. Number of package ranks of memory installed and number of logical ranks per package rank
  3. Device organization (data bit width) of SDRAMs used on this assembly
  4. SDRAM and support component supply voltage (VDD) blank = 1.2 V operable
  5. Module speed in Mb/s/data pin
  6. SDRAM speed grade
  7. Module Type
    • A = Unbuffered 16-bit Small Outline DIMM (“16b-SO-DIMM”), x16 data bus (placeholder)
    • B = Unbuffered 32-bit Small Outline DIMM (“32b-SO-DIMM”), x32 data bus (placeholder)
    • C = Registered 72-bit Small Outline DIMM (“72b-SO-RDIMM”), x64 primary + 8 bit ECC module data bus(placeholder) E = Unbuffered DIMM (“UDIMM”), x64 primary + 8 bit ECC module data bus
    • L = Load-Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
    • N = Mini registered DIMM (“Mini-RDIMM”), x64 primary + 8 bit ECC module data bus
    • R = Registered DIMM (“RDIMM”), x64 primary + 8 bit ECC module data bus
    • S = Small Outline DIMM (“SO-DIMM”), no ECC (x64 bit module data bus)
    • T = Unbuffered 72-bit Small Outline DIMM (“72b-SO-DIMM”), x64 primary + 8 bit ECC module data bus
    • U = Unbuffered DIMM (“UDIMM”), no ECC (x64 bit module data bus)
    • W = Mini unbuffered DIMM (“Mini-UDIMM”), x64 primary + 8 bit ECC module data bus
  8. Reference design file used for this design (if applicable)
    • A = Reference design for raw card ’A’ is used for this assembly
    • B = Reference design for raw card ’B’ is used for this assembly
    • AC = Reference design for raw card ’AC’ is used for this assembly (example only)
    • ZZ = None of the JEDEC standard reference designs were used for this assembly
  9. Revision number of the reference design used
    • 0 = Initial release
    • 1 = First revision
    • 2 = Second revision
    • P = Pre-release or Engineering sample
    • Z = To be used when reference raw card = ZZ
  10. JEDEC SPD Revision Encoding and Additions level used on this DIMM

RCD (& Data Buffer) Information

(These codes are only used by SAMSUNG, Not JEDEC) 11&12. RCD, Data Buffer Revision & Vendor used on this DIMM

Jedec Description on label Buffer Vendor RCD ver DB ver (Only LRDIMM)
DC0 IDT C0 B1
MB1 Montage B1 A1
MC0 Montage C0 B0
DC3 IDT C0 A3
MA0 Montage A0 A1
DB1 IDT B1 B0
PA0 Rambus (Inphi) A0 A0
DC1 IDT C1 C1

PACKAGE DIMENSION

78ball FBGA for

  • 4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)
  • 4Gb E-die (x4/x8)
  • 8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4) 8Gb C-die (x4/x8)

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (4)

78ball FBGA for 16Gb M-die (x4/x8)

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (5)

  • 96ball FBGA for 4Gb D-die (x16) / 4Gb E-die (x16)
    • 8Gb B-die (x16) / 8Gb C-die (x16)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (6)
  • 96ball FBGA for 16Gb M-die (x16)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (7)

MODULE DIMENSION

  • x72 288pin DDR4 SDRAM RDIMM
  • x72 288pin DDR4 SDRAM LRDIMM
  • x72 288pin DDR4 SDRAM ECC UDIMM
  • x64 288pin DDR4 SDRAM Non ECC UDIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (8)
  • x72 260pin DDR4 SDRAM ECC SODIMM
  • x64 260pin DDR4 SDRAM Non ECC SODIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (9)
  • x72 288pin DDR4 SDRAM VLP RDIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (10)
  • x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)
  1. FRONTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (11)
  2. BACKSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (12)
  3. CLIPSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (13)
  4. ASS’Y VIEW
    • Reference thickness total (Maximum) : 7.30 (With clip thickness)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (14)

x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)

  1. FRONT PARTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (15)
  2. BACK PARTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (16)
  3. CLIP PARTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (17)

x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)

  1. FRONT PARTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (18)
  2. BACK PART
  3. SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (19)CLIP PARTSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (20)

MORE INFO

Documents / Resources

SAMSUNG DDR4 PC4 25600 Server Memory [pdf] User Guide
DDR4 PC4 25600 Server Memory, DDR4 PC4 25600, Server Memory, Memory

References

Related Posts

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